JPH09190648A - Optical recording medium and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce an optical recording medium having excellent recording and reproducing characteristics at a high yield and a low cost. SOLUTION: This recording medium has a hard coating layer 32, at least a dielectric layer 33, a recording layer 34 and a protective layer 35 on the groove surface side of the substrate. At this time, the substrate 31 is introduced into a vacuum chamber 3 right after the substrate is molded by an injection molding method where the hard coating layer 32 is formed on the substrate surface by using a plasma CVD method. The respective layers on the groove surface side of the substrate are formed.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an optical recording medium and a method for manufacturing the same. In particular, it relates to a magneto-optical recording medium having a hard coat layer formed on the surface of a substrate, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, a large-capacity and high-speed recording medium has been required as a computer memory or an image information memory. As a recording medium that meets these demands, an optical disk (optical recording medium) for recording / reproducing using laser light has been actively developed. Among them, particularly promising are magneto-optical recording media and phase-change type optical recording media.

FIG. 3 shows a sectional view of a typical film structure of these optical recording media. The structure of the recording medium is generally a hard coat layer (32) / substrate (31) / underlayer protective layer (underlayer dielectric layer (33)) / recording layer (34) / upper layer protective layer (upper layer dielectric). Body layer (35) / reflection layer (36) / overcoat layer (37) or hard coat layer / substrate / underlayer protective layer (underlayer dielectric layer) / recording layer / upper layer protective layer (upper layer dielectric layer) ) / Overcoat layer. Here, the reflective layer and the overcoat layer are provided as needed.

The magneto-optical recording medium utilizes a property (magnetic Kerr effect) in which polarized laser light is applied to the surface of a magnetic material and the direction of rotation of the polarization plane of the reflected laser light is different depending on the direction of its magnetization. Information is recorded / reproduced by using this method, and the larger the Kerr rotation angle, the larger the C / N ratio can be obtained. In order to increase the Kerr rotation angle (enhancement effect) by an optical interference effect, a transparent dielectric layer (underlying dielectric layer () is generally provided between the magnetic recording layer (34) and the substrate (31). 33)) is added.

On the other hand, the phase change type optical recording medium is erased by irradiating a recording thin film with a laser beam, heating and rapid cooling to make the thin film in an amorphous state for recording, and further heating and slow cooling with a laser beam. And recording / reproducing information. Also in this phase change recording medium, in order to have an optical enhancing effect, a dielectric layer (underlying dielectric layer (33)) is provided between the substrate (31) and the recording layer (34).
Is provided.

[0006] Such a dielectric layer also has a role as a protective film for protecting the recording layer (34) in addition to the enhancing effect due to the interference effect. Generally, the dielectric layer should sandwich the recording layer (34). Provided on the base (upper / upper protective layer (33,
35)). Further, in many cases, a metal reflective layer (36) is added to the uppermost layer in order to further enhance the interference effect.

Further, since these optical recording media are required to have data storage performance for a long period of time, an overcoat layer (37) made of resin is generally formed on the uppermost layer by spin coating or the like.

Further, in order to prevent the recorded data from becoming unreadable or unwritable due to scratches on the substrate surface at the time of operation during use, the substrate surface is coated with a hard coat made of resin by spin coating or the like. Layer (32)
Are formed.

In the conventional manufacturing process of an optical recording medium, in order to prevent a pinhole defect in a film-formed product, after the substrate is molded, the substrate is washed with a deionized water cleaning device and then a clean dryer or a substrate degassing device is used. After sufficiently drying and degassing, the film was introduced into a vacuum film forming apparatus, and each layer such as the dielectric layer and the recording layer was formed by sputtering or the like. After these films are formed, a resin coater is applied on the substrate surface with a spin coater and cured with ultraviolet rays to form a hard coat layer, and an overcoat agent is applied on the groove side of the substrate and cured with ultraviolet rays to cure the resin. A process such as forming a coat layer has been taken.

[0010]

However, the conventional manufacturing process of the optical recording medium has the following problems.

