JP2002252117A - Laminated coil component and its manufacturing method - Google Patents

Laminated coil component and its manufacturing method

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Publication number
JP2002252117A
JP2002252117A JP2001353428A JP2001353428A JP2002252117A JP 2002252117 A JP2002252117 A JP 2002252117A JP 2001353428 A JP2001353428 A JP 2001353428A JP 2001353428 A JP2001353428 A JP 2001353428A JP 2002252117 A JP2002252117 A JP 2002252117A
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electrode
coil
laminate
laminated
via hole
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JP3788325B2 (en
Inventor
Hajime Arakawa
Motoi Nishii
Takahiro Yamamoto
高弘 山本
元 荒川
基 西井
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Murata Mfg Co Ltd
株式会社村田製作所
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Abstract

PROBLEM TO BE SOLVED: To provide a laminated coil component that can be reduced in size and in manufacturing cost and has a low conductor resistance, and to provide a method of manufacturing the component. SOLUTION: A coil 2, the center axis of which crosses the direction of a lamination A of an element (laminate) 1 at right angles, is formed by respectively connecting one- and the other-side end sections of a prescribed via hole of a plurality of via holes 4 provided in the element 1, in the direction of lamination A to one- and the other-side end sections of another prescribed via hole of the via holes 4 in the direction of lamination A through belt-like connecting electrodes 5 having plural-layer structures and provided in the element 1, in parallel with the laminating surface of the element 1 (in the direction perpendicular to the direction of lamination A). At the same time, the coil 2 is connected to an external electrode 3 for inputting and outputting through a lead-out electrode 6, which has a plural-layer structure and are provided in parallel with the lamination surface.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本願発明は積層型コイル部品及びその製造方法に関し、詳しくは、積層構造のコイルが積層体中に配設されてなる積層型インダクタや積層型LC複合部品などのような積層型コイル部品及びその製造方法に関する。 The present invention relates to relates to laminated coil components and a manufacturing method thereof, particularly, such as multilayer inductor and multilayer LC composite component coil of laminated structure is disposed in the stack It relates to a multilayer coil component and a manufacturing method thereof.

【0002】 [0002]

【従来の技術及び発明が解決しようとする課題】代表的な積層型コイル部品の1つに、積層型インダクタがあり、このような積層型インダクタのうちには、例えば、 One of the prior art and problems to be Solved by the Invention A typical laminated coil component, there are laminated inductor, within such a multilayer inductor may be, for example,
図9に示すような構造を有するものがある。 Those having a structure as shown in FIG. すなわち、 That is,
この積層型インダクタは、積層体である素子51の積層方向Aと一致するようにして設定されたコイル中心軸を周回する積層型のコイル52が素子51の内部に配設され、かつ、このコイル52の両端部が引き出された素子51の両端面に入出力用外部電極53が配設された構造を有している。 The multilayer inductor, multilayer coil 52 orbiting the coil center axis that is set to match the stacking direction A of the element 51 is a laminated body is disposed within the device 51, and the coil 52 input-output external electrodes 53 on both end surfaces of both end portions drawn out element 51 has an arranged structure of.

【0003】そして、上記従来の積層型インダクタは、 [0003] Then, the above-mentioned conventional laminated inductor,
通常、図10に示すように、層間接続のためのバイアホール54を形成したセラミックグリーンシート56に、 Usually, as shown in FIG. 10, the ceramic green sheet 56 to form a via hole 54 for interlayer connection,
スクリーン印刷などの方法により、バイアホール54に応じた形状に導電ペーストを印刷してコイルパターン(内部電極)55を形成した後、このコイルパターン5 By a method such as screen printing, after forming a coil pattern (inner electrode) 55 by printing a conductive paste into a shape corresponding to the via hole 54, the coil pattern 5
5が印刷されたセラミックグリーンシート56、及び所定の位置にバイアホール57が形成され、かつ、表裏前面に外部との接続のための電極膜58が形成されたセラミックグリーンシート59を積層圧着し、焼成した後、 5 via hole 57 is formed in the printed ceramic green sheet 56, and a predetermined position, and the ceramic green sheet 59 where the electrode film 58 is formed for connecting to the outside front and back front laminated crimping, after baking,
入出力用外部電極53(図9)を形成する工程を経て製造されている。 It is manufactured through a step of forming the input and output external electrode 53 (FIG. 9).

【0004】しかし、上述のように、導電ペーストをスクリーン印刷し、焼成することにより形成される電極(焼成後のコイルパターン(内部電極)55)の厚みは、最大でも20μm程度と厚みが小さく、このようなコイルパターン55からなるコイル52(図9)を備えた上記従来の積層型コイル部品においては、導体抵抗が大きく、大電流に十分に対応することが困難であるのが実情である。 However, as described above, a conductive paste is screen printing, the thickness of the electrode formed by sintering (coil pattern after sintering (internal electrodes) 55) has a smaller 20μm approximately the thickness at the maximum, in such a coil pattern coil 52 above known multilayer coil component having a (Figure 9) consisting of 55, large conductor resistance, it is fact is it is difficult to sufficiently cope with a large current.

【0005】ところで、導体抵抗を低減する方法として、例えば、同一のコイルパターン55を複数層ずつ積層して電極厚みを大きくする方法が考えられるが、積層枚数が増大すると、製品の大型化を招くばかりでなく、 [0005] As a method for reducing the conductor resistance, e.g., a method of increasing the electrode thickness by laminating the same coil pattern 55 by a plurality of layers are considered, the number of laminated layers is increased, increasing the size of the product not only,
製造工程が複雑になりコストの上昇を招くという問題点がある。 There is a problem that manufacturing process causes an increase in cost becomes complicated. なお、上記問題点は積層型インダクタに限らず、積層LC複合部品などの種々の積層型コイル部品にも当てはまるものである。 Incidentally, the above problem is not limited to the multilayer inductor, but also applies to various laminated coil component such as a laminated LC composite part.

【0006】本願発明は上記問題点を解決するものであり、小型化が可能で、導体抵抗が低く、しかも、製造コストの低減を図ることが可能な積層型コイル部品及びその製造方法を提供することを目的とする。 [0006] The present invention has been made to solve the above problems, it can be miniaturized, low conductor resistance, moreover, provides a laminated coil component and a manufacturing method thereof capable of reducing the manufacturing cost and an object thereof.

【0007】 [0007]

【課題を解決するための手段】上記目的を達成するために、本願発明の請求項1にかかる積層型コイル部品は、 To achieve SUMMARY OF to the above objects, the multilayer coil component according to claim 1 of the present invention,
積層体内部に、積層方向と直交するコイル中心軸を周回するコイルが配設され、かつ、積層体の両端面に、コイルの両端部と導通する入出力用外部電極が配設された構造を有する積層型コイル部品であって、積層体内部の、 Inside the laminated body, the coil arranged to surround the coil central axis perpendicular to the stacking direction, and, on both end surfaces of the laminate, the structure input and output external electrode is arranged to be electrically connected to the both end portions of the coil a laminated coil component having been, in the stack portion,
積層方向から見た複数の位置に、軸心が積層方向に沿うように配設されたバイアホールと、積層体内部に、積層面と平行に配設され、所定のバイアホールの積層方向の一方側端部どうし及び所定のバイアホールの積層方向の他方側端部どうしを接続することにより、バイアホールと協働して、コイル中心軸が積層方向と直交するコイルを構成する複数層構造の帯状接続電極と、積層体内部に、積層面と平行に配設され、バイアホールと帯状接続電極から構成される前記コイルと前記入出力用外部電極とを接続する複数層構造の引出電極とを具備することを特徴としている。 A plurality of positions as viewed from the laminating direction, a via hole axis is arranged along the stacking direction, the internal laminate is disposed in parallel with the laminated surface, one of the laminating direction of the predetermined via hole by connecting the other end portion to each other in the stacking direction of the side edge portions to each other and a predetermined via hole, in cooperation with the via hole, a strip-shaped multilayer structure constituting the coil the coil center axis perpendicular to the stacking direction comprising: a connection electrode, the interior laminate, is arranged in parallel with the laminated surface, and a lead electrode of the multilayer structure that connects the input-output external electrodes and the coil composed of the via hole and the strip connection electrode It is characterized in that.

