JPH09227154A - Sealing composition - Google Patents

Sealing composition

Info

Publication number
JPH09227154A
JPH09227154A JP8255898A JP25589896A JPH09227154A JP H09227154 A JPH09227154 A JP H09227154A JP 8255898 A JP8255898 A JP 8255898A JP 25589896 A JP25589896 A JP 25589896A JP H09227154 A JPH09227154 A JP H09227154A
Authority
JP
Japan
Prior art keywords
low
sealing
composition
weight
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8255898A
Other languages
Japanese (ja)
Inventor
Ryuichi Tanabe
隆一 田辺
Naoki Sugimoto
直樹 杉本
Setsuo Ito
節郎 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP8255898A priority Critical patent/JPH09227154A/en
Publication of JPH09227154A publication Critical patent/JPH09227154A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/12Silica-free oxide glass compositions
    • C03C3/16Silica-free oxide glass compositions containing phosphorus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a sealing composition containing a specific phosphoric acid-tin oxide glass powder having low melting point and a low-expansion ceramics filler, free from lead and useful for improving the hydrostatic strength and thermal strength of a cathode-ray tube, plasma display panel and fluorescent display tube. SOLUTION: A sealing composition having a thermal expansion coefficient of 80×10<-7> to 110×10<-7> / deg.C between room temperature and 300 deg.C after baking is produced by compounding 50-99wt.% of a phosphoric acid-tin oxide low- melting glass powder composed of 50-72mol% (in terms of SnO) of a tin oxide, 0-10mol% of ZnO and 25-40mol% of P2 O5 with 1-50wt.% of a low-expansion ceramics filler having an average thermal expansion coefficient of 70 to 10<-7> / deg.C between room temperature and 300 deg.C.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、低温度の熱処理に
より封着できるブラウン管のパネルとファンネルとを封
着するための封着用組成物およびプラズマディスプレイ
パネル(PDP)または蛍光表示管(VFD)を封着す
るための封着用組成物に関する。
TECHNICAL FIELD The present invention relates to a sealing composition and a plasma display panel (PDP) or a fluorescent display tube (VFD) for sealing a funnel with a cathode ray tube panel which can be sealed by heat treatment at a low temperature. The present invention relates to a sealing composition for sealing.

【0002】[0002]

【従来の技術】従来、カラーブラウン管のパネルとファ
ンネルとは、特公昭36−17821号に開示されるタ
イプのPbO−B23 −ZnO−SiO2 系結晶性低
融点ガラスを用い440〜450℃の温度に30〜40
分程度保持して封着していた。かくして封着されたパネ
ルとファンネルはその内部を10-6Torr以上の高真
空を得るため300〜380℃に加熱されつつ排気され
る。
2. Description of the Related Art Conventionally, a panel and a funnel of a color cathode ray tube are made of a PbO-B 2 O 3 -ZnO-SiO 2 -based crystalline low melting point glass of the type disclosed in Japanese Patent Publication No. 36-17821, 440-450. 30-40 at a temperature of ℃
It was held for about a minute and sealed. The thus sealed panel and funnel are exhausted while being heated to 300 to 380 ° C. in order to obtain a high vacuum of 10 −6 Torr or more inside.

【0003】また、従来、PDPまたはVFDにおける
ガラス基板の封着には、低融点ガラスを用い、440〜
500℃で封着していた。かくして封着されたパネルは
PDPの場合は250〜380℃に加熱されつつ排気さ
れ、100〜500Torrになるようにネオン、He
−Xe等の放電ガスを封入し、またVFDの場合は真空
を得るため250〜380℃に加熱されつつ排気されて
封止される。
[0003] Conventionally, a glass substrate of PDP or VFD is sealed with a low melting point glass, and 440-400 is used.
It was sealed at 500 ° C. In the case of a PDP, the sealed panel is heated to 250 to 380 ° C. and evacuated, and neon and He are heated to 100 to 500 Torr.
A discharge gas such as -Xe is filled, and in the case of VFD, it is heated to 250 to 380 [deg.] C. to obtain a vacuum, and then exhausted and sealed.

【0004】従来の封着用粉末ガラスは、鉛成分を含有
するガラスが用いられていたが、最近では鉛成分を含有
しないガラスが求められる。
Conventionally, glass containing a lead component has been used as the powder glass for sealing, but recently, a glass containing no lead component is required.

【0005】また、従来の封着用粉末ガラスは、ガラス
基板との熱膨張率がマッチングせず、パネルが割れた
り、排気のときの加熱によりガラス基板にはんだが流動
したり、発泡したり、封着部分が割れたりしていた。
Further, the conventional powder glass for sealing does not have a coefficient of thermal expansion matching that of the glass substrate, and the panel is cracked, or the solder is fluidized, foamed, or sealed on the glass substrate due to heating during exhaust. The wearing part was cracked.

