JPH09213721A - Apparatus and method for mounting chipped component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce tack time and achieve alignment with stability and accuracy by picking up an image in advance using a rough adjustment camera, and performing rough adjustment by a rough adjusting means. SOLUTION: Image information on a bare chip 20 the image of which is picked up by a rough adjustment camera 30 is processed using a computer for control. The amounts of compensation for rough adjustment of the bare chip 20 in the directions of the X axis, Y axis and θ axis are calculated from the result of the arithmetic operation by the computer. The deviation of the bare chip 20 in the X-axis direction is corrected by means of a mount head moving actuator that moves a mount head 38. The correction in the Y-axis direction is performed using a Y-direction moving stage 27; and the correction in the θ direction is accomplished by a θ-direction rotary actuator 40. This makes it possible to align chipped components in a short time using a mount position adjustment camera with high magnification and a small field of view for high-accuracy alignment, and thus reduce tact time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped component mounting device and a chip-shaped component mounting method, and more particularly to a chip-shaped component mounting device and a chip-shaped component mounting device for mounting a chip-shaped component at a predetermined position by a mount head. Regarding mounting method.

[0002]

2. Description of the Related Art An example of a conventional chip-shaped component mounting device is shown in FIG. This device is a bare chip bonder for mounting a bare chip 1 composed of an IC having no package on a circuit board. The bare chip 1 is supplied in a state where two adjacent sides of the butting plate 3 fixed on the chip supply table 2 are butted. On the other hand, the circuit board 4 on which the bare chip 1 is mounted is supplied and held by the Y-axis direction moving table 5.

The chip reversing head 7 is provided with a suction head on the lower surface of the tip thereof, and the bare chip 1 supplied onto the chip supply base 2 is sucked and rotated 180 ° by a rotary actuator 8 to be inverted. Then, the mount head 10 holding the suction nozzle 9 at the tip is positioned in the vertical direction, moved by the X-axis direction moving base 11, and the bare chip 1 reversed by the chip reversing head 7 is transferred by suction. There is.

Mount head 1 that adsorbs bare chip 1
0 moves to the mount position on the circuit board 4 by the operation of the X-axis direction moving table 11. At the same time, the circuit board 4 held on the Y-axis direction moving table 5 is also moved to the mount position in the Y-axis direction. Then, the recognition camera 13 mounted on the X-axis direction moving base 14 and the Y-axis direction moving base 15 is inserted into the space where the bare chip 1 and the circuit board 4 face each other at the mounting position, and the mounting head 10 above the mounting head 10 is inserted. The image of the electrode of the bare chip 1 and the wiring pattern of the circuit board 4 which are sucked by the suction nozzle 9 is captured, and image processing is performed to perform the alignment.

The adjustment of the rotation direction of the mount head 10 at this time is performed by rotating the mount head 10 about its main axis. The correction in the X-axis direction is X
This is performed by the axial moving table 11. The movement adjustment in the Y-axis direction is performed by the Y-axis direction moving table 5.

After completing the alignment of these three axes,
The recognition camera 13 is retracted from the lower part of the mount head 10 by the X-axis direction moving base 14, and then the mount head 1 is moved.
0 is lowered to bond the bare chip 1 on the circuit board 4.

[0007]

According to such a conventional chip-shaped component mounting apparatus, when the bare chip 1 is sucked from the chip supply table 2 by the chip reversing head 7, the bare chip 1 and the chip reversing head 7 are sucked. The relative position of the nozzle is misaligned. Therefore, the chip reversing head 7
To the suction nozzle 9 of the mount head 10 from the bare chip 1
When handed over, the bare chip 1 may be removed from the field of view of the recognition camera 13, which is an optical camera with high magnification. In this case, the recognition camera 13 is moved to the X-axis direction moving base 14 and the Y
It is moved by the axial moving base 15 to perform a search.
That is, when the bare chip 1 is out of the visual field of the recognition camera 13, the bare chip 1 must be searched, which increases the takt time.

Further, the bare chip 1 sucked and held by the suction nozzle 9 of the mount head 10 in this way must be corrected with relatively large correction amounts in the X-axis direction, the Y-axis direction, and the θ-axis direction. For this reason, the amount of deviation after alignment tends to increase.

The present invention has been made in view of the above problems, and has a chip-shaped component mounting apparatus capable of shortening the tact time and stabilizing and improving the alignment accuracy. Another object of the present invention is to provide a chip-shaped component mounting method.

[0010]

SUMMARY OF THE INVENTION The present invention is a chip-shaped component mount in which a chip-shaped component is imaged by a mount position adjusting camera, the position is adjusted by position adjusting means, and the mount head is mounted at a predetermined mounting position. The apparatus includes a coarse movement adjusting camera and a coarse movement adjusting means, and images are taken by the coarse movement adjusting camera and the coarse movement adjusting means before the image pickup by the mount position adjusting camera and the position adjustment by the position adjusting means. The present invention relates to a mounting device for a chip-shaped component, characterized in that the coarse movement is adjusted by.

The coarse movement adjusting means may preliminarily coarsely adjust the position of the chip-shaped component held by the mount head.

The coarse movement adjusting means may coarsely adjust the relative position of the chip-shaped component with respect to the mount position adjusting camera.

The mount position adjusting camera has a pair of upper and lower optical systems. The upper optical system captures an image of the chip-shaped component held by the mount head, and the lower optical system captures an image of the mount position. You may put it in.

A chip reversing head for supplying a chip-shaped component to the mount head may be provided, and the chip-shaped component transferred and reversed by the chip reversal head may be imaged by the coarse adjustment camera.

The chip-shaped component may be a bare chip IC.

The invention relating to the method is a method of mounting a chip-shaped component at a predetermined position by a mount head, wherein the coarse-motion adjustment camera recognizes the position and / or the posture of the chip-shaped component to perform coarse-motion adjustment, and thereafter. In order to finely adjust the position and / or orientation of the chip-shaped component by a mount position adjustment camera,
The present invention relates to a chip-shaped component mounting method characterized by the above.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the overall structure of a chip-shaped component mounting device according to an embodiment of the present invention. This mounting device has an IC without a package,
That is, the chip supply table 21 for supplying the bare chip 20 is provided. The L-shaped abutting plate 1 as shown in FIG.
9 are arranged. A chip reversal head 23 having a suction nozzle 22 for sucking the bare chip 20 supplied by the abutting plate 19 on the lower surface of the tip portion.
Are arranged so as to face the chip supply table 21.

The chip reversing head 23 is rotatably operated by a rotary actuator 24, and is rotatably supported by a support 25 as shown in FIG. The support table 25 is mounted on the X-axis direction moving table 26 and the Y-axis direction moving table 27, whereby the position adjustment is performed in each of the two directions.

Further, as shown in FIG. 4, this mount device is provided with a coarse movement adjustment camera 30. The coarse adjustment camera 30 is supported by the tip of an arm 31, and the base end of the arm 31 is mounted on a pedestal 33 via a support column 32 shown in FIG.
It is supported above. That is, the coarse adjustment camera 30 is a fixed type.

A support 36 is mounted upright on the frame 33, and an X-axis direction guide rail 37 is movably supported on the support 36. The mount head 38 is supported by the X-axis direction guide rail 37 so as to be movable in the X-axis direction. Mount head 38
A suction nozzle 39 is disposed on the tip side of the chip so as to suck the bare chip 20 supplied by the chip reversing head 23. Further, the mount head 38 is provided with a θ-direction rotary actuator 40 for adjusting rotation about its main axis.

A Y-axis direction moving table 43 is provided on the side end of the frame 33.
Is attached, and the circuit board 44 is supplied by the moving base 43.

Next, the mount position adjusting camera 47 inserted into the lower side of the mount head 38 will be described. As shown in FIG.
The chip imaging unit 48 is provided on the upper portion on the tip side, and the substrate imaging unit 49 is provided on the lower portion on the tip side. That is, the mount position adjusting camera 47 captures images in the upper and lower portions thereof, respectively. Further, the mount position adjusting camera 47 is configured to be position-adjusted in the X-axis direction and the Y-axis direction by the X-axis direction moving table 50 and the Y-axis direction moving table 51.

An operation panel 54 is attached to the front end side of the gantry 33, and a start button 55 and an operation button 56 are attached to the operation panel 54.

Next, FIG. 7 shows a control system for coarse movement adjustment.
The image captured by the coarse adjustment camera 30 is input to the control computer 60. The control computer 60 includes a mount head moving actuator 61, a mount head rotating θ-direction rotating actuator 40, a circuit board moving Y-axis direction moving table 43, a mount position adjusting camera X-axis direction moving table 50, and a mount position adjusting camera. Y-axis direction moving stand 5
1, and control signals are supplied to the Y-axis direction moving table 27 for the chip reversing head.

Next, the operation of such a chip-shaped component mounting device will be described. Bare chip 20 is chip supply table 21
As shown in FIG. 2, the abutting plate 19 fixed on the upper side supplies the abutting plate 19 with its two sides abutting. On the other hand, the circuit board 44 is supplied and held on the Y-axis direction moving base 43.

The suction nozzle 22 of the chip reversing head 23 adsorbs the bare chip 20 supplied on the chip supply table 21 as shown in FIG. 3, and thereafter, the rotary actuator 24 rotates 180 ° to rotate the chip reversing head 23. Are inverted as shown in FIG. Then, the rear surface of the bare chip 20 that has been inverted and held is recognized by the coarse movement adjustment camera 30 located above in FIG.

The image information of the bare chip 20 taken by the coarse adjustment camera 30 is image-processed by the control computer 60 shown in FIG. And computer 6
Based on the calculation result of 0, in the X-axis direction of the bare chip 20,
A correction amount for coarse movement adjustment in the Y-axis direction and the θ-axis direction is calculated.

The displacement of the bare chip 20 in the X-axis direction is corrected by the mount head moving actuator 6 for moving the mount head 38 in the direction of the X-axis direction guide rail 37.
1 (see FIG. 7). The correction in the Y-axis direction is performed by the Y-axis direction moving table 27, which is adjusted by the position in the Y-axis direction of the chip reversing head 23 that sucks the bare chip 20 by the suction nozzle 22. Further, the correction in the θ direction is performed by rotating the mount head 38 about the main axis, and is achieved by the θ direction rotary actuator 40.

While adjusting the three axes in this manner, the bare chip 20 sucked by the suction nozzle 22 of the chip reversing head 23 is mounted on the mount head 3 as shown in FIG.
8 is transferred to the suction nozzle 39. The mount head 38 that has attracted the bare chip 20 is moved along the X-axis direction guide rail 37 to the mount position of the circuit board 44. At the same time, the circuit board 44 held on the Y-axis direction moving base 43
Is also moved to the mount position.

With the bare chip 20 held by the suction nozzle 39 of the mount head 38 and the circuit board 44 facing each other at the mount position as shown in FIG. 6, the mount position adjusting camera 47 enters the space between them. To do. The mount position adjustment camera 47 is moved by an X-axis direction moving table 50 and a Y-axis direction moving table 51. Then, an image of the electrode of the bare chip 20 is captured by the chip imaging unit 48 provided on the mount position adjusting camera 47. Further, an image of the wiring pattern of the circuit board 44 is captured by the board imaging unit 49 on the lower side. These image signals are also taken into the control computer 60 and subjected to image processing for alignment.

The correction of the rotation direction at this time is a rotation adjustment about the main axis of the mount head 38 and is performed by the θ-direction rotary actuator 40. The correction in the X-axis direction is performed by moving the mount head 38 along the X-axis direction guide rail 37. The correction in the Y-axis direction is performed by moving the circuit board 44 in the Y-axis direction by the Y-axis direction moving table 43.

