JPH0627644A - Pellicle and production of pellicle - Google Patents

Pellicle and production of pellicle

Info

Publication number
JPH0627644A
JPH0627644A JP18122992A JP18122992A JPH0627644A JP H0627644 A JPH0627644 A JP H0627644A JP 18122992 A JP18122992 A JP 18122992A JP 18122992 A JP18122992 A JP 18122992A JP H0627644 A JPH0627644 A JP H0627644A
Authority
JP
Japan
Prior art keywords
pellicle
film
frame
pellicle film
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18122992A
Other languages
Japanese (ja)
Inventor
Kazuo Iwai
計夫 岩井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP18122992A priority Critical patent/JPH0627644A/en
Publication of JPH0627644A publication Critical patent/JPH0627644A/en
Pending legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To prevent the deformation of a pellicle film by a fluctuation in outdoor pressure of the pellicle to be stuck to a photomask used in the process for production of semiconductor devices, etc. CONSTITUTION:The pellicle film 1 in the outer peripheral part of the pellicle is previously reinforced and a reinforced part 8 is provided with a fine hole 7. Other methods include a method of boring a small hole in a pellicle frame 2 and sealing the hole of the pellicle frame 2 with a tape provided with the fine holes at least at one point, a method of providing the pellicle frame 2 with an aperture and sticking an airtight film provided with deflection to the above-mentioned aperture, etc. The difference between the atm. pressures in and out of the pellicle is automatically regulated and the intrusion of the foreign matter at the time of air pressure regulation, etc., is prevented. In addition, the danger of the intrusion of the foreign matter is eliminated and, therefore, the need for the inspection of the foreign matter which is heretofore carried out is eliminated and further, the operation for resticking of the pellicle which is heretofore carried out in the event of the intrusion of the foreign matter and the failure of the pellicle is eliminated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は半導体装置等の製造工程
中のフォトリソグラフイ工程において用いられるマス
ク、レチクルに装着するペリクルの構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a pellicle mounted on a mask and a reticle used in a photolithography process in a manufacturing process of a semiconductor device or the like.

【0002】[0002]

【従来の技術】図4に従来の技術によるペリクルの構造
を示す。図4(a)は、従来技術によるペリクルをフォ
トマスクに装着した状態を示す外形図であり、図4
(b)は、図4(a)のシールテープ4が貼付された部
分の断面図である。
2. Description of the Related Art FIG. 4 shows the structure of a pellicle according to the prior art. FIG. 4A is an external view showing a state in which a pellicle according to a conventional technique is mounted on a photomask.
4B is a cross-sectional view of a portion to which the seal tape 4 of FIG. 4A is attached.

【0003】図中の1で示されるのがペリクル膜であ
り、2で示されるペリクルフレームに接着されており、
さらにペリクルフレーム2のペリクル膜を接着した反対
側の面には接着剤5が塗布されている。これをペリクル
と呼んでいる。
Reference numeral 1 in the drawing denotes a pellicle film, which is adhered to a pellicle frame shown by 2,
Further, an adhesive 5 is applied to the surface of the pellicle frame 2 opposite to the surface on which the pellicle film is adhered. This is called a pellicle.

【0004】ペリクルは3で示されるフォトマスク上に
接着剤5で固定され外部からの異物をフォトマスク上に
付着させないようになっている。
The pellicle is fixed on the photomask indicated by 3 with an adhesive 5 so as to prevent foreign matter from adhering to the photomask.

【0005】しかし、外気の気圧の変動にともないペリ
クル膜とフォトマスクとに挟まれた空気の膨張収縮によ
り、ペリクル膜がフレーム面より上下し、転写性能、検
査等に支障を及ぼし、甚だしい場合はペリクル膜が割れ
ることもあるため、気圧変動の影響を防ぐためにペリク
ル内外の気圧差をなくす必要がある。
However, due to the expansion and contraction of the air sandwiched between the pellicle film and the photomask due to the fluctuation of the atmospheric pressure of the outside air, the pellicle film moves up and down from the frame surface, which hinders the transfer performance, inspection, etc. Since the pellicle film may be broken, it is necessary to eliminate the pressure difference between the inside and outside of the pellicle in order to prevent the influence of atmospheric pressure fluctuation.