【0006】[0006]

【発明が解決しようとする課題】本発明は、鉛成分を含
有しないガラス粉末を用いた、ブラウン管、PDPおよ
びVFD封着用ガラスセラミックス組成物を提供するこ
とを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a glass-ceramic composition for encapsulating cathode ray tubes, PDPs and VFDs, which uses glass powder containing no lead component.

【0007】[0007]

【課題を解決するための手段】本発明は、リン酸−酸化
スズ系の低融点ガラス粉末50〜99重量%と低膨張セ
ラミックスフィラー1〜50重量%とからなる組成物で
あり、低融点ガラス粉末の組成が実質的にモル表示で、
SnOに換算したスズ酸化物:50〜72%、ZnO:
0〜10%、P25 :25〜40%、からなることを
特徴とする封着用組成物を提供する。
The present invention is a composition comprising 50 to 99% by weight of a phosphoric acid-tin oxide low melting point glass powder and 1 to 50% by weight of a low expansion ceramic filler. The composition of the powder is substantially in mol,
Tin oxide converted to SnO: 50 to 72%, ZnO:
There is provided a sealing composition comprising 0 to 10% and P 2 O 5 : 25 to 40%.

【0008】[0008]

【発明の実施の形態】本発明におけるリン酸−酸化スズ
系の低融点ガラスの組成範囲について、以下に説明す
る。本発明においては、比較的低温の400〜500
℃、かつ短時間(6分〜1時間)で充分に流動して、封
着可能なように、結晶性低融点ガラスはモル%表示で以
下のような組成範囲を持つ。
BEST MODE FOR CARRYING OUT THE INVENTION The composition range of the phosphoric acid-tin oxide low melting point glass in the present invention will be described below. In the present invention, a relatively low temperature of 400 to 500
The crystalline low-melting point glass has the following composition range in terms of mol% so that it can be sufficiently flowed and sealed at a temperature of a short period (6 minutes to 1 hour).

【0009】 SnOに換算したスズ酸化物 50〜72%、 ZnO 0〜10%、 P25 25〜40%。Tin oxide converted to SnO: 50 to 72%, ZnO: 0 to 10%, P 2 O 5: 25 to 40%.

【0010】SnOに換算したスズ酸化物の含有量が5
0モル%未満の場合は軟化点が高くなりすぎ、流動性が
悪く、封着部の強度、気密性が損なわれ、400〜50
0℃では封着できない。その含有量が72モル%超で
は、ガラス化が困難になる。SnOは上記範囲中、特に
52〜70モル%であることが好ましい。
The content of tin oxide converted to SnO is 5
If it is less than 0 mol%, the softening point becomes too high, the fluidity is poor, and the strength and airtightness of the sealed portion are impaired, and the softening point is 400 to 50
It cannot be sealed at 0 ° C. If its content exceeds 72 mol%, vitrification becomes difficult. In the above range, SnO is particularly preferably 52 to 70 mol%.

【0011】ZnOは必須成分ではないが、含有させる
ことによって、焼成後の封着組成物の熱膨張係数を低下
させ、封着対象物の熱膨張係数とマッチングさせうる。
ただし、含有量が10モル%超では、軟化点が高くなり
すぎ、400〜500℃では封着できない。ZnOは上
記範囲中、特に0〜8モル%であることが好ましい。
Although ZnO is not an essential component, its inclusion can reduce the coefficient of thermal expansion of the sealing composition after firing and can match the coefficient of thermal expansion of the object to be sealed.
However, if the content exceeds 10 mol%, the softening point becomes too high and sealing cannot be performed at 400 to 500 ° C. ZnO is particularly preferably 0 to 8 mol% in the above range.

【0012】P25 の含有量が25モル%未満の場合
には、ガラス化が困難になり、40モル%超の場合に
は、封着物の耐水性が低下する。P25 は上記範囲
中、特に27〜38モル%であることが好ましい。
When the content of P 2 O 5 is less than 25 mol%, vitrification becomes difficult, and when it exceeds 40 mol%, the water resistance of the sealing material is lowered. It is preferred P 2 O 5 is in the above range, in particular 27 to 38 mol%.

【0013】また、本発明でいう、低膨張セラミックス
フィラーとは、室温から300℃における平均熱膨張係
数が70×10-7/℃以下であるセラミックスフィラー
をいう。
The low expansion ceramic filler referred to in the present invention means a ceramic filler having an average coefficient of thermal expansion of 70 × 10 -7 / ° C. or less from room temperature to 300 ° C.

【0014】かかる低膨張セラミックスフィラーとして
は、ジルコン、コージエライト、チタン酸アルミニウ
ム、アルミナ、ムライト、シリカ、β−ユークリプタイ
ト、β−スポジュメンおよびβ−石英固溶体から選ばれ
た少なくとも1種が好ましく、特に、封着強度向上のた
めには、コージエライト、ジルコンが望ましい。
As the low expansion ceramics filler, at least one selected from zircon, cordierite, aluminum titanate, alumina, mullite, silica, β-eucryptite, β-spodumene and β-quartz solid solution is particularly preferable. In order to improve the sealing strength, cordierite and zircon are desirable.

【0015】本発明において、低融点ガラス粉末の含有
量は、低融点ガラス粉末と低膨張セラミックスフィラー
との総量に対して50〜99重量%の範囲であり、低膨
張セラミックスフィラーの含有量は低融点ガラス粉末と
低膨張セラミックスフィラーとの総量に対して1〜50
重量%の範囲である。低融点ガラス粉末が99重量%超
では、低膨張セラミックスフィラーの量が少ないため、
焼成後の熱膨張係数が大きくなりすぎ、封着される対象
物と平均熱膨張係数が合わず、割れやすい。その含有量
が50重量%未満では、ガラス分が少なく流動性が悪く
なり、封着部の気密性が損なわれる。低融点ガラス粉末
と低膨張セラミックスフィラーとの総量に対して低融点
ガラス粉末の含有量は、好ましくは55〜99重量%、
特に好ましくは60〜99重量%、セラミックスフィラ
ーの含有量は、好ましくは1〜45重量%、特に好まし
くは1〜40重量%である。
In the present invention, the content of the low-melting glass powder is in the range of 50 to 99% by weight with respect to the total amount of the low-melting glass powder and the low-expansion ceramic filler, and the content of the low-expansion ceramic filler is low. 1 to 50 relative to the total amount of the melting point glass powder and the low expansion ceramics filler
% By weight. If the low melting point glass powder exceeds 99% by weight, the amount of the low expansion ceramic filler is small,
The coefficient of thermal expansion after firing becomes too large, the average coefficient of thermal expansion does not match the object to be sealed, and it is easily cracked. When the content is less than 50% by weight, the glass content is small and the fluidity is deteriorated, and the airtightness of the sealed portion is impaired. The content of the low-melting glass powder with respect to the total amount of the low-melting glass powder and the low-expansion ceramics filler is preferably 55 to 99% by weight,
The content of the ceramic filler is particularly preferably 60 to 99% by weight, preferably 1 to 45% by weight, particularly preferably 1 to 40% by weight.

【0016】かくして得られる封着用組成物の焼成後の
室温〜250℃の熱膨張係数は60×10-7〜110×
10-7/℃となることが好ましい。熱膨張係数が、この
範囲をはずれると、封着対象物の熱膨張係数とマッチン
グすることが困難になる。
The coefficient of thermal expansion of the thus obtained sealing composition at room temperature to 250 ° C. after firing is 60 × 10 −7 to 110 ×.
It is preferably 10 −7 / ° C. If the coefficient of thermal expansion deviates from this range, it becomes difficult to match the coefficient of thermal expansion of the object to be sealed.

【0017】本発明の封着用組成物をブラウン管のパネ
ルとファンネルとを封着するために適用する場合には、
リン酸−酸化スズ系の低融点ガラス粉末60〜99重量
%と低膨張セラミックスフィラー1〜40重量%とから
なり、焼成後の室温〜300℃の熱膨張係数が80×1
-7〜110×10-7/℃であることが好ましい。
When the sealing composition of the present invention is applied to seal a cathode ray tube panel and a funnel,
Consists of phosphoric acid-tin oxide low melting glass powder 60 to 99% by weight and low expansion ceramics filler 1 to 40% by weight, and has a thermal expansion coefficient of 80 × 1 at room temperature to 300 ° C. after firing.
It is preferably 0 −7 to 110 × 10 −7 / ° C.

【0018】かかる封着用組成物は、400℃〜500
℃の温度に5分〜1時間保持することにより、ブラウン
管のパネルとファンネルとを封着でき、封着後の300
〜380℃の排気時の加熱により、流動したり、発泡し
たり、機械的強度が損なわれたりすることがない。
Such a sealing composition has a temperature of 400 ° C to 500 ° C.
By holding at a temperature of ℃ for 5 minutes to 1 hour, the panel of the cathode ray tube and the funnel can be sealed, and after the sealing,
Heating at the time of evacuation to 380 ° C. does not cause fluidization, foaming, or loss of mechanical strength.

