JPH0922808A - Chip part retaining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip part retaining device for easily retaining a chip part element body and for retaining the element body in a proper position. SOLUTION: When retaining a chip part element body 3, first the chip part element body 3 is inserted into a plate body 11 with a larger retention space than the outer periphery of the chip part element body 3. Then, a vertical string 13 and a horizontal string 14 are moved back and forth or right and left by a variable mechanism 12 to deform a retention space 15. The strings 13 and 14 are compressed to the chip part element body 3 due to the deformation of the retention space 15 to retain the chip part element body 3 at the retention space 15. On the other hand, when returning the retention space 15 to its original state by the variable mechanism 12, the retention state of the chip part element body 3 can be canceled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component holding device for holding a chip component body such as a resistor or a capacitor and forming external electrodes on the chip component body.

[0002]

2. Description of the Related Art Conventionally, as a method of forming external electrodes of chip parts, the method disclosed in Japanese Patent Publication No. 62-29888 or Japanese Patent Publication No. 4-70761 is known.

This external electrode forming method for a chip component comprises a load plate for accommodating a chip component element body (a chip component in which external electrodes are not formed) and a chip component holding device formed of an elastic body, for example, a carrier plate. Prepare in advance and set the load plate on the upper surface of this carrier plate. Next, the chip component element body is supplied to the accommodation space of the load plate, and the supplied chip component element body is supported by the upper edge of the holding space of the carrier plate and accommodated in the accommodation space.

Thereafter, the pushing member, that is, the pin, moves downward from the upper opening of the accommodation space to push the component element body in the accommodation space downward, move the component element body to the holding space side, and the carrier. A conductor paste for external electrodes is applied to the chip component body held by the plate.

[0005]

As described above, the carrier plate used in the conventional external electrode forming method is formed such that the insertion area of the holding space is smaller than the area of the insertion end of the chip component body. The chip component body is pressed by a pin and transferred to a carrier plate.

However, the upper end area of the chip component body is very small, and the diameter of the pin for pushing out this chip component body is also small, so the strength of the pin cannot be secured sufficiently. Therefore, in order to increase the holding force of the carrier plate, when the insertion area of the holding space is reduced, there is a possibility that problems such as pin bending may occur.

Further, when the center of the axis of the pin and the center of the upper end surface of the chip component body are displaced, the chip component body is pushed to one side, whereby the chip component body is held in the holding space of the carrier plate. May be stored in a tilted position. However, when the chip component body is accommodated in a tilted state in this way, the coated surface of the conductor paste is also in a tilted state, so that there is a problem that the external electrodes cannot be formed uniformly. .

In view of the conventional problems described above, an object of the present invention is to provide a chip component holding device which can easily hold a chip component body and can hold the chip component body in an appropriate posture.

[0009]

In order to solve the above-mentioned problems, the present invention inserts and holds a chip part element body into a holding space and attaches a conductor paste to the chip part element body to form an external electrode. In the holding device, a device main body in which a plurality of warp threads and weft threads intersect each other at a predetermined interval to form the holding space larger than the outer circumference of the chip component body in a portion surrounded by the warp threads and the weft thread; And a variable mechanism for moving the weft and deforming the holding space.

[0010]

According to the present invention, when holding the chip component body, the chip component body is first inserted into the main body of the apparatus having a holding space larger than the outer circumference of the chip component body. Thereafter, the warp or weft is moved by the variable mechanism to deform the holding space. Due to the deformation of the holding space, the warp threads or the weft threads are pressed against the chip component body to hold the chip component body in the holding space. On the other hand, when the holding space is returned to the original state by the variable mechanism, the holding state of the chip component body is released.

[0011]

1 to 6 show a chip component holding device according to the present invention, for example, a method of forming external electrodes to which a carrier plate is applied.

FIG. 1 shows a first load plate 1a, a second load plate 1b and a carrier plate 2 used for forming external electrodes, wherein the load plates 1a and 1b are made of metal or hard resin. What is done,
An accommodation space 1c for accommodating a chip component body (hereinafter referred to as a component body in the embodiment) 3 in each of the load plates 1a and 1b.
Are formed in large numbers. This accommodating space 1c is a component body 3.
Has a slightly larger insertion area than the cross-sectional area, and has a depth dimension that is approximately half the height dimension of the component body 3 when the first load plate 1a is removed,
When the component body 3 is accommodated in the accommodation space 1c, the second load plate 1b extends from the center to the upper end of the component body 3.
It is designed to project above the (support plate).

The carrier plate 2 is an elastic member such as a silicone rubber plate body 2a surrounded by a metal frame 2b. The plate body 2a is located at a position corresponding to the accommodating space 1a of the load plate 1. A large number of holding spaces 2c in which the component bodies 3 are transported are arranged.

External electrodes are formed by using each of the load plates 1a and 1b and the carrier plate 2 as shown in FIGS. 2 to 6, and the method of forming the external electrodes will be described below.

