JPH09221558A - Production of antistatic plastic plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process for producing an antistatic plastic plate by coating, whereby an antistatic coating film can be firmly and homogeneously laid on a plastic plate without causing its deformation or distortion. SOLUTION: This process for forming an antistatic plate or sheet comprises applying a photocuring conductive coating material to a transparent plastic film, drying the wet film to form a conductive layer, separately heating the conductive layer and the plastic plate, laying the heated conductive layer on the heated plastic plate, irradiating the laid conductive layer with an actinic radiation through a transparent plastic film to cure the conductive layer, and peeling the transparent film from the surface of the conductive layer.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a method for manufacturing an antistatic plastic plate.

[0002]

2. Description of the Related Art Materials for semiconductor wafer storage containers, floor materials and wall materials in manufacturing plants that require various kinds of ultra- or ultra-fine processing such as electronic components and semiconductors are subject to the adhesion of dust due to electrification.
A highly antistatic plastic plate is used for the purpose of preventing secondary contamination and the like due to dropping and re-dispersion of the dust. Conventionally, antistatic plastics used for the above purpose are made of fine metal powders such as aluminum and zinc, metal oxides such as titanium oxide, zinc oxide and tin oxide, conductive carbon powder, conductive polyaniline powder and the like. When applying a conductive substance to the surface of a molded product such as a plastic plate thinly and uniformly, or when molding a plastic such as a processing material such as a sheet or a plate or a molded product such as a storage container for semiconductor wafers, knead it uniformly in the plastic. The conductive plastic composition was molded by extrusion molding or injection molding to produce a conductive plastic molded product.

[0003] However, a molded article obtained by uniformly kneading a conductive substance in the above-mentioned plastic and extruding or molding the conductive plastic composition is kneaded in order to increase the light transmittance. Optically devised, such as making the particle size of the conductive substance to be 0.2 μm or less, but in most cases, even if the plastic itself gives a transparent molded article, The transparency was significantly impaired by the conductive substance dispersed therein.

[0004] Therefore, in order to produce a highly antistatic and highly transparent plastic plate,
A coating method in which a portion having an antistatic function is concentrated on a surface portion is employed, and the coating film having an antistatic function is formed of an extremely thin layer in order to maintain translucency. Therefore, it is necessary to improve the accuracy of the thickness of the coating film so that the variation in the antistatic ability does not occur due to the extreme variation in the thickness.

As a conductive resin sheet as described above and a method for producing the same, Japanese Patent Application Laid-Open No. Hei 6-263899 discloses a method in which a paint composed of a thermoplastic resin and a conductive material is applied to the surface of a thermoplastic resin release film and cured. To form a conductive coating,
Next, the release film, a method for producing a conductive resin sheet, the coating surface of which faces the surface of a thermoplastic resin base sheet, and thermocompression bonding with the resin base sheet, the conductive material is polyaniline A method for manufacturing a conductive resin sheet and a conductive resin sheet formed by laminating a conductive coating layer comprising the thermoplastic resin and conductive polyaniline on a surface of a thermoplastic resin base sheet in a heat and pressure integrated manner. Is disclosed.

However, in the method of manufacturing a conductive resin sheet disclosed in Japanese Patent Application Laid-Open No. Hei 6-263899, it is necessary to laminate the conductive coating layer on the surface of the thermoplastic resin base sheet by heat and pressure. Can not be adhered to the surface of the thermoplastic resin substrate sheet unless the conductive coating layer is heated to a considerably high temperature, and therefore, when heated to such a high temperature and hot pressed, the thermoplastic resin substrate sheet However, there is a problem that the material is thermally deformed.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and an object of the present invention is to provide a method for producing a highly antistatic plastic plate by a coating method, which is a plastic plate. It is an object of the present invention to provide a method for producing an antistatic plastic plate, which allows an antistatic coating film to be uniformly and firmly laminated without deformation or distortion.

[0008]

According to the present invention, a transparent plastic film is coated with a photocurable conductive coating material and dried to form a conductive layer. The first step is heating the conductive layer and the plastic plate. The second step and the third step,
A fourth step of laminating the heated conductive layer on the heated plastic plate, a fifth step of irradiating the laminated conductive layer with the transparent plastic film to actinic rays to cure the conductive layer. The gist is a method for producing an antistatic plastic plate or sheet, which comprises a step and a sixth step of peeling the transparent plastic film from the surface of the conductive layer.

The above-mentioned photocurable conductive coating material comprises (a) a thermoplastic resin, (b) a conductive powder, (c) a (meth) acrylate compound having at least two or more (meth) acryloyl groups in the molecule, and (D) A photopolymerization initiator is a constituent. The above-mentioned (a) thermoplastic resin is not particularly limited as long as it can be molded by usual thermoforming equipment. For example, acrylic resin, vinyl chloride resin,
Examples thereof include polystyrene resin, polyurethane resin, polycarbonate resin and the like.

The conductive powder (b) is not particularly limited as long as it does not significantly impair the translucency.
It is appropriately selected and used from inorganic conductive powder and organic conductive powder. As the inorganic conductive powder, for example,
Conductive powder whose surface or the whole particle is made of a tin oxide component.
A conductive powder added with 20% by weight may be used. The electroconductive powder made of the tin oxide component exhibits high electroconductivity, but when the particle size is large, visible light is scattered and the transparency of the electroconductive coating film obtained is reduced, so that the particle size is 0.
It is preferably 4 μm or less. However, in the case of a conductive powder in which tin oxide is coated on the surface of particles having transparency such as barium sulfate, the scattering of the visible light is small, and thus the particle diameter may be 0.4 μm or more.

A conductive powder obtained by coating the surface of particles having transparency such as barium sulfate with antimony oxide-containing tin oxide is preferably used because of its high transparency. The particle diameter of the conductive powder obtained by coating the surface of barium sulfate particles with the antimony oxide-containing tin oxide is 0.01 to 2 particles.
It is preferably used in the range of μm. The particle size is 0.01
When the thickness is less than μm, the volume ratio of barium sulfate particles as the core material in the conductive coating film formed to have the required conductivity becomes small, and the transparency of the conductive coating film decreases. On the other hand, if the particle size exceeds 2 μm, the smoothness of the formed conductive coating film is reduced, minute air holes are generated between the filled conductive powders, the conductive coating film becomes cloudy, and the Lower.

The compounding amount of the above-mentioned inorganic conductive powder is preferably 100 to 500 parts by weight with respect to 100 parts by weight of the thermoplastic resin used as the binder. The blending amount is 10
When the amount is less than 0 parts by weight, the conductivity of the formed conductive coating film is lowered, and the necessary antistatic effect cannot be obtained, and when the amount is more than 500 parts by weight, the conductivity formed is The transparency of the coating film decreases.

As the organic conductive powder, for example,
Conductive powders such as an aniline polymer, a pyrrole polymer, and a thiophene polymer are exemplified. Above all, a conductive aniline polymer is preferably used because of its excellent thermal stability. The content of the conductive aniline-based polymer is preferably 0.1 to 30 parts by weight with respect to 100 parts by weight of the thermoplastic resin used as the binder. When the amount is less than 0.1 part by weight, the conductivity of the conductive coating film to be formed is reduced, the required antistatic effect is not obtained, and when the amount exceeds 30 parts by weight. As a result, the transparency of the formed conductive coating film decreases.

The above (c) (meth) acrylate compound having at least two (meth) acryloyl groups in the molecule is not particularly limited as long as it can be polymerized by active rays such as ultraviolet rays and visible rays. However, for example, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, nonaethylene glycol di (meth) acrylate, polyethylene glycol Di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, nonapropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate , Pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, trimethylolpropane tri (meth) acrylate, glycerol tri (meth) acrylate, tris- (2-hydroxy Ethyl) -isocyanuric acid ester (meth) acrylate, 2,2-bis [4
-(Acryloxydiethoxy) phenyl] propane,
2,2-bis [4- (methacryloxydiethoxy) phenyl] propane, 3-phenoxy-2-propanoyl acrylate, 1,6-bis (3-acryloxy-2-hydroxypropyl) -hexyl ether, tetramethylolmethane Tetra (meth) acrylate etc. are mentioned.