【0019】本発明の封着用組成物をブラウン管のパネ
ルとファンネルとを封着するために適用する場合におい
て、低融点ガラス粉末の含有量が99重量%超では、低
膨張セラミックスフィラーの量が少ないため、熱膨張係
数が大きくなりすぎ、パネルおよびファンネルと平均熱
膨張係数が合わず、割れやすい。その含有量が60重量
%未満では、ガラス分が少なく流動性が悪くなり、ブラ
ウン管として充分な真空が得られにくい。この場合、低
融点ガラス粉末と低膨張セラミックスフィラーとの総量
に対して低融点ガラス粉末の含有量は、より好ましくは
65〜99重量%、特に好ましくは70〜99重量%、
セラミックスフィラーの含有量は、より好ましくは1〜
35重量%、特に好ましくは1〜30重量%である。
When the sealing composition of the present invention is applied to seal a panel of a cathode ray tube and a funnel, when the content of the low melting point glass powder exceeds 99% by weight, the amount of the low expansion ceramic filler is small. For this reason, the coefficient of thermal expansion becomes too large, the average coefficient of thermal expansion does not match that of the panel and the funnel, and the panel is easily cracked. When the content is less than 60% by weight, the glass content is small and the fluidity is deteriorated, and it is difficult to obtain a sufficient vacuum for a cathode ray tube. In this case, the content of the low-melting glass powder with respect to the total amount of the low-melting glass powder and the low expansion ceramics filler is more preferably 65 to 99% by weight, particularly preferably 70 to 99% by weight,
The content of the ceramics filler is more preferably 1 to
35% by weight, particularly preferably 1 to 30% by weight.

【0020】また、室温〜300℃における焼成後の封
着用組成物の平均熱膨張係数が80×10-7〜110×
10-7/℃の範囲外になると、封着後のパネルガラスま
たはファンネルガラスまたは封着部に引張応力が働き、
バルブの耐圧強度が低下する。
The average thermal expansion coefficient of the sealing composition after firing at room temperature to 300 ° C. is 80 × 10 −7 to 110 ×.
When the temperature is out of the range of 10 −7 / ° C., tensile stress acts on the panel glass or funnel glass or the sealed portion after sealing,
The pressure resistance of the valve decreases.

【0021】本発明の封着用組成物をPDP封着用また
はVFD封着用に適用する場合は、リン酸−酸化スズ系
の低融点ガラス粉末50〜98重量%と低膨張セラミッ
クスフィラー2〜50重量%とからなり、焼成後の室温
〜250℃の熱膨張係数が60〜90×10-7/℃であ
ることが好ましい。
When the sealing composition of the present invention is applied to PDP sealing or VFD sealing, the phosphoric acid-tin oxide low melting glass powder is 50 to 98% by weight and the low expansion ceramics filler is 2 to 50% by weight. It is preferable that the thermal expansion coefficient at room temperature to 250 ° C. after firing is 60 to 90 × 10 −7 / ° C.

【0022】かかる封着用組成物は、400〜500℃
の温度で5分〜1時間保持することにより、PDP用ガ
ラス基板またはVFDを封着でき、封着後に280〜3
80℃で排気する際に、加熱により流動したり、発泡し
たり、機械的強度が損なわれたりすることがない。
The composition for sealing is 400 to 500 ° C.
The glass substrate for PDP or VFD can be sealed by holding at the temperature of 5 minutes to 1 hour.
When exhausted at 80 ° C., it does not flow, foam, or lose mechanical strength due to heating.

【0023】本発明の封着用組成物をPDP封着用また
はVFD封着用に適用する場合において、結晶性低融点
ガラス粉末の含有量が98重量%を超えると低融点フィ
ラー量が少ないため、焼成後の熱膨張係数が大きくなり
すぎて基板ガラスと熱膨張係数が合わず、封着後シール
フリット部に引張応力が残り割れやすい。50重量%未
満では、ガラス分が少なく流動性が悪くなりPDPやV
FDとして充分な封着部の気密性が得られない。この場
合、低融点ガラス粉末と低膨張セラミックスフィラーと
の総量に対して低融点ガラス粉末の含有量は、より好ま
しくは55〜98重量%、特に好ましくは60〜98重
量%、セラミックスフィラーの含有量は、より好ましく
は2〜45重量%、特に好ましくは2〜40重量%であ
る。
In the case of applying the sealing composition of the present invention to PDP sealing or VFD sealing, if the content of the crystalline low melting point glass powder exceeds 98% by weight, the amount of the low melting point filler is small, so that after firing, The coefficient of thermal expansion becomes too large and the coefficient of thermal expansion does not match that of the substrate glass, and tensile stress remains in the seal frit portion after sealing and cracks easily. If it is less than 50% by weight, the glass content is small and the fluidity becomes poor, so that PDP and V
As an FD, sufficient airtightness of the sealed portion cannot be obtained. In this case, the content of the low-melting glass powder with respect to the total amount of the low-melting glass powder and the low-expansion ceramics filler is more preferably 55 to 98% by weight, particularly preferably 60 to 98% by weight, and the content of the ceramics filler. Is more preferably 2 to 45% by weight, particularly preferably 2 to 40% by weight.

【0024】また、室温〜250℃における焼成後の封
着用組成物の平均熱膨張係数が60〜90×10-7/℃
の範囲外になると、封着後に基板ガラスまたは封着部に
引張応力が働き、耐圧強度が低下する。
The average thermal expansion coefficient of the sealing composition after firing at room temperature to 250 ° C. is 60 to 90 × 10 −7 / ° C.
If the value is out of the range, tensile stress acts on the substrate glass or the sealing portion after sealing, and the compressive strength decreases.

