JPH0922111A - Pellicle - Google Patents
PellicleInfo
- Publication number
- JPH0922111A JPH0922111A JP16954595A JP16954595A JPH0922111A JP H0922111 A JPH0922111 A JP H0922111A JP 16954595 A JP16954595 A JP 16954595A JP 16954595 A JP16954595 A JP 16954595A JP H0922111 A JPH0922111 A JP H0922111A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- reticle
- adhesive layer
- adhesive
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
- Y10T428/249985—Composition of adhesive or bonding component specified
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Liquid Crystal (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はペリクル、特にはL
SI、超LSIなどの半導体装置あるいは液晶表示板を
製造する際のゴミよけとして使用される、実質的に 500
nm以下の光を用いる露光方式における帯電防止されたペ
リクルに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention
Substantially 500 used to prevent dust when manufacturing semiconductor devices such as SI and VLSI, or liquid crystal display panels.
The present invention relates to an antistatic pellicle in an exposure method using light of nm or less.
【0002】[0002]
【従来の技術】LSI、超LSIなどの半導体装置ある
いは液晶表示板などの製造においては、半導体ウェハー
あるいは液晶用原版に光を照射してパターニングを作成
するのであるが、この場合に用いる露光原版にゴミが付
着していると、このゴミが光を吸収したり、光を曲げて
しまうため、転写したパターニングが変形したり、エッ
ジががさついたものとなるほか、白地が黒く汚れたりし
て、寸法、品質、外観などが損なわれ、半導体装置や液
晶表示板などの性能や製造歩留りの低下を来たすという
問題があった。このため、これらの作業は通常クリーン
ルームで行われているが、このクリーンルーム内でも露
光原版を常に清浄に保つことが難しいので、露光原版の
表面にゴミよけのための露光用の光をよく通過させるペ
リクルを貼着する方式が行なわれている。2. Description of the Related Art In the manufacture of semiconductor devices such as LSIs and VLSIs or liquid crystal display panels, a semiconductor wafer or a liquid crystal master is irradiated with light to form a pattern. If dust adheres, the dust absorbs light or bends the light, so the transferred pattern will be deformed, the edges will be rough, and the white background will be stained black, In addition, there is a problem in that the quality, appearance, and the like are impaired, and the performance and manufacturing yield of semiconductor devices and liquid crystal display panels are reduced. For this reason, these operations are usually performed in a clean room, but it is difficult to always keep the exposure master clean in this clean room.Therefore, the exposure master light often passes through the surface of the exposure master for exposure to prevent dust. A method of attaching a pellicle to be used is used.
【0003】この場合、ゴミは露光原版の表面上には直
接付着せず、ペリクル上に付着するため、リソグラフィ
ー時に焦点を露光原版のパターン上に合わせておけば、
ペリクル上のゴミは転写に無関係となるのであるが、こ
のペリクル膜は通常光を良く通過させるニトロセルロー
ス、酢酸セルロースなどからなる透明なペリクル膜をア
ルミニウム、ステンレス、ポリエチレンなどからなるペ
リクル枠の上部にペリクル膜の良溶媒を塗布し、風乾し
て接着する(特開昭 58-219023号公報参照)か、アクリ
ル樹脂やエポキシ樹脂などの接着剤で接着し(米国特許
第 4,861,402号明細書、特公昭 63-27,707号公報参
照)、さらにはペリクル枠の下部には露光原版に装着さ
れるために、ポリブテン樹脂、ポリ酢酸ビニル樹脂、ア
クリル樹脂などからなる粘着層、および粘着層の保護を
目的とした離型層(セパレーター)で構成されている。[0003] In this case, the dust does not directly adhere to the surface of the exposure master, but adheres to the pellicle. Therefore, if the focus is set on the pattern of the exposure master during lithography,
Dust on the pellicle is unrelated to the transfer, but this pellicle film usually consists of a transparent pellicle film made of nitrocellulose, cellulose acetate, etc. that passes light well over the pellicle frame made of aluminum, stainless steel, polyethylene, etc. A pellicle film is coated with a good solvent and air-dried for adhesion (see JP-A-58-219023) or an adhesive such as an acrylic resin or an epoxy resin (US Pat. No. 4,861,402, Japanese Patent Publication No. 63-27,707), and further, for the purpose of protecting the adhesive layer made of polybutene resin, polyvinyl acetate resin, acrylic resin, etc., and the adhesive layer in order to be mounted on the exposure master plate under the pellicle frame. It is composed of a release layer (separator).