In the conventional method of manufacturing an optical recording medium,
Once the injection-molded substrate is stored in the stocker and thoroughly washed with a deionized water cleaner, put it in a clean dryer etc. to fully dry the substrate, then put it in a vacuum film-forming machine and perform dielectric treatment by sputtering etc. The respective layers such as the body layer and the recording layer have been formed. Therefore, a costly device such as a substrate stocker, a deionized water cleaner, and a clean dryer is required, resulting in a considerable manufacturing cost.

In the conventional manufacturing process of an optical recording medium, after forming each layer such as a dielectric layer and a recording layer on the groove surface side of a molded substrate, a hard coat agent is applied to the substrate surface side by a spin coater. Then, it was cured with ultraviolet rays to form a hard coat layer. However, in this process, many handling steps are performed before the hard coat layer is formed, and there are many steps, so the substrate is often contaminated, and as a result, a spot defect occurs on the substrate surface and the yield is extremely deteriorated. I was letting it.

In order to improve this, it has been devised to carry out the film forming process of the hard coat layer before the film forming process of each layer such as the dielectric layer and the recording layer (JP-A-6-96482).
However, in this method, since the substrate is left in the atmosphere until the spin coating is completed until the spin coating is completed, the substrate absorbs water, which requires degassing for several hours after the spin coating is completed. This degassing process is clean N
_It was necessary to carry out with a _two- atmosphere dryer or a vacuum deaeration device, and the device required a fairly expensive one and the cost was high. Further, since deaeration takes time, the number of substrates to be accommodated increases, the apparatus becomes large, and the space of the clean room is considerably required.

Therefore, in order to reduce the number of these devices and the number of steps, it has been attempted to introduce the substrate into the vacuum chamber immediately after forming the substrate to form a film. However, even if an attempt is made to form the hard coat layer on the surface of the substrate by sputtering or the like, it takes a long time because the sputtering rate is slow, and the processing ability is low. Also, in order to give this film hardness, 300
Although a film thickness of about 1000 nm is required, stress may be applied too much at this film thickness and the film may be cracked. Therefore, it was not practical to introduce the substrate into the vacuum chamber immediately after forming the substrate and form the hard coat layer by sputtering or the like.

Therefore, an object of the present invention is to solve the above problems, to form a good hard coat layer on the surface of a substrate with few defects such as spots and cracks, and to have a high yield and a high manufacturing cost. To provide a method for producing an optical recording medium having a low optical density, and an optical recording medium produced by this method and having excellent recording and reproducing characteristics.

[0016]

[Means for Solving the Problems] The present inventors have completed the present invention as a result of various studies in order to achieve the above object.

The first invention is an optical recording medium having a hard coat layer on the substrate surface side and at least a dielectric layer, a recording layer and a protective layer on the substrate groove surface side, wherein the hard coat layer is a plasma CVD method. The present invention relates to an optical recording medium characterized by being formed by

The second invention relates to the optical recording medium of the first invention, wherein the substrate surface temperature when the hard coat layer is formed on the substrate by the plasma CVD method is 120 ° C. or lower.

The third invention relates to the optical recording medium of the first or second invention, wherein the substrate is made of a polymer resin material.

A fourth invention relates to the optical recording medium of the first or second invention, wherein the substrate is made of a polymer resin material selected from polycarbonate, polyolefin and polymethylmethacrylate.

A fifth aspect of the present invention is a method for manufacturing an optical recording medium having a hard coat layer on the substrate surface side and at least a dielectric layer, a recording layer and a protective layer on the substrate groove surface side. An optical recording medium characterized by being immediately introduced into an atmospheric vacuum displacement chamber after being molded by (1), forming the hard coat layer on the surface of the substrate by a plasma CVD method, and then forming each layer on the groove side of the substrate. Manufacturing method.

The sixth invention relates to the method for producing an optical recording medium of the fifth invention, wherein the substrate surface temperature when the hard coat layer is formed on the substrate by the plasma CVD method is 120 ° C. or lower.

The seventh invention is the production of the optical recording medium of the fifth or sixth invention, wherein the time from the molding of the substrate by the injection molding method to the introduction of the substrate into the atmospheric vacuum displacement chamber is within 3 minutes. Regarding the method.

An eighth invention relates to a method of manufacturing the optical recording medium of the fifth, sixth or seventh invention, wherein the substrate is made of a polymer resin material.

The ninth invention relates to a method for manufacturing the optical recording medium of the fifth, sixth or seventh invention, wherein a polymer resin material selected from polycarbonate, polyolefin and polymethylmethacrylate is used as the material of the substrate.

The tenth invention relates to an optical recording medium manufactured by the method of any one of the fifth to ninth inventions.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.

FIG. 1 shows a schematic view of a microwave plasma CVD apparatus used in the present invention.

1 is a substrate holder for setting a substrate,
Reference numeral 2 is a plasma chamber for generating plasma, 3 is a film forming chamber, 4 is an annular microwave waveguide, 5 is a microwave power source, 6 is a slot tube, 7 is a first gas introduction means, and 8 is a second gas introduction. Means, 9 is a conductance valve, 10
Is a turbo molecular pump.

FIG. 1 shows the one in which the annular microwave waveguide (4) is used as the plasma generating means, but any other device configuration can be applied as long as it is a means capable of generating a plasma which can be isolated from the substrate and has a small amount of ion incidence. Is. For example, a microwave coupling means such as a direct connection type, a rectangular waveguide, an applicator, a rigidano coil or a helical antenna, a high frequency introducing means such as a cylindrical magnetron electrode or a magnetic field helical coil can be applied.

Next, the manufacturing process of the present invention will be described with reference to FIGS.

First, the substrate is molded by the molding machine (21), and the molded substrate is conveyed within the shortest possible time, preferably within 3 minutes, and the substrate transfer path (22) and the gate valve (23).
It is introduced into the atmospheric vacuum displacement chamber (24) through the location.

Next, the vacuum process chamber (2
5), the substrate is sent to the film forming chamber (3) of the microwave plasma CVD apparatus (26) to form a hard coat layer on the surface of the substrate. A second gas (for example, SiH ₄ gas) is introduced into the film forming chamber (3) by the second gas introducing means (8), and at the same time, the first gas for plasma generation is introduced into the plasma chamber (2). Gas (eg Ar gas, N ₂ gas)
Is introduced by the first gas introduction means (7).

Then, the conductance valve (9) provided in the exhaust system is adjusted to adjust the inside of the plasma chamber (2) and the film forming chamber (3) to about 10 mTorr. Electric power of about 2 to 3 KW is supplied to the microwave waveguide (4) from the microwave power source. Microwave energy is introduced into the film forming chamber (3) from the slit of the microwave waveguide to generate high-density plasma in the plasma chamber (2) to excite and decompose the first gas,
The second gas (for example, SiH ₄ gas) introduced into the film forming chamber (3) and introduced into the film forming chamber is efficiently decomposed and reacted. Thereby, the hard coat layer is formed on the substrate surface side disposed in the film forming chamber (3) by the vapor phase reaction and the reaction on the substrate surface.

Thereafter, the substrate is continuously sent to the sputter chamber (27) without breaking the vacuum, and the underlayer protective layer (underlayer dielectric layer), the recording layer and the overlayer are formed on the substrate groove surface side by the sputter gun (28). A protective layer and, if necessary, a reflective layer and an overcoat layer are sequentially formed.

After the above steps are completed, the substrate is taken out from the substrate take-out position (29) into the atmosphere and sent to the next step.

Next, the structure of the optical recording medium of the present invention will be described with reference to FIG.

The structure of the optical recording medium of the present invention can be the same as that of the above-mentioned conventional optical recording medium. Generally, a hard coat layer (32) / substrate (31) / underlayer protective layer (underlayer dielectric layer (33)) / recording layer (34) / upper protective layer (upper dielectric layer (35)) / Reflective layer (36) / Overcoat layer (37) or Hard coat layer / Substrate /
The constitution of the underlayer protective layer (underlayer dielectric layer) / recording layer / upper layer protective layer (upper layer dielectric layer) / overcoat layer is selected.
Here, the reflective layer and the overcoat layer are provided as needed. The recording layer may have a multi-layer structure including, for example, a recording magnetic layer and a writing magnetic layer.

The substrate (31) of the optical recording medium of the present invention is preferably made of a polymer resin material. Specific examples include polycarbonate, polyolefin, and polymethylmethacrylate.

In order to avoid deformation of the substrate due to temperature rise during film formation, the temperature is preferably 150 ° C. or lower, more preferably 120 ° C.
The film is formed within the range of ℃ or less.

A preferred hard coat layer (3
The material of 2) is Si ₃ N ₄ , SiC, SiO, Si
Examples include O _{2 and the} like.

As the gas for forming the deposited film, the above Si is used.
In the case of forming the system hard coat layer, as the Si-containing second gas (raw material gas), inorganic silanes such as SiH ₄ and SiH ₆ , tetraethylsilane (TES), totramethylsilane (TMS), dimethylsilane ( DMS), tetraethoxysilane (TEOS), tetramethoxysilane (TMOS) and other organic silanes, SiF ₄ , Si ₂ F 6,
SiHF ₃ , SiH ₂ F ₂ , SiCl ₄ , Si ₂ Cl ₆ , Si
HCl ₃ , SiH ₂ Cl ₂ , SiH ₃ Cl, SiCl ₂ F ₂
Examples thereof include those that are in a gas state at room temperature and atmospheric pressure or that are easily gasified, such as halosilanes.

Further, in this case, the first gas (reaction gas)
_{The, N 2, NH 3, N} 2 H 4, hexamethyldisilazane _{(HMDS), O 2, O} 3, H 2 O, NO, N 2 O, NO
₂ , C ₂ H ₂ , CO, CO _{2 and the} like.

[0044]

EXAMPLES The present invention will be further described below with reference to examples, but the present invention is not limited thereto.

Example 1 Using the microwave plasma CVD apparatus shown in FIG. 1, a magneto-optical recording medium having a hard coat layer made of SiC formed on the surface of a substrate was produced. In addition, microwave plasma CVD
The device consists of an annular microwave waveguide (4) as shown in FIG.
An annular wave waveguide microwave CVD apparatus equipped with was used.

As the substrate, a substrate having a diameter of 86 mm and a plate thickness of 1.2 mm with a pre-groove was prepared by injection molding using a polycarbonate resin. Ubilon H4000 manufactured by Mitsubishi Gas Chemical Co., Ltd. was used as the polycarbonate resin, and DISK5M3 molding machine manufactured by Sumitomo Heavy Industries was used as the injection molding machine.

Within 3 minutes after molding, the substrate was sent to the atmospheric vacuum displacement chamber and introduced into the vacuum process chamber.

The substrate introduced into the vacuum process chamber is transferred into the film forming chamber (3) of the microwave plasma CVD apparatus, and the substrate surface is covered with SiC having a thickness of 300 nm.
A film (hard coat layer) was formed.

Then, the vacuum was sent to the sputtering chamber without breaking the vacuum, and a base dielectric layer having a thickness of 88 nm, a reproducing magnetic layer (GdFeCo) having a thickness of 10 nm, and a thickness of 20 nm were formed on the substrate groove surface side by a magnetron sputtering method. A magnetic recording layer (TbFeCo) is sequentially formed, and an upper dielectric layer having a thickness of 30 nm is further formed thereon, and finally a thickness of 6 is formed.
A 0 nm reflective layer (Al film) was continuously formed without breaking the vacuum.

The conditions for forming the hard coat layer are as follows. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the magneto-optical recording medium obtained as described above. The stress of the hard coat layer is the value in the compressive stress state, the film thickness distribution is the change rate within the effective area radius (R24 to R40 mm), and the peeling number is the peeling number (at 25 points) in the 5 mm square crosshatch test. is there.

Example 2 Using the microwave plasma CVD apparatus shown in FIG. 1, a magneto-optical recording medium having a hard coat layer made of Si ₃ N ₄ formed on the surface of a substrate was produced. In addition, microwave plasma CV
As the apparatus D, an annular waveguide microwave CVD apparatus provided with an annular microwave waveguide (4) as shown in FIG. 1 was used.

A polycarbonate resin was used as a substrate, and a substrate with a pregroove having a diameter of 86 mm and a plate thickness of 1.2 mm was prepared by an injection molding method. Ubilon H4000 manufactured by Mitsubishi Gas Chemical Co., Ltd. was used as the polycarbonate resin, and DISK5M3 molding machine manufactured by Sumitomo Heavy Industries was used as the injection molding machine.

Within 3 minutes after molding, the substrate was sent to the atmospheric vacuum displacement chamber and introduced into the vacuum process chamber.

[0054] substrate that is put into the vacuum process chamber, and transferred to a deposition chamber (3) of the microwave plasma CVD apparatus, Si ₃ having a thickness of 300nm on the substrate surface
An N ₄ film (hard coat layer) was formed.

Subsequently, the vacuum was sent to the sputtering chamber without breaking the vacuum, and a base dielectric layer having a thickness of 75 nm, a reproducing magnetic layer (GdFeCo) having a thickness of 10 nm, and a thickness of 20 nm were formed on the substrate groove surface side by a magnetron sputtering method. A magnetic recording layer (TbFeCo) is sequentially formed, and an upper dielectric layer having a thickness of 30 nm is further formed thereon, and finally a thickness of 6 is formed.
A 0 nm reflective layer (Al film) was continuously formed without breaking the vacuum.

The conditions for forming the hard coat layer are as follows. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the magneto-optical recording medium obtained as described above.

Example 3 Using the microwave plasma CVD apparatus shown in FIG. 1, a magneto-optical recording medium having a hard coat layer made of SiO ₂ formed on the surface of a substrate was produced. As the microwave plasma CVD apparatus, an annular waveguide microwave CVD apparatus using an annular microwave waveguide (4) as shown in FIG. 1 was used.

As the substrate, a substrate having a diameter of 130 mm and a plate thickness of 1.2 mm with a pregroove was prepared by injection molding using a polycarbonate resin. Ubilon H4000 manufactured by Mitsubishi Gas Chemical Co., Ltd. was used as the polycarbonate resin, and DISK5M3 molding machine manufactured by Sumitomo Heavy Industries was used as the injection molding machine.

Within 3 minutes after molding, the substrate was sent to the atmospheric vacuum displacement chamber and introduced into the vacuum process chamber.

The substrate introduced into the vacuum process chamber is transferred into the film forming chamber (3) of the microwave plasma CVD apparatus, and SiO 2 having a thickness of 300 nm is formed on the surface of the substrate.
_Two films were formed.

Then, the vacuum is sent to the sputtering chamber without breaking the vacuum, and a base dielectric layer having a thickness of 110 nm and a thickness of 20 are formed on the substrate groove surface side by a magnetron sputtering method.
nm recording magnetic layer (TbFeCo) is formed, and a 30 nm thick top dielectric layer is further formed thereon, and finally a reflection layer (Al film) having a thickness of 60 nm is continuously formed without breaking the vacuum. Formed.

The film forming conditions for the hard coat layer are as follows. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the magneto-optical recording medium obtained as described above.

Example 4 Using the microwave plasma CVD apparatus shown in FIG. 1, a phase change type optical recording medium in which a hard coat layer made of SiC was formed on the surface of a substrate and an Sb-Te based film was formed as a recording layer was prepared. did. As the microwave plasma CVD apparatus, an annular waveguide microwave CVD apparatus including an annular microwave waveguide (4) as shown in FIG. 1 was used.