In the photocurable conductive coating composition, the amount of the (meth) acrylate compound having at least two (meth) acryloyl groups in the molecule (c) is 100 parts by weight of the thermoplastic resin (a). 10 to 250 for a part
It is preferably part by weight, more preferably 30 to 200 parts by weight. When the addition amount is a small amount less than 10 parts by weight,
The surface hardness of the conductive layer containing the above components after irradiation with actinic rays such as ultraviolet rays or visible rays is insufficient, and the addition amount is 250
When the amount is more than the weight part, the surface of the conductive layer obtained from the photocurable conductive coating material may be cracked or the tackiness may be insufficient, resulting in insufficient adhesion to the plastic plate as the base material.

The (d) photopolymerization initiator is a (meth) acrylate compound which is activated by actinic rays such as ultraviolet rays and visible rays and has at least two or more (meth) acryloyl groups in the molecule (c). It is not particularly limited as long as it has the ability to initiate the polymerization,
Examples of substances activated by ultraviolet rays include sulfides such as sodium methyldithiocarbamate sulfide, tetramethylthiuram monosulfide, diphenylmonosulfide, dibenzothiazoyl monosulfide, dibenzothiazoyl disulfide, thioxanthone, ethylthioxanthone, and 2 -Thioxanthone and its derivatives such as chlorothioxanthone, diethylthioxanthone and diisopropylthioxanthone, diazo compounds such as hydrazone, azoisobutyronitrile and benzenediazonium, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzophenone, dimethylaminobenzophenone , Michler's ketone, benzyl anthraquinone, t
-Butyl anthraquinone, 2-methyl anthraquinone,
Aromatic carbonyl compounds such as 2-ethylanthraquinone, 2-aminoanthraquinone, 2-chloroanthraquinone, benzyldimethylketal, methylphenylglyoxylate, 1-hydroxycyclohexylphenylketone, 2-hydroxy-2-methyl-1-phenylpropane -1-one, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, 2,
Acetophenone derivatives such as 2-diethoxyacetophenone and 2,2-dimethoxyacetophenone, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isopropyl 4-dimethylaminobenzoate, 4-
Dialkylaminobenzoic acid esters such as butyl dimethylaminobenzoate, benzoyl peroxide, di-t
-Peroxides such as butyl peroxide, dicumyl peroxide and cumene hydroperoxide, acridine derivatives such as 9-phenylacridine, 9-p-methoxyphenylacridine, 9-acetylaminoacridine and benzacridine, 9,10- Phenazine derivatives such as dimethylbenzphenazine, 9-methylbenzphenazine and 10-methoxybenzphenazine, 4,4 ^' , 4 ^"
Quinoxaline derivatives such as trimethoxy-2,3-diphenylquinoxaline, 2,4,5-triphenylimidazoyl dimer, halogenated ketones, acylphosphine oxides, acylated phosphorus compounds such as acylphosphonates, and the like. .

Further, as those which are activated by visible light,
For example, 2-nitrofluorene, 2,4,6-tris (trichloromethyl) -1,3,5-triazine, 3,
^3' -Carbonyl biscoumarin, thiomichler ketone, etc. are mentioned.

A non-volatile amine compound or amino compound is added, if necessary, in order to prevent a decrease in sensitivity due to oxygen inhibition of the photopolymerization initiator (d). The amine compound or amino compound is not particularly limited, but for example, triethanolamine,
Amine compounds such as methyldiethanolamine, dialkylaminobenzoates, photopolymerization initiators containing an amino group such as Michler's ketone, etc. are effectively used.

The amount of the photopolymerization initiator added to the photocurable conductive coating composition is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 100 parts by weight of the thermoplastic resin (a). ~ 8 parts by weight. If the amount added is less than 0.01 parts by weight, the photopolymerization rate will be low and the resulting coating film will be insufficiently cured, and if the amount added is more than 10 parts by weight, the photopolymerization rate will be insufficient. Not only does it reach a saturated state and no further effect is obtained, but also the coating film obtained by excessive addition turns yellow.

