JPH09205260A - Resin body containing printed-wiring board and motor stator provided with this resin body - Google Patents
Resin body containing printed-wiring board and motor stator provided with this resin bodyInfo
- Publication number
- JPH09205260A JPH09205260A JP3303696A JP3303696A JPH09205260A JP H09205260 A JPH09205260 A JP H09205260A JP 3303696 A JP3303696 A JP 3303696A JP 3303696 A JP3303696 A JP 3303696A JP H09205260 A JPH09205260 A JP H09205260A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- wiring board
- resin body
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
Landscapes
- Structure Of Printed Boards (AREA)
- Brushless Motors (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、印刷配線板を含
む樹脂体と、このような樹脂体を備えたモータステータ
に係り、特に金型による回路パターン損傷を防ぐように
したものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin body including a printed wiring board and a motor stator provided with such a resin body, and more particularly to a motor body for preventing damage to a circuit pattern by a mold.
【0002】[0002]
【従来の技術】従来より、印刷配線板に電子部品等を載
置結線して堅固な固着、塵埃等の侵入を防ぐ目的より樹
脂で一体モールドする構造は知られている。最近におい
ては小型化のため回路パターンを細く形成せざるを得な
い。特にCDROMスピンドルモータのように、複数個
のホール素子と電機子コイルを印刷配線板に載置結線し
てなるモータステータにおいては、回路パターンも極め
て細くしなくてはならない。2. Description of the Related Art Conventionally, there has been known a structure in which an electronic component or the like is placed and connected on a printed wiring board to be firmly fixed and integrally molded with a resin for the purpose of preventing intrusion of dust and the like. Recently, in order to reduce the size, it is inevitable to form a fine circuit pattern. Particularly in a motor stator such as a CDROM spindle motor in which a plurality of Hall elements and armature coils are mounted and connected to a printed wiring board, the circuit pattern must be extremely thin.
【0003】[0003]
【発明が解決しようとする課題】このように回路パター
ンを細くすると、印刷配線板を金型でサンドイッチのよ
うに挟んで樹脂モールドするとき、金型は外方に配した
他の電子部品から逃げるために薄く形成する必要がある
ため、回路パターンを傷つけたり、切断してしまうおそ
れがある。特に銅張鉄板型の印刷配線板では全く縮小し
ないので、この問題が大きく発生する。この発明の目的
は、上記の問題点を金型の構造を複雑にすることなく簡
単な構成により解決しようとするもので、回路パターン
を傷つけてしまうおそれのない印刷配線板を含む樹脂体
にすることにある。When the circuit pattern is thinned in this way, when the printed wiring board is sandwiched by a mold like a sandwich and resin-molded, the mold escapes from other electronic parts arranged outside. Therefore, the circuit pattern needs to be thinly formed, which may damage or cut the circuit pattern. In particular, a copper-clad iron plate type printed wiring board does not shrink at all, so this problem occurs greatly. An object of the present invention is to solve the above problems by a simple structure without complicating the structure of a mold, and to provide a resin body including a printed wiring board that does not damage a circuit pattern. Especially.
【0004】[0004]
【課題を解決するための手段】上記のような問題点を解
決するために、この発明は樹脂モールド部より外方に導
出されたパターンを金型から保護する手段を設けたもの
で、これにより、導出されたパターンの傷や切断などの
問題を解決できる。In order to solve the above problems, the present invention is provided with a means for protecting a pattern led out from a resin mold portion from a mold. , It is possible to solve problems such as scratches and cutting of the derived pattern.
【0005】[0005]
【発明の実施の形態】この発明は、樹脂モールド部より
外方に導出されたパターンを保護する手段としては導出
されたパターンの金型受け部を幅広にして当接圧力を分
散するのがよい。BEST MODE FOR CARRYING OUT THE INVENTION According to the present invention, as a means for protecting a pattern led out from a resin mold portion, it is preferable to widen a die receiving portion of the led pattern to disperse the contact pressure. .
【0006】また、導出されたパターンの近傍の金型受
け部に捨てパターンを設けてこの部分で金型を受けるこ
とにより、導出パターンを保護するようにしてもよい。It is also possible to protect the derived pattern by providing a discard pattern in the mold receiving portion near the derived pattern and receiving the mold at this portion.
【0007】さらに、モータステータに応用するには、
印刷配線回路を有するステータベースに複数個の電機子
コイルを載置し、各端末を所定の回路パターンに結線
後、樹脂で一体にモールドしてなるものであって、樹脂
モールド部より外方に導出されたパターンを金型から保
護するために金型受け部を幅広にしたり、捨てパターン
を形成するのがよい。Further, for application to a motor stator,
A plurality of armature coils are placed on a stator base having a printed wiring circuit, each terminal is connected to a predetermined circuit pattern, and then integrally molded with resin. In order to protect the derived pattern from the mold, it is preferable to widen the mold receiving portion or form a discard pattern.
【0008】上記のようにすると、金型の合わせ部分
(金型受け部)の押圧力が分散し単位面積当たりの押圧
力が小となって外方へ導出されたパターンの切断や傷な
どの不具合が生じなくなる。With the above arrangement, the pressing force of the mating portion of the mold (mold receiving portion) is dispersed, and the pressing force per unit area becomes small, so that there is no problem such as cutting or scratching of the pattern led to the outside. No problems will occur.
【0009】[0009]
【実施例】次にこの発明の印刷配線板を含む樹脂体とし
てブラシレスのモータステータに応用した実施例を図1
に示す要部斜視図及び図2に示す印刷配線板のパターン
形成平面図で説明する。同図において、1は所定の回路
パターン群11、12‥‥を印刷配線した銅張鉄基板か
らなるステータベースで、6個の空心電機子コイル2‥
‥が放射状に且つ中心から同心円となるようにUV硬化
剤等で固着され、ホール素子端末を含め各端末を所定の
回路パターンに半田結線後、中央に配した軸受ホルダ3
と共に耐熱性樹脂Jで一体成形してなる。このような樹
脂モールドする金型は他の駆動用ICなどの電子部品か
ら逃げるため、外周部の厚みが0.3ミリ程度と薄くな
っているため、この金型受け部分の導出用回路パターン
11、12、13は幅広部4、5、6になっている。ま
た導出用回路パターンのない部分には捨てパターン7、
8などが形成されて金型受け部分の押圧力を分散させて
いる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment in which a resin body containing a printed wiring board according to the present invention is applied to a brushless motor stator is shown in FIG.
It will be described with reference to the perspective view of the main part shown in FIG. 2 and the pattern formation plan view of the printed wiring board shown in FIG. In the figure, 1 is a stator base made of a copper clad iron substrate on which predetermined circuit pattern groups 11, 12, ... Are printed and wired, and six air-core armature coils 2.
The bearing holders 3 are fixed radially with a UV curing agent or the like so as to form concentric circles from the center, and each terminal including the Hall element terminals is soldered to a predetermined circuit pattern and then arranged in the center.
Together with this, it is integrally molded with heat resistant resin J. Since such a resin-molding die escapes from other electronic components such as driving ICs, the outer peripheral portion has a thin thickness of about 0.3 mm. Therefore, the lead-out circuit pattern 11 of the die receiving portion is formed. , 12 and 13 are wide portions 4, 5 and 6. In addition, in the part where there is no derivation circuit pattern, the discard pattern 7,
8 and the like are formed to disperse the pressing force of the die receiving portion.
【0010】上記は導出用回路パターンの金型受け部を
幅広にしたものを示したが回路パターンを接近させて形
成し、捨てパターンを大きくとってもよい。Although the above has shown the case where the die receiving portion of the deriving circuit pattern is wide, the circuit patterns may be formed close to each other, and the discard pattern may be made large.
【0011】また、上記実施例では、ステータベースと
して銅張鉄基板からなるものを示したが、鉄損を防ぐた
めに、薄手のガラスクロスエポキシ基板またはフレキシ
ブル基板を珪素鋼板に貼着してなるステータベースにし
てもよい。In the above embodiment, the stator base is made of a copper clad iron substrate. However, in order to prevent iron loss, a thin glass cloth epoxy substrate or a flexible substrate is attached to a silicon steel plate. May be used as a base.