【0025】本発明において、低膨張セラミックスフィ
ラーは、望ましくは、重量表示で、封着用組成物量に対
してアルミナとジルコンの合量が9%以下である。アル
ミナは熱膨張係数が65×10-7〜75×10-7/℃
(50〜350℃)、ジルコンは熱膨張係数が42×1
-7〜48×10-7/℃(50〜350℃)であり、熱
膨張係数が比較的大きく、ガラスと混合しても熱膨張係
数を調整する効果が、他の低膨張フィラーより小さいた
めである。低膨張セラミックスフィラーの含有量を上記
の好ましい範囲にすると、ガラス成分の量をさほど減ら
すことなく、所望の熱膨張係数が得られるので、耐圧強
度の向上に効果がある。
In the present invention, the low-expansion ceramics filler is desirably a total weight of alumina and zircon of 9% or less based on the weight of the sealing composition in terms of weight. Alumina has a coefficient of thermal expansion of 65 × 10 −7 to 75 × 10 −7 / ° C.
(50 to 350 ° C), zircon has a thermal expansion coefficient of 42 x 1
0 -7 48 a × 10 -7 / ℃ (50~350 ℃ ), thermal expansion coefficient is relatively large, the effect of adjusting the thermal expansion coefficient be mixed with glass is smaller than other low-expansion filler This is because. When the content of the low-expansion ceramics filler is within the above-mentioned preferred range, a desired coefficient of thermal expansion can be obtained without significantly reducing the amount of the glass component, which is effective in improving the compressive strength.

【0026】参考にその他の熱膨張係数(50〜350
℃、単位:×10-7/℃)は、次に示す通りである。
For reference, other thermal expansion coefficients (50 to 350)
(° C, unit: × 10 -7 / ° C) is as shown below.

【0027】コージエライト 10〜 20、 チタン酸アルミニウム 10〜 20、 ムライト 50〜 60、 シリカ 5〜 6、 β−ユークリプタイト −60〜−80、 β−スポジュメン 8〜 15、 β−石英固溶体 −10〜+10。Cordierite 10 to 20, aluminum titanate 10 to 20, mullite 50 to 60, silica 5 to 6, β-eucryptite -60 to -80, β-spodumene 8 to 15, β-quartz solid solution -10. +10.

【0028】なお、上記観点では、封着用組成物量に対
してアルミナ、ジルコン以外の低膨張セラミックスフィ
ラーの合量が16重量%以上であることがより好まし
い。また、この組成物に着色のために顔料を添加して使
用することもできる。
From the above viewpoint, it is more preferable that the total amount of the low expansion ceramic filler other than alumina and zircon is 16% by weight or more based on the amount of the composition for sealing. In addition, a pigment may be added to the composition for coloring.

【0029】[0029]

【実施例】ガラス成分のうちP25 成分を除く固体原
料中に、85%正リン酸を滴下することによって得られ
た原料スラリーをよく混合した後に、120℃で乾燥す
ることによって粉末バッチを作成した。この原料を石英
ルツボ中に入れ、ふたをして1000〜1100℃で溶
融した後、水砕またはローラーを通すことによりフレー
ク状のガラスにした。次いでこれをボールミルにて所定
時間粉砕し、表1のガラス組成欄に示すような組成の低
融点ガラス粉末を製造した。
EXAMPLE A raw material slurry obtained by dropping 85% orthophosphoric acid into a solid raw material excluding the P 2 O 5 component of the glass component was well mixed and then dried at 120 ° C. to obtain a powder batch. It was created. This raw material was put into a quartz crucible, covered with a lid, melted at 1000 to 1100 ° C., and then granulated or passed through a roller to give a glass in the form of flakes. Then, this was pulverized with a ball mill for a predetermined time to produce a low melting point glass powder having a composition shown in the glass composition column of Table 1.

【0030】これらの低融点ガラス粉末と低膨張セラミ
ックスフィラーとを表1の構成欄に示す重量割合で混合
し、封着用組成物を調製した。例1〜8は実施例、例9
〜11は比較例である。また、例1〜5、例9はブラウ
ン管用途、例6、7、10はPDP用途、例8、11は
VFD用途に調製した例である。
These low-melting glass powders and low-expansion ceramics fillers were mixed in a weight ratio shown in the constitutional column of Table 1 to prepare a sealing composition. Examples 1 to 8 are Examples and Example 9
11 are comparative examples. Further, Examples 1 to 5 and Example 9 are prepared for cathode ray tubes, Examples 6, 7, and 10 are prepared for PDP, and Examples 8 and 11 are prepared for VFD.

【0031】この封着用組成物について、フローボタン
径、接着残留歪、平均熱膨張係数を測定した結果を表1
に示す。それぞれの測定法は以下のとおりである。
The results of measuring the flow button diameter, adhesive residual strain, and average thermal expansion coefficient of this sealing composition are shown in Table 1.
Shown in Each measuring method is as follows.

