JPH06142554A - Nozzle for applying ag paste and preparation thereof - Google Patents

Nozzle for applying ag paste and preparation thereof

Info

Publication number
JPH06142554A
JPH06142554A JP15561992A JP15561992A JPH06142554A JP H06142554 A JPH06142554 A JP H06142554A JP 15561992 A JP15561992 A JP 15561992A JP 15561992 A JP15561992 A JP 15561992A JP H06142554 A JPH06142554 A JP H06142554A
Authority
JP
Japan
Prior art keywords
paste
hole
slit
stainless steel
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15561992A
Other languages
Japanese (ja)
Inventor
Akio Sakihara
明男 先原
Akio Tashiro
秋雄 田代
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP15561992A priority Critical patent/JPH06142554A/en
Publication of JPH06142554A publication Critical patent/JPH06142554A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nozzles (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To make the thickness of application uniform by providing concentratedly a lot of narrow slit-like extrusion holes in parallel and communicated with slit-like communicating holes crossed at right angle in their intermediate parts on a stainless steel in the nozzle for applying Ag paste to an IC lead frame. CONSTITUTION:A square projection 6 is projected on the apex face of a stainless steel body 1 and a starting hole 7 for wire cutting is provided at the center of the projection 6. A slit-like communicating hole 8 is provided in a straight line by making this starting hole 7 as the center by means of a wire electric discharge processing machine. Then, from one end of this communicating hole 8 to another end thereof, a lot of slit-like extrusion holes 9 crossed at right angle to this communicating hole 8 are perforated and arranged in parallel and concentratedly. The projection 6 may show a circular shape.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ICリードフレーム上
にシリコンペレットを載せる前にAgペーストを吐出塗
布する為のノズル及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle for discharging and applying an Ag paste before placing silicon pellets on an IC lead frame, and a method for manufacturing the nozzle.

【0002】[0002]

【従来の技術】従来のAgペースト塗布用ノズルは、図
6に示すステンレス鋼ボディ1に、図7に示すように一
定間隔に碁盤の目状に穴2を穿設し、然る後図8に示す
ように穴2にステンレス鋼パイプ3を挿入してなるもの
である。
2. Description of the Related Art A conventional Ag paste coating nozzle is a stainless steel body 1 shown in FIG. 6 in which holes 2 are formed in a grid pattern at regular intervals as shown in FIG. The stainless steel pipe 3 is inserted into the hole 2 as shown in FIG.

【0003】ところで、かかるAgペースト塗布用ノズ
ル4は、ステンレス鋼ボディ1の穴2に、ステンレス鋼
パイプ3を挿入する際、穴2の内径よりもステンレス鋼
パイプ3の外径を僅かに(0.005〜0.01mm)大きくして打
ち込む為、ステンレス鋼パイプ3の外径が細かったり、
肉厚が薄いと、打ち込み時に曲がってしまう。従って、
ステンレス鋼パイプ3の外径を太く肉厚も厚くしていた
ので、狭いピッチのステンレス鋼パイプ3を有するAg
ペースト塗布用ノズル4を作ることができなかった。こ
の為、ICリードフレームにシリコンペレットを載せる
際に、ノズル4にてICリードフレーム上にAgペース
トを吐出塗布すると、ステンレス鋼パイプ3のピッチが
広く、外径を太くしている分内径が大きいことから、A
gペーストの吐出量が多く、図9に示すように隣り同志
の吐出されたAgペースト5に重なる部分5aが発生
し、その表面が図10に示すように波状となり、均一な厚
さの薄膜を形成できなかった。
By the way, such an Ag paste coating nozzle 4 makes the outer diameter of the stainless steel pipe 3 slightly smaller than the inner diameter of the hole 2 (0.005) when the stainless steel pipe 3 is inserted into the hole 2 of the stainless steel body 1. (~ 0.01mm) Since it is driven in a large size, the outer diameter of the stainless steel pipe 3 is small,
If the wall is thin, it will bend when driving. Therefore,
Since the outer diameter of the stainless steel pipe 3 was large and the wall thickness was also large, Ag having a narrow pitch stainless steel pipe 3
The paste application nozzle 4 could not be made. For this reason, when the silicon paste is placed on the IC lead frame, if the Ag paste is discharged and applied onto the IC lead frame by the nozzle 4, the pitch of the stainless steel pipes 3 is wide and the inner diameter is large due to the large outer diameter. Therefore, A
The discharge amount of the g paste is large, and as shown in FIG. 9, a portion 5a that overlaps the discharged Ag pastes 5 of adjacent ones is generated, and the surface becomes wavy as shown in FIG. It could not be formed.