In addition to the thermoplastic resin and the conductive powder, an organic solvent, an ultraviolet absorber, an antioxidant, a thermal polymerization inhibitor, etc. may be added to the above-mentioned photocurable conductive coating material, if necessary.

The organic solvent is appropriately selected and used depending on the type of the base plastic plate to which the photocurable conductive coating material is applied and the type of the thermoplastic resin used as the binder. The boiling point is 70 to 160 ° C. Something is preferable. When the boiling point is less than 70 ° C, evaporation during coating is large, the viscosity of the photocurable conductive coating material changes, and the coating property is lowered, and when the boiling point exceeds 160 ° C, a large amount of energy is required for drying. .

Examples of the organic solvent include cyclohexanone, ethylene glycol monomethyl ether (methyl cellosolve), ethylene glycol monoethyl ether (ethyl cellosolve), diethylene glycol dimethyl ether, butyl acetate, isopropyl acetone, methyl ethyl ketone, methyl isopropyl ketone, toluene, xylene. , Anisole and the like.

The UV absorber is not particularly limited, but examples thereof include salicylic acid UV absorbers, benzophenone UV absorbers, benzotriazole UV absorbers, and cyanoacrylate UV absorbers. . Examples of the antioxidant include a phenolic antioxidant, a phosphoric acid antioxidant, and a sulfur antioxidant. Examples of the thermal polymerization inhibitor include hydroquinone and p-methoxyphenol.

Further, in order to improve the dispersibility of the conductive powder in the thermoplastic resin used as the binder, the conductive powder is previously mixed with a silane coupling agent, a titanium coupling agent, an aluminate coupling agent or the like. It is also effective to perform surface treatment before placing.

The method for preparing the photocurable conductive coating material is not particularly limited, but the above-mentioned (a) thermoplastic resin and (b) conductive powder used as a binder and (c) in the molecule are used. It is prepared by mixing and dissolving a (meth) acrylate compound having at least two or more (meth) acryloyl groups and (d) a photopolymerization initiator in an organic solvent, and a photocurable conductive coating material comprising the above components. As a device for mixing and dissolving the composition in an organic solvent, for example, a sand mill, a ball mill, an attritor, a high speed rotary stirring device, a triple roll, or the like is used.

Ultraviolet rays or visible rays are used as the above-mentioned actinic rays, and an ultraviolet ray polymerization initiator or a visible ray polymerization initiator is added to the photocurable conductive coating composition according to the kind of the above-mentioned actinic rays. It

The transparent plastic film used in the first step is not particularly limited as long as it does not significantly reduce the irradiation efficiency upon irradiation with actinic rays such as ultraviolet rays or visible rays. Examples thereof include polyolefin films such as polyethylene and polypropylene, and polyester films such as polyethylene terephthalate. The transparent plastic film may be subjected to a uniaxial or biaxial stretching treatment, or may be subjected to a surface release treatment as required.

The photocurable conductive coating material is applied onto the transparent plastic film. The coating method employed in the first step is not particularly limited as long as it is a method capable of precise coating. Although not limited thereto, for example, a spray method, a bar coating method, a doctor blade method, a roll coating method, a dipping method and the like can be mentioned.

The conductive layer formed on the transparent plastic film preferably has a thickness of 0.5 to 5 μm. If the thickness of the conductive layer is less than 0.5 μm, the conductivity becomes insufficient, and the required antistatic effect cannot be obtained.
On the other hand, when the thickness of the conductive layer exceeds 5 μm, the total light transmittance decreases and the transparency decreases.

The plastic plate is not particularly limited, but for example, vinyl chloride (PV
C) type resin, acrylic type resin, ABS (acrylonitrile-butadiene-styrene) type resin, polycarbonate (PC) resin, polyethylene terephthalate resin, polyether ether ketone (PEEK) resin, polyphenylene sulfide (PPS) resin, polyether sulfone Examples thereof include plates and sheets molded from plastic such as (PES) resin, polysulfone resin, polyimide resin, polyetherimide resin, and fluororesin.