【0032】フローボタン径:封着時の組成物の流動性
を示すもので、封着組成物の試料粉末ブラウン管用は
5.5g、PDP,VFD用は3.5gを、直径12.
7mmの円柱状に加圧成形後、表1に記載した焼成温度
(単位:℃)に、30分間保持したとき、封着組成物が
流動した直径(単位:mm)である。このフローボタン
径は、ブラウン管用は26.5mm以上、PDP用は2
0mm以上、VFD用は20mm以上が望ましい。
Flow button diameter: It shows the fluidity of the composition at the time of sealing, and is 5.5 g for the sample powder cathode ray tube of the sealing composition, 3.5 g for PDP and VFD, and the diameter is 12.
It is the diameter (unit: mm) through which the sealing composition flows when it is held at the firing temperature (unit: ° C) described in Table 1 for 30 minutes after being pressure-molded into a 7 mm columnar shape. The diameter of this flow button is 26.5 mm or more for CRT and 2 for PDP.
0 mm or more, and for VFD, 20 mm or more is desirable.

【0033】接着残留歪:封着組成物とビヒクル(酢酸
イソアミルにニトロセルロース1.2%を溶解した溶
液)とを重量比6.5:1の割合で混合してペーストと
した。このペーストをブラウン管用はファンネルガラス
片の上、PDP、VFD用は基板ガラス片の上に塗布
し、フローボタン径の場合と同条件で焼成後、ガラス片
と焼成後の封着用組成物との間に発生した残留歪(単
位:nm/cm)をポーラリメーターを用いて測定し
た。「+」は封着用組成物が圧縮歪、「−」は焼成後の
封着用組成物が引張歪を受けていることを示す。この残
留歪は−100〜+500nm/cmの範囲が望まし
い。
Adhesive residual strain: The sealing composition and the vehicle (solution of 1.2% nitrocellulose dissolved in isoamyl acetate) were mixed at a weight ratio of 6.5: 1 to form a paste. This paste is applied on a funnel glass piece for a cathode ray tube and on a substrate glass piece for a PDP and VFD, and after firing under the same conditions as in the case of a flow button diameter, a glass piece and a sealing composition after firing are applied. The residual strain (unit: nm / cm) generated during the measurement was measured using a polarimeter. "+" Indicates that the sealing composition is under compression strain, and "-" indicates that the sealing composition after firing is under tensile strain. This residual strain is desirably in the range of -100 to +500 nm / cm.

【0034】平均熱膨張係数:封着用組成物をフローボ
タン径の場合と同条件で焼成後、所定寸法に研磨して、
熱膨張測定装置により昇温速度10℃/分の条件で伸び
の量を測定し、室温〜300℃(ブラウン管用途)また
は室温〜250℃(PDPまたはVFD用途)での平均
熱膨張係数(単位:×10-7/℃)を算出した。ブラウ
ン管ガラス用途においては、熱膨張係数のマッチングを
考慮すると、この平均熱膨張係数は80〜110×10
-7-1の範囲が望ましい。PDP用基板ガラス、VFD
用基板ガラス用途においては、熱膨張係数のマッチング
を考慮するとこの平均熱膨張係数は60〜90×10-7
-1の範囲が望ましい。
Average coefficient of thermal expansion: The composition for sealing was baked under the same conditions as in the case of the flow button diameter, and then ground to a predetermined size,
The amount of elongation is measured by a thermal expansion measuring device at a temperature rising rate of 10 ° C./min, and an average coefficient of thermal expansion at room temperature to 300 ° C. (for cathode ray tube) or room temperature to 250 ° C. (for PDP or VFD) (unit: × 10 −7 / ° C.) was calculated. In the use of cathode ray tube glass, the average coefficient of thermal expansion is 80 to 110 × 10 considering the matching of coefficients of thermal expansion.
The range of -7-1 is desirable. Substrate glass for PDP, VFD
Considering the matching of the coefficient of thermal expansion, the average coefficient of thermal expansion is 60 to 90 × 10 −7 in the application of glass for substrates.
The range of -1 is desirable.

【0035】また、これらの封着用組成物を用いて封着
を行ったブラウン管、PDP、VFDの強度を測定し
た。
Further, the strengths of cathode ray tubes, PDPs, and VFDs sealed with these sealing compositions were measured.

【0036】ブラウン管については、25型のファンネ
ルとパネルの間に封着用組成物を介在させ、400〜5
00℃に30分間保持してファンネルとパネルを封着し
てバルブを製造し、このバルブについて耐水圧強度、耐
熱強度を測定した。
For a cathode ray tube, a sealing composition is interposed between a 25-type funnel and a panel, and the composition is 400-5.
The valve was manufactured by keeping the funnel and the panel sealed at 00 ° C for 30 minutes, and the water pressure resistance and heat resistance of the valve were measured.