【0004】[0004]

【発明が解決しようとする課題】そこで本発明は、IC
リードフレーム上にAgペーストを吐出塗布した際、均
一な厚さの薄膜を形成できるAgペースト塗布用ノズル
とその製造方法を提供しようとするものである。
Therefore, according to the present invention, an IC
It is an object of the present invention to provide an Ag paste coating nozzle capable of forming a thin film having a uniform thickness when a Ag paste is discharged and coated on a lead frame, and a manufacturing method thereof.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
の本発明のAgペースト塗布用ノズルは、ステンレス鋼
のボディに、狭いスリット状の吐出孔が多数平行に且つ
中間で直交する狭いスリット状の連結孔で連結されて密
集配設されてなるものである。かかるAgペースト塗布
用ノズルを作る本発明の製造方法は、ステンレス鋼のボ
ディの中心に、ワイヤーカット用のスタート孔を明け、
次にこのスタート孔を中心として一直線にワイヤー放電
加工機で狭いスリット状の連結孔を穿設し、次いでこの
連結孔の一端から他端まで直交する多数の狭いスリット
状の吐出孔を平行に配列密集して穿設することを特徴と
する。
In order to solve the above-mentioned problems, the Ag paste coating nozzle of the present invention has a narrow slit-shaped discharge hole in which a large number of narrow slit-shaped discharge holes are arranged in parallel with each other in the body of a stainless steel. And are densely arranged by being connected by the connecting holes. The manufacturing method of the present invention for producing such an Ag paste coating nozzle is to open a start hole for wire cutting in the center of a stainless steel body,
Next, a narrow slit-shaped connecting hole is drilled in a straight line centering on this start hole with a wire electric discharge machine, and then a number of narrow slit-like discharging holes that are orthogonal to each other from one end to the other end of this connecting hole are arranged in parallel. The feature is that they are densely provided.

【0006】[0006]

【作用】上記構造の本発明のAgペースト塗布用ノズル
は、狭いスリット状の吐出孔が多数平行に密集配設され
ているので、ICリードフレーム上にAgペーストを吐
出した際、各吐出孔から吐出されたAgペースト量が少
なく、従ってICリードフレーム上のAgペーストは平
坦になり、むらが無くなって、均一な厚さの薄膜が形成
される。また上記のAgペースト塗布用ノズルの製造方
法によれば、均一な厚さの薄膜を形成できる優れたAg
ペースト塗布用ノズルを容易に且つ能率良く製造でき
る。
In the Ag paste coating nozzle of the present invention having the above structure, a large number of narrow slit-shaped discharge holes are densely arranged in parallel. Therefore, when the Ag paste is discharged onto the IC lead frame, the discharge holes are discharged from the respective discharge holes. The amount of the Ag paste discharged is small, so that the Ag paste on the IC lead frame becomes flat and uniform, and a thin film having a uniform thickness is formed. Further, according to the method for manufacturing the Ag paste coating nozzle described above, an excellent Ag capable of forming a thin film having a uniform thickness.
The paste application nozzle can be manufactured easily and efficiently.