【0012】この発明は、印刷配線板を含む樹脂体であ
ればブラシレスモータのステータにかぎらず他の電子部
品アッセンブリにも応用できる。The present invention can be applied not only to the stator of a brushless motor but also to other electronic component assemblies as long as it is a resin body containing a printed wiring board.
【0013】[0013]
【発明の効果】この発明は、上記のように構成したの
で、印刷配線板を含む樹脂体として回路パターンを細く
したものでも、樹脂モールド時にパターンの傷や断線を
おこすおそれがなくなり、特にブラシレスモータのステ
ータのように銅張鉄基板などに用いて好適なものとな
る。EFFECTS OF THE INVENTION Since the present invention is configured as described above, even when the circuit pattern is made thin as the resin body including the printed wiring board, there is no risk of the pattern being scratched or broken during resin molding, and in particular the brushless motor. It is suitable for use on a copper clad iron substrate such as the stator.
【図1】本発明の印刷配線板を含む樹脂体としてブラシ
レスモータのステータに応用した実施例の要部斜視図で
ある。FIG. 1 is a perspective view of essential parts of an embodiment in which a resin body including a printed wiring board according to the present invention is applied to a stator of a brushless motor.
【図2】同実施例の印刷配線板からなるステータベース
の平面図である。FIG. 2 is a plan view of a stator base including the printed wiring board according to the same embodiment.
1 ステータベース 11、12‥‥ 回路パターン 2 空心電機子コイル 3 軸受ホルダ J 樹脂 4、5、6 幅広部 7、8 捨てパターン 1 Stator base 11, 12, ... Circuit pattern 2 Air core armature coil 3 Bearing holder J Resin 4, 5, 6 Wide part 7, 8 Discard pattern
Claims (4)
形成した印刷配線板を含む樹脂体において、樹脂モール
ド部より外方に導出されたパターンを金型から保護する
手段を設けた印刷配線板を含む樹脂体。1. A printed wiring board including a printed wiring board having a circuit pattern formed inside and outside a resin molding portion, and a means for protecting a pattern led out from the resin molding portion from a mold. Resin body containing.
型受け部を幅広にした請求項1に記載の印刷配線板を含
む樹脂体。2. The resin body including a printed wiring board according to claim 1, wherein the die receiving portion of the pattern derived as the means is widened.
傍の金型受け部に捨てパターンを設けた請求項2に記載
の印刷配線板を含む樹脂体。3. The resin body including a printed wiring board according to claim 2, wherein a discard pattern is provided in a mold receiving portion near the pattern derived as the means.
複数個の電機子コイルを載置し、各端末を所定の回路パ
ターンに結線後、樹脂で一体にモールドしてなる印刷配
線板を含む樹脂体を備えたモータステータにおいて、樹
脂モールド部より外方に導出されたパターンを金型から
保護する手段を設けた印刷配線板を含む樹脂体を備えた
モータステータ。4. A resin body including a printed wiring board formed by mounting a plurality of armature coils on a stator base having a printed wiring circuit, connecting each terminal to a predetermined circuit pattern, and integrally molding the resin with a resin. A motor stator including a resin body including a printed wiring board provided with means for protecting a pattern drawn out from a resin mold portion from a mold in the motor stator including the.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3303696A JP3472015B2 (en) | 1996-01-26 | 1996-01-26 | Resin body including printed wiring board and motor stator provided with this resin body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3303696A JP3472015B2 (en) | 1996-01-26 | 1996-01-26 | Resin body including printed wiring board and motor stator provided with this resin body |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09205260A true JPH09205260A (en) | 1997-08-05 |
JP3472015B2 JP3472015B2 (en) | 2003-12-02 |
Family
ID=12375574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3303696A Expired - Fee Related JP3472015B2 (en) | 1996-01-26 | 1996-01-26 | Resin body including printed wiring board and motor stator provided with this resin body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3472015B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190165641A1 (en) * | 2017-11-30 | 2019-05-30 | Nidec Corporation | Circuit board, motor, and fan motor |
-
1996
- 1996-01-26 JP JP3303696A patent/JP3472015B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190165641A1 (en) * | 2017-11-30 | 2019-05-30 | Nidec Corporation | Circuit board, motor, and fan motor |
Also Published As
Publication number | Publication date |
---|---|
JP3472015B2 (en) | 2003-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |