JPH09211073A - Inspecting apparatus for flip-chip connecting substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contact the probes of an inspecting apparatus to a mounting pad directly when the inspection of a flip-chip connecting substrate having the mounting pad for mounting a flip-chip semiconductor integrated circuit is performed. SOLUTION: A substrate for inspection 10 is inserted between a mounting pad 2 and probes 21 of an inspecting apparatus 20. The substrate for inspection 10 is constituted of a TAB tape 12 having minute bumps 16 in contact with the mounting pad 2 and a supporting substrate 11, which supports the TAB tape 12 and contact pads 19 to which the probes 21 are brought into contact. By arranging the contact pads 19 on the supporting substrate 11, the planar dimension of the substrate for inspection 10 can be made small. A probe 23 is brought into contact with an end terminal 4 of the connecting substrate 1, and the inspection of the circuits between the mounting pad 2 and the end terminal 4 can be performed. Furthermore, the interval between the substrate for inspection 10 and the connecting substrate can be made small by providing the TAB-tape structure. It is not necessary to provide minute probes for the minute bumps 16, and the manufacture of the substrate for inspection becomes easy.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus for inspecting a connection board for mounting a flip chip type semiconductor integrated circuit, and more particularly to an apparatus for inspecting an electric circuit of a connection board including a flip chip electrode. .

[0002]

2. Description of the Related Art A connection board on which a flip-chip type semiconductor integrated circuit is mounted is formed with fine mounting pads for mounting by directly connecting bumps or the like constituting flip-chip electrodes. Various wiring circuits connected to terminal elements such as predetermined power supply terminals and signal terminals are formed. In order to inspect the wiring circuit of such a connection board, it is preferable to inspect each path from the mounting pad to each of the terminators. However, since the mounting pads are formed as an extremely fine pattern corresponding to the electrodes of the flip-chip type semiconductor integrated circuit, the probes (inspection needles) provided in the existing test equipment can be used as individual mounting pads. Direct contact is difficult. Therefore, conventionally, a test pad is provided between the mounting pad and each terminator, a probe is brought into contact with this test pad, and an electrical test is performed between the test pad and the terminator for mounting. A visual inspection is performed between the pad and the test pad with the naked eye. Therefore, it is unavoidable that there are defects that cannot be visually inspected, and this is one of the causes for lowering the yield of conventional connection boards.

In view of the above, a technique has been proposed in which a probe is indirectly contacted with the mounting pad by providing a contact pad in which the mounting pad is enlarged in plan view. FIG. 4 shows Japanese Patent Laid-Open No. 5-218150.
This is a technique proposed in Japanese Laid-Open Patent Publication No. 2003-115, in which a flexible film 33 having a fine contactor 32 capable of contacting the electrode 30a of the semiconductor integrated circuit 30 is arranged on the surface of the support plate 31 and connected to this contactor 32. The circuit pattern 34 on the flexible film 33 is enlarged in size in the plane direction in the peripheral portion thereof, and is electrically connected to the probe 36 of the inspection device at the enlarged portion 35. In this apparatus, by forming the contactor 32 minutely, it is possible to directly contact the electrode 30a of the minute semiconductor integrated circuit 30 and inspect its electrical characteristics.

However, when this technique is applied to inspect a flip-chip connection substrate as the subject of the present invention, a circuit connected to the contactor 32 although the contactor 32 can electrically contact the mounting pad. When the pattern 34 is enlarged in the plane direction to the peripheral portion and it is attempted to electrically connect to the inspection device in the enlarged portion 35, there is a terminator in the peripheral portion of a normal flip chip connection substrate, and this terminator is present. Also, since it is necessary to electrically connect the inspection device, it is necessary to dispose the enlarged portion 35 at a position avoiding the terminator. Therefore, the enlarged portion 35 of the circuit pattern 34 is inevitably limited to the inner side of the region in which the terminator is arranged, and the expected effect cannot be obtained due to this limitation. I will not be able to.

On the other hand, the applicant of the present invention first discloses in Japanese Patent Laid-Open No. 5-2.
The technique proposed in Japanese Patent No. 11215, as shown in FIG. 5, uses a chip substrate 41 having an inspection pad 42 formed by a technique similar to that of an ordinary semiconductor integrated circuit chip as a probe card substrate 43 having a multilayer wiring structure. The probe 44 of the inspection device is fixed on the upper surface of the probe card substrate 43.
Is provided with a metal electrode 45 that can be contacted with the above, and the inspection pad 42 and the metal electrode 45 are electrically connected by a thin metal wire 46 via the chip substrate 41 and the probe card substrate 43. In this configuration, the chip substrate 41
Since the probe 44 is brought into contact with the metal electrode 45 in the plane area including the area, when the technique is applied to the inspection device of the flip chip connection board, the plane size of the probe card is restricted by the terminator of the flip chip connection board. Even in such a case, it is advantageous in that the upper region of the chip substrate 41 can be effectively used.

[0006]

However, in the one proposed above, since the chip substrate 41 and the probe card substrate 43 are electrically connected by the fine metal wire 46, the fine inspection pad 42 of the chip substrate 41 is It is necessary to form a fine probe 48 for preventing the thin metal wire 46 from coming into contact with the semiconductor chip 47 which is a non-inspection body. Such a fine probe 48 is formed on the chip substrate 41 at a fine pitch (60 to 80 μm). It is extremely difficult to form by (1), and even if it is possible, the cost is increased, and it is difficult to actually apply such a technique, and there remains a problem to be solved.

It is an object of the present invention to provide a flip chip connection board inspection apparatus which can be manufactured easily and can be constructed at low cost and which can be practically used.

[0008]

A flip-chip connection board inspection apparatus according to the present invention comprises an inspection board interposed between a mounting pad provided on the flip-chip connection board and a probe of the inspection apparatus. This inspection board is integrally attached with a TAB tape on which fine bumps connected to the mounting pads are formed, and the TAB tape is integrally attached, and the upper surface of the TAB tape is electrically connected to the fine bumps and brought into contact with the probe of the inspection apparatus. And a supporting substrate on which contact pads are formed.

In this support substrate, a connection pad provided on the lower surface and a contact pad provided on the upper surface are electrically connected to each other by a multilayer wiring structure, and the connection pad has a T-shape.
The conductive leads of the AB tape are connected, and the plurality of contact pads are arranged in a grid pattern in the plane area including the TAB tape. The TAB tape has a circuit pattern and leads formed of copper foil on an insulating film such as a polyimide film, fine bumps are formed on a part of the circuit pattern, and the leads connected to the fine bumps are supported. It is mechanically and electrically connected to the connection pad of the substrate by a brazing material.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing the overall configuration of a flip-chip connection board inspection apparatus according to the present invention. The flip-chip connection substrate 1 has a flip-chip type semiconductor integrated circuit (not shown) mounted on the upper surface thereof, and a plurality of fine mounting pads 2 to which bumps and the like provided on the flip-chip type semiconductor integrated circuit are directly connected are arrayed. A required circuit pattern 3 is formed of a conductive film on these mounting pads 2, and some of them are connected to various terminators 4 such as power supply terminals and signal terminals. Here, a test pad 5 electrically connected to the mounting pad 2 or the circuit pattern 3 is provided on the back surface of the flip-chip connection substrate 1 as before.

On the other hand, the inspection board 10 is placed on the mounting pad 2, and the probe 21 of the inspection device 20 is electrically connected via the inspection board 10. The inspection board 10 is composed of a support board 11 and a TAB tape 12, as shown in FIGS. 2A and 2B, a front view and a back view, and FIG. Has been done. The TAB tape 12 is composed of a polyimide film 13 and a wiring pattern 14 made of a copper foil which is attached to the surface of the polyimide film 13 and formed into a required pattern, and a part of the wiring pattern 14 is formed. Is formed with a fine pad 15 corresponding to the mounting pad 2 of the flip chip connection substrate 1.
Further, fine bumps 16 made of solder or the like are formed on the fine pads 15. Here, since the wiring pattern 14 is pattern-formed using the photolithography technique as in the manufacture of the semiconductor integrated circuit, the fine pads 15 and the fine bumps 16 can be finely formed.

The TAB tape 12 is mounted on the lower surface of the support substrate 11 and integrated with it. The support substrate 11 is formed as a multilayer wiring structure substrate in which conductive wiring films 11a are formed in multiple layers mainly on an insulating substrate such as ceramics. The TAB tape is provided on the connection pad 17 provided on the lower surface of the support substrate 11. The TAB tape 12 is supported on the support substrate 11 by connecting the leads 18 formed by a part of the wiring pattern 14 of the wiring 12 with brazing material such as solder.
Integrated with each other and electrically connected to each other. In addition, a plurality of contact pads 1 are formed on the upper surface of the support substrate 11.
9 are arranged in a grid pattern, and each contact pad 19 is electrically connected to the connection pad 17 or the like. The contact pad 19 is formed with a pitch dimension that allows the probe 21 of the inspection device 20 to be in contact therewith.

When the flip chip connection substrate 1 is inspected using such an inspection substrate, as shown in FIG. 1, the inspection substrate is mounted on the mounting pads 2 provided on the flip chip connection substrate 1. 10 is positioned, and the inspection board 10 is pressed onto the flip-chip connection board 1 on the position. As a result, the fine bumps 16 provided on the TAB tape 12 are brought into contact with the mounting pads 2, respectively, and mutual electrical contact is made. Then, a part 22 of the probe of the inspection device 20 is brought into contact with the test pad 5 provided on the back surface of the flip chip connection substrate 1 to electrically connect it, and the other probe 21 is connected to the contact pad 19 of the inspection substrate 10. To make electrical connection. Then, the inspection device 20 inspects the conduction state between the probes 21 and 22. In particular, by conducting a continuity test between the contact pads 19 on the upper surface of the inspection board 10 and the test pads 5 on the back surface of the flip chip connection board 1, the conduction between the mounting pads 2 of the flip chip connection board 1 and the test pads 5 is conducted. Can be inspected.

Therefore, an electrical inspection between the mounting pad 2 and the test pad 5 of the flip chip connection substrate 1 becomes possible, and the inspection which has hitherto relied on the visual inspection is performed objectively and with high reliability. This is effective in improving the yield. Although only a part of the test pads 5 is shown in FIG. 1, if the test pads 5 are provided corresponding to all the mounting pads 2 provided on the flip chip connection substrate 1, all the test pads 5 are provided. It is possible to inspect between the mounting pad and the test pad.

Although an example of inspecting the circuit between the mounting pad 2 and the test pad 5 is shown here, the circuit between the mounting pad 2 and each terminator 4 may be directly inspected. It is possible. In this case, a part of the probes 23 of the inspection device 20 may be brought into direct contact with each of the terminators 4, as shown by a chain line in FIG. In this case, in the inspection board 10 in this embodiment, the contact pads 19 with which the probe 21 is contacted are arranged in a grid pattern on the upper surface of the inspection board 10. Therefore, each contact pad 19 is extended to the periphery of the inspection board 10. There is no need to enlarge it, and there is no need to increase the plane size of the inspection substrate 10. Therefore, the inspection substrate 10 does not exist in the upper region of the terminator 4 provided in the peripheral portion of the flip chip connection substrate 1, and the probe does not contact the terminator as in the conventional technique shown in FIG. It won't be difficult.

Further, here, since the fine bumps 16 provided on the inspection substrate 10 are formed by the TAB tape structure, even when the fine bumps 16 are brought into contact with the mounting pads 2 of the flip chip connection substrate 1. Unlike the conventional device using the thin metal wires, it is not necessary to secure a required space with respect to the flip-chip connection substrate 1, and there is almost no possibility of a short circuit between the two. Therefore, TAB
It is not necessary to form a fine probe for contacting the mounting pad 2 on the fine bumps 16 of the tape 12, and an inspection substrate can be formed extremely easily and at low cost.

[0017]

As described above, according to the present invention, the inspection board is provided between the mounting pad provided on the flip-chip connection board and the probe of the inspection apparatus, and the inspection board is connected to the mounting pad. With fine bumps formed
Since the B tape and the TAB tape are integrally attached to the upper surface of the support substrate, the upper surface of which is formed a contact pad that is electrically connected to the fine bumps to contact the probe. By contacting the contact pad, the mounting pad and the probe can be electrically connected, and the flip chip connection substrate can be inspected.
Further, in this case, the contact pad is also arranged in the upper region of the TAB tape to reduce the plane size of the inspection board and enable connection of the probe to the terminator of the flip-chip connection board. It is also possible to inspect the circuit between and. Further, since the fine bumps that come into contact with the mounting pads are formed on the TAB tape and supported by the supporting substrate, the distance between the flip chip connection substrate and the inspection substrate can be reduced, and it is not necessary to provide fine probes on the fine bumps. In addition, the inspection board can be easily manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a front view showing an overall configuration for explaining an inspection state by an inspection device of the present invention.

FIG. 2 is a front view and a back view of an inspection board.

FIG. 3 is an enlarged cross-sectional view of a part of the inspection board.

FIG. 4 is a front view for explaining an example of a conventionally proposed inspection apparatus.

FIG. 5 is a front view for explaining the outline of the inspection apparatus previously proposed by the present applicant.

[Explanation of symbols]

 1 Flip Chip Connection Board 2 Mounting Pad 3 Circuit Pattern 4 Terminator 5 Test Pad 10 Inspection Board 11 Supporting Board 12 TAB Tape 13 Polyimide Film 14 Wiring Pattern 16 Fine Bump 17 Connection Pad 19 Contact Pad 20 Inspection Equipment 21, 22, 23 probe

Claims (4)

[Claims] 1. An inspection apparatus for a flip chip connection substrate having a mounting pad for mounting a flip chip type semiconductor integrated circuit, wherein the inspection is inserted between the mounting pad and the probe of the inspection apparatus. The inspection board is provided with a TAB tape on which fine bumps connected to the mounting pads are formed, and the TAB tape is integrally attached, and the upper surface of the TAB tape is electrically connected to the fine bumps. An inspection apparatus for a flip-chip connection board, comprising: a support board having a contact pad on which a probe is contacted. 2. The support substrate has a connection pad provided on a lower surface thereof and the contact pad provided on an upper surface thereof electrically connected to each other by a multilayer wiring structure, and the connection pad has a T
The flip chip connection board inspection apparatus according to claim 1, wherein the conductive leads of the AB tape are connected, and the plurality of contact pads are arranged in a grid pattern in a plane region including the TAB tape. 3. The TAB tape has a circuit pattern and leads formed of copper foil on an insulating film such as a polyimide film, and fine bumps are formed on a part of the circuit pattern and connected to the fine bumps. 3. The flip chip connection board inspection apparatus according to claim 1, wherein the leads are mechanically and electrically connected to the connection pads of the support board by a brazing material. 4. The flip-chip connection board is provided with various terminators electrically connected to the mounting pads and a test pad, and the probe of the inspection apparatus is configured so that the terminator and the test pad can be contacted arbitrarily. An inspection apparatus for a flip chip connection substrate according to any one of claims 1 to 3.