【0007】[0007]

【実施例】本発明のAgペースト塗布用ノズル及びその
製造方法の一実施例を図によって説明する。図1に示す
直径25mm、高さ10mmのステンレス鋼ボディ1の先端面に
突設した高さ5mm、一辺10mmの角形の突起6の中心に、
図2に示すようにワイヤーカット用の内径0.15mmのスタ
ート孔7を明け、次にこのスタート孔7を中心として一
直線にワイヤー放電加工機で図3に示すように幅 0.1m
m、長さ8mmのスリット状の連結孔8を穿設し、次いで
この連結孔8の一端から他端まで図4に示すように直交
する幅 0.1mm、長さ8mmのスリット状の吐出孔9を27本
平行に 0.3mm間隔に配列密集して穿設した。前記の角形
の突起6は丸形の場合もある。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the Ag paste coating nozzle and manufacturing method thereof according to the present invention will be described with reference to the drawings. At the center of a square protrusion 6 with a height of 5 mm and a side of 10 mm protruding from the tip surface of a stainless steel body 1 having a diameter of 25 mm and a height of 10 mm shown in FIG.
As shown in FIG. 2, a start hole 7 with an inner diameter of 0.15 mm for wire cutting is opened, and then a straight line centering on this start hole 7 is used in a wire electric discharge machine as shown in FIG.
A slit-shaped connecting hole 8 having a length of m and a length of 8 mm is bored, and then a slit-like discharge hole 9 having a width of 0.1 mm and a length of 8 mm which is orthogonal from one end to the other end of the connecting hole 8 as shown in FIG. Twenty-seven of them were arranged in parallel at 0.3 mm intervals, and were perforated. The rectangular protrusion 6 may be round.

【0008】このようにして製造したAgペースト塗布
用ノズル10は、狭いスリット状の吐出孔9が多数平行に
密集配列されているので、図5に示すようにICリード
フレーム11上にAgペースト12を吐出した際、各吐出孔
9から吐出されたAgペースト量が少なく、従ってIC
リードフレーム11上のAgペースト12は平坦になり、む
らが無くなって、均一な厚さの薄膜が形成される。尚、
本発明のAgペースト塗布用ノズル10は、各スリット状
の吐出孔9の端部同志を離してあるので、Agペースト
吐出後ノズル10を引き上げた際負圧がかかっても空気を
巻き込むことが無く、吐出孔9の端部に空気がたまるこ
とが無い。
In the Ag paste coating nozzle 10 thus manufactured, a large number of narrow slit-shaped discharge holes 9 are densely arranged in parallel, so that the Ag paste 12 is formed on the IC lead frame 11 as shown in FIG. The amount of Ag paste discharged from each discharge hole 9 is small when
The Ag paste 12 on the lead frame 11 becomes flat and even, and a thin film having a uniform thickness is formed. still,
In the Ag paste coating nozzle 10 of the present invention, the end portions of the slit-shaped discharge holes 9 are separated from each other, so that air is not entrained even if a negative pressure is applied when the nozzle 10 is pulled up after discharging the Ag paste. Air does not collect at the end of the discharge hole 9.

【0009】[0009]

【発明の効果】以上の通り本発明のAgペースト塗布用
ノズルによれば、ICリードフレーム上にAgペースト
を吐出した際、狭いスリット状の各吐出孔から吐出され
たAgペースト量が少なく、従ってAgペーストは平坦
となり、むらが無くなって、均一な厚さの薄膜が形成さ
れる。また、本発明のAgペースト塗布用ノズルの製造
方法によれば、上記の優れた効果のあるAgペースト塗
布用ノズルを容易に且つ能率良く製造できる。
As described above, according to the nozzle for applying Ag paste of the present invention, when the Ag paste is discharged onto the IC lead frame, the amount of Ag paste discharged from each of the narrow slit-shaped discharge holes is small. The Ag paste becomes flat and uniform, and a thin film having a uniform thickness is formed. Further, according to the method of manufacturing the Ag paste coating nozzle of the present invention, the Ag paste coating nozzle having the above-mentioned excellent effects can be manufactured easily and efficiently.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 1 is a diagram showing steps of an embodiment of a method for manufacturing a nozzle for applying Ag paste of the present invention.

【図2】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 2 is a diagram showing a step of an embodiment of a method for manufacturing an Ag paste coating nozzle of the present invention.