【0008】本願発明(請求項1)の積層型コイル部品は、複数のバイアホールのうちの所定のバイアホールの積層方向の一方側端部どうし及び所定のバイアホールの積層方向の他方側端部どうしを、積層面と平行に(積層方向に直交する方向に)配設された複数層構造の帯状接続電極により接続して、コイル中心軸が積層方向と直交するコイルを形成するとともに、積層面と平行に配設された複数層構造の引出電極により該コイルを入出力用外部電極と接続するようにしているので、製品の大型化を招くことなく、導体抵抗を低減することが可能になる。 [0008] The present invention laminated coil component (claim 1), the other end of the stacking direction of the predetermined one side end each other and a predetermined via holes in the stacking direction of the via hole of the plurality of via holes was how, by connecting the strip-shaped connection electrodes of the laminated surface parallel to (in a direction perpendicular to the stacking direction) disposed a multilayer structure, to form a coil which coil center axis is perpendicular to the laminating direction, the laminated surface since so as to connect the input and output external electrode the coil by the extraction electrode of the parallel disposed a plurality layers structure, without increasing the size of the product, it is possible to reduce the conductor resistance .
すなわち、帯状接続電極及び引出電極を複数層構造として、バイアホールの電極断面積と同等程度の断面積が確保されるまで帯状接続電極及び引出電極の厚みを大きくする(積層数を増やす)ことにより、小型化を阻害することなく、導体抵抗を低減して、大電流への対応性を向上させることができるようになる。 That is, the strip-shaped connection electrodes and the lead electrodes as a multilayer structure, increasing the thickness of the strip connection electrode and the extraction electrode to the cross-sectional area of ​​about equivalent to the electrode cross-sectional area of ​​the via hole is ensured (increasing the number of laminated layers) that the without inhibiting the miniaturization by reducing the conductor resistance, it is possible to improve the response of the large current.

【0009】また、請求項2の積層型コイル部品は、前記引出電極が、積層体の積層方向の略中央部に、かつ、 Further, the multilayer coil component according to claim 2, wherein the extraction electrode is at a substantially central portion in the lamination direction of the laminated body, and,
積層面と平行に配設されていることを特徴とする。 Characterized in that it is disposed parallel to the stacked face.

【0010】引出電極が積層体の最外層付近に配設されている場合には、実装基板上の電極と引出電極との間に浮遊容量が発生する場合があり、高周波特性が劣化しやすくなることがあるため、実装時の方向性に配慮する必要があるが、請求項2にかかる積層型コイル部品においては、引出電極を、積層体の積層方向の略中央部に、かつ、積層面と平行に配設するようにしているため、実装基板上の電極と引出電極との間に浮遊容量が発生することを抑制することが可能になり、実装時の方向性をなくして、実装工程における作業性を向上させることが可能になる。 [0010] If the extraction electrode is disposed in the vicinity of the outermost layer of the laminate, may stray capacitance generated between the electrode and the extraction electrode on the mounting board, composed of high-frequency characteristics are likely to deteriorate because sometimes, it is necessary to consider the direction of the time of mounting, in the laminated coil component according to claim 2, the extraction electrode, at a substantially central portion in the lamination direction of the laminate, and the laminate surface because you have to arranged parallel, it is possible to suppress the stray capacitance is generated between the electrode and the extraction electrode on the mounting board, eliminating directionality in mounting, in the mounting process it is possible to improve the workability.

【0011】また、請求項3の積層型コイル部品は、積層体の表面に、バイアホールと帯状接続電極から構成される前記コイルと対向する容量取得用外部電極が配設されていることを特徴としている。 Further, the multilayer coil component according to claim 3, characterized in that the surface of the laminate, said coil opposite to capacity acquisition external electrode composed of the via hole and the strip connection electrode is arranged It is set to.

【0012】積層体の表面に、バイアホールと帯状接続電極から構成されるコイルと対向する容量取得用外部電極を配設するようにした場合、積層体の表面に容量取得用外部電極を配設するだけで、バイアホールと容量取得用外部電極との間で必要な容量を確保することが可能になり、容易に積層型LC複合部品を構成することが可能になる。 [0012] surface of the laminate, if you choose to dispose the capacity acquisition external electrode to the coil facing composed of via holes and the strip connection electrode, disposed external electrode capacity acquisition on the surface of the laminated body simply, it is possible to secure the necessary capacity between the via hole and the capacity acquisition external electrode, it is possible to easily constitute the multilayer LC composite component.

【0013】また、請求項4の積層型コイル部品は、積層体内部の、前記帯状接続電極よりも積層方向外側の一方側及び他方側の少なくとも一方の領域に、前記帯状接続電極と対向する容量取得用内部電極が配設されているとともに、積層体の表面にグランド接続用外部電極が配設されており、かつ、容量取得用内部電極がグランド接続用外部電極に接続されていることを特徴としている。 Further, the multilayer coil component according to claim 4, the stack portion, on one side and at least one region of the other side in the stacking direction outside than the strip connecting electrodes, capacitance facing the strip connecting electrode features with internal electrode acquisition is provided, and an external electrode for grounding is disposed on the surface of the laminate, and that the internal electrode capacity acquisition is connected to the external electrode for grounding It is set to.

【0014】帯状接続電極よりも積層方向外側の一方側及び他方側の少なくとも一方の領域に、帯状接続電極と対向する容量取得用内部電極を配設するとともに、積層体の表面にグランド接続用外部電極を配設し、容量取得用内部電極をグランド接続用外部電極に接続することにより、請求項3にかかる積層型コイル部品の場合よりも大きい容量を確保することが可能になり、特性設計の自由度を向上させることが可能になる。 [0014] At least one region of one side and the other side in the stacking direction outside than the strip connecting electrode, while disposed internal electrode capacity acquisition facing the strip connection electrodes, an external ground connection to the surface of the laminate arranged an electrode, by connecting the internal electrode capacity acquisition to the external electrode for grounding, it is possible to secure a greater capacity than the case of the laminated coil component according to claim 3, characteristic design it is possible to improve the degree of freedom.

【0015】また、請求項5の積層型コイル部品は、積層体の、前記容量取得用内部電極が配設される領域が誘電体セラミックを主成分とする材料から形成されていることを特徴としている。 Further, the multilayer coil component according to claim 5, as a feature that the region of the stack, the capacity acquisition inner electrode is arranged is formed of a material composed mainly of dielectric ceramics there.

【0016】積層体の、容量取得用内部電極が配設される領域を誘電体セラミックを主成分とする材料から構成することにより、さらに大きい容量を確保することが可能になり、本願発明をより実効あらしめることができる。 [0016] the laminate, by forming the area where the internal electrode capacity acquisition is arranged a material composed mainly of dielectric ceramics, it is possible to secure a larger capacity, more the present invention it can be effective Arashimeru.

【0017】また、本願発明(請求項6)の積層型コイル部品の製造方法は、請求項1〜5のいずれかに記載の積層型コイル部品を製造するための方法であって、回折格子で分光されたレーザビームを照射してセラミックグリーンシートに貫通孔を形成した後、この貫通孔に導電ペーストを充填してバイアホールを形成する工程を具備していることを特徴としている。 Further, the method of fabricating the multilayer coil component of the present invention (claim 6) is a method for manufacturing a laminated coil component according to any one of claims 1 to 5, a diffraction grating after forming a through hole in the ceramic green sheet by irradiating the spectral laser beam, it is characterized in that it comprises a step of forming via holes by filling a conductive paste into the through-hole.

【0018】回折格子で分光されたレーザビームを照射してセラミックグリーンシートに貫通孔を形成した後、 [0018] After forming a through hole in the ceramic green sheet by irradiating a laser beam a diffraction grating,
この貫通孔に導電ペーストを充填してバイアホールを形成することにより、セラミックグリーンシートに対して高精度の貫通孔を、極めて効率よく形成することが可能になり、本願発明の積層型コイル部品を効率よく製造することが可能になる。 By forming the penetrating via holes by filling a conductive paste into the hole, the precision of the through holes of the ceramic green sheet, it is possible to very efficiently formed, a laminated coil component of the present invention it is possible to efficiently manufacture. また、レーザビームを照射する方法によれば、微細で、精度の高いバイアホールを形成することが可能になるため、同じ製品寸法で巻き数の多いコイルを形成することが可能になる。 Further, according to the method of irradiating a laser beam, a fine, since it becomes possible to form a high via hole precision, it is possible to form a coil having a large number of windings in the same product sizes.

【0019】また、請求項7の積層型コイル部品の製造方法は、前記バイアホールが形成されたセラミックグリーンシートを積層して積層体を形成するにあたって、1 Further, the method of fabricating the multilayer coil component according to claim 7, in forming a laminate by laminating a ceramic green sheet where the via hole is formed, 1
枚又は2枚以上のセラミックグリーンシートを積層するたびに仮圧着しながら積層を行い、所定枚数積層した後、本圧着することにより積層体を形成することを特徴としている。 Like or two or more ceramic green sheets subjected to lamination with temporary pressure bonding each time of laminating, after a predetermined number of sheets stacked, it is characterized by forming a laminate by pressure bonding.

【0020】1枚又は2枚以上のセラミックグリーンシートを積層するたびに仮圧着しながら積層を行い、所定枚数積層した後、本圧着することにより、コイルパターンの位置ずれを生じたりすることなく、確実に所望の積層体を形成することが可能になり、本願発明の積層型コイル部品をさらに効率よく製造することができるようになる。 [0020] performs lamination with temporary pressure bonding each time of laminating one or two or more ceramic green sheets, after a predetermined number of stacked, by the crimping, without or misaligned coil pattern, certainly it is possible to form a desired laminate, so a laminated coil component of the present invention can be further efficiently produced.

【0021】 [0021]

【発明の実施の形態】以下、本願発明の実施の形態を図面に基づいて説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, will be explained based on the embodiment of the present invention with reference to the drawings. なお、以下の実施形態では、磁性体セラミック中にコイルが配設された構造を有する積層型インダクタ及び積層型LC複合部品を例にとって説明する。 In the following embodiment, illustrating a multilayer inductor and a multilayer LC composite component having a structure in which coils are disposed in the magnetic ceramic as an example.

【0022】[実施形態1]図1は本願発明の一実施形態(実施形態1)にかかる積層型インダクタを示す外観斜視図、図2は積層型インダクタを構成する積層体を示す分解斜視図である。 [0022] [Embodiment 1] FIG. 1 is an external perspective view showing a laminated inductor according to one embodiment (Embodiment 1) of the present invention, FIG 2 is an exploded perspective view showing a laminated body constituting the laminated inductor is there.

【0023】この実施形態1にかかる積層型インダクタは、図1に示すように、素子(積層体)1の内部に、素子1の積層方向Aと直交するように設定されたコイル中心軸を周回する積層型のコイル2が配設され、かつ、素子1の両端面に、コイル2の両端部と導通する入出力用外部電極3が配設された構造を有している。 The multilayer inductor according to the first embodiment, as shown in FIG. 1, orbiting inside the element (laminate) 1, the coil center axis that is set to be perpendicular to the stacking direction A of the element 1 laminated coil 2 is disposed to and on both end faces of the element 1, has an input-output external electrodes 3 which conduct both end portions of the coil 2 is disposed structure.

【0024】そして、素子1の内部には、所定の平面位置(積層方向から見た位置)に、軸心が積層方向Aに沿うように配設された複数のバイアホール4が配設されている。 [0024] Then, inside the device 1, the predetermined plane position (as viewed from the lamination direction position), a plurality of via holes 4 which axis is arranged along the stacking direction A is arranged there. また、同じく、素子1の内部には、所定のバイアホール4の積層方向の一方側端部(上端部)どうし及び所定のバイアホール4の積層方向の他方側端部(下端部)どうしを接続することにより、バイアホール4と一体となってコイル中心軸が積層方向Aと直交するコイル2を構成する複数層構造の帯状接続電極5が、積層面と平行(積層方向Aに直交する方向)に配設されている。 Further, similarly, in the interior of the device 1, one side edge portion of the lamination direction of the predetermined via holes 4 (upper part) How to and the other side end of the stacking direction of the predetermined via holes 4 (lower part) How to connect the by (a direction perpendicular to the stacking direction a) the coil center axis integrally with the via hole 4 is band-shaped connection electrode 5 of the multilayer structure forming the coil 2 which is perpendicular to the laminating direction a, parallel to the stacking plane It is disposed to.

【0025】さらに、素子1の内部には、バイアホール4と帯状接続電極5から構成されるコイル2と入出力用外部電極3とを接続する複数層構造の引出電極6が、積層面と平行(積層方向Aに直交する方向)に配設されている。 Furthermore, parallel to the interior of the device 1, the lead electrode 6 of the multi-layer structure for connecting the input and output external electrodes 3 and composed coil 2 from the via hole 4 and the strip connection electrode 5, a laminated surface It is arranged (the direction perpendicular to the stacking direction a). なお、この実施形態1の積層型インダクタにおいて、引出電極6は、帯状接続電極5と同一平面に形成されている。 Incidentally, in the laminated inductor of this embodiment 1, the extraction electrode 6 is formed in a strip connecting electrode 5 and the same plane.

【0026】次に、この実施形態1の積層型インダクタの製造方法について説明する。 Next, a method for manufacturing the multilayer inductor of the embodiment 1. まず、図2に示すように、(1)所定位置ごとにバイアホール7(最終的にバイアホール4(図1)となる)が形成されたセラミックグリーンシート8と、(2)所定位置ごとにバイアホール9 First, as shown in FIG. 2, (1) (a final via hole 4 (FIG. 1)) via holes 7 at predetermined positions and the ceramic green sheet 8 is formed, (2) at predetermined positions via hole 9
(最終的にバイアホール4(図1)との接続部分となる)が形成され、かつ、これらのバイアホール9を含む、所定形状の帯状接続電極5(図1)及び引出電極6 (Finally a connection portion between the via hole 4 (FIG. 1)) is formed, and includes these via holes 9, the strip connection electrode 5 having a predetermined shape (FIG. 1) and the extraction electrode 6
となる導体パターン10,11が形成されたセラミックグリーンシート12と、(3)所定位置ごとにバイアホール13(最終的にバイアホール4(図1)との接続部分となる)が形成され、かつ、これらのバイアホール13 The ceramic green sheet 12 on which the conductor patterns 10 and 11 are formed as a, (3) (a connecting portion of the final via hole 4 (FIG. 1)) via holes 13 at predetermined positions are formed, and , these via holes 13
を含む、所定形状の帯状接続電極5(図1)となる導体パターン14が形成されたセラミックグリーンシート1 Including, ceramic green sheets 1 to the conductor pattern 14 as a strip-shaped connecting electrode 5 having a predetermined shape (FIG. 1) is formed
5と、(4)バイアホール及び導体パターンが形成されていない外層用のセラミックグリーンシート16の4種類のセラミックグリーンシートを用意する。 5, to prepare four kinds of ceramic green sheets (4) ceramic green sheet 16 for the outer layer of the via hole and the conductor pattern is not formed.

【0027】なお、セラミックグリーンシート8,1 [0027] It should be noted that the ceramic green sheet 8,1
2,15,16としては、例えば、Ni−Cu−ZnフェライトやNi−Znフェライトなどの磁性体セラミック材料、あるいは、ガラスセラミックからなる非磁性の絶縁体セラミック材料などをドクターブレード法や引き上げ法などの方法で成形したものなどが用いられる。 The 2,15,16, for example, a magnetic ceramic material such as Ni-Cu-Zn ferrite or Ni-Zn ferrite, or insulating ceramic material of the nonmagnetic made of glass ceramic and a doctor blade method or the Czochralski method, etc. such as those formed by the method is used.

【0028】また、導体パターン10,11,14は、 [0028] In addition, the conductor patterns 10, 11, 14 is,
例えば、Agを主成分とする導電ペーストをスクリーン印刷することによって形成されている。 For example, it is formed by a conductive paste mainly composed of Ag screen printing. なお、引出電極6となる導体パターン11は、図2に示すように、セラミックグリーンシート12の端縁近傍にまで引き出されているとともに、端縁近傍では、セラミックグリーンシート12の一つの辺に沿うように、帯状のパターンに形成され、外部電極3と確実に導通するように構成されている。 Incidentally, the conductor pattern 11 serving as a lead electrode 6, as shown in FIG. 2, with drawn out until the edge vicinity of the sheet 12, the edge vicinity, along one side of the sheet 12 as is formed on the belt-like pattern, and is configured to ensure continuity with the external electrode 3.

【0029】また、バイアホール7,9,13は、レーザ光源から放射され、回折格子を通過して分光されたレーザビームを照射することにより、セラミックグリーンシート8,12,15の所定位置に貫通孔を形成した後、この貫通孔に導電ペーストを充填することにより形成されている。 Further, via holes 7,9,13, by irradiating emitted from the laser light source, a laser beam spectrally through the diffraction grating, through a predetermined position of the ceramic green sheet 8,12,15 after forming the hole, it is formed by filling a conductive paste into the through-hole.

【0030】なお、バイアホール7,9,13となる貫通孔は、例えば、セラミックグリーンシートのマザーシートを移動可能に支持するX−Yテーブルと、CO 2やYAGなどのレーザ光源と、レーザ光源から放射されたレーザビームを通過させて貫通孔と対応した形状、例えば円形の断面形状を有する複数のレーザビームに分光する回折格子と、回折格子を通過して分光されたレーザビームを所定の反射角で反射させるガルバノスキャンミラーと、反射されたレーザビームを集光する集光レンズなどを備えた加工装置を用い、マザーシート上に素子1のそれぞれと対応する区画を予め設定して、このマザーシートを移動させながら一つずつの区画に対して所要個数の貫通孔を同時的に形成する方法などを適用することにより、効率よく製 [0030] The through hole which becomes the via hole 7,9,13, for example, the X-Y table for movably supporting the mother sheet of a ceramic green sheet, a laser light source such as a CO 2 or YAG, a laser light source shape corresponding to the through hole by passing the emitted laser beam from, for example, a plurality of the diffraction grating for splitting the laser beam, the reflected laser beam of a predetermined spectrally through the diffraction grating having a circular cross-sectional shape a galvano-scan mirror for reflecting at the corner, the reflected laser beam using the processing device equipped with such a condenser lens for condensing a previously set the corresponding compartment with each element 1 on the mother sheet, the mother by applying the a method of simultaneously forming a through hole of a required number with respect to partition one by one while moving the sheet, manufactured efficiently することが可能である。 It is possible to.

【0031】このようなレーザビームの照射を利用した場合には、直径が50μmから200μm程度までの貫通孔を、±10μm程度の位置精度で、セラミックグリーンシート8,12,15に対して効率よく形成することができる。 [0031] When using such irradiation of the laser beam, the through-holes of diameter from 50μm up to about 200 [mu] m, at a position accuracy of about ± 10 [mu] m, efficiency of the ceramic green sheets 8,12,15 it can be formed. したがって、同じ製品寸法で、巻き数の多いコイルを形成することが可能になる。 Therefore, the same product dimensions, it is possible to form a lot of winding number of coils. なお、貫通孔の形成方法は、上述のようなレーザビームの照射による方法に限られるものではなく、金型による打ち抜き加工やドリルによる穿孔などの方法を適用することも可能である。 In addition, the method of forming the through hole is not limited to the method by laser beam irradiation as described above, it is also possible to apply a method such as drilling by punching or drilling using a mold.

【0032】それから、所定位置に形成されたバイアホール7どうしが互いに重なりあうように所定枚数のセラミックグリーンシート8を積層するとともに、帯状接続電極5及び引出電極6となる導体パターン10,11が形成されたセラミックグリーンシート12の所定枚数をバイアホール9がバイアホール7に重なるようにしてセラミックグリーンシート8の上面側に積層し、さらに、 [0032] Then, to what via holes 7 formed at predetermined positions with laminating ceramic green sheets 8 of a predetermined number so that overlap each other, the conductor patterns 10 and 11 as a strip-shaped connecting electrode 5 and the extraction electrode 6 is formed It has been a predetermined number of the ceramic green sheet 12 via holes 9 are laminated on the upper surface side of the ceramic green sheet 8 so as to overlap the via holes 7, further
帯状接続電極5となる導体パターン14が形成されたセラミックグリーンシート15の所定枚数をバイアホール13がバイアホール7に重なるようにセラミックグリーンシート8の下面側に積層する。 The predetermined number of ceramic green sheets 15 on which the conductor pattern 14 is formed as a strip-shaped connecting electrode 5 via holes 13 is laminated on the lower surface side of the ceramic green sheet 8 so as to overlap the via holes 7. なお、この際におけるセラミックグリーンシート12,15の積層枚数は、帯状接続電極5及び引出電極6の断面積がバイアホール7 Incidentally, the number of laminated ceramic green sheets 12 and 15 in this case, the strip connection electrode 5 and the cross-sectional area via hole 7 of the lead electrode 6
の断面積と同等程度となるように設定されている。 Is set such that the cross-sectional area equivalent to about.

【0033】そしてさらに、バイアホール及び導体パターンが形成されていないセラミックグリーンシート16 [0033] and further, the ceramic green sheet 16 via holes and the conductor pattern is not formed
の所定枚数ずつを、セラミックグリーンシート12の上面側とセラミックグリーンシート15の下面側とに積層した後、セラミックグリーンシート8,12,15,1 Of each predetermined number, after stacking on the lower surface side of the upper surface and the ceramic green sheet 15 of the sheet 12, the ceramic green sheets 8,12,15,1
6の全体を積層方向Aに沿って圧着することにより、積層体17(未焼成の素子1)が作製される。 By crimping the entire 6 along the stacking direction A, the laminate 17 (unfired element 1) is produced.

【0034】なお、これらセラミックグリーンシート8,12,15,16の全体としての積層枚数が多い場合には、バイアホール7どうしの積層部が圧着時に座屈を起こすことがあるので、ある程度以上の枚数を積層する場合には、セラミックグリーンシート8,12,1 [0034] It should be noted that, in the case of laminated sheets as a whole of these ceramic green sheet 8,12,15,16 often, because the lamination of the city if the via hole 7 may cause the buckling at the time of bonding, of a certain degree or more in the case of laminating the number is, ceramic green sheet 8,12,1
5,16の1枚又は2枚以上を積層するたびに、比較的低い圧力で仮圧着しながら積層を行い、所定枚数積層した後、本圧着することにより積層体を形成することが好ましい。 Each time of laminating 5,16 one or more two performs lamination with temporary pressure bonding at a relatively low pressure, after a predetermined number of stacked, it is preferable to form a laminate by pressure bonding.

【0035】また、セラミックグリーンシート8,1 [0035] In addition, the ceramic green sheet 8,1
2,15,16の積層順序には、特別の制約はなく、各セラミックグリーンシートを種々の任意の順序で積層するように構成することが可能である。 The stacking order of 2,15,16, no particular limitation, it is possible to configure so as to laminate the ceramic green sheets in various arbitrary order.

【0036】上記のようにして作製された積層体17 The laminate 17, which is produced as described above
(未焼成の素子1)においては、セラミックグリーンシート12,15に形成された、帯状接続電極5となる導体パターン10,14の各々が、バイアホール9,13 In (unfired element 1), which is formed in the ceramic green sheets 12 and 15, each of the conductor patterns 10, 14 as the strip-shaped connecting electrode 5, via holes 9 and 13
を介してセラミックグリーンシート8のバイアホール7 Via holes 7 of the ceramic green sheet 8 through the
と電気的に接続される結果、コイル中心軸が積層方向A Results to be electrically connected to the coil center axis stacking direction A
と直交する積層型のコイル2が積層体17の内部に形成される。 Laminated coil 2 perpendicular is formed inside the layered body 17 and.

【0037】ところで、実際の製造工程では、バイアホール7が形成された大面積のマザーセラミックグリーンシートと、多数の帯状接続電極5及び引出電極6となる導体パターン10,11が形成された大面積のマザーセラミックグリーンシートと、多数の帯状接続電極5となる導体パターン14が形成された大面積のマザーセラミックグリーンシートと、バイアホールや導体パターンの形成されていない大面積のマザーセラミックグリーンシートとを互いに積層したうえで圧着することによって積層ブロック(マザーブロック)を作製した後、この積層ブロックを所定の切断線に沿って切断、分割することにより、同時に個々の積層体17を作製する方法が適用されることになる。 [0037] Incidentally, a large area in the actual production process, the conductive patterns 10 and 11 made of the mother ceramic green sheet having a large area via hole 7 is formed, a number of strip-shaped connecting electrode 5 and the extraction electrode 6 is formed of the mother ceramic green sheet, and the mother ceramic green sheets of a number of large-area conductor pattern 14 as a strip-shaped connecting electrode 5 are formed, and a mother ceramic green sheet having a large area is not formed in the via hole and the conductor pattern after producing a laminated block (mother blocks) by crimping after having laminated together, cut along the laminated block to a predetermined cutting line, by splitting, methods of making the individual laminate 17 simultaneously applies It is is will be.

【0038】なお、この実施形態1の積層型インダクタにおいては、積層体17の積層方向Aとコイル中心軸とが直交するように構成されているので、大きな切断代を必要とし、加工時間が長くなるダイシングソー(砥石状の回転刃)を用いずに切断することも可能であることから、切断代をほとんど必要としない剃刀状の押し切り刃を用いて切断することが可能になり、製造工程を簡略化することが可能になる。 [0038] In the laminated inductor in this embodiment 1, since the stacking direction A and the coil central axis of the stack 17 is configured to be orthogonal, and requires a large cutting margin, long processing time consists can be cut without using a dicing saw (grindstone shaped rotary blade), it is possible to cut with a razor-like push cutter blade which requires little cutting margin, the manufacturing process it is possible to simplify.

【0039】それから、上述のようにして作製した未焼成の積層体17を脱脂焼成処理して素子1を作製した後、素子1の両端面に、導電ペーストを塗布して焼き付けることにより、コイル2の両端部と導通する入出力用外部電極3を形成する。 [0039] Then, after forming the device 1 the unfired laminate 17 was prepared by degreasing firing treatment as described above, the end faces of the element 1, by applying and baking a conductive paste, the coil 2 forming the input-output external electrodes 3 to conduct the both ends. これにより、図1に示すような積層型インダクタが得られる。 Thus, the layered inductor shown in FIG. 1 is obtained. なお、この積層型インダクタは、入出力用外部電極3が素子1の水平方向(横方向)両端側にある姿勢をとった場合にコイル2が横巻状態となる、いわゆるコイル横巻タイプの積層型コイル部品である。 Incidentally, the laminated inductor, a coil 2 is horizontal winding state when the input and output external electrode 3 has taken the position in the horizontal direction (lateral direction) opposite ends of the element 1, a stack of so-called coil Spiral Type it is the type coil component.

【0040】この実施形態1の積層型インダクタにおいては、素子1の積層方向Aとコイル中心軸とが互いに直交しているので、積層方向Aとコイル中心軸とが平行である従来の構成では1kgf程度であった抗折強度を3〜 [0040] In the multilayer inductor of the embodiment 1, since the stacking direction A and the coil center axis of the element 1 are perpendicular to each other, in the conventional structure and the stacking direction A and the coil center axis is parallel 1kgf 3 to the bending strength was a degree
4kgf程度まで高めることが可能になる。 It is possible to increase up to about 4kgf. 特に、ガラスを主成分とする非磁性体セラミックを用いた高周波用インダクタの場合には、抗折強度を5倍以上にまで高めることができる。 Particularly, in the case of high-frequency inductors with non-magnetic ceramic mainly composed of glass, it is possible to increase the bending strength to more than five times.

【0041】また、この積層型インダクタにおいては、 Further, in the multilayer inductor,
帯状接続電極5及び引出電極6が複数層構造を有しており、積層数を増やすことにより、バイアホール4の断面積と同等程度の断面積が確保されるまで電極厚みを大きくすることができるため、従来の積層型インダクタにおいては、100MHzでのインダクタンスが10nH程度であったのに対し、この実施形態1の積層型インダクタにおいては、100MHzでのインダクタンスが約1 Strip connection electrode 5 and the extraction electrode 6 has a multilayer structure, by increasing the number of laminated layers, it is possible to cross-sectional area of ​​approximately equivalent to the cross-sectional area of ​​the via hole 4 is to increase the electrode thickness to be secured Therefore, in the conventional layered inductor, whereas inductance at 100MHz was about 10 nH, the laminated inductor in this embodiment 1, the inductance at 100MHz is approximately 1
00nH程度になることが確認されている。 It is about 00nH has been confirmed. なお、複数層構造の帯状接続電極5及び引出電極6を形成する態様としては、上述のように単層構造の導体パターンを形成したセラミックグリーンシートを複数枚積層するとともに、各単層構造の導体パターンをバイアホールにより接続する態様の他に、一枚のセラミックグリーンシートに複数層構造の導体パターンを形成し、これを複数枚積層して、各複数層構造の導体パターンをバイアホールにより接続する態様、あるいは一枚のセラミックグリーンシートに複数層構造の導体パターンを形成する態様などが例示されるが、これらはいずれも本願発明の範囲に含まれるものである。 As the mode for forming the strip-shaped connection electrode 5 and the extraction electrode 6 of the multi-layer structure, a ceramic green sheet with a plurality of stacked forming a conductor pattern of a single-layer structure as described above, the conductor of each monolayer structure other embodiments for connecting the patterns through via holes, to form a conductor pattern of multi-layer structure on one of the ceramic green sheet, which was plurally stacked, connecting the conductor patterns of the multilayer structure by via holes aspect, or the like manner to form a conductor pattern of the multilayer structure on one of the ceramic green sheet is exemplified, they are those both within the scope of the present invention.

【0042】また、この実施形態1では、素子1の内部に単一のコイル2を配設しているが、2個以上のコイルを並列的に配設することも可能である。 Further, in the embodiment 1, although disposed a single coil 2 inside the element 1, it is also possible to two or more coils in parallel disposed. なお、2個のコイルが並列的に配設された積層型インダクタであれば、 Incidentally, if the layered inductor in which two coils are disposed in parallel,
トランスとして使用することも可能である。 It is also possible to use as a transformer. 例えば、2 For example, 2
個のコイルが並列的に配設された積層型コイル部品を形成する場合、図3に示すように、上記実施形態1の場合に準じて、一枚のシートに導体パターン、バイアホールなどが2組ずつ形成されたセラミックグリーンシートを用意し、これを積層することにより、上記実施形態1の積層型インダクタを製造する場合と同様の方法で製造することができる。 If the number of coils forming the parallel disposed a laminated coil component, as shown in FIG. 3, according to the case of the first embodiment, the conductor pattern on a single sheet, such as via holes 2 preparing a ceramic green sheet formed by pairs, by laminating it can be manufactured in the same manner as in the case of production of a multilayer type inductor of the first embodiment. なお、図3においては、図1及び図2 In FIG. 3, FIGS. 1 and 2
と同一又は相当する部分に同一符号を付している。 And the same reference numeral to the same or corresponding parts and.

【0043】[実施形態2]図4は本願発明の他の実施形態(実施形態2)にかかる積層型インダクタを示す外観斜視図、図5は積層型インダクタを構成する積層体を示す分解斜視図である。 [0043] [Embodiment 2] FIG. 4 is an external perspective view showing a laminated inductor according to another embodiment of the present invention (Embodiment 2), exploded perspective view Fig. 5 showing a laminated body constituting the laminated inductor it is. この実施形態2の積層型インダクタにおいては、複数層構造の引出電極6が素子(積層体)1の積層方向Aの略中央部に、積層面と平行(積層方向Aに直交する方向)に配設されている。 In the multilayer inductor of the embodiment 2, distribution at a substantially central portion in the lamination direction A lead electrode 6 elements (laminate) 1 of multilayer structure, parallel to the stacking plane (direction perpendicular to the stacking direction A) It has been set. なお、この実施形態2の積層型インダクタの全体構成を含むその他の構成は、上記実施形態1の積層型インダクタの場合と同様であることから、重複を避けるため説明を省略する。 Other configurations including the entire structure of a multilayer inductor in this embodiment 2 is omitted because it is similar to the case of multilayer inductor of the first embodiment, the description to avoid repetition. なお、図4及び図5においては、図1及び図2と同一又は相当する部分に同一符号を付している。 In FIGS. 4 and 5 are designated by the same reference numerals 1 and 2 and the same or corresponding parts Fig.

【0044】この実施形態2の積層型インダクタは、図5に示すように、(1)所定位置ごとにバイアホール7 The multilayer inductor in this embodiment 2, as shown in FIG. 5, (1) via holes 7 at predetermined positions
(最終的にバイアホール4(図4)となる)と、前記実施形態1の場合と同様の、所定形状の引出電極6となる導体パターン11が形成されたセラミックグリーンシート18と、(2)所定位置ごとにバイアホール7(最終的にバイアホール4(図4)となる)が形成されたセラミックグリーンシート8(8a,8b)と、(3)所定位置ごとにバイアホール9(最終的にバイアホール4(図4)との接続部分となる)が形成され、かつ、これらのバイアホール9を含む、所定形状の帯状接続電極5(図4)となる導体パターン10が形成されたセラミックグリーンシート19と、(4)所定位置ごとにバイアホール13(最終的にバイアホール4(図4)との接続部分となる)が形成され、かつ、これらのバイアホール13を含む、所定形状の帯状接続 (Eventually via holes 4 (a 4)) and, in the same manner as in the case of the embodiment 1, the ceramic green sheet 18 on which the conductor pattern 11 is formed as a lead electrode 6 having a predetermined shape, (2) via holes 7 for each predetermined position (eventually via holes 4 (a 4)) ceramic formed green sheet 8 (8a, 8b) and, (3) via holes 9 (finally at predetermined positions via holes 4 is a connection portion between (Fig. 4)) is formed, and these via-containing holes 9, the strip connecting electrode 5 (ceramic green Figure 4) and a conductor pattern 10 is formed in a predetermined shape a sheet 19, (4) via holes 13 at predetermined positions (the connecting portion of the final via hole 4 (FIG. 4)) is formed, and including those of the via holes 13, strip having a predetermined shape connection 極5(図4)となる導体パターン14が形成されたセラミックグリーンシート20 Ceramic green sheets 20 on which the conductor pattern 14 serving as electrode 5 (Fig. 4) is formed
と、(5)バイアホール及び導体パターンが形成されていない外層用のセラミックグリーンシート16の5種類のセラミックグリーンシートを用意し、上記実施形態1の場合に準じて、これら5種類のセラミックグリーンシートを、積層、圧着した後、焼成、外部電極の形成などの工程を経て作製される。 If, (5) via holes and prepared five kinds of ceramic green sheets of the ceramic green sheet 16 for the outer layer conductor pattern is not formed, in accordance with the case of the first embodiment, these five ceramic green sheets a laminate, after bonding, sintering, is produced through processes such as the formation of external electrodes.

【0045】この実施形態2の積層型インダクタにおいては、引出電極6が素子1(積層体17)の積層方向A The stacking direction A in the laminated inductor of this embodiment 2, the lead electrode 6 device 1 (laminate 17)
の略中央部に配設されているので、実装基板上の電極と引出電極6との間に浮遊容量が発生することを抑制することが可能になり、実装時の方向性をなくして、実装工程における作業性を向上させることが可能になる。 Because it is arranged at a substantially central portion, the stray capacitance between the electrode and the extraction electrode 6 on the mounting board becomes possible to suppress the occurrence, eliminating directionality in mounting, mounting of it is possible to improve the workability in the process. なお、この実施形態2の積層型インダクタにおいては、その他の点においても、上記実施形態1の積層型インダクタと同様の効果を得ることができる。 In the laminated inductor in the second embodiment, in other respects, it is possible to obtain the same effect as multilayer inductor of the first embodiment.

【0046】[実施形態3]図6は本願発明のさらに他の実施形態(実施形態3)にかかる積層型LC複合部品を示す外観斜視図である。 [0046] [Embodiment 3] FIG. 6 is a further perspective view illustrating such a multilayer LC composite component to another embodiment (Embodiment 3) of the present invention. この実施形態3の積層型LC Laminated LC of this embodiment 3
複合部品においては、積層体である素子1の両側面中央部から、上下両面側に回り込むように、コイル2(主としてバイアホール4)と対向する一対の容量取得用外部電極40が配設されている。 In composite parts, from both sides the central portion of the element 1 is a laminate, vertically as around to both sides, a pair of capacitive acquisition external electrode 40 facing the coil 2 (mainly via hole 4) is arranged there.

【0047】すなわち、この実施形態3の積層型LC複合部品は、実施形態1で説明した積層型インダクタを構成する素子1に、容量取得用外部電極40を配設したものであり、容量取得用外部電極40が、主として、コイル2を構成するバイアホール4と対向するように配設されている。 [0047] That is, the multilayer LC composite component of this embodiment 3, the element 1 constituting the laminated inductor described in the first embodiment is obtained by providing the capacity acquisition external electrode 40, the capacitor obtains external electrodes 40 are disposed so as mainly to face the via holes 4 constituting the coil 2.

【0048】なお、容量取得用外部電極40は、入出力用外部電極3と同様、素子1の所定の領域に導電ペーストを塗布して焼き付ける方法などにより形成することが可能である。 [0048] The capacity acquired external electrode 40, like the input-output external electrodes 3 can be formed by a method of baking by applying a conductive paste in a predetermined region of the element 1. この実施形態3の積層型インダクタの全体構成を含むその他の構成は、上記実施形態1の積層型インダクタの場合と同様であることから、重複を避けるため説明を省略する。 Other configurations, including the overall structure of the laminated inductor of this embodiment 3 will be omitted because it is similar to the case of multilayer inductor of the first embodiment, the description to avoid repetition. なお、図6においては、図1及び図2と同一又は相当する部分に同一符号を付している。 In FIG. 6, it is denoted by the same reference numerals to portions identical or corresponding to FIG. 1 and FIG 2.

【0049】上述のように、実施形態1の積層型インダクタを構成する素子1の表面の所定の位置に、コイル(実施形態では、主としてコイル2を構成するバイアホール4)と対向する容量取得用外部電極40を配設するだけで、バイアホール4と容量取得用外部電極40との間で必要な容量を確保することが可能になり、積層型L [0049] As described above, at a predetermined position on the surface of the element 1 constituting the multilayer inductor of the first embodiment, the coil (in the embodiment, the via hole 4 which constitutes mainly the coil 2) and the capacitor acquisition facing simply disposing the external electrode 40, it is possible to ensure the necessary capacity between the via hole 4 and a capacitor for obtaining the external electrodes 40, stacked L
C複合部品を容易に形成することが可能になる。 The C composite component it is possible to easily form.

【0050】なお、この実施形態3では、実施形態1の積層型インダクタを構成する素子1に容量取得用外部電極40を配設するように構成しているが、容量取得用外部電極40の具体的な形状や配設位置などには、特別の制約はなく、例えば、実施形態2で説明した積層型インダクタを構成する素子1に容量取得用外部電極40を配設するように構成することも可能である。 [0050] In this embodiment 3, although adapted to dispose the capacity acquisition external electrode 40 to the element 1 constituting the laminated inductor of Embodiment 1, specific capacity acquiring external electrode 40 thereof include such shapes and arrangement positions, no particular limitation, for example, also be configured to dispose the capacity acquisition external electrode 40 to the element 1 constituting the layered inductor described in embodiment 2 possible it is.

【0051】[実施形態4]図7は本願発明のさらに他の実施形態(実施形態4)にかかる積層型LC複合部品を示す外観斜視図、図8はこの積層型LC複合部品を構成する積層体を示す分解斜視図である。 [0051] [Embodiment 4] Figure 7 further perspective view illustrating such a multilayer LC composite component to another embodiment (Embodiment 4) of the present invention, FIG 8 is laminated to constitute the multilayer LC composite component it is an exploded perspective view showing a body. この実施形態4 Embodiment 4
の積層型LC複合部品においては、積層体である素子1 In the multilayer LC composite component, a laminate element 1
の内部の、帯状接続電極5(図7)よりも積層方向Aの外側の領域(上側領域及び下側領域)1aに、帯状接続電極5と対向する一対の容量取得用内部電極42が配設されている。 Internal, the strip connecting electrode 5 outside the region (upper region and lower region) in the stacking direction A than (Fig. 7) 1a, a pair of capacity acquisition inner electrode 42 facing the strip connection electrode 5 is disposed in the It is. そして、容量取得用内部電極42は、素子1の表面の両側面に形成された容量取得用外部電極を兼ねる一対のグランド接続用外部電極40aに接続されている。 The capacity acquisition inner electrode 42 is connected to the external electrodes 40a for a pair of ground connection which also serves as a capacitor for obtaining the external electrodes formed on both sides of the surface of the element 1. なお、この実施形態4の積層型LC複合部品においては、素子1の、容量取得用内部電極42が配設される上側領域及び下側領域1aは誘電体セラミックを主成分とする材料から形成されている。 In the multilayer LC composite component of this embodiment 4, the device 1, the upper region and the lower region 1a of the internal electrodes 42 are disposed for capacity acquisition is formed of a material composed mainly of dielectric ceramics ing.

【0052】この実施形態4の積層型LC複合部品は、 [0052] multilayer LC composite component of this embodiment 4,
帯状接続電極5と対向する一対の容量取得用内部電極4 Strip connection electrode 5 opposed to the pair of capacitive acquisition inner electrode 4
2と、容量取得用内部電極42が接続される、容量取得用外部電極を兼ねるグランド接続用外部電極40aを備えており、さらに、容量取得用内部電極42が配設される上側領域及び下側領域1aが誘電体セラミックを主成分とする材料から形成されているので、上記実施形態3 2, the internal electrode 42 capacitance acquired are connected, and an external electrode 40a for ground connection also serving as the external electrode capacity acquisition, further an upper region and a lower internal electrode 42 capacitance acquired is arranged since region 1a is formed of a material composed mainly of dielectric ceramics, the above-described embodiment 3
の積層型LC複合部品の場合に比べて、さらに大きい容量を確保することが可能になり、本願発明をさらに実効あらしめることができる。 Than in the case of a multilayer LC composite component, it is possible to secure a larger capacity, the present invention can be further effective Arashimeru.

【0053】なお、この実施形態4の積層型LC複合部品の全体構成を含むその他の構成は、上記実施形態1の積層型インダクタ、及び上記実施形態3の積層型LC複合部品と同様であることから、重複を避けるため説明を省略する。 [0053] Note that other configurations, including an overall configuration of a multilayer LC composite component of this fourth embodiment, the multilayer inductor of the embodiment 1, and is similar to the multilayer LC composite component of the third embodiment from, the description thereof will be omitted in order to avoid duplication. なお、図7及び8においては、図1、図2及び図6と同一又は相当する部分に同一符号を付している。 In FIG. 7 and 8, FIG. 1 are denoted by the same reference numerals to the same or corresponding parts as in FIG. 2 and FIG. また、図7においては、容量取得用内部電極42やグランド接続用外部電極40aを示す必要があることから、素子1の内部の構造の図示を省略しているが、素子1の内部の構造は図6とまったく同様である。 Further, in FIG. 7, it is necessary to show the internal electrode 42 and the grounding external electrode 40a for capacity acquisition, although not shown in the internal structure of the device 1, the internal structure of the device 1 is 6 to be exactly the same.

【0054】また、この実施形態4の積層型LC複合部品は、例えば、図8示すように、(1)所定位置ごとにバイアホール7(最終的にバイアホール4(図6参照)となる)が形成されたセラミックグリーンシート8と、 [0054] Further, the multilayer LC composite component of this fourth embodiment, for example, as shown FIG. 8, (a final via hole 4 (see FIG. 6)) (1) via holes 7 at predetermined positions a ceramic green sheet 8 but which has been formed,
(2)所定位置ごとにバイアホール9(最終的にバイアホール4(図6参照)との接続部分となる)が形成され、 (2) via holes 9 at predetermined position (the connecting portion of the final via hole 4 (see FIG. 6)) is formed,
かつ、これらのバイアホール9を含む、所定形状の帯状接続電極5(図6参照)となる導体パターン10,及び前記実施形態1の場合と同様の、所定形状の引出電極6 And, including those of the via hole 9, a predetermined shape strip connecting electrode 5 (see FIG. 6) and a conductor pattern 10, and similar to that of the embodiment 1, the predetermined shape extraction electrode 6
となる導体パターン11が形成されたセラミックグリーンシート12と、(3)所定位置ごとにバイアホール13 The ceramic green sheet 12 on which the conductor pattern 11 is formed as a, (3) via holes 13 at predetermined positions
(最終的にバイアホール4(図6参照)との接続部分となる)が形成され、かつ、これらのバイアホール13を含む、所定形状の帯状接続電極5(図6参照)となる導体パターン14が形成されたセラミックグリーンシート15と、(4)バイアホール及び導体パターンが形成されていない外層用のセラミックグリーンシート16と、 (Finally a connection portion between the via hole 4 (see FIG. 6)) is formed, and including those of the via-hole 13, a conductor pattern 14 serving as a strip-shaped connecting electrode 5 having a predetermined shape (see FIG. 6) the ceramic green sheet 15 but formed a ceramic green sheet 16 for the outer layer is not formed (4) via holes and the conductor patterns,
(5)平面視十字形状で、一方の端部と該端部に対向する他方の端部がシート端面にまで達するような、容量取得用内部電極42となる導体パターン43が形成されたセラミックグリーンシート44の5種類のセラミックグリーンシートを用意し、上記実施形態1の場合に準じて、 (5) in a plan view cross-shaped ceramic green the other end opposite the one end portion and the end portion is such as to reach the sheet end surface, the conductor pattern 43 serving as a capacitor for obtaining the internal electrodes 42 are formed It prepared 5 types of ceramic green sheets of the sheet 44, according to the case of the first embodiment,
これら5種類のセラミックグリーンシートを、積層、圧着した後、焼成、外部電極の形成などの工程を経て作製される。 These five types of ceramic green sheets, stacking, after crimping, fired, is produced through processes such as the formation of external electrodes.

【0055】なお、本願発明は、上記実施形態1〜4に限定されるものではなく、発明の要旨の範囲内において、種々の応用、変形を加えることが可能である。 [0055] Incidentally, the present invention is not limited to the above embodiments 1-4, within the scope of the invention, it is possible to add various applications and modifications.

【0056】 [0056]

【発明の効果】上述のように、本願発明(請求項1)の積層型コイル部品は、複数のバイアホールのうちの所定のバイアホールの積層方向の一方側端部どうし及び所定のバイアホールの積層方向の他方側端部どうしを、積層面と平行に(積層方向に直交する方向に)配設された複数層構造の帯状接続電極により接続して、コイル中心軸が積層方向と直交するコイルを形成するとともに、積層面と平行に配設された複数層構造の引出電極により該コイルを入出力用外部電極と接続するようにしているので、製品の大型化を招くことなく、導体抵抗を低減することができる。 As described above, according to the present invention, the multilayer coil component of the present invention (claim 1) is a predetermined one side end each other and a predetermined via holes in the stacking direction of the via hole of the plurality of via holes the other end portion to each other in the stacking direction, are connected by a strip-shaped connection electrodes (direction perpendicular to the stacking direction) disposed a multilayer structure parallel to the lamination plane, the coil where the coil center axis perpendicular to the stacking direction to form a, since to be connected with the input-output external electrodes the coil by an extraction electrode disposed parallel to the lamination plane multilayer structure, without increasing the size of the product, the conductor resistance it can be reduced. すなわち、帯状接続電極及び引出電極を複数層構造として、バイアホールの電極断面積と同等程度の断面積が確保されるまで帯状接続電極及び引出電極の厚みを大きくする(積層数を増やす)ことにより、小型化を阻害することなく、導体抵抗を低減して、大電流への対応性を向上させることが可能になる。 That is, the strip-shaped connection electrodes and the lead electrodes as a multilayer structure, increasing the thickness of the strip connection electrode and the extraction electrode to the cross-sectional area of ​​about equivalent to the electrode cross-sectional area of ​​the via hole is ensured (increasing the number of laminated layers) that the without inhibiting the miniaturization by reducing the conductor resistance, it is possible to improve the response of the large current.

【0057】また、引出電極が積層体の最外層付近に配設されている場合には、実装基板上の電極と引出電極との間に浮遊容量が発生する場合があり、高周波特性が劣化しやすくなることがあるため、実装時の方向性に配慮する必要があるが、請求項2の積層型コイル部品のように、引出電極を、積層体の積層方向の略中央部に、かつ、積層面と平行に配設するようにした場合、実装基板上の電極と引出電極との間に浮遊容量が発生することを抑制することが可能になり、実装時の方向性をなくして、実装工程における作業性を向上させることができる。 [0057] In the case where the lead electrodes are disposed near the outermost layer of the laminate, may stray capacitance generated between the electrode and the extraction electrode on the mounting board, high frequency characteristics are degraded since it may become easier, but it is necessary to consider the direction of the time of mounting, as laminated coil component according to claim 2, the extraction electrode, at a substantially central portion in the lamination direction of the laminate, and laminating If so arranged parallel to the plane, it is possible to suppress the stray capacitance is generated between the electrode and the extraction electrode on the mounting board, eliminating directionality in mounting, mounting step it is possible to improve the workability in.

【0058】また、請求項3の積層型コイル部品のように、積層体の表面に、バイアホールと帯状接続電極から構成されるコイルと対向する容量取得用外部電極を配設するようにした場合、積層体の表面に容量取得用外部電極を配設するだけで、バイアホールと容量取得用外部電極との間で必要な容量を確保することが可能になり、容易に積層型LC複合部品を構成することができる。 [0058] Further, as the laminated coil component according to claim 3, the surface of the laminate, if you choose to dispose the coil opposite to capacity acquisition external electrode composed of the via hole and the strip connection electrode , simply disposing the external electrode capacity acquisition on the surface of the laminate, it is possible to secure the necessary capacity between the via hole and the capacity acquisition external electrodes, easily multilayer LC composite component it can be configured.

【0059】また、請求項4の積層型コイル部品のように、帯状接続電極よりも積層方向外側の一方側及び他方側の少なくとも一方の領域に、帯状接続電極と対向する容量取得用内部電極を配設するとともに、積層体の表面にグランド接続用外部電極を配設し、容量取得用内部電極をグランド接続用外部電極に接続するようにした場合、請求項3にかかる積層型コイル部品の場合よりも大きい容量を確保することが可能になり、特性設計の自由度を向上させることができる。 [0059] Further, as the laminated coil component according to claim 4, on one side and at least one region of the other side in the stacking direction outside than the strip connecting electrode, the internal electrode capacity acquisition facing the strip connection electrode as well as arranged, disposed external electrode for grounding connected to the surface of the laminate, if you choose to connect the internal electrode capacity acquisition to the external electrode for grounding, when the laminated coil component according to claim 3 it is possible to secure a greater capacity than can improve the degree of freedom in characteristics design.

【0060】また、請求項5の積層型コイル部品のように、積層体の、容量取得用内部電極が配設される領域を誘電体セラミックを主成分とする材料から構成するようにした場合、さらに大きい容量を確保することが可能になり、本願発明をより実効あらしめることができる。 [0060] Further, as the laminated coil component according to claim 5, of the laminate, when the region where the internal electrode capacity acquisition is arranged to constitute a material composed mainly of dielectric ceramics, it is possible to secure a larger capacity, it is possible to present invention more effective Arashimeru.

【0061】また、本願発明(請求項6)の積層型コイル部品の製造方法は、回折格子で分光されたレーザビームを照射してセラミックグリーンシートに貫通孔を形成した後、この貫通孔に導電ペーストを充填してバイアホールを形成するようにしているので、セラミックグリーンシートに対して高精度の貫通孔を、極めて効率よく形成することが可能になり、本願発明の積層型コイル部品を効率よく製造することができる。 [0061] Further, the method of fabricating the multilayer coil component of the present invention (claim 6), after forming a through hole in the ceramic green sheet by irradiating a laser beam a diffraction grating, conductor in the through-hole since so as to form a via hole filled with a paste, a highly accurate through holes with respect to the ceramic green sheet, it is possible to very efficiently formed, a laminated coil component of the present invention efficiently it can be produced. また、レーザビームを照射する方法によれば、微細で、精度の高いバイアホールを形成することが可能になるため、同じ製品寸法で巻き数の多いコイルを形成することが可能になる。 Further, according to the method of irradiating a laser beam, a fine, since it becomes possible to form a high via hole precision, it is possible to form a coil having a large number of windings in the same product sizes.

【0062】また、請求項7の積層型コイル部品の製造方法のように、1枚又は2枚以上のセラミックグリーンシートを積層するたびに仮圧着しながら積層を行い、所定枚数積層した後、本圧着することにより、コイルパターンの位置ずれを生じたりすることなく、確実に所望の積層体を形成することが可能になり、本願発明の積層型コイル部品をさらに効率よく製造することができる。 [0062] Also, as in the method for manufacturing the laminated coil component according to claim 7, performs lamination with temporary pressure bonding each time of laminating one or two or more ceramic green sheets, after a predetermined number of stacked, the by crimping, without or misaligned coil pattern, reliably it is possible to form a desired laminate the laminated coil component of the present invention can be further efficiently produced.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本願発明の一実施形態(実施形態1)にかかる積層型インダクタを示す外観斜視図である。 1 is an external perspective view showing a laminated inductor according to one embodiment (Embodiment 1) of the present invention.

【図2】実施形態1にかかる積層型インダクタを構成する積層体を示す分解斜視図である。 2 is an exploded perspective view showing a laminated body constituting the laminated inductor according to the first embodiment.

【図3】実施形態1の積層型インダクタの変形例にかかる積層体を示す分解斜視図である。 3 is an exploded perspective view of a laminate according to a modification of the multilayer inductor of the first embodiment.

【図4】本願発明の他の実施形態(実施形態2)にかかる積層型インダクタを示す外観斜視図である。 4 is an external perspective view showing such a multilayer inductor to another embodiment of the present invention (Embodiment 2).

【図5】実施形態2にかかる積層型インダクタを構成する積層体を示す分解斜視図である。 5 is an exploded perspective view showing a laminated body constituting the laminated inductor according to a second embodiment.

【図6】本願発明のさらに他の実施形態(実施形態3) [6] Yet another embodiment of the present invention (Embodiment 3)
にかかる積層型LC複合部品を示す外観斜視図である。 It is an external perspective view showing such a multilayer LC composite component.

【図7】本願発明のさらに他の実施形態(実施形態4) [7] Yet another embodiment of the present invention (Embodiment 4)
にかかる積層型LC複合部品を示す外観斜視図である。 It is an external perspective view showing such a multilayer LC composite component.

【図8】実施形態4にかかる積層型LC複合部品を構成する積層体を示す分解斜視図である。 8 is an exploded perspective view showing a laminated body constituting the multilayer LC composite component according to the fourth embodiment.

【図9】従来の積層型インダクタを示す外観斜視図である。 9 is an external perspective view showing a conventional multilayer inductor.

【図10】従来の積層型インダクタを構成する積層体を示す分解斜視図である。 10 is an exploded perspective view showing a laminated body constituting a conventional multilayer inductor.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 素子(積層体) 1a 素子の上側領域及び下側領域 2 コイル 3 入出力用外部電極 4,7,9,13 バイアホール 5 帯状接続電極 6 引出電極 8(8a,8b),12,15,16,18,19,2 1 element (laminate) 1a elements of the upper region and the lower region 2 coil 3 output external electrode 4,7,9,13 via hole 5 strip connecting electrode 6 lead electrode 8 (8a, 8b), 12,15, 16,18,19,2
0,44セラミックグリーンシート 10,11,14,43 導体パターン 17 未焼成の積層体 40 容量取得用外部電極 40a グランド接続用外部電極 42 容量取得用内部電極 A 積層方向 0,44 ceramic green sheets 10,11,14,43 conductor pattern 17 green internal electrode A stacking direction external electrode 42 volume acquisition laminate 40 capacity acquisition external electrode 40a ground connection

───────────────────────────────────────────────────── フロントページの続き (72)発明者 荒川 元 京都府長岡京市天神二丁目26番10号 株式 会社村田製作所内 Fターム(参考) 5E062 DD04 5E070 AA01 AA05 BA12 CB04 CB13 CB17 ────────────────────────────────────────────────── ─── front page of the continuation (72) inventor Arakawa original Kyoto Prefecture Nagaokakyo Tenjin chome No. 26 No. 10 stock company Murata Manufacturing Co., Ltd. in the F-term (reference) 5E062 DD04 5E070 AA01 AA05 BA12 CB04 CB13 CB17

Claims (7)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】積層体内部に、積層方向と直交するコイル中心軸を周回するコイルが配設され、かつ、積層体の両端面に、コイルの両端部と導通する入出力用外部電極が配設された構造を有する積層型コイル部品であって、 積層体内部の、積層方向から見た複数の位置に、軸心が積層方向に沿うように配設されたバイアホールと、 積層体内部に、積層面と平行に配設され、所定のバイアホールの積層方向の一方側端部どうし及び所定のバイアホールの積層方向の他方側端部どうしを接続することにより、バイアホールと協働して、コイル中心軸が積層方向と直交するコイルを構成する複数層構造の帯状接続電極と、 積層体内部に、積層面と平行に配設され、バイアホールと帯状接続電極から構成される前記コイルと前記入出力用外部電極とを 1. A inside the laminate, coils around the coil center axis orthogonal to the stacking direction are disposed, and, on both end surfaces of the laminate, distribution input and output external electrode conducting with both end portions of the coil a laminated coil component having a set structure, the stack unit, in a plurality of positions as viewed from the laminating direction, a via hole axis is arranged along the stacking direction, inside the laminate are disposed in parallel with the laminated surface, by connecting the other end portion to each other in the stacking direction of one side edge portion with each other and a predetermined via holes in the stacking direction of a given via hole, in cooperation with the via holes a strip connecting electrodes of multilayer structures constituting the coil the coil center axis perpendicular to the stacking direction, the internal laminate is disposed in parallel with the laminated surface, and the coil composed of the via hole and the strip connection electrode and said input-output external electrodes 続する複数層構造の引出電極とを具備することを特徴とする積層型コイル部品。 Laminated coil component characterized by comprising a lead electrode of the multilayer structure to continue.
  2. 【請求項2】前記引出電極が、積層体の積層方向の略中央部に、かつ、積層面と平行に配設されていることを特徴とする請求項1記載の積層型コイル部品。 Wherein said leading electrode is, the substantially central portion in the lamination direction of the laminate, and the laminated coil component according to claim 1, characterized in that it is arranged parallel to the stacked face.
  3. 【請求項3】積層体の表面に、バイアホールと帯状接続電極から構成される前記コイルと対向する容量取得用外部電極が配設されていることを特徴とする請求項1又は2記載の積層型コイル部品。 The surface of 3. A laminate stack of claim 1 or 2 wherein said coil opposite to capacity acquisition external electrode composed of the via hole and the strip connection electrode, characterized in that it is provided type coil component.
  4. 【請求項4】積層体内部の、前記帯状接続電極よりも積層方向外側の一方側及び他方側の少なくとも一方の領域に、前記帯状接続電極と対向する容量取得用内部電極が配設されているとともに、積層体の表面にグランド接続用外部電極が配設されており、かつ、容量取得用内部電極がグランド接続用外部電極に接続されていることを特徴とする請求項3記載の積層型コイル部品。 4. the stack unit, in at least one region of one side and the other side in the stacking direction outside than the strip connecting electrode, the strip connecting electrode opposed to the capacity acquisition inner electrode is arranged together, and the external electrode for grounding connected is disposed on the surface of the laminate and laminated coil according to claim 3, wherein the internal electrode capacity acquisition is connected to the external electrode for grounding parts.
  5. 【請求項5】積層体の、前記容量取得用内部電極が配設される領域が誘電体セラミックを主成分とする材料から形成されていることを特徴とする請求項3又は4記載の積層型コイル部品。 Of 5. A laminate according to claim 3 or 4 stacked according area where the capacity acquisition inner electrode is arranged is characterized in that it is formed of a material composed mainly of dielectric ceramics coil parts.
  6. 【請求項6】請求項1〜5のいずれかに記載の積層型コイル部品を製造するための方法であって、 回折格子で分光されたレーザビームを照射してセラミックグリーンシートに貫通孔を形成した後、この貫通孔に導電ペーストを充填してバイアホールを形成する工程を具備していることを特徴とする積層型コイル部品の製造方法。 6. A method for manufacturing a laminated coil component according to claim 1, forming a through hole in the ceramic green sheet by irradiating a laser beam a diffraction grating after, the method of fabricating the multilayer coil component characterized in that it comprises a step of forming a via hole by filling a conductive paste into the through-hole.
  7. 【請求項7】前記バイアホールが形成されたセラミックグリーンシートを積層して積層体を形成するにあたって、1枚又は2枚以上のセラミックグリーンシートを積層するたびに仮圧着しながら積層を行い、所定枚数積層した後、本圧着することにより積層体を形成することを特徴とする請求項6記載の積層型コイル部品の製造方法。 In 7. forming a laminate by laminating a ceramic green sheet where the via hole is formed, performs a laminate with temporary pressure bonding each time of laminating one or two or more ceramic green sheets, a predetermined after number lamination method for manufacturing a laminated coil component according to claim 6, wherein the forming a stacked body by the pressure bonding.
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