A polycarbonate resin was used as the substrate, and a substrate having a diameter of 86 mm and a plate thickness of 1.2 mm with a pregroove was prepared by an injection molding method. Ubilon H4000 manufactured by Mitsubishi Gas Chemical Co., Ltd. was used as the polycarbonate resin, and DISK5M3 molding machine manufactured by Sumitomo Heavy Industries was used as the injection molding machine.

Within 3 minutes after molding, the substrate was sent to the atmospheric vacuum displacement chamber and introduced into the vacuum process chamber.

The substrate introduced into the vacuum process chamber is transferred into the film forming chamber (3) of the microwave plasma CVD apparatus, and a 300 nm thick SiC film is formed on the surface of the substrate.
A film (hard coat layer) was formed.

Then, the vacuum is sent to the sputtering chamber without breaking the vacuum, and a base dielectric layer having a thickness of 88 nm and a thickness of 20 n are formed on the substrate groove surface side by a magnetron sputtering method.
m recording layers (Sb-Te based films) were sequentially formed. Further, an upper dielectric layer having a thickness of 30 nm was formed thereon, and finally, a reflecting layer (Al film) having a thickness of 60 nm was continuously formed without breaking vacuum.

The conditions for forming the hard coat layer are as follows. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the phase-change optical recording medium obtained as described above.

Comparative Example 1 By the DC sputtering method using a single-wafer sputtering apparatus, S
A magneto-optical recording medium having a hard coat layer made of i ₃ N ₄ was prepared.

A substrate having a diameter of 86 mm and a plate thickness of 1.2 mm with a pre-groove was prepared by injection molding using a polycarbonate resin. Ubilon H4000 manufactured by Mitsubishi Gas Chemical Co., Ltd. was used as the polycarbonate resin, and DISK5M3 molding machine manufactured by Sumitomo Heavy Industries was used as the injection molding machine.

The substrate was introduced into the vacuum process chamber within 3 minutes after molding, and a dielectric protective layer was formed on the surface of the substrate by reactive sputtering using a Si target and N ₂ gas.
It was formed with a thickness of 0 nm.

On the opposite side of the substrate group surface, Si
A dielectric protective layer having a thickness of 85 nm is formed by a reactive sputtering method using a target and N ₂ gas, and a reproducing magnetic layer (GdF) having a thickness of 10 nm is formed by a magnetron sputtering method.
eCo) and recording magnetic layer (TbFeC) with a thickness of 20 nm
o), a 30 nm thick top dielectric layer is further formed thereon by the above reactive sputtering method, and finally, a reflection layer (Al layer having a thickness of 60 nm is formed by the magnetron sputtering method).
The film was continuously formed without breaking the vacuum.

The film forming conditions for the hard coat layer are as follows. The characteristics of the hard coat layer obtained as described above are shown in Table 1.
Shown in Further, it was attempted to measure the recording / reproducing characteristics of this magneto-optical recording medium, but the focus was not applied and the signal characteristics (saturation C / N ratio) could not be evaluated.

Comparative Example 2 A magneto-optical recording medium was manufactured in the same manner as in Example 1 except that the introduction time into the atmospheric vacuum displacement chamber after the molding of the substrate was changed to 4 minutes. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the obtained magneto-optical recording medium.

Comparative Example 3 A magneto-optical recording medium was manufactured in the same manner as in Example 1 except that the introduction time into the atmospheric vacuum displacement chamber after the molding of the substrate was changed to 6 minutes. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the obtained magneto-optical recording medium.

Comparative Example 4 A magneto-optical recording medium was manufactured in the same manner as in Example 1 except that the temperature at the time of film formation on the substrate was changed to 121 ° C. Table 1 shows the characteristics of the hard coat layer and the recording / reproducing characteristics of the obtained magneto-optical recording medium.