【0004】[0004]
【発明が解決しようとする課題】このペリクル構成物の
中では、ペリクルを使用する前にペリクルをガラス基盤
としてのレチクルに貼り付けることが必要とされるため
に、この粘着層は重要なものとされる。しかし、レチク
ルにペリクルを貼り付けるときに、レチクルと粘着剤と
の間に隙目(以下エアパスと称する)やエアー溜りが生
じる場合があり、ここにエアパスがあるとそこから外界
のパーティクルがマスクパターン上に付着する恐れがあ
るし、またここにエアー溜りがあると経時的にエアー溜
りが大きくなり、最終的にこれがエアパスになる恐れが
ある。In this pellicle composition, the adhesive layer is important because it is necessary to attach the pellicle to the reticle as a glass substrate before using the pellicle. To be done. However, when the pellicle is attached to the reticle, there may be a gap (hereinafter referred to as an air path) or an air pool between the reticle and the adhesive. There is a risk that it will adhere to the upper part, and if there is an air pocket there, the air pocket will increase over time, and this may eventually become an air path.
【0005】そのため、現状ではペリクルをレチクルに
圧着する際に、ペリクル面全体に30kg以上の荷重をかけ
る必要があるため、これによって高価なレチクルが割れ
るというトラブルが発生することがある。したがって、
これについてはペリクル圧着力の低減のために、粘着剤
を柔らかく仕上げるという試みも行なわれているが、こ
れを貼り付け条件を十分に満たすだけの柔らかさにする
と、今度は貼り付けたペリクルの経時における形状安定
性が不十分になるということから、これに対する検討が
問題点とされている。Therefore, under the present circumstances, when the pellicle is pressure-bonded to the reticle, it is necessary to apply a load of 30 kg or more to the entire surface of the pellicle, which may cause a trouble that the expensive reticle is broken. Therefore,
In this regard, attempts have been made to soften the pressure-sensitive adhesive to reduce the pressure applied to the pellicle, but if this is made soft enough to satisfy the bonding conditions, then the time of the pellicle that has been bonded will be reduced. Since the shape stability in (1) becomes insufficient, the examination for this is a problem.
【0006】[0006]
【課題を解決するための手段】本発明はこのような不
利、問題点を解決したペリクルに関するもので、これは
ペリクルをガラス基盤に貼り付けるためのペリクルの粘
着層を、その全表面が凸曲面を形成するものとしてなる
ことを特徴とするものである。The present invention relates to a pellicle that solves the above disadvantages and problems. It has an adhesive layer of a pellicle for sticking a pellicle to a glass substrate, and the entire surface thereof is a convex curved surface. Is formed.
【0007】[0007]
【発明の実施の形態】通常、ペリクルの粘着層はペリク
ルをレチクルに均一な高さで貼り付けるために、図3に
示したように粘着層表面の凹凸をなくし、できるだけ平
坦になるように仕上げられているが、しかしこの場合に
はそれが平坦であるためにレチクルに貼り付けるときに
エアー溜りが発生し易いという不利がある。事実、これ
を図3に示したようにこのペリクルの粘着層を平坦のも
のとすると、レチクルとの接触面積が大きいためにレチ
クルに貼り付けるときにここにエアー溜りが発生し、図
4に示したようにこれに圧力を加えてもこれが10kgの荷
重では全体に貼り付かず、この場合にはこの荷重をレチ
クルを破損しかねない30kgにまで高める必要があった。BEST MODE FOR CARRYING OUT THE INVENTION Usually, in order to attach the pellicle to the reticle at a uniform height, the adhesive layer of the pellicle is finished so as to be as flat as possible by eliminating the unevenness of the adhesive layer surface as shown in FIG. However, in this case, since it is flat, there is a disadvantage that an air pocket is likely to be generated when it is attached to the reticle. In fact, if the adhesive layer of this pellicle is made flat as shown in FIG. 3, an air pocket will be generated here when sticking to the reticle because the contact area with the reticle is large, and as shown in FIG. Even if pressure is applied to this, it does not stick to the whole under a load of 10 kg, and in this case it was necessary to increase this load to 30 kg which could damage the reticle.
【0008】本発明はこのような不利を解決したもの
で、これは前記したようにペリクルの粘着層を、その全
表面が凸曲面を形成したもので、これには例えば図1に
示したような蒲鉾型や俵型(図示せず)のものとしてな
るものである。このものは一例として図1に示したよう
にレチクル上に蒲鉾型の粘着層が置かれているが、これ
はそれが蒲鉾型であるために図3の従来のものに比べて
エアー溜りが発生しにくいものとなり、このものは小さ
な圧力で粘着層とレチクルを粘着させることができるこ
とを見出し、これを圧着すると図2に示したようにこれ
が平板状になって高い面圧でレチクルに密着し、粘着さ
れ、この場合レチクルと粘着層との粘着面を大きくした
いときには圧着力を大きくすれば、これを任意にコント
ロールすることができることを確認した。The present invention has solved such disadvantages, as described above, in which the adhesive layer of the pellicle has a convex curved surface over the entire surface thereof, as shown in FIG. 1, for example. It is a fish-bowl type or a bale type (not shown). As an example of this, a kamaboko-shaped adhesive layer is placed on the reticle as shown in FIG. 1, but this is a kamaboko-shaped adhesive layer, so air pockets are generated compared to the conventional one in FIG. It was difficult to do this, and it was found that this can stick the adhesive layer and the reticle with a small pressure, and when this is pressed, it becomes a flat plate as shown in FIG. 2 and adheres to the reticle with a high surface pressure, It was confirmed that when the adhesive is applied, and in this case, when the adhesive surfaces of the reticle and the adhesive layer are desired to be increased, the pressure can be arbitrarily controlled by increasing the pressure force.
【0009】なお、この蒲鉾型の粘着層は圧力を加えて
レチクルに貼り付けると、蒲鉾型の原形が圧力により平
板状になるが、この場合にはエアー溜りが発生せず、エ
アパスもできないので、この加圧は荷重が10kg程度でも
よい。このものはその厚みが貼り付ける前の90%以下に
なるけれども、これが平板状となり粘着力が大きくなる
ので、これで実用上充分な粘着力を有するものになる。When the pressure-sensitive adhesive layer of the kamaboko type is attached to the reticle by applying pressure, the original shape of the kamaboko type becomes flat due to the pressure, but in this case, no air pool is generated and no air path is possible. The load of this pressurization may be about 10 kg. Although the thickness of this product is 90% or less of that before attachment, it becomes flat and has a large adhesive force, so that it has a practically sufficient adhesive force.
【0010】しかし、この圧着時にはペリクルとガラス
基盤によって遮られているエリアの圧力が高くなり、こ
の圧力を逃がさないとペリクル膜が膨れ易くなるので、
このペリクル膜の膨れを防止するためには、ペリクルフ
レームに気圧調整用の通気孔を設けることがよく、さら
にこの通気孔にはここに外界からパーティクルが混入し
ないようにするために、ここにフィルターを設けること
がよい。However, during this pressure bonding, the pressure in the area blocked by the pellicle and the glass substrate becomes high, and the pellicle film is likely to swell unless this pressure is released.
In order to prevent the pellicle film from swelling, it is preferable to provide a ventilation hole for adjusting the atmospheric pressure in the pellicle frame. Furthermore, in order to prevent particles from being mixed into the ventilation hole from the outside, there is a filter here. Should be provided.
【0011】[0011]
【実施例】つぎに本発明の実施例、比較例をあげる。 実施例 表面をアルマイト処理した、高さが 6.3mmで端面の外周
が 120mm角、内周が 110mm角、一辺の中央部に 0.5mmφ
の貫通穴のあるアルミニウムフレームを用意した。つい
で、この下端面にシリコーン粘着剤・KR−120[信
越化学工業(株)製商品名]を厚みが 0.6mmの蒲鉾型に
なるように塗布して 120℃で30分間キュアし、さらにこ
のフレームの上端面に非晶性フッ素系重合体・サイトッ
プCTX−Aタイプ[旭硝子(株)製商品名]を厚みが
0.1mmになるように塗布した。Next, examples of the present invention and comparative examples will be described. Example The surface is anodized, the height is 6.3 mm, the outer circumference of the end face is 120 mm square, the inner circumference is 110 mm square, and the center of one side is 0.5 mmφ
An aluminum frame with a through hole was prepared. Then, a silicone adhesive KR-120 [trade name of Shin-Etsu Chemical Co., Ltd.] is applied to the lower end surface so as to form a kamaboko shape with a thickness of 0.6 mm and cured at 120 ° C. for 30 minutes, and this frame is further cured. Amorphous fluoropolymer CYTOP CTX-A type [Product name of Asahi Glass Co., Ltd.]
It was applied to have a thickness of 0.1 mm.
【0012】また、このフレームの内側面にはシリコー
ン粘着剤・KR−120(前出)を厚みが0.05mmとなる
ようにコーティングし(ただし、 0.5mmφの貫通穴を除
く)、さらに 0.5mmφの貫通穴を塞ぐように、孔径 0.5
μmで大きさが10×5mmのポリテトラフルオロエチレン
(PTFE)製のフィルターを設け、他方ここに非晶性
フッ素系重合体・サイトップCTX−Sタイプ[旭硝子
(株)製商品名]で1.62μmの薄膜を形成し、これをこ
のフレームに 108℃で熱融着した。The inner surface of this frame is coated with silicone adhesive KR-120 (previously described) to a thickness of 0.05 mm (except for a through hole of 0.5 mmφ), and further 0.5 mmφ. The hole diameter is 0.5 so that the through hole is blocked.
A filter made of polytetrafluoroethylene (PTFE) with a size of 10 μm and a size of 10 × 5 mm is installed, while an amorphous fluoropolymer, CYTOP CTX-S type [trade name of Asahi Glass Co., Ltd.] is 1.62. A μm thin film was formed, and this was heat-sealed to this frame at 108 ° C.
【0013】つぎに、このようにして仕上げたペリクル
をレチクル上に置き、ペリクルフレーム上端面に10kgの
荷重をかけてペリクルをレチクルに貼り付けたところ、
この場合にはシリコーン粘着剤KR120(前出)の厚
みは 0.5mmであり、レチクルとフレームの間にエアパ
ス、エアー溜りなどの隙間は見られなかったので10kgの
荷重をかけた直後にペリクルは貼り付き、このペリクル
の膨らみは10分後に元に戻った。Next, the pellicle thus finished was placed on the reticle, and a load of 10 kg was applied to the upper surface of the pellicle frame to attach the pellicle to the reticle.
In this case, the thickness of the silicone adhesive KR120 (described above) was 0.5 mm, and no gap such as an air path or an air pool was found between the reticle and the frame, so the pellicle was attached immediately after applying a load of 10 kg. The bulge of this pellicle returned after 10 minutes.
【0014】比較例1 実施例と同様なフレームを用意し、この下端面にシリコ
ーン粘着剤・KR−120(前出)を厚みが 0.3mmのプ
レート状となるように塗布し、 120℃で30分間キュア
し、さらにフレームの上端面に前記したサイトップCT
X−Aタイプ(前出)を厚みが 0.1mmになるように塗布
した。また、このフレームの内側面にはシリコーン粘着
剤・KR−120(前出)を厚みが0.05mmとなるように
コーティングし(ただし、 0.5mmφの貫通穴を除く)、
さらに 0.5mmφの貫通穴を塞ぐように、孔径 0.5μm、
フィルター大きさが10mm×5mmのPTFE製のフィルタ
ーを設け、他方ここに前記したサイトップCTX−Sタ
イプ(前出)で1.62μmの薄膜を形成し、これをこのフ
レームに 108℃で熱融着した。Comparative Example 1 A frame similar to that of the example was prepared, and a silicone adhesive KR-120 (described above) was applied to the lower end surface of the frame so as to form a plate having a thickness of 0.3 mm, and the temperature was 120 ° C. for 30 minutes. Cure for a minute, and then add Cytop CT to the top surface of the frame.
The XA type (described above) was applied so that the thickness would be 0.1 mm. The inner surface of this frame is coated with silicone adhesive KR-120 (described above) to a thickness of 0.05 mm (excluding 0.5 mmφ through holes).
Furthermore, so as to block the 0.5 mmφ through hole, the hole diameter is 0.5 μm,
A filter made of PTFE with a size of 10 mm × 5 mm is provided, while a 1.62 μm thin film is formed on the above-mentioned Cytop CTX-S type (described above) and heat-sealed onto this frame at 108 ° C. did.
【0015】ついで、このようにして仕上げたペリクル
をレチクル上に置き、ペリクルフレームの上端面に10kg
の荷重をかけてペリクルをレチクルに貼り付けたとこ
ろ、この場合にはレチクルとフレームの間にエアパスな
どの隙間が見られたので、ペリクルとレチクルは貼り付
かず、そこでエアパスのなくなるまで荷重を増したとこ
ろ、このものは荷重がレチクルを破損しかねない30kgで
ようやく全体が貼り付いた。Then, the pellicle thus finished is placed on the reticle, and 10 kg is put on the upper end surface of the pellicle frame.