【0006】そこで上記のような問題に対応するために
従来の技術では、ペリクルフレーム2の側面に6で示さ
れる通気孔を開け、4で示されるシールテープで前記通
気孔6をシールした構造を持ち、気圧変動時にシールテ
ープ4を剥すことによりペリクル内外の気圧差をなくす
方式を採っていた。
Therefore, in order to address the above-mentioned problems, in the conventional technique, a vent hole 6 is opened in the side surface of the pellicle frame 2 and the vent hole 6 is sealed with a seal tape 4. In addition, a method was adopted in which the pressure difference between the inside and outside of the pellicle is eliminated by peeling off the seal tape 4 when the atmospheric pressure changes.

【0007】[0007]

【発明が解決しようとする課題】しかし、前述の従来技
術では、通気孔の直径は0.5〜1.0mm程度が限界
であり気圧調整時に異物がペリクル内に侵入することを
完全に防止することが出来ないという問題点を有してい
た。さらに気圧変動時に人がシールテープを剥す作業を
行うため、異物の付着などが起こりやすく、また、気圧
変動にリアルタイムで対応できない等の問題点があり、
作業も煩雑であつた。
However, in the above-mentioned prior art, the diameter of the vent hole is limited to about 0.5 to 1.0 mm, and foreign matter is completely prevented from entering the pellicle during air pressure adjustment. It had a problem that it could not be done. Furthermore, since a person peels off the sealing tape when the atmospheric pressure changes, there is a problem that foreign matters are likely to adhere and that the atmospheric pressure change cannot be dealt with in real time.
The work was complicated.

【0008】そこで本発明はこのような問題点を解決す
るもので、その目的とするところは人手に頼ることなく
自動的にペリクル内外の気圧差が調整できるペリクルを
提供するところにある。
Therefore, the present invention solves such a problem, and an object of the present invention is to provide a pellicle capable of automatically adjusting the pressure difference between the inside and outside of the pellicle without relying on human hands.

【0009】[0009]

【課題を解決するための手段】本発明のペリクルは、 (1)半導体装置などの製造工程において用いられるフ
ォトマスクに貼付するペリクルにおいて、外気の圧力の
変動にともなってペリクル膜が変形することを防ぐため
にペリクルフレームに小穴を開け、さらに微細な穴を少
なくとも1箇所設けたテープで前記ペリクルフレームの
穴をシールした構造を持つことを特徴とする。
The pellicle of the present invention is: (1) In a pellicle to be attached to a photomask used in a manufacturing process of a semiconductor device or the like, the pellicle film is prevented from being deformed due to a change in the pressure of the outside air. In order to prevent this, a small hole is made in the pellicle frame, and the hole of the pellicle frame is sealed with a tape having at least one fine hole.

【0010】(2)半導体装置などの製造工程において
用いられるフォトマスクに貼付するペリクルにおいて、
外気の圧力の変動にともなってペリクル膜が変形するこ
とを防ぐために、ペリクル外周部のペリクル膜に予め補
強を施し、前記補強部に微細な穴を少なくとも1箇所設
けたことを特徴とする。
(2) In a pellicle to be attached to a photomask used in a manufacturing process of a semiconductor device or the like,
In order to prevent the pellicle film from being deformed due to a change in the pressure of the outside air, the pellicle film on the outer periphery of the pellicle is reinforced in advance, and at least one fine hole is provided in the reinforced part.

【0011】(3)半導体装置などの製造工程において
用いられるフォトマスクに貼付するペリクルにおいて、
外気の圧力の変動にともなってペリクル膜が変形するこ
とを防ぐためにペリクルフレームに開口部を設け、前記
開口部にたわみをもたせた気密膜を貼付する構造を持つ
ことを特徴とする。
(3) In a pellicle attached to a photomask used in a manufacturing process of a semiconductor device,
The pellicle frame is provided with an opening in order to prevent the pellicle film from being deformed due to a change in the pressure of the outside air, and a flexible airtight film is attached to the opening.

【0012】[0012]

【実施例】以下に本発明の実施例を図面にもとづいて説
明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0013】図1に前記手段(1)に関わる本発明のペ
リクルの構造を示す。図1(a)は、本発明のペリクル
をフォトマスクに装着した状態を示す外形図であり、図
1(b)は、図1(a)のシールテープ4が貼付された
部分の断面図である。
FIG. 1 shows the structure of the pellicle of the present invention relating to the means (1). FIG. 1A is an external view showing a state in which the pellicle of the present invention is mounted on a photomask, and FIG. 1B is a sectional view of a portion to which the seal tape 4 of FIG. 1A is attached. is there.

【0014】ペリクルの基本的な構造は従来技術と同様
であり、図中の1で示されるのがペリクル膜であり、2
で示されるペリクルフレームに接着されており、さらに
ペリクルフレーム2のペリクル膜を接着した反対側の面
には接着剤5が塗布されている。また、ペリクルフレー
ム2の側面には通気孔6が開けられており、前記通気孔
6はシールテープ4で塞がれている。
The basic structure of the pellicle is the same as that of the prior art. Reference numeral 1 in the drawing is a pellicle film, and 2 is a pellicle film.
The adhesive 5 is applied to the surface of the pellicle frame 2 opposite to the surface on which the pellicle film is adhered. A vent hole 6 is formed in the side surface of the pellicle frame 2, and the vent hole 6 is closed with a seal tape 4.

【0015】尚、前記シールテープ4には、あらかじめ
微細通気孔7(直径0.2〜1.0μm)が1〜数カ所
開けられたものを用いてる。
As the sealing tape 4, a fine ventilation hole 7 (having a diameter of 0.2 to 1.0 .mu.m) which is preliminarily formed in one to several places is used.

【0016】前記微細通気孔7はレーザー光または放電
等を利用して形成するが、その直径はフォトマスク表面
に付着させたくないパーテイクルの径より小さくかつ、
空気を通すことのできる範囲の径を選択することが望ま
しく、前記実施例の場合においては0.2〜1.0μm
の直径を選択し加工をおこなつた。
The fine vent holes 7 are formed by using laser light or electric discharge, and the diameter thereof is smaller than the diameter of particles which are not desired to be attached to the photomask surface, and
It is desirable to select a diameter within a range through which air can pass, and in the case of the above embodiment, 0.2 to 1.0 μm.
The diameter was selected and processing was performed.

【0017】前述した本発明によるペリクルをフォトマ
スク3に接着剤5を介して接着固定することにより、大
気の変動等によりペリクル外部の気圧が変化した場合に
おいても、ペリクル内部(ペリクル膜、ペリクルフレー
ム、フォトマスクに囲まれた空間)の圧力は、ペリクル
フレーム2の通気孔6とシールテープ4の微細通気孔7
を通してペリクル外部の気圧に自動的に追従することが
出来る。
By bonding and fixing the above-described pellicle according to the present invention to the photomask 3 via the adhesive 5, even when the atmospheric pressure outside the pellicle changes due to atmospheric fluctuations or the like, the inside of the pellicle (pellicle film, pellicle frame) is changed. The pressure in the space surrounded by the photomask is set to be the ventilation holes 6 of the pellicle frame 2 and the fine ventilation holes 7 of the seal tape 4.
Can automatically follow the atmospheric pressure outside the pellicle.

【0018】次に、図2に前記手段(2)に関わる本発
明のペリクルの構造を示す。図2(a)は、本発明のペ
リクルをフォトマスクに装着した状態を示す外形図であ
り、図2(b)は、図2(a)のペリクル膜補強8を施
した部分の断面図である。
Next, FIG. 2 shows the structure of the pellicle of the present invention relating to the means (2). FIG. 2A is an external view showing a state in which the pellicle of the present invention is mounted on a photomask, and FIG. 2B is a cross-sectional view of a portion to which the pellicle film reinforcement 8 of FIG. 2A is applied. is there.

【0019】図中の1で示されるのがペリクル膜であ
り、2で示されるペリクルフレームに接着されており、
さらにペリクルフレーム2のペリクル膜を接着した反対
側の面には接着剤5が塗布されている。
Reference numeral 1 in the drawing denotes a pellicle film, which is adhered to a pellicle frame shown by 2,
Further, an adhesive 5 is applied to the surface of the pellicle frame 2 opposite to the surface on which the pellicle film is adhered.

【0020】ここで、前記ペリクル膜1の外周部にはペ
リクル膜補強8が施され、さらに前記ペリクル膜補強部
8には微細通気孔7が開けられているが、その製造工程
は以下のようなものである。
Here, a pellicle membrane reinforcement 8 is provided on the outer peripheral portion of the pellicle membrane 1, and a fine ventilation hole 7 is formed in the pellicle membrane reinforcement portion 8. The manufacturing process is as follows. It is something.

【0021】ニトロセルロース等のペリクル膜材をガラ
ス基板上にスピン塗布した後、ガラス基板を静止した状
態でペリクル外周部に当たる部分にペリクル膜材を追加
塗布し、ペリクル膜を厚くすることによりペリクル膜補
強部8を形成する。続いてペリクル膜剥し用のフレーム
にてペリクル膜を剥し取った後、前記ペリクル膜補強部
8に微細通気孔7を開ける。この様にして作られたペリ
クル膜をペリクルフレームに接着し、ペリクルフレーム
に合わせてペリクル膜をカットすることにより本発明の
ペリクルが完成する。この様にペリクルフレームにペリ
クル膜を接着する前にペリクル膜に微細通気孔を開ける
ことにより、加工時のペリクルの破損を防止し、加工性
を向上させることができる。
After the pellicle film material such as nitrocellulose is spin-coated on the glass substrate, the pellicle film material is additionally applied to the portion corresponding to the outer periphery of the pellicle while the glass substrate is stationary, and the pellicle film is thickened. The reinforcing portion 8 is formed. Subsequently, after the pellicle film is peeled off by the frame for peeling the pellicle film, the fine ventilation holes 7 are opened in the pellicle film reinforcing portion 8. The pellicle of the present invention is completed by adhering the pellicle film thus produced to the pellicle frame and cutting the pellicle film according to the pellicle frame. In this way, by opening fine ventilation holes in the pellicle film before adhering the pellicle film to the pellicle frame, damage to the pellicle during processing can be prevented and workability can be improved.

【0022】なお、ペリクル膜補強部の膜厚は十〜数十
μmが適当であり、また前記微細通気孔7はレーザー光
または放電等を利用して形成するが、その直径はフォト
マスク表面に付着させたくないパーテイクルの径より小
さくかつ、空気を通すことのできる範囲の径を選択する
ことが望ましく、前記実施例の場合においては0.2〜
1.0μmの直径を選択し加工をおこなつた。
The film thickness of the pellicle film reinforcing portion is preferably 10 to several tens of μm, and the fine ventilation holes 7 are formed by using laser light or discharge, and the diameter thereof is on the surface of the photomask. It is desirable to select a diameter that is smaller than the diameter of the particles that are not desired to be adhered and that allows air to pass through.
The diameter of 1.0 μm was selected and processed.

【0023】前述した本発明によるペリクルをフォトマ
スク3に接着剤5を介して接着固定することにより、大
気の変動等によりペリクル外部の気圧が変化した場合に
おいても、ペリクル内部(ペリクル膜、ペリクルフレー
ム、フォトマスクに囲まれた空間)の圧力は、ペリクル
膜1の微細通気孔7を通してペリクル外部の気圧に自動
的に追従することが出来る。
By bonding and fixing the above-described pellicle according to the present invention to the photomask 3 via the adhesive 5, even when the atmospheric pressure outside the pellicle changes due to atmospheric fluctuations or the like, the inside of the pellicle (pellicle film, pellicle frame) is changed. The pressure in the space surrounded by the photomask) can automatically follow the atmospheric pressure outside the pellicle through the fine ventilation holes 7 in the pellicle film 1.

【0024】また、従来技術と異なりペリクルフレーム
2の側面に通気孔を開ける必要がないため、加工性の面
や異物等の品質の面において従来技術より有利である。
Further, unlike the prior art, it is not necessary to form a vent hole in the side surface of the pellicle frame 2, and therefore it is advantageous over the prior art in terms of workability and quality of foreign matters.

【0025】次に、図3に前記手段(3)に関わる本発
明のペリクルの構造を示す。図3(a)は、本発明のペ
リクルをフォトマスクに装着した状態を示す外形図であ
り、図3(b)は、図3(a)の可変形気密膜10が貼
付された部分の断面図である。
Next, FIG. 3 shows the structure of the pellicle of the present invention relating to the means (3). FIG. 3A is an external view showing a state in which the pellicle of the present invention is mounted on a photomask, and FIG. 3B is a cross section of a portion to which the deformable hermetic film 10 of FIG. 3A is attached. It is a figure.

【0026】図中の1で示されるのがペリクル膜であ
り、2で示されるペリクルフレームに接着されており、
さらにペリクルフレーム2のペリクル膜を接着した反対
側の面には接着剤5が塗布されている。また、前記ペリ
クルフレーム2の側面には開口部9が開けてあり、前記
開口部9はたわみを持たせた可変気密膜10で塞がれて
いる。
Reference numeral 1 in the drawing denotes a pellicle film, which is adhered to a pellicle frame shown by 2,
Further, an adhesive 5 is applied to the surface of the pellicle frame 2 opposite to the surface on which the pellicle film is adhered. Further, an opening 9 is opened on the side surface of the pellicle frame 2, and the opening 9 is closed by a flexible airtight film 10 having a bend.

【0027】前述した本発明によるペリクルをフォトマ
スク3に接着剤5を介して接着固定すると、以下のよう
な作用によりペリクル膜の変形を自動的に防止すること
が出来る。
When the above-described pellicle according to the present invention is adhered and fixed to the photomask 3 via the adhesive 5, the deformation of the pellicle film can be automatically prevented by the following actions.

【0028】大気の変動等によりペリクルの外部の気圧
が高くなった場合には、可変気密膜10はペリクルの内
部に向かい凹み、ペリクル内部の体積が減少することに
よりペリクル内外の圧力は平衡状態に保たれ、ペリクル
膜1の凹みを防止する。逆に、ペリクル外部の気圧が低
くなった場合には、可変気密膜10はペリクルの外部に
向かい膨らみ、ペリクル膜1の膨らみを防止する。
When the atmospheric pressure outside the pellicle becomes high due to atmospheric fluctuations or the like, the variable airtight film 10 is recessed toward the inside of the pellicle, and the volume inside the pellicle decreases, so that the pressure inside and outside the pellicle becomes equilibrium. It is kept to prevent the pellicle film 1 from being depressed. On the contrary, when the atmospheric pressure outside the pellicle becomes low, the variable airtight film 10 bulges toward the outside of the pellicle and prevents the pellicle film 1 from bulging.

【0029】なお、一般に用いられている5インチレチ
クル用のペリクルにおいては、ペリクルフレーム側面の
面積に対し30〜40%程度の開口率と、2〜4mm程
度の可変気密膜のたわみ量により、5%程度のペリクル
外部における気圧変動に対応できた。
In a commonly used pellicle for a 5-inch reticle, an opening ratio of about 30 to 40% with respect to the area of the side surface of the pellicle frame and a deflection amount of the variable airtight film of about 2 to 4 mm are set to 5 It was possible to cope with pressure fluctuations outside the pellicle of about%.

【0030】[0030]

【発明の効果】以上説明したように、本発明のペリクル
は、 (1)ペリクルフレームに小穴を開け、さらに微細な穴
を少なくとも1箇所設けたテープで前記ペリクルフレー
ムの穴をシールする (2)ペリクル外周部のペリクル膜に予め補強を施し、
前記補強部に微細な穴を少なくとも1箇所設ける (3)ペリクルフレームに開口部を設け、前記開口部に
たわみをもたせた気密膜を貼付する と言う簡単な構造により、ペリクルの外部の気圧の変動
によるペリクル膜の変形を自動的に防止し、かつペリク
ル内外の圧力調整時の異物の混入を防ぐという効果があ
る。
As described above, according to the pellicle of the present invention, (1) a small hole is made in the pellicle frame, and the hole of the pellicle frame is sealed with tape having at least one fine hole (2). Reinforce the pellicle film around the pellicle in advance,
At least one fine hole is provided in the reinforcing portion. (3) Fluctuations in atmospheric pressure outside the pellicle due to a simple structure in which an opening is provided in the pellicle frame and a flexible airtight film is attached to the opening. This has the effects of automatically preventing the deformation of the pellicle film due to the above, and preventing foreign matter from being mixed in when the pressure inside and outside the pellicle is adjusted.