[0077]

[Table 1]

[0078]

As is clear from the above description, in the method of the present invention, the hard coat layer is formed by using the plasma CVD method. Therefore, a film having a small film stress can be formed at a relatively low temperature and at a high speed. Therefore, even if the substrate is introduced into the vacuum chamber immediately after forming the substrate, the hard coat layer having good film characteristics can be formed.

As a result, an optical recording medium having excellent recording / reproducing characteristics can be manufactured.

Furthermore, since a high-cost device such as a substrate stocker, a pure water cleaning device, a dryer in a clean N ₂ atmosphere, or a vacuum degassing device is not required and the number of steps is reduced, the manufacturing cost of the optical recording medium is reduced. Can be significantly reduced.

In addition, since the hard coat layer can be formed before forming the dielectric layer, the recording layer, etc., the substrate surface is not contaminated, and the spot defects on the substrate surface are reduced. However, it has become possible to improve the yield extremely.

[Brief description of the drawings]

FIG. 1 is a schematic view of a microwave plasma CVD apparatus used in the present invention.

FIG. 2 is an explanatory diagram of a manufacturing process of the optical recording medium of the present invention.

FIG. 3 is a cross-sectional view showing a typical film configuration of a conventional optical recording medium and an optical recording medium of the present invention.

[Explanation of symbols]

 1 substrate holder 2 plasma chamber 3 film forming chamber 4 annular microwave waveguide 5 microwave power source 6 slot tube 7 first gas introducing means 8 second gas introducing means 9 conductance valve 10 turbo molecular pump 21 molding machine 22 substrate transfer Route 23 Gate valve 24 Atmospheric vacuum displacement chamber 25 Vacuum process chamber 26 Microwave plasma CVD device 27 Sputter chamber 28 Sputter gun 29 Substrate removal position 31 Substrate 32 Hard coat layer 33 Underlayer protective layer (underlayer dielectric layer) 34 Recording layer 35 Ground protection layer (upper dielectric layer) 36 Reflective layer 37 Overcoat layer

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location G11B 5/84 7303-5D G11B 5/84 5/85 7303-5D 5/85 C 7/26 531 7303-5D 7/26 531

Claims (10)

[Claims] 1. An optical recording medium having a hard coat layer on the substrate surface side and at least a dielectric layer, a recording layer and a protective layer on the substrate groove surface side, wherein the hard coat layer is formed by a plasma CVD method. An optical recording medium characterized by being a thing. 2. The optical recording medium according to claim 1, wherein the substrate surface temperature when the hard coat layer is formed on the substrate by the plasma CVD method is 120 ° C. or lower. 3. The substrate according to claim 1, which is made of a polymer resin material.
Or the optical recording medium of 2. 4. The optical recording medium according to claim 1, wherein the substrate is made of a polymer resin material selected from polycarbonate, polyolefin and polymethylmethacrylate. 5. A method of manufacturing an optical recording medium having a hard coat layer on the surface side of a substrate and having at least a dielectric layer, a recording layer and a protective layer on the groove side of the substrate, after molding the substrate by injection molding. A method for manufacturing an optical recording medium, which comprises immediately introducing the film into an atmospheric vacuum displacement chamber, forming the hard coat layer on the surface of the substrate by a plasma CVD method, and then forming each layer on the groove side of the substrate. 6. The method for producing an optical recording medium according to claim 5, wherein the substrate surface temperature when the hard coat layer is formed on the substrate by the plasma CVD method is 120 ° C. or lower. 7. The method for producing an optical recording medium according to claim 5, wherein the time from the molding of the substrate by the injection molding method to the introduction of the substrate into the atmospheric vacuum displacement chamber is within 3 minutes. 8. The method for manufacturing an optical recording medium according to claim 5, 6 or 7, wherein the substrate is made of a polymer resin material. 9. The substrate material is polycarbonate,
The method for producing an optical recording medium according to claim 5, 6 or 7, wherein a polymer resin material selected from polyolefin and polymethylmethacrylate is used. 10. An optical recording medium manufactured by the method according to claim 5.