First, as shown in FIG. 2, the component element body 3 is inserted into each accommodation space 1c of each load plate 1a, 1b,
Then, as shown in FIG. 3, the first load plate 1a
Is removed, and the component body 3 is projected upward. In such a state, as shown in FIG. 4, the holding space 2c of the carrier plate 2 and the component body 3 accommodated in each accommodation space 1c are arranged to face each other, and the carrier plate 2 is attached to the second load plate 1
Lower toward b. Thereby, the lower end side of the component body 3 is held in the holding space 2c in a state of protruding downward.

When the step of transferring the component body 3 is completed, the carrier plate 2 is moved upward to remove the entire component body 3 from the second load plate 1b.
As shown in FIG. 6, the lower protruding portion of the component body 3 is dipped in the conductor paste 5 on the base 4, and then the carrier plate 2 is pulled up as shown in FIG. As a result, the conductor paste adheres to the end of the component body 3.

When such an external electrode forming method is adopted, the conductor paste for external electrodes can be attached to the end portion of the component body 3 without using a pin mechanism as in the prior art.

However, in this external electrode forming method, when the component element body 3 shown in FIG. 4 is transferred, that is, when each component element body 3 is pressed into the holding space 2c of the carrier plate 2, the carrier plate 2 is pressed. The holding space 2c and the component body 3 need to be precisely opposed to each other, and the transfer operation of the component body 3 may not be performed smoothly.

The chip component holding device according to the present invention is characterized in that it has a carrier plate 10 having a holding means capable of smoothly holding the component element body 3 in the above-mentioned external electrode forming method.

An embodiment of the carrier plate 10 will be described with reference to FIGS. 7 to 18. The carrier plate 10 includes a rectangular plate body (apparatus body) 11 and a variable mechanism 12 that deforms the plate body 11. As shown in FIGS. 7 and 8, the plate body 11 is formed by forming warp threads 13 and weft threads 14 made of wire so as to intersect each other at a predetermined interval.
A holding space 15 in which the component body 3 is inserted and held is formed in a space surrounded by 4. Also, the warp yarn 13 and the weft yarn 1
As shown in FIGS. 9 and 11, in No. 4, the warp yarns 13 are linear, and the weft yarns 14 are alternately knitted with respect to the warp yarns 13. On the other hand, the variable mechanism 12 has four frame bodies 16 so as to surround the periphery of the plate body 11. The ends of the warp threads 13 and the weft threads 14 are connected to each frame body 16, while the end portions of each frame body 16 are connected. A connecting pin 17 is connected so that it can rotate.

Since the carrier plate 10 is constructed as described above, not only the holding space 15 is formed in a square shape as shown in FIG. 7, but also the frame body 16 is moved back and forth or left and right as shown in FIG. Can be formed into a diamond shape. Here, when the holding space 15 is formed in a square shape, the inner circumference of the holding space 15 is larger than the outer circumference of the component body 3, and when the holding space 15 is formed in a rhombus shape, the component body 3 is formed. The outer peripheral surface of the thread is pressed against the threads 13 and 14.

Next, the carrier plate 1 according to the present embodiment.
An external electrode forming method using 0 will be described based on each drawing.

FIGS. 7 to 11 correspond to the step of transferring the component body described in the external electrode forming method,
First, as shown in FIGS. 7 and 9, the carrier plate 10 having the rectangular holding space 15 is placed on the second load plate 1b, and the protruding portion of the component body 3 is accommodated in the holding space 15. Place it as it is. Then, FIG.
As shown in (a) of FIG.
Is held between the second load plate 1b and the pressing plate 18. After that, this is reversed and (b) of FIG.
Turn it upside down as shown in. In this inverted state, as shown in FIG. 10 (c), the second load plate 1b
Remove. Next, the frame body 16 of the variable mechanism 12 is moved to form the holding space 15 in a rhombic shape, and the component body 3 is held as shown in FIG. As a result, as shown in FIGS. 8 and 11 (a) (b), the component element body 3 becomes
4 is held in the holding space 15.

When the step of holding the component body 3 is completed, the carrier plate 10 is held with the component body 3 held.
12, the projecting portion of the component element body 3 is dipped in the conductor paste 5 on the base 4, and then the carrier plate 10 is pulled up as shown in FIG. As a result, the conductor paste adheres to the end of the component body 3.

After the step of attaching the conductor paste, the external electrodes are formed by the steps of drying and firing the component body 3 and the conductor paste. Here, when removing the component body 3 from the carrier plate 10, FIG. As shown in, the frame 16 of the variable mechanism 12 is moved to reconfigure the holding space 15 into a rectangular shape. As a result, the holding state of the component body 3 is released, and the component body 3 is disengaged from the carrier plate 10.

As described above, according to this embodiment, the conductor paste for external electrodes is attached to the end of the component body 3 without using the conventional pin mechanism, and the component body 3 is also attached.
Can be optionally discharged from the carrier plate 10. Further, the warp threads 13 are linearly arranged so as to face each other, and when the component element body 3 is held, since the warp threads 13 hold the same height portion of the component element body 3, the component element body 3 is held without tilting. To be done.

