JPH09191167A - Chip component and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form required conductor pattern and terminal electrodes at the same time to reduce the production cost by patterning a conductor film on the inner faces of terminal electrode forming holes, together with a conductor film on a substrate to form specified conductor pattern including the terminal electrodes of a chip component. SOLUTION: An insulative substrate 1 such as glass substrate is selected. Terminal electrode forming holes 2 and via-hole forming holes are formed through the substrate in the same stem. A conductor film is formed on the front and back faces of the substrate 1 and inner faces of the holes by the Cu plating etc. A photoresist film is applied to the entire surface by electrodeposition. A photo mask is patterned to form spiral conductor patterns 7 on both sides of the substrate as well as via-holes 3' and terminal electrodes 6. A protective film is printed on other part than the electrodes 6. Finally individual chip components are separated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component surface-mounted on a circuit board and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, for example, for a chip resistor or the like mounted on a circuit board, various electrode patterns for a plurality of chips are formed on an insulating substrate, and these are firstly divided into columns and divided. After printing the side electrode on the surface and firing it,
It is manufactured by subdividing into individual chip shapes and further plating the terminal electrode portions. Also, for example, a mold type chip inductor is manufactured by mounting a winding as a separate body on a substrate and covering the whole with a resin, and a multilayer type chip inductor is manufactured by using a ferrite green sheet to form a conductor. It is manufactured by alternately laminating and printing magnetic materials and firing.

[0003] Further, as a planar inductance element in which a separate coil is not mounted or lamination printing is not performed,
In some cases, a spiral conductive pattern was formed on an insulating substrate. FIG. 18 shows an example of a case where such a conventional planar inductance element is formed into a chip shape. In FIG. 18, a spiral conductor pattern 13 is formed on the substrate, and the outer peripheral end of the spiral conductor pattern 13 is one of the terminal electrodes 1.
8 is connected to the other terminal electrode 18 via an air bridge 17. The steps of forming the chip inductor by patterning the conductor film in a spiral shape as described above are as follows. First, as shown in FIG. 19, a resist film 11 is patterned on the upper surface of the substrate 10,
As shown in FIG. 20, a conductor film 12 is vapor-deposited on the entire surface, and the resist film 11 is lifted off to form a spiral conductor pattern 13. Subsequently, the resist film 14 is patterned as shown in FIG. 22, the power feeding layer 15 is sputtered on the surface thereof, and the resist film 16 is formed at portions other than the portion where the air bridge is to be formed as shown in FIG.
To form an air bridge 17 by plating. After that, the resist film 14 is removed by the ion milling method as shown in FIG. 24, each chip is cut from the substrate as shown in FIG. 25, and the terminal electrode 18 is formed at the end thereof.

[0004]

However, in the above-mentioned conventional chip components, the terminal electrodes on the side surfaces must be formed individually after separating the chip-shaped sections from the substrate, regardless of the type. Was. In addition, since a chip component such as a multilayer chip inductor formed by thick film printing forms a multi-layered conductor pattern, there is a problem that the number of manufacturing steps increases, and an air bridge is formed as shown in FIG. However, the resist film for forming the air bridge must be removed in a special process, which complicates the manufacturing process as a whole.

An object of the present invention is to provide a chip part and a method of manufacturing the same which can solve the above problems by forming a conductor pattern required for a chip part and a terminal electrode substantially at the same time.

Another object of the present invention is to enable formation of a conductor pattern required for a chip component by a conductor pattern of substantially a single layer without using a conventional air bridge or the like. It is an object to provide a chip component and a method for manufacturing the same that solve the problem.

Another object of the present invention is obtained in the prior art in which a plurality of terminal electrodes are provided at opposite ends and conductive patterns extending from the plurality of terminal electrodes are provided on the front and back surfaces of the substrate, respectively. An object of the present invention is to provide a small-sized and multifunctional chip component that has not been achieved and a manufacturing method thereof.

[0008]

According to the method of manufacturing a chip component of the present invention, in order to be able to form a predetermined conductor pattern and a terminal electrode at the same time, an insulating substrate, Alternatively, a step of forming a terminal electrode forming hole in which a part of the inner surface is a part of a terminal electrode of a chip component is formed on a substrate on which an insulating plate is preformed with a conductor film, and on the substrate and the terminal electrode forming hole. A step of forming a conductor film on an inner surface by a plating method, and a conductor film on the substrate or a conductor film on the inner surface of the terminal electrode forming hole together with the conductor film on the substrate are patterned by an etching method to form a chip component Forming a predetermined conductor pattern including the terminal electrodes of
Forming a slit or a groove at a position on the substrate passing through a portion of the chip component where no terminal electrode is formed, and separating the chip component from the substrate.

In the method of manufacturing a chip component according to the first aspect of the present invention, the terminal electrode forming hole is formed in the substrate in advance, the conductor film is formed on the inner surface of the terminal electrode forming hole by the plating method, and the substrate is formed by the etching method. Necessary because the conductor film on the inner surface of the terminal electrode formation hole is patterned together with the conductor film on the top or the conductor film on the substrate, and then the chip component is separated from the substrate at the portion where the terminal electrode is not formed. Since the conductive pattern and the terminal electrode are simultaneously formed, and the terminal electrode is formed before being separated as a chip component, the manufacturing cost is significantly reduced.

Further, according to the method of manufacturing a chip component of the present invention, an insulating substrate is formed as described in claim 2 in order to form conductive patterns on the front and back surfaces of the substrate and to easily conduct the two. Or, in a substrate in which a conductor film is preliminarily formed on an insulating plate, a hole for forming a terminal electrode whose inner surface is a part of a terminal electrode of a chip component and a hole for a via hole are formed in a chip component forming region. A step of forming a conductor film on the front and back surfaces of the substrate, the inner surfaces of the terminal electrode forming holes and the via hole holes by a plating method, and a conductor film on the front and back surfaces of the substrate or the front and back surfaces of the substrate Forming a predetermined conductor pattern including the terminal electrodes of the chip component by patterning the conductor film on the inner surface of the terminal electrode forming hole with the conductor film of 1. by an etching method, and the terminal electrode of the chip component. Forming a slit or groove in the position on the substrate through the formed portions not, and a step of separating the chip components from the substrate.

In the chip component of the present invention, the conductor patterns on the front and back surfaces of the substrate are electrically connected to each other so that the two-layer conductor pattern is used. A hole is formed, a terminal electrode is formed at opposite ends of the insulating substrate, a conductor film is formed in the via hole hole, and one terminal electrode on the surface of the insulating substrate and the via hole hole are formed. A conductor pattern of a predetermined shape is formed between the conductor film and the conductor film of a predetermined shape between the other terminal electrode on the back surface of the insulating substrate and the conductor film in the hole for the via hole. Formed.

In the chip component manufacturing method according to claim 2 and the chip component according to claim 3, after the terminal electrode forming holes and the via hole are formed in the substrate, the front and back surfaces of the substrate and the terminals are plated by a plating method. A conductor film is formed on the inner surfaces of the hole for electrode formation and the via hole, and the conductor film on the inner surface of the terminal electrode formation hole is formed by the etching method together with the conductor film on the front and back surfaces of the substrate or the conductor film on the front and back surfaces of the substrate. Since the film is patterned, and then the chip component is separated from the substrate, a predetermined conductor pattern on the front and back surfaces of the substrate and via holes are simultaneously formed together with the terminal electrodes. It becomes possible to easily manufacture a chip component that conducts through the inside of the substrate.

Further, in order to use the chip component of the present invention as a chip inductor, as described in claim 4, the hole for via hole is provided at substantially the center of the substrate and has the predetermined shape. Each of the conductor patterns spirally extends from the terminal electrode to the conductor film in the via hole.

In the chip component according to the fourth aspect, since the spiral conductor pattern is formed from the terminal electrode to the via hole on each of the front and back surfaces of the substrate, the inductor is provided between the opposing terminal electrodes. Unlike the conventional one using the laminated printing and the one using the air bridge, a chip inductor using the conductor pattern on the front and back surfaces of the substrate can be obtained.