In the second and third steps, the first
The conductive layer formed on the transparent plastic film in the process and the plastic plate are heat-treated. The heating means is not particularly limited as long as it can uniformly heat to the required temperature, but for example, hot air heating, microwave irradiation to generate heat (conductive layer)
Microwave heating, infrared heating with an infrared heater, and the like. These heating means may be used alone or in combination. Especially, since infrared heating has little heating unevenness and can be used stably, it can be suitably used as a heating means for the conductive layer formed on the transparent plastic film.

The heating temperature of the conductive layer formed on the transparent plastic film and the plastic plate in the second and third steps is preferably 40 to 1.
30 degreeC, More preferably, it is 50-100 degreeC. When the heating temperature is lower than 40 ° C, the adhesion between the layers of the conductive layer / plastic plate laminate obtained is insufficient, and when the heating temperature is higher than 130 ° C, it is formed on the heated transparent plastic film. The applied conductive layer and the plastic plate are deformed.

In the fourth step, the second step and the third step
The conductive layer and the plastic plate formed on the transparent plastic film heat-treated in the process are
It is laminated. The means for laminating the conductive layer and the plastic plate is not particularly limited, but examples thereof include one using a laminating device using heating / pressurizing rolls and one using a hot pressing device.

In the fifth step, the conductive layer and the plastic plate formed on the transparent plastic film have at least two (meth) acryloyl groups in the molecule (c) present in the conductive layer. Is reliably adhered by the (meth) acrylate compound having a. In this state, the conductive layer is cured by irradiating the conductive layer with actinic rays such as ultraviolet rays or visible rays through the transparent plastic film. Firmly adheres to the plastic plate surface. As a light source of the actinic ray, for example, a high-pressure mercury lamp, a halogen lamp, a xenon lamp, a nitrogen laser, a He-Cd laser, an Ar laser or the like is used.

Then, in the sixth step, the transparent plastic film is peeled off from the surface of the cured conductive layer to manufacture an antistatic plastic plate.

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

[Preparation of Photocurable Conductive Paint] Conductive Paint A Copolymer resin for binder (commercial name: S-REC E- manufactured by Sekisui Chemical Co., Ltd.) consisting of 10 mol% of 2-hydroxypropyl acrylate and 90 mol% of vinyl chloride. HA) 100
Parts by weight, methyl ethyl ketone 200 parts by weight, cyclohexanone 800 parts by weight, polyethylene glycol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: A-200) 1
00 parts by weight and 3 parts by weight of a photopolymerization initiator (manufactured by Ciba-Geigy, trade name: Irgacure 184, substance name: 1-hydroxycyclohexyl phenyl ketone) are charged in an attritor and dissolved by stirring. Next, the primary particle size is 0.0
A photocurable conductive coating material A was prepared by adding 300 parts by weight of antimony oxide-containing tin oxide powder (trade name: T-1 manufactured by Mitsubishi Materials Corp.) of 2 μm with stirring and dispersing for 8 hours.

Conductive paint B In place of the antimony oxide-containing tin oxide powder of the conductive paint A, conductive powder having an average particle size of 0.2 μm (Mitsui Kinzoku Co. A photocurable conductive coating material B was prepared in the same manner as the conductive coating material A except that 200 parts by weight of the trade name: Pastran Type-IV) was used.

Conductive paint C 100 parts by weight of a methacrylate resin (trade name: Delpet LP-1 manufactured by Asahi Kasei Co., Ltd.), 60 parts by weight of methyl ethyl ketone, and 240 parts by weight of cyclohexanone are charged into an attritor and dissolved by stirring. Next, organic conductive aniline-polymer powder (trade name: Ve manufactured by Allied Signal Co., Ltd.)
15 parts by weight of rsicon) was added with stirring and dispersed by stirring for 8 hours to prepare a photocurable conductive coating material C.

Example 1 A conductive paint A was dried on a polyethylene terephthalate film (manufactured by Teijin Ltd., trade name: Tetron Film HP7) having a thickness of 25 μm so that the film thickness after drying was 2 μm using a bar coater. The conductive layer was formed by coating and drying (first step). Next, the conductive layer obtained in the first step and the transparent acrylic resin plate having a thickness of 3 mm are each heated with hot air so that the surface temperature thereof becomes 60 ° C. (second step and third step), Surface temperature is 60
The transparent acrylic resin plate heated to ℃ and the conductive layer are laminated so that they are in contact with each other, and thermocompression-bonded at a pressure of 4 kg / cm ^{2 with} a pressure roll heated to a temperature of 100 ° C. / A polyethylene terephthalate film laminate was prepared (fourth step).