Further, as shown in FIG. 15, the accommodation space 1
When the component element body 3 is accommodated in the shallow first load plate 1b ′ of c ′, the yarns 13 and 14 hold substantially the center of the component element body 3, so that the component element body is inserted from above and below the plate body 11. Both ends of 3 largely project. Therefore, in such a case, after attaching the conductor paste to one end of the component body 3,
This can be rotated a half turn as shown in FIG. 16, and the other end of the component element body 3 can be immersed in the conductor paste 5 as shown in FIG. 17, whereby the component element body 3 as shown in FIG. Conductor paste can be attached to both ends of the.

FIGS. 19 and 20 show another embodiment of the chip component holding device. In the carrier plate 20 according to this embodiment, warp yarns 21 and weft yarns 22 are stretched vertically and horizontally on a frame 23 while the warp yarns One end of 21 is connected to a variable mechanism (sliding plate 24) that slides back and forth.

When the component element body 3 is held by the carrier plate 20 according to this embodiment, first, FIG.
As shown in FIG.
The warp 21 is loosened by sliding it toward 0, and the space pin 26 is moved toward the holding space 25 as shown in FIG. 20 (b). Here, the space pin 25 is larger than the tension holding space 25, and by inserting the space pin 25 into the holding space 25, as shown in (a) and (c) of FIG. The lateral width of the holding space 25 increases. By placing the carrier plate 20 on the second load plate 1b in a state where the holding space 25 is expanded, the protruding portion of the component body 3 is housed in the holding space 25. When this housing operation is completed, the sliding plate 24 is moved to the original position. As a result, the warp yarn 21 becomes in a tension state and the component element body 3 is held in the holding space 25.

According to this embodiment, the conductive paste can be attached to the component body 3 by simply removing the carrier plate 20 holding the component body 3 from the second load plate 1b.

[0031]

As described above, according to the present invention,
By operating the variable mechanism, it is possible to hold or release the holding of the chip component element body, and it is possible to form the external electrodes without using the pin mechanism as in the conventional case. Therefore,
Various defects associated with the pin mechanism, such as variations in external electrodes, can be eliminated.

[Brief description of drawings]

FIG. 1 is a perspective view of a load plate and a carrier plate used in an external electrode forming method to which a chip component holding device according to the present invention is applied.

FIG. 2 is a sectional view showing a chip component body accommodating step.

FIG. 3 is a sectional view showing a state in which a first load plate is removed.

FIG. 4 is a cross-sectional view showing a chip component element transfer process.

FIG. 5 is a cross-sectional view showing a chip component body dipping process.

FIG. 6 is a cross-sectional view showing a chip component element body paste attaching process.

FIG. 7 is a plan view showing a housed state of a chip component body according to the present embodiment.

FIG. 8 is a plan view showing a holding state of the chip component body according to the present embodiment.

FIG. 9 is a sectional view showing a chip component body accommodating step according to the present embodiment.

FIG. 10 is a cross-sectional view showing a transition operation from a chip component body accommodating step to a holding step according to the present embodiment.

FIG. 11 is a cross-sectional view showing a step of holding a chip component body according to the present embodiment.

FIG. 12 is a cross-sectional view showing a chip component body dipping process according to the present embodiment.

FIG. 13 is a sectional view showing a chip component element body paste applying step according to the present embodiment.

FIG. 14 is a cross-sectional view showing a chip component element discharging step according to the present embodiment.

FIG. 15 is a cross-sectional view showing a chip component body holding step according to another external electrode forming step of the present embodiment.

FIG. 16 is a cross-sectional view showing a chip component body rotating step according to another external electrode forming step of this embodiment.

FIG. 17 is a cross-sectional view showing a chip component body dipping process according to another external electrode forming process of the present embodiment.

FIG. 18 is a cross-sectional view showing a chip component element body paste applying step according to another external electrode forming step of the present embodiment.

FIG. 19 is a plan view showing a chip component holding device according to another embodiment.

FIG. 20 is a view showing a chip component body accommodating step of a chip component holding device according to another embodiment.

[Explanation of symbols]

3 ... Chip component body, 10, 20 ... Carrier plate,
11 ... Plate main body, 12 ... Variable mechanism, 24 ... Sliding plate, 13, 21 ... Warp thread, 14, 22 ... Weft thread, 15, 2
5 ... holding space.

Claims (1)

[Claims] 1. A chip component holding device in which a chip component body is inserted and held in a holding space, and a conductor paste is attached to the chip component body to form external electrodes, wherein a large number of warp yarns and weft yarns are formed at predetermined intervals. An apparatus main body in which the holding space larger than the outer circumference of the chip component body is formed in a portion which is crossed and surrounded by the warp yarn and the weft yarn; and a variable mechanism which moves the warp yarn and the weft yarn to deform the holding space. A chip component holding device comprising: