JPH09191130A - Light emitting element device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the power consumption of a light emitting element device and, at the same time, to reduce the size of the device by efficiently utilizing the light rays emitted from light emitting elements. SOLUTION: In a light emitting element device, light shielding films 12 having openings 12a are formed within prescribed extents in front of light emitting elements 11 on a semiconductor substrate 10 on which the elements 11 are formed and, at the same time, micro-lenses 13 are formed on the front faces of the elements 11. The micro-lenses 13 are formed by forming resist patterns 13b on the elements 11 and forming the surfaces of the patterns 13b in curved surfaces, such as spherical surfaces, etc., through heat-treatment.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device having a microlens and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, when light emitted from a light emitting element such as an LED (light emitting diode) is used in optical communication or the like, the light emitted from the light emitting element is directly used without being collected on the front surface of the light emitting element. Was there.

[0003]

Therefore, the utilization efficiency of the light emitted from the light emitting element is not always good, and a large amount of electric power is required to give a sufficient intensity to the light emitted from the light emitting element. However, there is a problem that it is not suitable for low power consumption when it is used for optical communication, for example.

Conventionally, there is also a package in which a package for encapsulating a light emitting element is formed in a lens shape to provide a light collecting property, but in this case, it is difficult to miniaturize the package because the package is formed in a lens shape. There was a problem.

The present invention has been made in view of the above problems, and its problem is that light emitted from a light emitting element can be efficiently used, power consumption can be reduced, and light emission suitable for downsizing can be achieved. An object is to provide an element device and a manufacturing method thereof.

[0006]

A light emitting device according to claim 1, wherein the light emitting device emits light, and the light emitting device is integrally formed on the front surface of the light emitting device to collect the light emitted from the light emitting device. It is provided with a microlens which emits light and emits it.

A light emitting device according to a second aspect is the first aspect.
The light emitting device described above is provided with a translucent film which is interposed between the light emitting device and the microlens and which adjusts the light collecting position by the microlens.

According to a third aspect of the present invention, there is provided a method of manufacturing a light emitting device, wherein the light emitting device emits light and the light emitting device is integrally formed on the front surface of the light emitting device to collect the light emitted from the light emitting device. A method for manufacturing a light emitting device including a emitting microlens, comprising patterning a resist material layer at a position corresponding to the light emitting element on a substrate on which the light emitting element is formed, and heat treating the surface shape of the resist material layer. The curved surface is used to form a microlens.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a light emitting device, wherein the light emitting device emits light and the light emitting device is integrally formed on a front surface of the light emitting device to collect the light emitted from the light emitting device. A method of manufacturing a light-emitting device including a microlens for emitting light, comprising patterning a light-curable light-transmissive material layer at a position corresponding to the light-emitting device on a substrate on which the light-emitting device is formed, and heat-treating the material by heat treatment. The surface shape of the light-transmitting material layer is curved, and the light-transmitting material layer having the curved surface shape is irradiated with predetermined light to cure the light-transmitting material layer to form a microlens.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a light emitting device, wherein the light emitting device emits light and the light emitting device is integrally formed on the front surface of the light emitting device to collect the light emitted from the light emitting device. A method for manufacturing a light-emitting element device, comprising: a microlens for emitting light; and a translucent film interposed between the light-emitting element and the microlens, for adjusting the condensing position by the microlens. A light-transmitting film is formed on the substrate on which the element is formed, the resist material layer is patterned on the light-transmitting film at a position corresponding to the light emitting element, and the surface shape of the resist material layer is curved by heat treatment. To form a microlens.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a light emitting device, wherein the light emitting device emits light and the light emitting device is integrally formed on a front surface of the light emitting device to collect light emitted from the light emitting device. A method for manufacturing a light-emitting element device, comprising: a microlens for emitting light; and a translucent film interposed between the light-emitting element and the microlens, for adjusting the condensing position by the microlens. A light-transmitting film is formed on the substrate on which the element is formed, and a light-curable light-transmitting material layer is patterned on the light-transmitting film at a position corresponding to the light-emitting element. The surface shape of the material layer is curved, and the light-transmitting material layer having the curved surface shape is irradiated with predetermined light to cure the light-transmitting material layer to form a microlens.

In the light emitting element device according to the first aspect, the light emitted from the light emitting element is condensed and emitted by the microlens formed integrally with the light emitting element on the front surface of the light emitting element.

In the light emitting element device according to the second aspect, the light condensing position by the microlens is adjusted by the translucent film interposed between the light emitting element and the microlens.

According to a third aspect of the present invention, there is provided a method of manufacturing a light emitting element device, wherein the resist material layer patterned at a position corresponding to the light emitting element on the substrate on which the light emitting element is formed is heat-treated to form the surface shape of the resist material layer. Is curved to form a microlens.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a light emitting device, wherein the photo-curable translucent material layer patterned at a position corresponding to the light emitting device on the substrate on which the light emitting device is formed is heat treated. The surface shape of the translucent material layer is curved, and the microlens is formed by irradiating the translucent material layer with predetermined light to cure the translucent material layer.

According to a fifth aspect of the present invention, there is provided a method for manufacturing a light emitting device, in which a light transmitting film is formed on a substrate on which the light emitting device is formed, and a resist is formed on the light transmitting film at a position corresponding to the light emitting device. The material layer is patterned, and the resist material layer is heat-treated, whereby the surface shape of the resist material layer is curved to form a microlens.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a light emitting device, in which a light transmissive film is formed on a substrate on which the light emitting device is formed, and the light transmissive film is exposed to light at a position corresponding to the light emitting device. The curable light-transmitting material layer is patterned, and the light-transmitting material layer is heat-treated so that the surface shape of the light-transmitting material layer is curved, and further predetermined light is applied to the light-transmitting material layer. The microlenses are formed by irradiating and curing the translucent material layer.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is an explanatory view showing a method of manufacturing a light emitting device according to the first embodiment of the present invention. As shown in FIG. 1C, the light emitting device according to the present embodiment is
A light-shielding film 12 having an opening 12a in a predetermined range on the front surface (upper surface) of the light emitting element 11 is formed on the semiconductor substrate 10 on which a plurality of light emitting elements 11 such as LEDs are formed, and the front surface of the light emitting element 11 is formed. And a microlens 13 made of a resist material is formed.

Next, a method of manufacturing the light emitting device according to this embodiment will be described. In this manufacturing method, first,
As shown in FIG. 1A, a light shielding film 12 having an opening 12a is formed in a predetermined area on the front surface of the light emitting element 11 on the semiconductor substrate 10 on which the plurality of light emitting elements 11 are formed.
For example, Al is used for the light shielding film 12. The method of forming the light-shielding film 12 is, for example, a method of depositing a material for the light-shielding film 12 such as Al on the entire surface of the semiconductor substrate 10 and patterning the light-shielding film 12 having the openings 12a by a photolithography process. . Next, a resist material, which is also a microlens material, is applied on the light emitting element 11 and the light shielding film 12 by, for example, a coating device to form a resist material layer 13a. The thickness of the resist material layer 13a is the same as the light emitting element 1
1 is set appropriately according to the size of 1
It is a degree. Next, as shown in FIG. 1B, the resist material layer 13a is exposed with a predetermined pattern by a photomask and developed to form (pattern) a resist pattern 13b on the front surface of the light emitting element 11. Next, FIG.
As shown in FIG.
The surface shape of b is a curved surface such as a spherical surface, and the microlens 13 made of a resist material is formed on the base. The temperature of the heat treatment depends on the type of resist material, but is, for example, 150 °
It is about C. Here, the shape of the microlens 13 is
It is controlled by the material of the resist material, the thickness, the temperature of heat treatment, and the like.

As described above, according to the light emitting device and the manufacturing method thereof according to the present embodiment, the light emitting device 11
The light emitted from is condensed by the microlens 13 formed on the front surface thereof and emitted to the front, so that the light emitted from the light emitting element 11 can be efficiently used. Therefore, for example, when the light emitting element device according to the present embodiment is used for optical communication, it becomes possible to send a signal even if the light emitted from the light emitting element 11 is weaker than in the conventional case. The required power can be reduced and the power consumption can be reduced. Further, since the microlens 13 is formed directly on the light emitting element 11, the light emitting element device can be easily downsized as compared with the case where the package is formed into a lens shape, and as a result, the device using the light emitting element device can be downsized. Will also be possible.