After performing such fine adjustment, the mount position adjusting camera 47 is retracted from directly under the mount head 38 by the X-axis direction moving table 50 and the Y-axis direction moving table 51. Then, after this, the mount head 38 descends, the bare chip 20 held by the suction nozzle 39 is placed on the circuit board 44, and bonding is performed.

In particular, in the present embodiment, the chip reversing head 23 sucks and reverses the bare chip 20 supplied onto the chip supply table 21, and holds it as shown in FIG.
At this time, the coarse movement adjusting camera 30 captures an image of the back surface of the bare chip 20 on which the electrodes are provided from above, and the control computer 60 processes the image of the back surface of the chip 20. And calculate the amount of posture deviation. Based on the result obtained here, the control computer 60 calculates the correction amounts in the X-axis direction, the Y-axis direction, and the θ-axis direction as described above.

The deviation amount ΔX in the X-axis direction is corrected by the movement of the mount head 38 on the X-axis direction guide rail 37, and the deviation amount ΔY in the Y-axis direction is corrected by the chip reversing head 2.
3 is moved in the Y-axis direction by the operation of the Y-axis moving base 27, and the deviation amount Δθ in the θ-axis direction is corrected by rotating the θ-direction rotary actuator 40 of the mount head 38.

By such a correction, the variation in the suction position and the posture when the bare chip 20 is transferred to the suction nozzle 39 of the mount head 38 can be considerably suppressed,
The load of position adjustment accompanying the image capturing of the mount position adjustment camera 47 is reduced, the stabilization of accuracy is improved, and the tact time can be shortened.

Generally, when highly accurate alignment is required, it is necessary to increase the optical magnification for recognizing an object. Increasing the magnification means that the field of view becomes narrower, and when a high-magnification camera is used as the mount position adjusting camera 47, how quickly the target target, that is, the alignment mark, etc. can be brought into the field of view improves productivity. Is the key to Further, the smaller the amount of highly accurate position correction and angle correction at the final stage, the more highly accurate the mount can be expected.

In view of such a problem, the present embodiment is provided with a coarse adjustment camera 30 and utilizes the control system shown in FIG. 7 based on the image obtained by such a camera 30. By adding the coarse adjustment, the mount position adjusting camera 47 having an optical system with a high magnification and a small field of view for highly accurate alignment can be used to
That is, the bare chip 20 can be caught within the field of view of the camera in a short time, and the tact time is shortened and the productivity is improved. Further, by adding the step of coarse movement adjustment, it is possible to reduce the adjustment amount at the time of high-accuracy alignment using the mount position adjustment camera 47, and it is possible to improve the stabilization of alignment accuracy. It will be.

In the above embodiment, in the coarse adjustment using the image signal from the coarse adjustment camera 30, the correction in the X-axis direction is performed by moving the mount head 38 in the direction of the X-axis guide rail 37. The axial correction is performed by the movement of the chip reversing head 23 by the Y-axis direction moving table 27, and the θ-axis correction is performed by the rotation adjustment by the θ-direction rotary actuator 40 about the main axis of the mount head 38. However, there is no particular limitation as to what unit performs the correction for each axis.

For example, an image captured by the coarse adjustment camera 30 is used to control the X by the control computer 60.
The adjustment amounts in the axial direction, the Y-axis direction, and the θ-axis direction are calculated, and based on this calculation, the mount position adjustment camera 47 is moved in the X-axis direction moving table 50 and the Y-axis direction in the X-axis direction and the Y-axis direction, respectively. The movement may be adjusted by the direction moving table 51. Note that the movement adjustment in the θ-axis direction is
This may be achieved by rotation of the mount head 38 by the θ-direction rotary actuator 40. For movement adjustment in the Y-axis direction, the circuit board 44 is moved to the Y-axis direction moving table 4.
You may adjust by moving by 3.