【0031】また、異物混入の危険性がなくなるため、
従来行っていた異物検査が必要なくなり、さらに異物混
入時およびペリクル破損時に行っていたペリクルの貼直
し作業についても必要なくなったため、半導体装置の製
造スピードがアップした。
Further, since there is no danger of foreign matter entering,
Since the foreign substance inspection that was conventionally performed is no longer necessary, and the pellicle reattachment work that was performed when foreign substances are mixed or when the pellicle is damaged is no longer required, thus increasing the speed of manufacturing semiconductor devices.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の方式1によるペリクルの外形図。FIG. 1 is an outline view of a pellicle according to method 1 of the present invention.

【図2】 本発明の方式2によるペリクルの外形図。FIG. 2 is an outline view of a pellicle according to method 2 of the present invention.

【図3】 本発明の方式3によるペリクルの外形図。FIG. 3 is an outline view of a pellicle according to method 3 of the present invention.

【図4】 従来の方式によるペリクルの外形図。FIG. 4 is an external view of a pellicle according to a conventional method.

【符号の説明】[Explanation of symbols]

1 ペリクル膜 2 ペリクルフレーム 3 フォトマスク 4 シールテープ 5 接着剤 6 通気孔 7 微細通気孔 8 ペリクル膜補強部 9 開口部 10 可変形気密膜 1 Pellicle Membrane 2 Pellicle Frame 3 Photomask 4 Sealing Tape 5 Adhesive 6 Vent 7 Micro Vent 8 Pellicle Membrane Reinforcement 9 Opening 10 Variable Airtight Membrane

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 半導体装置などの製造工程において用い
られるフォトマスクに貼付するペリクルにおいて、外気
の圧力の変動にともなってペリクル膜が変形することを
防ぐためにペリクルフレームに小穴を開け、さらに微細
な穴を少なくとも1箇所設けたテープで前記ペリクルフ
レームの穴をシールした構造を持つことを特徴とするペ
リクル。
1. In a pellicle attached to a photomask used in a manufacturing process of a semiconductor device or the like, a small hole is formed in a pellicle frame to prevent the pellicle film from being deformed due to a change in the pressure of the outside air, and a finer hole is formed. A pellicle having a structure in which the hole of the pellicle frame is sealed by a tape provided with at least one portion.
【請求項2】 半導体装置などの製造工程において用い
られるフォトマスクに貼付するペリクルにおいて、外気
の圧力の変動にともなってペリクル膜が変形することを
防ぐために、ペリクル外周部のペリクル膜に予め補強を
施し、前記補強部に微細な穴を少なくとも1箇所設けた
ことを特徴とするペリクル。
2. In a pellicle to be attached to a photomask used in a manufacturing process of a semiconductor device or the like, in order to prevent the pellicle film from being deformed due to the fluctuation of the pressure of the outside air, the pellicle film on the outer periphery of the pellicle is reinforced in advance. A pellicle characterized by being provided with at least one fine hole in the reinforcing portion.
【請求項3】 基板にペリクル膜材をスピン塗布しペリ
クル膜を形成する工程と、前記ペリクル膜を剥し用のフ
レームを用いて剥す工程と、前記フレームにより剥され
た前記ペリクル膜をペリクルフレームに接着し前記ペリ
クルフレームに合わせて前記ペリクルをカットする工程
を有するペリクルの製造方法において、基板にペリクル
膜材をスピン塗布しペリクル膜を形成する工程の後にペ
リクルの外周部に前記ペリクル膜材を静止塗布する工程
を有し、かつ前記ペリクル膜を剥し用のフレームを用い
て剥す工程の後に前記のペリクルの外周部に前記ペリク
ル膜材を静止塗布した部分に微細な穴を開ける工程を有
することを特徴とする請求項2記載のペリクルの製造方
法。
3. A step of spin-coating a pellicle film material on a substrate to form a pellicle film, a step of peeling the pellicle film using a frame for peeling, and the pellicle film peeled by the frame on a pellicle frame. In a method of manufacturing a pellicle having a step of adhering and cutting the pellicle in accordance with the pellicle frame, a step of spin-coating a pellicle film material on a substrate to form a pellicle film is followed by resting the pellicle film material on an outer peripheral portion of the pellicle. And a step of forming fine holes in a portion of the outer periphery of the pellicle where the pellicle film material is statically applied after the step of peeling the pellicle film using a frame for peeling. The method for manufacturing a pellicle according to claim 2, wherein the pellicle is manufactured.
【請求項4】 半導体装置などの製造工程において用い
られるフォトマスクに貼付するペリクルにおいて、外気
の圧力の変動にともなってペリクル膜が変形することを
防ぐために、ペリクルフレームに開口部を設け、前記開
口部にたわみをもたせた気密膜を貼付する構造を持つこ
とを特徴とするペリクル。
4. In a pellicle attached to a photomask used in a manufacturing process of a semiconductor device or the like, an opening is provided in the pellicle frame to prevent the pellicle film from being deformed due to a change in pressure of the outside air. A pellicle characterized by having a structure in which an airtight membrane having a flexure is attached to the part.
JP18122992A 1992-07-08 1992-07-08 Pellicle and production of pellicle Pending JPH0627644A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18122992A JPH0627644A (en) 1992-07-08 1992-07-08 Pellicle and production of pellicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18122992A JPH0627644A (en) 1992-07-08 1992-07-08 Pellicle and production of pellicle

Publications (1)

Publication Number Publication Date
JPH0627644A true JPH0627644A (en) 1994-02-04

Family

ID=16097069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18122992A Pending JPH0627644A (en) 1992-07-08 1992-07-08 Pellicle and production of pellicle

Country Status (1)

Country Link
JP (1) JPH0627644A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0752621A1 (en) * 1995-07-05 1997-01-08 Shin-Etsu Chemical Co., Ltd. Frame-supported pellicle for photomask protection
JP2001201845A (en) * 1999-11-09 2001-07-27 Asahi Kasei Electronics Co Ltd Large-sized pellicle
WO2003034475A1 (en) * 2001-10-10 2003-04-24 Nikon Corporation Method and device for gas displacement, mask protective device, mask, and method and device for exposure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0752621A1 (en) * 1995-07-05 1997-01-08 Shin-Etsu Chemical Co., Ltd. Frame-supported pellicle for photomask protection
US5723860A (en) * 1995-07-05 1998-03-03 Shin-Etsu Chemical Co., Ltd. Frame-supported pellicle for photomask protection
JP2001201845A (en) * 1999-11-09 2001-07-27 Asahi Kasei Electronics Co Ltd Large-sized pellicle
WO2003034475A1 (en) * 2001-10-10 2003-04-24 Nikon Corporation Method and device for gas displacement, mask protective device, mask, and method and device for exposure

Similar Documents

Publication Publication Date Title
EP2267529B1 (en) Pellicle
US5723860A (en) Frame-supported pellicle for photomask protection
US6055040A (en) Pellicle frame
JP2001133960A (en) Pellicle for lithography and method for using pellicle
TWI613511B (en) Dust-proof film assembly
TWI431415B (en) A photomask unit comprising a photomask and a pellicle attached to the photomask and a method for fabricating a photomask unit
KR20210153018A (en) Pellicle
JPH10239500A (en) Pressure bulkhead and x-ray exposing device using it
CN1552000B (en) Removable optical pellicle
EP3249467A1 (en) A pellicle
KR20190040444A (en) Pellicle frame, pellicle and method for peeling pellicle
EP0548312A1 (en) Pressure relieving pellicle
KR0164946B1 (en) Mask protective device
JPH0627644A (en) Pellicle and production of pellicle
JP5479868B2 (en) Pellicle and its mounting method
JPH0968792A (en) Pellicle with filter
JP2020175500A (en) Mems device and fabrication method thereof
JPH05150445A (en) Mask for exposure
JPH1062966A (en) Pellicle for lithography
JPH06273922A (en) Mask protecting pellicle
JPH0627643A (en) Photomask and production of semiconductor device
JP2007003747A (en) Photomask with pellicle, and pellicle
KR100571397B1 (en) Pellicle for photo mask
JPH06258819A (en) Pellicle for protecting mask
JPH09160223A (en) Filter for pellicle and its manufacture