【0037】また、PDPについては、この封着用組成
物をあらかじめPDPの基板の端部に介在させ、400
〜500℃で30分保持して封着して、パネルを製造し
た。
With respect to the PDP, the sealing composition was preliminarily placed at the end of the substrate of the PDP, and
A panel was manufactured by holding at ~ 500 ° C for 30 minutes and sealing.

【0038】さらに、VFDの場合は電極等を形成した
ガラス基板の端部の間にグリッドを設置して介在させ4
00〜500℃で30分間保持してガラス基板どうしを
封着して、パネルを製造した。
Further, in the case of VFD, a grid is placed between the end portions of the glass substrate on which the electrodes and the like are formed to interpose 4
A panel was manufactured by holding the glass substrate at 00 to 500 ° C. for 30 minutes to seal the glass substrates together.

【0039】これらのパネルについて、耐水圧強度、耐
熱強度を測定した結果を表1に示した。それぞれの測定
法は次のとおりである。 耐水圧強度:バルブまたはパネルの内外に水による圧力
差を与えて破壊するときの圧力差を測定した(単位:k
g/cm2 、5個の平均値)。バルブまたはパネルとし
ての強度を保証するために、通常この耐水圧強度は3k
g/cm2 以上が望ましい。
Table 1 shows the results of measuring the water pressure resistance and heat resistance of these panels. Each measuring method is as follows. Water pressure resistance strength: The pressure difference at the time of breaking by applying a pressure difference due to water to the inside or outside of the valve or panel was measured (unit: k
g / cm 2 , 5 average value). In order to guarantee the strength as a valve or panel, this water pressure resistance strength is usually 3k.
It is preferably g / cm 2 or more.

【0040】耐熱強度:バルブまたはパネルの内外に水
と湯による温度差を与えて破壊するときの温度差を測定
した(単位:℃、5個の平均値)。ブラウン管、PD
P、VFDを製造する際の熱処理工程で発熱する熱応力
を考慮すると、通常この耐熱強度は45℃以上であるこ
とが望ましい。
Heat resistance: The temperature difference between water and hot water was applied to the inside and outside of the valve or panel to measure the temperature difference (unit: ° C, average of 5 pieces). CRT, PD
Considering the thermal stress generated in the heat treatment process for manufacturing P and VFD, it is usually desirable that the heat resistance strength is 45 ° C. or higher.

【0041】表1から、本発明に係る封着用組成物は従
来品以上の特性を有することがわかる。例1、2は熱膨
張係数の比較的大であるジルコン及びアルミナの合量が
少ないため、耐水圧強度が例3より高めである。また、
例6も熱膨張係数が比較的大であるジルコン及びアルミ
ナの合量が少ないため、耐水圧強度が例7より高めであ
る。
From Table 1, it can be seen that the sealing composition according to the present invention has the properties superior to those of the conventional products. In Examples 1 and 2, since the total amount of zircon and alumina having a relatively large coefficient of thermal expansion is small, the water pressure resistance strength is higher than that in Example 3. Also,
In Example 6 as well, since the total amount of zircon and alumina having a relatively large thermal expansion coefficient is small, the water pressure resistance strength is higher than that in Example 7.

【0042】[0042]

【表1】 [Table 1]

【0043】[0043]

【発明の効果】本発明によれば、鉛を全く含まない、ブ
ラウン管、PDP、VFDなどの封着に好適な封着用組
成物が得られる。本発明の封着用組成物を用いて封着し
たブラウン管、PDP、VFDは特に耐水圧強度、耐熱
強度に優れている。
EFFECTS OF THE INVENTION According to the present invention, a sealing composition containing no lead and suitable for sealing cathode ray tubes, PDPs, VFDs and the like can be obtained. Braun tubes, PDPs and VFDs sealed with the sealing composition of the present invention are particularly excellent in water pressure resistance and heat resistance.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H01J 11/02 H01J 11/02 D 17/18 17/18 29/86 29/86 Z ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical indication location H01J 11/02 H01J 11/02 D 17/18 17/18 29/86 29/86 Z