【図3】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 3 is a diagram showing steps of an embodiment of a method for manufacturing a nozzle for applying Ag paste according to the present invention.

【図4】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 4 is a diagram showing steps of an embodiment of a method for manufacturing a nozzle for applying Ag paste according to the present invention.

【図5】本発明のAgペースト塗布用ノズルよりAgペ
ーストをICリードフレーム上に吐出して薄膜を形成し
た状態を示す図である。
FIG. 5 is a diagram showing a state in which a thin film is formed by discharging Ag paste onto an IC lead frame from an Ag paste coating nozzle of the present invention.

【図6】従来のAgペースト塗布用ノズルの製造方法の
工程を示す図である。
FIG. 6 is a diagram showing a step in a method for manufacturing a conventional Ag paste coating nozzle.

【図7】従来のAgペースト塗布用ノズルの製造方法の
工程を示す図である。
FIG. 7 is a diagram showing a step of a method for manufacturing a conventional Ag paste coating nozzle.

【図8】従来のAgペースト塗布用ノズルの製造方法の
工程を示す図である。
FIG. 8 is a diagram showing a step in a method for manufacturing a conventional Ag paste coating nozzle.

【図9】従来のAgペースト塗布用ノズルにより形成さ
れた薄膜の欠陥を示す要部平面図である。
FIG. 9 is a plan view of relevant parts showing defects in a thin film formed by a conventional Ag paste coating nozzle.

【図10】図9のA−A線側断面図である。10 is a sectional view taken along line AA of FIG. 9.

【符号の説明】[Explanation of symbols]

1 ステンレス鋼ボディ 7 スタート孔 8 スリット状の連結孔 9 スリット状の吐出孔 10 Agペースト塗布用ノズル 1 Stainless steel body 7 Start hole 8 Slit-shaped connection hole 9 Slit-shaped discharge hole 10 Ag paste application nozzle

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ステンレス鋼のボディに、狭いスリット
状の吐出孔が多数平行に且つ中間で直交する狭いスリッ
ト状の連結孔で連結されて密集配設されてなるAgペー
スト塗布用ノズル。
1. An Ag paste coating nozzle comprising a stainless steel body and a large number of narrow slit-shaped discharge holes which are connected in parallel and densely arranged by narrow slit-shaped connecting holes which are orthogonal to each other in the middle.
【請求項2】 ステンレス鋼のボディの中心に、ワイヤ
ーカット用のスタート孔を明け、次にこのスタート孔を
中心として一直線にワイヤー放電加工機で狭いスリット
状の連結孔を穿設し、次いでこの連結孔の一端から他端
まで直交する多数の狭いスリット状の吐出孔を平行に配
列密集して穿設することを特徴とするAgペースト塗布
用ノズルの製造方法。
2. A start hole for wire cutting is opened in the center of a stainless steel body, and then a narrow slit-shaped connecting hole is bored in a straight line around the start hole by a wire electric discharge machine. A method for manufacturing an Ag paste coating nozzle, characterized in that a large number of narrow slit-shaped discharge holes that are orthogonal to each other from one end to the other end of the connection hole are arranged in parallel and densely formed.
JP15561992A 1992-05-22 1992-05-22 Nozzle for applying ag paste and preparation thereof Pending JPH06142554A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15561992A JPH06142554A (en) 1992-05-22 1992-05-22 Nozzle for applying ag paste and preparation thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15561992A JPH06142554A (en) 1992-05-22 1992-05-22 Nozzle for applying ag paste and preparation thereof

Publications (1)

Publication Number Publication Date
JPH06142554A true JPH06142554A (en) 1994-05-24

Family

ID=15609971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15561992A Pending JPH06142554A (en) 1992-05-22 1992-05-22 Nozzle for applying ag paste and preparation thereof

Country Status (1)

Country Link
JP (1) JPH06142554A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013427A (en) * 2004-05-25 2006-01-12 Ricoh Co Ltd Minute adhesive nozzle and adhesive coating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006013427A (en) * 2004-05-25 2006-01-12 Ricoh Co Ltd Minute adhesive nozzle and adhesive coating device

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