Further, the chip component of the present invention has four or more terminal electrodes and obtains a multifunctional chip component by the conductor pattern composed of two layers. A plurality of terminal electrodes are formed on opposite ends of the insulating substrate, a conductor pattern connected to the plurality of terminal electrodes on one end is formed on the surface of the insulating substrate, and the other end is formed on the back surface of the insulating substrate. A conductor pattern connected to the plurality of terminal electrodes of the portion.

In the chip component according to the fifth aspect, the conductor pattern extending from the four or more terminal electrodes to the front and back surfaces of the substrate acts as a chip component having a predetermined function. For example, if two terminal electrodes are formed on opposite ends of the substrate and zigzag electrode patterns are formed on the front and back surfaces of the substrate, the zigzag electrode patterns on the front and back surfaces of the substrate are inductively coupled to each other. Will act as a transformer.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION A chip part and a method for manufacturing the same according to a first embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a partial perspective view showing a state in which a terminal electrode forming hole and a via hole are formed in an insulating substrate. In FIG. 1, reference numeral 1 denotes an insulating substrate, on which U-shaped terminal electrode forming holes 2 facing each other are arranged vertically and horizontally. Also, via-holes 3 are formed in the chip component formation region.

FIG. 2 is a partial perspective view showing a state in which a conductive film is plated on the entire surface of the substrate from the state shown in FIG. 1, a photoresist film is applied, exposed, developed, and then etched. In FIG. 2, reference numerals 6 denote terminal electrodes located at opposite ends of the chip component, each being formed continuously on five surfaces. 3 'is a via hole formed by forming a conductive film on the inner surface of the via hole (3). A spiral conductive pattern 7 extending from the terminal electrode 6 to the via hole 3 'is formed on the front and back surfaces of the region to be the chip component.

FIG. 3 is a perspective view of a single chip component separated from the substrate 1 by cutting off a two-dot chain line portion from the state shown in FIG. 2, and FIG. 4 is a perspective view of the chip component shown in FIG. 3A and 3B are a top view and a bottom view, respectively. However, the protective film is omitted in FIGS. 3 and 4. By forming the conductor patterns 7 extending spirally from the terminal electrodes 6 to the via holes 3 'on the front and back surfaces of the substrate, a predetermined inductance is generated between the two opposing terminal electrodes 6-6. Become.

Next, a method of manufacturing the above-mentioned chip component will be described with reference to FIGS.
This will be described with reference to FIG.

First, as shown in FIG. 5, an insulating substrate 1 such as a glass cloth / epoxy glass substrate is selected. As shown in FIG. 6, a hole 2 for forming a terminal electrode and a hole 3 for a via hole are formed in the same substrate 1 by milling with an NC drilling machine or pressing with a press machine in the same step. Next, as shown in FIG. 7, the conductor film 4 is applied to the front and back surfaces of the substrate and the inner surfaces of the holes by electroless plating of copper or the like and electrolytic plating. Subsequently, as shown in FIG. 8, a photoresist film is applied to the entire surface by an electrodeposition method. Thereafter, a photomask is patterned on the both surfaces of the substrate by irradiating the photomask with scattered light and developing the photomask as shown in FIG. Subsequently, the conductor film 4 is etched and the resist film 5 is removed to form a spiral-shaped conductor pattern 7 on both surfaces of the substrate as shown in FIG. Form. Then, FIG.
The protective film 8 is printed on portions other than the terminal electrodes 6 as shown in FIG. Finally, as shown by a two-dot chain line in FIG. 2, individual chip components are separated at positions passing through portions where terminal electrodes are not formed. This is performed by forming a groove having a V-shaped cross section with a V-cut machine (slitter) and dividing the groove, or by dicing with a dicing saw.

Although FIGS. 5 to 11 show an example in which the insulating substrate 1 is used as a starting material, for example, a copper-clad laminated substrate in which an insulating base material is laminated with a copper foil is similarly used as a starting material. be able to.

Next, another example of the terminal electrode forming hole will be described in the second.
12 to 15 as the third, fourth and fifth embodiments.
This will be described based on FIG.

FIG. 12 is a plan view of a terminal electrode forming hole according to the second embodiment. In FIG. 12, reference numerals 2 denote terminal electrode forming holes, and a region indicated by A is a chip component forming region. In this manner, the terminal electrode forming holes of the adjacent chip components may be provided as continuous holes.