[0040]

As described above, according to the present invention, the coarse movement adjusting camera and the coarse movement adjusting means are provided, and the coarse movement adjusting camera images in advance and the coarse movement adjusting means performs the coarse movement adjustment. Is.

By performing the coarse adjustment in this way, it becomes possible to capture the chip-shaped component in a short time by a high-magnification, small-field-of-view mount position adjustment camera for highly accurate alignment. As a result, the tact time is shortened and the productivity is improved. Further, by adding the step of coarse movement adjustment, the adjustment amount at the time of highly accurate alignment can be reduced, and the alignment precision can be stabilized and improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing an overall configuration of a chip-shaped component mounting device.

FIG. 2 is a main part perspective view showing a bare chip supply part.

FIG. 3 is a front view of the same.

FIG. 4 is a front view of a chip reversing head.

FIG. 5 is a front view showing suction of a chip-shaped component by a mount head.

FIG. 6 is a front view of the main parts showing the operation of the mount position adjustment camera.

FIG. 7 is a block diagram of a control system.

FIG. 8 is a perspective view of a conventional chip-shaped component mounting device.

[Explanation of symbols]

 19 Abutting plate 20 Bare chip 21 Chip supply table 22 Adsorption nozzle 23 Chip reversing head 24 Rotary actuator 25 Support table 26 X-axis moving table 27 Y-axis moving table 30 Coarse adjustment camera 31 Arm 32 Strut 33 Frame 36 Support table 37 X-axis direction guide rail 38 Mount head 39 Adsorption nozzle 40 θ-direction rotary actuator 43 Y-axis direction moving stand 44 Circuit board 47 Mount position adjustment camera 48 Chip imaging section 49 Board imaging section 50 X-axis direction moving stand 51 Y-axis moving stand 54 Operation Panel 55 Start Button 56 Operation Button 60 Control Computer 61 Actuator (for Moving Mount Head)

Claims (7)

[Claims] 1. A chip-shaped component mounting apparatus in which an image of a chip-shaped component is picked up by a mount position adjusting camera, the position is adjusted by a position adjusting means, and the mount head mounts the chip-shaped component at a predetermined mount position. Coarse movement adjusting means is provided, and prior to the image pickup by the mount position adjusting camera and the position adjustment by the position adjusting means, an image is taken by the coarse movement adjusting camera and the coarse movement adjusting means performs the coarse movement adjustment. A mounting device for chip-shaped parts, characterized in that 2. The chip-shaped component mounting apparatus according to claim 1, wherein the coarse-movement adjusting means adjusts the position of the chip-shaped component held by the mount head in advance. 3. The chip-shaped component mounting apparatus according to claim 1, wherein the coarse-movement adjusting means coarse-adjusts the relative position of the chip-shaped component with respect to the mount position adjustment camera. 4. The mount position adjusting camera has a pair of upper and lower optical systems, and an image of a chip-shaped part held by a mount head is taken in by an upper optical system, and an image of a mount position is taken by a lower optical system. The chip-shaped mount device according to claim 1, 2, or 3, wherein the chip-shaped mount device is incorporated. 5. A chip inversion head for supplying a chip-shaped component to a mount head is provided, and the chip-shaped component transferred and inverted by the chip inversion head is imaged by the coarse adjustment camera. Claim 1, characterized in that
The mounting device for a chip-shaped component according to claim 2, claim 3, or claim 4. 6. The chip-shaped component mounting apparatus according to claim 1, 2, 3, 4, or 5, wherein the chip-shaped component is a bare chip IC. 7. A method of mounting a chip-shaped component at a predetermined position by a mount head, wherein a coarse movement adjustment camera recognizes the position and / or orientation of the chip-shaped component to perform coarse movement adjustment, and then the mount position. A chip-shaped component mounting method, wherein fine adjustment is performed by recognizing the position and / or orientation of the chip-shaped component with an adjustment camera.