When the pellicle was attached to the reticle by applying the load of., In this case, a gap such as an air path was seen between the reticle and the frame, so the pellicle and reticle did not stick and the load was increased until the air path disappeared. When I did this, the whole thing finally stuck at 30 kg because the load could damage the reticle.
【0016】比較例2 表面をアルマイト処理した、高さが 6.3mmで端面の外周
が 120mm角、内周が 110mm角のアルミニウムフレーム
(0.5mm の貫通穴はない)を用意した。ついで、この下
端面にシリコーン粘着剤・KR−120(前出)を厚み
が 0.6mmの俵状となるように塗布し、 120℃で30分間キ
ュアし、さらにこのフレームの上端面に前記したサイト
ップCTX−Aタイプ(前出)を厚みが 0.1mmになるよ
うに塗布した。また、このフレームの内側面にはシリコ
ーン粘着剤・KR−120(前出)を厚みが0.05mmとな
るようにコーティングし、他方ここに前記したサイトッ
プCTX−Sタイプ(前出)で1.62μmの薄膜を形成
し、これをフレームに 108℃で熱融着した。Comparative Example 2 An aluminum frame having a height of 6.3 mm, an outer circumference of an end face of 120 mm square and an inner circumference of 110 mm square (without a through hole of 0.5 mm) was prepared. Then, a silicone adhesive KR-120 (described above) was applied to the lower end surface so as to form a bale shape having a thickness of 0.6 mm, cured at 120 ° C. for 30 minutes, and further, the above-mentioned size was applied to the upper end surface of the frame. Top CTX-A type (described above) was applied to a thickness of 0.1 mm. The inner surface of this frame is coated with a silicone adhesive, KR-120 (previously described) to a thickness of 0.05 mm, while 1.62 μm for Cytop CTX-S type (previously described). Was formed into a thin film and heat-sealed to a frame at 108 ° C.
【0017】つぎに、このようにして仕上げたペリクル
をレチクル上に置き、ペリクルフレームの上端面に10kg
の荷重をかけてペリクルとレチクルを貼り付けたとこ
ろ、この場合には粘着剤が俵状であったことからレチク
ルとフレームとの間にエアパスなどの隙間は見られず、
これは10kgの荷重で貼り付いたけれども、10kgの荷重を
かけた直後に発生したペリクル膜の膨らみは元に戻らな
かった。Next, the pellicle thus finished is placed on the reticle, and 10 kg is put on the upper end surface of the pellicle frame.
When the pellicle and the reticle were attached by applying a load of, the adhesive was in the shape of a bale in this case, so no gap such as an air path was seen between the reticle and the frame,
Although this adhered with a load of 10 kg, the bulge of the pellicle film generated immediately after the load of 10 kg was not restored.
【0018】[0018]
【発明の効果】本発明はペリクルに関するものであり、
これはレチクル貼り付け用の粘着層を、その全表面が凸
曲面を形成するものとしてなるものであるが、これによ
ればレチクルとフレームとの間にエアパス、エアー溜り
などの発生を防止することができるので、ペリクルのガ
ラス基盤への貼り付けを小さい荷重で行なうことがで
き、したがってペリクル貼り付け時の基盤の破損をなく
すことができるという有利性が与えられる。The present invention relates to a pellicle,
This is an adhesive layer for sticking a reticle, whose entire surface forms a convex curved surface. According to this, it is possible to prevent the occurrence of air paths, air pools, etc. between the reticle and the frame. Therefore, the pellicle can be attached to the glass substrate with a small load, and therefore the substrate can be prevented from being damaged when the pellicle is attached.
【図1】粘着層を蒲鉾型とした本発明の1例のペリクル
の縦断面図を示したものである。FIG. 1 is a vertical cross-sectional view of a pellicle according to an example of the present invention in which an adhesive layer has a kamaboko shape.
【図2】図1のペリクルに圧力荷重を加えたときのペリ
クルの縦断面図を示したものである。FIG. 2 is a vertical sectional view of the pellicle when a pressure load is applied to the pellicle of FIG.
【図3】粘着層をプレート状とした公知のペリクルの縦
断面図を示したものである。FIG. 3 is a vertical cross-sectional view of a known pellicle having a plate-shaped adhesive layer.
【図4】図3のペリクルに圧力荷重を加えたときのペリ
クルの縦断面図を示したものである。FIG. 4 is a vertical sectional view of the pellicle when a pressure load is applied to the pellicle of FIG.
Claims (5)
のペリクルの粘着層を、その全表面が凸曲面を形成する
のものとしてなることを特徴とするペリクル。1. A pellicle characterized in that an adhesive layer of the pellicle for attaching the pellicle to a glass substrate is formed so that the entire surface thereof forms a convex curved surface.
1に記載したペリクル。2. The pellicle according to claim 1, wherein the adhesive layer has a kamaboko shape.
みが、貼り付け前の90%以下になる請求項1又は2のい
ずれかに記載したペリクル。3. The pellicle according to claim 1, wherein the thickness of the adhesive layer when attached to a glass substrate is 90% or less of that before attachment.
孔を設けてなる請求項1又は2のいずれかに記載したペ
リクル。4. The pellicle according to claim 1, wherein the pellicle frame is provided with ventilation holes for adjusting atmospheric pressure.
ルターを設けてなる請求項4に記載したペリクル。5. The pellicle according to claim 4, wherein the ventilation hole is provided with a filter for preventing particle contamination.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16954595A JPH0922111A (en) | 1995-07-05 | 1995-07-05 | Pellicle |
US08/673,257 US5723860A (en) | 1995-07-05 | 1996-06-28 | Frame-supported pellicle for photomask protection |
DE69607686T DE69607686T2 (en) | 1995-07-05 | 1996-06-28 | Frame-supported membrane cover to protect a photo mask |
EP96401439A EP0752621B1 (en) | 1995-07-05 | 1996-06-28 | Frame-supported pellicle for photomask protection |
TW085107995A TW454104B (en) | 1995-07-05 | 1996-07-02 | Frame-supported pellicle for photomask protection |
KR1019960027231A KR100441349B1 (en) | 1995-07-05 | 1996-07-05 | Frame-supported pellicle for photomask protection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16954595A JPH0922111A (en) | 1995-07-05 | 1995-07-05 | Pellicle |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0922111A true JPH0922111A (en) | 1997-01-21 |
Family
ID=15888471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16954595A Pending JPH0922111A (en) | 1995-07-05 | 1995-07-05 | Pellicle |
Country Status (6)
Country | Link |
---|---|
US (1) | US5723860A (en) |
EP (1) | EP0752621B1 (en) |
JP (1) | JPH0922111A (en) |
KR (1) | KR100441349B1 (en) |
DE (1) | DE69607686T2 (en) |
TW (1) | TW454104B (en) |
Cited By (4)
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JP2011013611A (en) * | 2009-07-06 | 2011-01-20 | Shin-Etsu Chemical Co Ltd | Pellicle |
JP2012230227A (en) * | 2011-04-26 | 2012-11-22 | Shin Etsu Chem Co Ltd | Pellicle for lithography |
JP2013057861A (en) * | 2011-09-09 | 2013-03-28 | Shin Etsu Chem Co Ltd | Pellicle for lithography and manufacturing method for the same |
KR20140130010A (en) * | 2013-04-30 | 2014-11-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Pellicle |
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AU2325900A (en) * | 1999-03-12 | 2000-10-04 | Nikon Corporation | Exposure device, exposure method, and device manufacturing method |
US6436586B1 (en) * | 1999-04-21 | 2002-08-20 | Shin-Etsu Chemical Co., Ltd. | Pellicle with a filter and method for production thereof |
JP2001133960A (en) * | 1999-11-08 | 2001-05-18 | Shin Etsu Chem Co Ltd | Pellicle for lithography and method for using pellicle |
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US6524754B2 (en) | 2001-01-22 | 2003-02-25 | Photronics, Inc. | Fused silica pellicle |
US7351503B2 (en) * | 2001-01-22 | 2008-04-01 | Photronics, Inc. | Fused silica pellicle in intimate contact with the surface of a photomask |
US6911283B1 (en) | 2001-02-07 | 2005-06-28 | Dupont Photomasks, Inc. | Method and apparatus for coupling a pellicle to a photomask using a non-distorting mechanism |
US6841312B1 (en) | 2001-04-11 | 2005-01-11 | Dupont Photomasks, Inc. | Method and apparatus for coupling a pellicle assembly to a photomask |
US7008487B1 (en) | 2002-03-04 | 2006-03-07 | Micron Technology, Inc. | Method and system for removal of contaminates from phaseshift photomasks |
JP2003315983A (en) * | 2002-04-22 | 2003-11-06 | Mitsubishi Electric Corp | Photomask |
DE10246788B4 (en) * | 2002-10-08 | 2007-08-30 | Infineon Technologies Ag | Protective mask for reflection masks and method for using a protected reflection mask |
WO2004040374A2 (en) * | 2002-10-29 | 2004-05-13 | Dupont Photomasks, Inc. | Photomask assembly and method for protecting the same from contaminants generated during a lithography process |
TWI286674B (en) * | 2002-12-27 | 2007-09-11 | Asml Netherlands Bv | Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container |
US6842227B2 (en) * | 2003-03-06 | 2005-01-11 | Intel Corporation | Fusion attachment of rigid pellicles and/or frames |
US7316869B2 (en) * | 2003-08-26 | 2008-01-08 | Intel Corporation | Mounting a pellicle to a frame |
US7264853B2 (en) * | 2003-08-26 | 2007-09-04 | Intel Corporation | Attaching a pellicle frame to a reticle |
US7314667B2 (en) * | 2004-03-12 | 2008-01-01 | Intel Corporation | Process to optimize properties of polymer pellicles and resist for lithography applications |
US20050202252A1 (en) * | 2004-03-12 | 2005-09-15 | Alexander Tregub | Use of alternative polymer materials for "soft" polymer pellicles |
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JP2010261987A (en) * | 2009-04-30 | 2010-11-18 | Shin-Etsu Chemical Co Ltd | Photomask |
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US8420281B2 (en) | 2009-09-16 | 2013-04-16 | 3M Innovative Properties Company | Epoxy-functionalized perfluoropolyether polyurethanes |
KR101781659B1 (en) | 2009-09-16 | 2017-09-25 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Fluorinated coating and phototools made therewith |
EP2478034A1 (en) | 2009-09-16 | 2012-07-25 | 3M Innovative Properties Company | Fluorinated coating and phototools made therewith |
KR101990345B1 (en) * | 2009-10-02 | 2019-06-18 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Method of producing pellicle |
JP2011107293A (en) * | 2009-11-16 | 2011-06-02 | Shin-Etsu Chemical Co Ltd | Pellicle for lithography |
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JPH04212958A (en) * | 1990-12-07 | 1992-08-04 | Nikon Corp | Pellicle frame attaching method |
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JPH0627644A (en) * | 1992-07-08 | 1994-02-04 | Seiko Epson Corp | Pellicle and production of pellicle |
-
1995
- 1995-07-05 JP JP16954595A patent/JPH0922111A/en active Pending
-
1996
- 1996-06-28 US US08/673,257 patent/US5723860A/en not_active Expired - Lifetime
- 1996-06-28 EP EP96401439A patent/EP0752621B1/en not_active Expired - Lifetime
- 1996-06-28 DE DE69607686T patent/DE69607686T2/en not_active Expired - Lifetime
- 1996-07-02 TW TW085107995A patent/TW454104B/en active
- 1996-07-05 KR KR1019960027231A patent/KR100441349B1/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011013611A (en) * | 2009-07-06 | 2011-01-20 | Shin-Etsu Chemical Co Ltd | Pellicle |
JP2012230227A (en) * | 2011-04-26 | 2012-11-22 | Shin Etsu Chem Co Ltd | Pellicle for lithography |
JP2013057861A (en) * | 2011-09-09 | 2013-03-28 | Shin Etsu Chem Co Ltd | Pellicle for lithography and manufacturing method for the same |
KR20140130010A (en) * | 2013-04-30 | 2014-11-07 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Pellicle |
JP2014215572A (en) * | 2013-04-30 | 2014-11-17 | 信越化学工業株式会社 | Pellicle |
KR20200140766A (en) * | 2013-04-30 | 2020-12-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Pellicle |
Also Published As
Publication number | Publication date |
---|---|
DE69607686T2 (en) | 2000-09-28 |
KR970008322A (en) | 1997-02-24 |
EP0752621B1 (en) | 2000-04-12 |
DE69607686D1 (en) | 2000-05-18 |
EP0752621A1 (en) | 1997-01-08 |
TW454104B (en) | 2001-09-11 |
US5723860A (en) | 1998-03-03 |
KR100441349B1 (en) | 2004-10-14 |
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