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】リン酸−酸化スズ系の低融点ガラス粉末5
0〜99重量%と低膨張セラミックスフィラー1〜50
重量%とからなる組成物であり、低融点ガラス粉末の組
成が実質的にモル表示で、 SnOに換算したスズ酸化物 50〜72%、 ZnO 0〜10%、 P25 25〜40%、 からなることを特徴とする封着用組成物。
1. A phosphoric acid-tin oxide-based low-melting glass powder 5
0 to 99% by weight and low expansion ceramic filler 1 to 50
The composition of the low-melting-point glass powder is substantially in terms of mol, and the tin oxide converted to SnO is 50 to 72%, ZnO is 0 to 10%, and P 2 O 5 is 25 to 40%. A composition for sealing, which comprises:
【請求項2】低膨張セラミックスフィラーが、ジルコ
ン、コージエライト、チタン酸アルミニウム、アルミ
ナ、ムライト、シリカ、β−ユークリプタイト、β−ス
ポジュメンおよびβ−石英固溶体からなる群から選ばれ
た1種以上である請求項1記載の封着用組成物。
2. The low expansion ceramics filler is one or more selected from the group consisting of zircon, cordierite, aluminum titanate, alumina, mullite, silica, β-eucryptite, β-spodumene and β-quartz solid solution. The composition for sealing according to claim 1.
【請求項3】リン酸−酸化スズ系の低融点ガラス粉末6
0〜99重量%と低膨張セラミックスフィラー1〜40
重量%とからなり、焼成後の室温〜300℃の熱膨張係
数が80×10-7〜110×10-7/℃であることを特
徴とするブラウン管のパネルとファンネルとを封着する
ための請求項1または2記載の封着用組成物。
3. A phosphoric acid-tin oxide-based low melting point glass powder 6
0 to 99% by weight and low expansion ceramic filler 1 to 40
%, And has a thermal expansion coefficient of 80 × 10 −7 to 110 × 10 −7 / ° C. at room temperature to 300 ° C. after firing, for sealing a funnel panel and a cathode ray tube panel. The composition for sealing according to claim 1 or 2.
【請求項4】リン酸−酸化スズ系の低融点ガラス粉末5
0〜98重量%と低膨張セラミックスフィラー2〜50
重量%とからなり、焼成後の室温〜250℃の熱膨張係
数が60×10-7〜90×10-7/℃であることを特徴
とするプラズマディスプレイまたは蛍光表示管を封着す
るための請求項1または2記載の封着用組成物。
4. A phosphoric acid-tin oxide-based low melting point glass powder 5
0-98% by weight and low expansion ceramic filler 2-50
For sealing a plasma display or a fluorescent display tube, characterized by having a thermal expansion coefficient of 60 × 10 −7 to 90 × 10 −7 / ° C. at room temperature to 250 ° C. after firing. The composition for sealing according to claim 1 or 2.
【請求項5】低膨張セラミックスフィラーは、重量表示
で、アルミナとジルコンの合量が封着用組成物量に対し
て9%以下である請求項1、2、3または4記載の封着
用組成物。
5. The sealing composition according to claim 1, 2, 3 or 4, wherein the low expansion ceramics filler has a total amount of alumina and zircon of 9% or less based on the weight of the sealing composition in terms of weight.
JP8255898A 1995-12-19 1996-09-27 Sealing composition Withdrawn JPH09227154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8255898A JPH09227154A (en) 1995-12-19 1996-09-27 Sealing composition

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP33040595 1995-12-19
JP7-330405 1995-12-19
JP8255898A JPH09227154A (en) 1995-12-19 1996-09-27 Sealing composition

Publications (1)

Publication Number Publication Date
JPH09227154A true JPH09227154A (en) 1997-09-02

Family

ID=26542456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8255898A Withdrawn JPH09227154A (en) 1995-12-19 1996-09-27 Sealing composition

Country Status (1)

Country Link
JP (1) JPH09227154A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002255587A (en) * 2001-03-02 2002-09-11 Nippon Electric Glass Co Ltd Glass paste
JP2002326838A (en) * 2001-05-08 2002-11-12 Nippon Electric Glass Co Ltd Glass paste
JP2003128434A (en) * 2001-10-19 2003-05-08 Matsushita Electric Ind Co Ltd Plasma display panel and method for manufacturing the same and glass composition
JP2004059366A (en) * 2002-07-29 2004-02-26 Asahi Techno Glass Corp Lead-free low melting glass and sealing material
US7425518B2 (en) 2003-02-19 2008-09-16 Yamato Electronic Co., Ltd. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
US7585798B2 (en) 2003-06-27 2009-09-08 Yamato Electronic Co., Ltd. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
JP2010229002A (en) * 2009-03-30 2010-10-14 Nippon Electric Glass Co Ltd SnO-P2O5 GLASS USED FOR PHOSPHOR COMPOSITE MATERIAL

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002255587A (en) * 2001-03-02 2002-09-11 Nippon Electric Glass Co Ltd Glass paste
JP2002326838A (en) * 2001-05-08 2002-11-12 Nippon Electric Glass Co Ltd Glass paste
JP2003128434A (en) * 2001-10-19 2003-05-08 Matsushita Electric Ind Co Ltd Plasma display panel and method for manufacturing the same and glass composition
JP2004059366A (en) * 2002-07-29 2004-02-26 Asahi Techno Glass Corp Lead-free low melting glass and sealing material
US7425518B2 (en) 2003-02-19 2008-09-16 Yamato Electronic Co., Ltd. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
US7585798B2 (en) 2003-06-27 2009-09-08 Yamato Electronic Co., Ltd. Lead-free glass material for use in sealing and, sealed article and method for sealing using the same
JP2010229002A (en) * 2009-03-30 2010-10-14 Nippon Electric Glass Co Ltd SnO-P2O5 GLASS USED FOR PHOSPHOR COMPOSITE MATERIAL

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