The laminate obtained in the fourth step is strongly adhered to each other by virtue of the adhesive property of the conductive layer. Then, high pressure mercury is applied to the laminate from the polyethylene terephthalate film side of the laminate. The conductive layer was cured by irradiating the lamp with ultraviolet light having a light intensity of 1000 mJ / cm ² , whereby the transparent acrylic resin plate and the cured conductive layer were firmly bonded (fifth step). The polyethylene terephthalate film used for transfer was peeled from the surface of the photo-cured conductive layer obtained as described above (sixth step) to prepare an antistatic transparent acrylic resin plate.

(Examples 2 to 5), (Comparative Examples 1 to 3) In the second step and the third step, the surface temperature of the conductive layer obtained in the first step and the surface temperature of the transparent acrylic resin plate having a thickness of 3 mm were respectively adjusted. An antistatic transparent acrylic resin plate was produced in the same manner as in Example 1 except that heating was performed as shown in Table 1.

(Embodiment 6) In the first step, Embodiment 1
An antistatic transparent acrylic resin plate was produced in the same manner as in Example 1 except that the conductive coating material B was used instead of the conductive coating material A.

(Embodiment 6) In the first step, the first embodiment
An antistatic transparent acrylic resin plate was produced in the same manner as in Example 1 except that the conductive paint C was used in place of the conductive paint A.

In order to evaluate the performance of the antistatic plastic plates obtained in the above Examples and Comparative Examples, the following items were evaluated by the methods shown for each item.
The evaluation results are shown in Table 1.

1. Surface resistivity: The surface resistivity was measured according to ASTM D257. 2. Total light transmittance: The total light transmittance was measured according to ASTM D1003. 3. Haze: Haze was measured according to ASTM D1003. 4. Adhesion: In order to evaluate the adhesion between the conductive layer and the base plastic plate in accordance with JIS K 5400,
Make cuts in the conductive layer and adhesive layer at 1 mm intervals vertically and horizontally.
00 cross-cuts were prepared, and a cellophane adhesive tape (manufactured by Sekisui Chemical Co., Ltd., trade name: Sekisui cellophane tape No. 252) was attached onto the cross-cuts, and the tape was peeled off to obtain 100 above.
A cross-cut peeling test was performed to count how many conductive layers and adhesive layers remained without peeling off. The number written in the column in Table 1 represents the number of 100 pieces that remained without peeling. 5. Presence or absence of deformation: Regarding the deformation of the antistatic plastic plate obtained in the manufacturing process, the presence or absence was visually inspected.

[0047]

[Table 1]

[0048]

Since the method for producing an antistatic plastic plate of the present invention is constructed as described above, it is not limited to forming a conductive layer consisting of a highly antistatic coating film of a conductive paint, but it is not limited to the above. The transparency evaluated by the light transmittance and the haze is extremely excellent. For example, when monitoring or working in the working process using the antistatic plastic plate or sheet of the present invention as a partition wall,
In addition, the contents stored in the container can be used for precision work and observation of the inside without hindering a small amount of see-through, and the conductive layer made of a highly antistatic coating is firmly made of plastic. Since it is laminated on the plate, it is possible to stably provide an advanced antistatic plastic plate that can maintain excellent performance for a long time.

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Claims (1)

[Claims] 1. A first step of forming a conductive layer by applying a photocurable conductive coating material on a transparent plastic film and drying it, and a second step and a third step of heating the conductive layer and the plastic plate, respectively. A fourth step of laminating the heated conductive layer on the heated plastic plate, a fifth step of irradiating the laminated conductive layer with the transparent plastic film to actinic rays to cure the conductive layer. A process for producing an antistatic plastic plate or sheet, which comprises a process and a sixth process for peeling the transparent plastic film from the surface of the conductive layer.