FIG. 13 is a plan view of the terminal electrode forming hole according to the third embodiment. The terminal electrode has 3
If a conductor film is formed on the surface,
As shown in FIG. 3, the terminal electrode forming hole 2 may be formed in a substantially linear shape, and the chip parts may be separated in a direction orthogonal to the terminal electrode forming hole 2 as shown by a chain double-dashed line. .
In FIG. 13, a region indicated by A is a chip component forming region, (A) is an example in which a terminal electrode forming hole is provided for each single chip component forming region, and (B) is forming a plurality of chip components. This is an example in which a hole for forming a terminal electrode is provided in each region.

FIG. 14 is a plan view of the terminal electrode forming hole according to the fourth embodiment. In this example, a C-shaped terminal electrode forming hole 2 is provided to form a terminal electrode 6, which is separated at one location indicated by a two-dot chain line.

FIG. 15 is a plan view of the terminal electrode forming hole according to the fifth embodiment. In this example, the terminal electrode forming holes 2 are formed, and the terminal electrodes 6a and 6b are formed at the four corners of the chip component forming region, respectively, to obtain a four-terminal chip component.

Next, FIG. 16 shows an external perspective view of the chip part according to the sixth embodiment. This chip component is separated from the substrate at the two-dot chain line portion from the state shown in FIG. As described above, the terminal electrodes 6a and 6b are formed at the four corners of the substrate 1, and both ends of the terminal electrodes 6a and 6b are formed on the substrate surface.
a, serpentine conductor pattern 7 connected to 6a
Are formed, and both terminal electrodes 6 are also provided on the back side of the substrate 1.
A serpentine conductor pattern connected to b and 6b is formed. Thereby, the space between the terminal electrodes 6a and 6b functions as a transformer such as a transformer.

Next, FIG. 17 is an external perspective view showing the configuration of the chip part according to the seventh embodiment. In this example, six via holes 3 'are formed in the substrate 1, a distributed constant circuit is formed by these via holes, and the terminal electrode 6 and a part of the via holes are connected on the front surface or the back surface of the substrate. ing. According to the present invention, the conductor pattern required for the chip component, the via hole, and the terminal electrode are formed substantially at the same time, and thus the chip component incorporating the distributed constant circuit using the plurality of via holes can be easily formed. Is obtained.

[0031]

According to the first aspect of the present invention, a conductor pattern and a terminal electrode required for a chip component are simultaneously formed, and the terminal electrode is formed before being separated as a chip component. Costs are greatly reduced.

According to the invention described in claims 2 and 3,
Since the conductor pattern required for the chip component, the via hole and the terminal electrode are formed at the same time, and the terminal electrode is formed before being separated as the chip component, it has the conductor pattern on the front and back surfaces of the substrate, It becomes easy to manufacture a chip component in which the body pattern is conducted through the inside of the substrate.

According to the invention described in claim 4, since spiral conductor patterns are formed from the terminal electrode to the via hole on the front and back surfaces of the substrate respectively, the conventional laminated printing and air bridge formation can be performed. It becomes unnecessary and the chip inductor can be easily obtained.

According to the fifth aspect of the invention, a chip component having a predetermined function such as a transformer can be easily obtained by the conductor patterns extending from the four or more terminal electrodes to the front and back surfaces of the substrate.

[Brief description of the drawings]

FIG. 1 is a partial perspective view showing a state in the course of manufacturing a chip component according to a first embodiment.

FIG. 2 is a partial perspective view showing a state during the manufacture of the chip component according to the first embodiment.

FIG. 3 is an external perspective view of a chip part.

FIG. 4 is a top view and a bottom view of the chip component.

FIG. 5 is a sectional view of an insulating substrate.

FIG. 6 is a cross-sectional view after forming a terminal electrode forming hole and a via hole.

FIG. 7 is a cross-sectional view after a conductor film is formed.

FIG. 8 is a sectional view after a photoresist film is formed.

FIG. 9 is a cross-sectional view after patterning the photoresist film.

FIG. 10 is a cross-sectional view after conductor film etching.

FIG. 11 is a cross-sectional view after a protective film is applied.

FIG. 12 is a plan view showing an example of forming a terminal electrode forming hole according to a second embodiment.

FIG. 13 is a plan view illustrating an example of forming a terminal electrode forming hole according to a third embodiment.

FIG. 14 is a plan view showing an example of forming terminal electrode forming holes according to a fourth embodiment.

FIG. 15 is a plan view showing an example of forming a terminal electrode forming hole according to the fifth embodiment.

FIG. 16 is an external perspective view of a chip component according to a sixth embodiment.

FIG. 17 is an external perspective view of a chip part according to a seventh embodiment.

FIG. 18 is a plan view of a conventional chip inductor.

FIG. 19 is a cross-sectional view showing a state where a resist film is patterned on a substrate.

FIG. 20 is a cross-sectional view after formation of a conductor film.

FIG. 21 is a cross-sectional view after formation of a conductor pattern.

FIG. 22 is a cross-sectional view after patterning a resist film and forming a conductor film.

FIG. 23 is a cross-sectional view after formation of an air bridge.

FIG. 24 is a cross-sectional view after removing the resist film.

FIG. 25 is a cross-sectional view after forming a terminal electrode.

[Explanation of symbols]

 Reference Signs List 1-substrate 2-hole for forming terminal electrode 3-hole for via hole 3'-via hole 4-conductor film 5-photoresist film 6-terminal electrode 7-conductor pattern 8-protective film 10-substrate 11-resist Film 12-conductor film 13-conductor pattern 14-resist film 15-conductor film 16-resist film 17-conductor film (air bridge) 18-terminal electrode

Claims (5)

[Claims] 1. A step of forming a terminal electrode forming hole, a part of the inner surface of which is a part of a terminal electrode of a chip component, in an insulating substrate or a substrate in which a conductor film is formed in advance on an insulating plate, Forming a conductor film on the substrate and on the inner surface of the terminal electrode formation hole by a plating method, and a conductor film on the substrate or a conductor film on the inner surface of the terminal electrode formation hole together with the conductor film on the substrate Forming a predetermined conductor pattern including a terminal electrode of a chip component by patterning the film by an etching method, and forming a slit or groove at a position on the substrate passing through a portion where the terminal electrode of the chip component is not formed. A method of manufacturing a chip part, which comprises the step of forming the chip part and separating the chip part from the substrate. 2. A terminal electrode forming hole and a chip component forming region, a part of the inner surface of which is a part of a terminal electrode of a chip component, on an insulating substrate or a substrate in which a conductor film is previously formed on an insulating plate. A step of forming a hole for a via hole therein, a step of forming a conductor film on the front and back surfaces of the substrate, an inner surface of the terminal electrode forming hole and a via hole hole by a plating method, and Forming a predetermined conductor pattern including a terminal electrode of a chip component by patterning the conductor film or the conductor films on the front and back surfaces of the substrate together with the conductor film on the inner surface of the terminal electrode forming hole by an etching method; And a step of separating the chip component from the substrate by forming a slit or groove at a position on the substrate that passes through a portion of the chip component where the terminal electrode is not formed. Law. 3. A via hole is formed in the insulating substrate, terminal electrodes are formed at opposite ends of the insulating substrate, a conductor film is formed in the via hole, and a surface of the insulating substrate is formed. A conductor pattern having a predetermined shape is formed between one terminal electrode and the conductor film in the via hole hole, and the other terminal electrode on the back surface of the insulating substrate and the conductor film in the via hole hole. A chip component in which a conductor pattern having a predetermined shape is formed between and. 4. The via hole hole is provided substantially in the center of the substrate, and the conductor pattern of the predetermined shape is spirally formed from the terminal electrode to the conductor film in the via hole hole. It is an extended one.
The chip parts described in the above. 5. A plurality of terminal electrodes are formed on opposite ends of an insulating substrate, and a conductor pattern connected to a plurality of terminal electrodes on one end is formed on a surface of the insulating substrate, the insulating substrate A chip component in which a conductor pattern connected to a plurality of terminal electrodes at the other end is formed on the back surface of a substrate.