In the present embodiment, an example of a light emitting element device having a plurality of light emitting elements 11 and a plurality of microlenses 13 on its front surface has been described, but one light emitting element 11 and one microlens 13 on its front surface are provided. However, the manufacturing method in that case is the same as the manufacturing method described in the present embodiment.

FIG. 2 is an explanatory view showing a method of manufacturing a light emitting device according to a second embodiment of the present invention. As shown in FIG. 2D, the light emitting element device according to the present embodiment has
A light-shielding film 12 having an opening 12a in a predetermined range on the front surface (upper surface) of the light emitting element 11 is formed on the semiconductor substrate 10 on which a plurality of light emitting elements 11 such as LEDs are formed, and the front surface of the light emitting element 11 is formed. In addition, the microlens 13 made of a resist material is formed via the translucent film 14 for adjusting the condensing position of the microlens 13.

Next, a method of manufacturing the light emitting device according to this embodiment will be described. In this manufacturing method, first,
As shown in FIG. 2A, an opening 12a is formed in a predetermined area on the front surface of the light emitting element 11 on the semiconductor substrate 10 on which a plurality of light emitting elements 11 are formed, as in the first embodiment. The light-shielding film 12 having is formed. Next, a transparent material layer is formed on the entire surface of the light emitting element 11 and the light shielding film 12, and is polished and flattened to a predetermined thickness to form the transparent film 14. As the translucent material used for the translucent film 14, for example, a SiO ₂ film such as a TEOS (tetraethyl orthosilicate) oxide film is used. Next, as shown in FIG. 2B, a resist material, which is also a microlens material, is applied onto the translucent film 14 by, for example, a coating device to form a resist material layer 13a. Next, as shown in FIG. 2C, the resist material layer 13a is exposed with a predetermined pattern by a photomask and developed to form a resist pattern 13b on the front surface of the light emitting element 11. Next, as shown in FIG. 2D, the surface shape of the resist pattern 13b is changed to a curved surface such as a spherical surface by heat treatment, and the microlens 13 made of a resist material is formed.

As described above, according to the light emitting device and the manufacturing method thereof according to the present embodiment, the light emitting device 11
Since the translucent film 14 is provided between the micro lens 13 and the micro lens 13, the focusing position of the micro lens 13 can be adjusted by adjusting the thickness of the translucent film 14.
Other configurations, operations and effects of this embodiment are the same as those of the first embodiment.

FIG. 3 is an explanatory view showing a method of manufacturing a light emitting device according to the third embodiment of the present invention. As shown in FIG. 3D, the light emitting device according to the present embodiment is
On the semiconductor substrate 10 on which a plurality of light emitting elements 11 are formed,
The opening 12 is provided in a predetermined range on the front surface (upper surface) of the light emitting element 11.
The light-shielding film 12 having a is formed and the light-emitting element 1
A microlens 21 made of a light-curing translucent resin is formed on the front surface of the first lens 1.

Next, a method of manufacturing the light emitting device according to this embodiment will be described. In this manufacturing method, first,
As shown in FIG. 3A, an opening 12a is formed in a predetermined area on the front surface of the light emitting element 11 on the semiconductor substrate 10 on which a plurality of light emitting elements 11 are formed, as in the first embodiment. The light-shielding film 12 having is formed. Next, a light-curable translucent resin is applied onto the light emitting element 11 and the light shielding film 12 by, for example, an applicator to form a translucent resin layer 21a.
The thickness of the translucent resin layer 21a is appropriately set according to the size of the light emitting element 11 and the like, but is about 1 μm, for example. A resist material is applied onto the translucent resin layer 21a by, for example, a coating device to form a resist material layer 22a. Next, as shown in FIG. 3B, similarly to the first embodiment, the resist material layer 22a is exposed with a predetermined pattern and developed to form a resist pattern 22b on the front surface of the light emitting element 11.
To form Next, as shown in FIG. 3C, the translucent resin layer 21a is formed using the resist pattern 22b as a mask.
The unnecessary portion on the light-shielding film 12 is removed by etching to form a resin pattern 21b on the front surface of the light emitting element 11. Next, as shown in FIG. 3D, the resin pattern 21 is formed by reflowing by heat treatment.
The surface shape of b is a curved surface such as a spherical surface. The heat treatment temperature is
The temperature is, for example, about 200 ° C., though it depends on the type of translucent resin. Next, the resin pattern 2 whose surface shape is curved
A resin pattern 21b having a curved surface shape is obtained by collectively irradiating the entire surface of 1b with light for curing the translucent resin.
Is cured to form the microlens 21. here,
The shape of the microlens 21 is controlled by the material of the translucent resin, the thickness, the temperature of the heat treatment, and the like.

The light emitting device and the method of manufacturing the same according to the present embodiment are advantageous in the case of forming the microlens 21 larger than the microlens 13 made of the resist material as in the first embodiment. . In the present embodiment, an example of a light emitting element device having a plurality of light emitting elements 11 and microlenses 21 on the front surface thereof has been described, but the light emitting element 11 and microlenses 2 on the front surface thereof are described.
One may be one, and the manufacturing method in that case is the same as the manufacturing method described in the present embodiment. Other configurations, operations and effects of this embodiment are the same as those of the first embodiment.

FIG. 4 is an explanatory view showing a method of manufacturing a light emitting device according to a fourth embodiment of the present invention. As shown in FIG. 4D, the light emitting device according to the present embodiment is
On the semiconductor substrate 10 on which a plurality of light emitting elements 11 are formed,
The opening 12 is provided in a predetermined range on the front surface (upper surface) of the light emitting element 11.
The light-shielding film 12 having a is formed and the light-emitting element 1
On the front surface of No. 1, a microlens 21 made of a light-curable translucent resin is formed via a translucent film 23 for adjusting the condensing position of the microlens 21.

Next, a method of manufacturing the light emitting device according to this embodiment will be described. In this manufacturing method, first,
As shown in FIG. 4A, the opening 12a is formed in a predetermined area on the front surface of the light emitting element 11 on the semiconductor substrate 10 on which the plurality of light emitting elements 11 are formed, as in the first embodiment. The light-shielding film 12 having is formed. Next, as in the second embodiment, a transparent material layer is formed on the entire surface of the light emitting element 11 and the light shielding film 12, and the transparent film 23 is polished and flattened to a predetermined thickness. To form. Next, the transparent film 23
A light-curable translucent resin is applied to the top by, for example, an applicator to form a translucent resin layer 21a. Next, a resist material is applied onto the translucent resin layer 21a by, for example, a coating device to form a resist material layer 22a. Next, FIG.
As shown in (b), a predetermined pattern is exposed on the resist material layer 22a and developed to form a resist pattern 22b on the front surface of the light emitting element 11. Next, as shown in FIG. 4C, the resist pattern 22b is used as a mask to remove an unnecessary portion of the light-transmitting resin layer 21a on the light-shielding film 12 by etching to remove the front surface of the light-emitting element 11. Then, the resin pattern 21b is formed. Next, FIG.
As shown in (d), the surface shape of the resin pattern 21b is changed to a curved surface such as a spherical surface by reflowing by heat treatment.
Next, the entire surface of the resin pattern 21b having a curved surface shape is collectively irradiated with light for curing the translucent resin, and the resin pattern 21b having a curved surface shape is cured to cause the microlens 21. To form.

According to the light emitting device and the method of manufacturing the same according to the present embodiment, the light emitting device 11 and the microlens 2 are used.
Since the light-transmitting film 23 is provided between the light-transmitting film 1 and the light-transmitting film 1, the light-collecting position of the microlens 21 can be adjusted by adjusting the thickness of the light-transmitting film 23 as in the second embodiment. it can. Other configurations, operations and effects of this embodiment are the same as those of the third embodiment.

The present invention is not limited to the above-described embodiments, and for example, the light emitting element 11 is not limited to an LED, and other light emitting elements such as a semiconductor laser may be used.

[0033]

As described above, according to the method of manufacturing a light emitting device according to claim 1 or the light emitting device according to claim 3 or 4, a microlens is integrally formed with the light emitting device on the front surface of the light emitting device. Since the light emitting element is formed, the light emitted from the light emitting element can be efficiently used, the power consumption can be reduced, and the light emitting element device can be miniaturized.

According to the light emitting element device of the second aspect or the method of manufacturing the light emitting element device of the fifth or sixth aspect, the condensing position by the microlens is adjusted between the light emitting element and the microlens. Since the transparent film for this purpose is interposed, in addition to the above effect, by adjusting the thickness of the transparent film, it is possible to adjust the focusing position by the microlens.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a method for manufacturing a light emitting device according to a first embodiment of the invention.

FIG. 2 is an explanatory diagram showing a method of manufacturing a light emitting device according to a second embodiment of the invention.

FIG. 3 is an explanatory diagram showing a method of manufacturing a light emitting device according to a third embodiment of the invention.

FIG. 4 is an explanatory diagram showing a method of manufacturing a light emitting device according to a fourth embodiment of the invention.

[Explanation of symbols]

 10 semiconductor substrate 11 light emitting element 12 light shielding film 13 microlens 13a resist material layer 13b resist pattern

Claims (6)

[Claims] 1. A light emitting device that emits light, and a microlens that is integrally formed with the light emitting device on the front surface of the light emitting device and that collects and emits the light emitted from the light emitting device. A light emitting element device characterized by the above. 2. The light-transmitting film, which is interposed between the light-emitting element and the microlens and adjusts a focusing position of the microlens. Light emitting device. 3. A light emitting element that emits light, and a microlens that is integrally formed with the light emitting element on the front surface of the light emitting element and that collects and emits the light emitted from the light emitting element. A method for manufacturing a light emitting device, comprising patterning a resist material layer at a position corresponding to the light emitting element on a substrate on which the light emitting element is formed, and heat treating the surface shape of the resist material layer to a curved surface to form a microlens. A method of manufacturing a light-emitting device, the method comprising: 4. A light emitting element which emits light, and a microlens which is integrally formed with the light emitting element on the front surface of the light emitting element and which condenses and emits the light emitted from the light emitting element. A method for manufacturing a light-emitting device, comprising patterning a photo-curable translucent material layer at a position corresponding to the light-emitting device on a substrate on which the light-emitting device is formed, and heat-treating the translucent material layer by heat treatment. A light-emitting element device characterized in that a surface shape is curved, and the light-transmitting material layer having the curved surface shape is irradiated with predetermined light to cure the light-transmitting material layer to form a microlens. Production method. 5. A light emitting element for emitting light, a microlens integrally formed with the light emitting element on a front surface of the light emitting element, for condensing and emitting the light emitted from the light emitting element, and the light emitting element. A method of manufacturing a light emitting device, comprising: a light-transmitting film for adjusting a focusing position by the microlens, the device being interposed between the device and the microlens, wherein the light emitting device is formed. The transparent film is formed on the substrate, the resist material layer is patterned on the transparent film at a position corresponding to the light emitting element, and the surface shape of the resist material layer is curved by heat treatment. A method of manufacturing a light emitting device, comprising forming a microlens. 6. A light emitting element for emitting light, a microlens integrally formed with the light emitting element on the front surface of the light emitting element, for condensing and emitting the light emitted from the light emitting element, and the light emitting element. A method of manufacturing a light emitting device, comprising: a light-transmitting film for adjusting a focusing position by the microlens, the device being interposed between the device and the microlens, wherein the light emitting device is formed. The translucent film is formed on the substrate, and a photocurable translucent material layer is patterned on the translucent film at a position corresponding to the light emitting element, and the translucent material is subjected to heat treatment. A light-emitting element characterized in that a surface shape of a layer is curved, and the light-transmitting material layer having the curved surface shape is irradiated with predetermined light to cure the light-transmitting material layer to form a microlens. Device manufacturing method.