JPH09186451A - Method for collecting process data for soldering system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To specify the cause of soldering quality of a wiring board immediately by an arrangement for determining the soldering process of individual wiring board in the future. SOLUTION: A system for soldering a wiring board 1 while conveying on a conveyor 2 comprises a rotary encoder 21 outputting a signal proportional to the carrying distance of wiring board 1, and sensors for detecting data of flux coating process, preheating process, soldering process and cooling process of wiring board 1. While specifying the carrying position of wiring board 1 based on the output signals from these sensors, process data at each position is collected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, when soldering a work to be soldered such as a wiring board on which electronic parts are mounted, collects and utilizes the state of the soldering process individually for each wiring board. The present invention relates to a method of collecting process data in a soldering device for enabling the above.

[0002]

2. Description of the Related Art In a conventional soldering device, a flux applying device, a preheating device, a solder bath device, a cooling device, etc. are individually controlled and controlled, and each device individually maintains an appropriate process state. In this way, each process state is adjusted and set for each type of wiring board. For example,
It is the flux specific gravity of the flux coating device, the heater temperature of the preheating device, the molten solder temperature of the solder bath device, and the like.

That is, if each process constituted by these devices is managed and controlled in an appropriate state,
This is a technical idea based on a macroscopic viewpoint that a wiring board that is soldered through each of these processes is also appropriately soldered.

FIG. 12 is a block diagram showing an example of a conventional flow type soldering apparatus, and shows each part in a block diagram.

That is, a conveyor 2 which is a conveyor.
The wiring board 1 conveyed in the direction of the arrow A at the conveyance elevation angle θ is applied with the flux 4 on the soldering surface by the flux applying device 3, preheated by the preheating device 5, and then by the solder bath device 6. After being soldered and cooled by the cooling device 7, a series of soldering processes including a flux applying process, a preheating process, a soldering process and a cooling process are completed.

The flux coating device 3 holds the liquid amount, the specific gravity, and the liquid temperature of the flux 4 at predetermined values which are set in advance by the technique disclosed in Japanese Utility Model Laid-Open No. 56-100274, for example. . In addition, Japanese Unexamined Patent Publication
The foaming height can be maintained at a predetermined height by the technique disclosed in JP-A-2-168670. The flux management device 8 is also a control device that manages these.

Further, in the preheating device 5, for example, the preheating management device 9 having an automatic temperature control device holds the surface temperature at a predetermined value determined by a temperature sensor provided on the heater surface.

Further, in the solder bath device 6, the temperature of the molten solder 10 is maintained at a predetermined temperature determined by an automatic temperature controller. Also, JP-A-63-2209
The height of the first jet wave 12A and the height of the second jet wave 12B are held at predetermined values by the technique of Japanese Patent No. 73 and the technique of Japanese Patent Laid-Open No. 7-131143. The solder bath management device 11 is a device that controls and manages these.

That is, all of these techniques are configured to maintain the process state at a predetermined target value by feedback control.

Next, the cooling device 7 is constituted by, for example, a blower fan, and the flow rate of the blown air is controlled by the cooling management device 13.
It is configured to be controlled and managed by. That is, the cooling capacity can be adjusted and set.

The transfer conveyor 2 is constructed so that the transfer speed v _p can be adjusted by the rotation speed of the drive motor 14. The rotation speed of the drive motor 14 is adjusted by the transfer management device 1.
5 is configured to be controlled and managed.

Further, the molten solder 10 of the solder bath device 6
In an area where the wiring board 1 and the wiring board 1 contact each other, an inert gas such as N ₂ gas is supplied, and soldering may be performed in an atmosphere of low oxygen concentration. In this case, the oxygen concentration is measured by an oxygen concentration measuring device 16 equipped with a detection sensor for detecting the oxygen concentration in the region, and the inert gas supply flow rate is adjusted so that the oxygen concentration is maintained at a predetermined value. This device is the oxygen concentration management device 17. This technique is disclosed in, for example, Japanese Patent Laid-Open No. 3-101296. That is, it is an application of feedback control.

Each of the management devices is connected to the integrated management device 18 by a communication bus, and the target value of the process state is transmitted from the integrated management device 18 to each management device by mutual communication, or vice versa. The current process status is transmitted as data to the integrated management device 18. Further, the integrated management device 18 can also request the data of the current process state (hereinafter, simply referred to as process data) from each management device.

That is, each management device including the integrated management device 18 is composed of a microcomputer system, and communicates from its communication port via a communication bus. (Communication signal S _COM-F with the flux management device 8, communication signal S _COM-P with the preheating management device 9, communication signal S _COM-H with the solder bath management device 11, communication signal with the cooling management device 13 S _COM-C , communication signal S with transport management device 15
_COM-M , communication signal S _COM-O with oxygen concentration management device 17) The integrated management device 18 is provided with an operation unit 19 for giving instructions and a display unit 20 for displaying data and the like. There is.

Next, an example of a control procedure for the integrated management device 18 to communicate with each management device to change the indicated value and display the process data will be described. In addition, the integrated management device 1
Since each management device including 8 is composed of a microcomputer system, its control procedure can be realized by software.

FIGS. 13 (a) and 13 (b) show an integrated management device 1
13 is a flow chart showing the control procedure of FIG. 8, in which FIG.
(B) shows a setting change subroutine when the instruction value of the integrated management device 18 is changed. In addition, (1)-
(9), (11), and (12) show each step.

That is, in step (1), it is judged whether or not the instruction input of the total control device 18 of FIG. 12 is changed,
If changed, go to step (2), and then proceed to FIG.
The procedure moves to step (11) of the subroutine 3 (b). Then, in step (11), the reset instruction value is input, and in step (12), the reset instruction value is transmitted / notified to the relevant management device. Then, the process proceeds to step (3) of the main routine. Even if the instruction input has not been changed in step (1), the process proceeds to step (3).

In step (3), the flux control device 8 is requested to transmit the specific gravity of the flux 4, the liquid temperature, and the spray flow rate.

Then, in step (4), the surface temperature of the heater of the preheating device 5 is requested to the preheating management device 9,
In step (5), the liquid temperature of the molten solder 10 in the solder bath device 6 is requested to the solder bath management device 11, and step (6)
In step (7), the cooling management device 13 is requested to set the cooling capacity of the cooling device 7. In step (7), the transfer management device 15 is requested to transfer speed v _p of the transfer conveyor 2. In step (8), the oxygen concentration management device is requested. 17 demands oxygen concentration S _O.

Then, in step (9), the instantaneous value of each process data obtained in steps (3) to (8) is displayed at any time. After that, the procedure returns to step (1) and the above procedure is repeated.

[0021]

A conventional method of managing process data in a soldering apparatus or a method of collecting the same is to collect data indicating the state of each process held at a predetermined value as a instantaneous value. It is something to display.

On the other hand, although being feedback-controlled, each of these process states constantly fluctuates and fluctuates when viewed microscopically. Therefore, the soldering quality of the wiring board 1 to be soldered through these series of processes is affected by the fluctuation of these process states, and exhibits a distribution having a statistical spread.

However, in the conventional process data collection method, since each process state is treated as being held in a predetermined state, which wiring substrate 1 is used for each specific soldered wiring substrate 1. It is not possible to trace and analyze whether the soldering has been performed through such process conditions.

Further, as disclosed in Japanese Patent Laid-Open No. 7-142852, there is a technique for determining the quality by measuring the substrate temperature with a sensor immediately before and immediately after soldering, but each individual wiring substrate is specified. However, it was not possible to know what kind of series of continuous process conditions soldering took place.

An object of the present invention is to make it possible to determine, for each individual wiring board, which soldering process state the wiring board has been soldered to at a later date, so that the soldering quality is impaired. It is to be able to identify the cause immediately when it occurs. And, it is to make it possible to stably manufacture a high-quality wiring board.

[0026]

A method of collecting process data in a soldering apparatus according to the present invention is provided with a means for specifying a carrying position of a work to be soldered, and the carrying position of the work to be soldered is determined. The feature is that the process data at the position can be collected at any time while specifying.

[0027]

The invention according to claim 1 of the present invention makes it possible to collect the process state (process data) while tracking the transfer position of the workpiece to be soldered, that is, the processing process. It becomes possible to obtain a minute soldering process history peculiar to the soldering work.

The invention according to claim 2 of the present invention collects the process state (process data) while individually specifying each of a large number of works to be soldered, and is unique to the works to be soldered. It is possible to obtain a fine soldering process history. And by recording this in the file device, even if there is a problem in the soldering quality of a certain work to be soldered,
The process data of the work to be soldered can be read from the file device and the cause of the problem can be easily analyzed.

[0029]

EXAMPLES Next, examples will be used to explain how the method for collecting process data in the soldering apparatus of the present invention can be practically embodied.

(1) Overall Structure FIG. 1 is a block diagram showing an embodiment of the present invention. The structure of a flow type soldering device is illustrated with a focus on the device arranged along the transfer path of the transfer conveyor. 10, the same reference numerals as those in FIG. 10 indicate the same parts.

The soldering apparatus of this embodiment is different from the conventional soldering apparatus shown in FIG. 10 in that it is equipped with a rotary encoder 21 for measuring the transport distance of the transport conveyor 2 and is proportional to the transport distance. In addition to being configured to output a carrier pulse signal (for example, a signal having a resolution of a carrier distance of about 0.5 mm per pulse) S _E , the following configuration is provided. is there.

That is, an elevation angle sensor 22 for detecting the conveyance elevation angle θ of the conveyer 2, an entrance sensor 23 for detecting the entrance of the wiring board 1, and a marking device for printing the manufacturing date and the manufacturing number on the wiring board 1 ( Inkjet printer or laser marker) 24, radiation thermometer 25 equipped with a sensor for measuring the temperature of the wiring board 1 that has entered, radiation thermometer 26 equipped with a sensor for measuring the preheating temperature of the wiring board 1, wiring A radiation thermometer 27 equipped with a sensor for measuring the cooling temperature of the board 1, and an air temperature measuring sensor 2 for measuring the air temperature of the place where the soldering device is installed.
8. Humidity measuring sensor 29 for measuring humidity, and data management device 3 for collecting, storing and reading data
The process data management device 32 includes 0 and a file device 31.

The data management device 30 comprises a microcomputer system, and the file device 31 comprises a storage / reading device such as a magnetic disk device or a magnetic tape device. The data management device 30 includes an operation unit 33 for giving commands and data entry, a display unit 34 for displaying data, and a calendar for counting date and time.
A communication unit 36 for communicating with the clock unit 35 and the LAN 37 is provided.

The data management device 30 includes a conveyor 2
The carrier pulse signal S _E from the rotary encoder 21 is input, and the data management device 30 and each management device 8,
9, 11, 13, 15 are connected to the communication bus to input the process data obtained from the respective management devices, and the elevation angle data signal θ _S of the elevation angle sensor 22, the approach signal S _I of the approach sensor 23, and the radiation temperatures. Temperature data signals S _T1 , S _T2 , S _{T3 of} total 25, 26, 27, temperature data signal S _TA of air temperature measuring sensor 28, humidity data signal S _TS of humidity measuring sensor 29.
Each of the data is input and the marking command signal S _M is output to the marking device 24. It should be noted that the file device 31 is connected to the bus via a storage / readout communication signal S _BF to perform communication for storage / readout.

By the way, when an identification marking such as a bar code is provided on the wiring board 1 in advance, a reading device (not shown) is provided in place of the marking device 24.
The bar code code S _B is read and used as the production number. It should be noted that the transport coordinates Y ₀ ~ displayed in the upper part of FIG.
In Y ₇ , the position of the approach sensor 23 is the origin Y ₀ and the position of the marking device 24 or the reading device (not shown) is Y.
_1. Radiation thermometer 2 that measures the temperature of the wiring board 1
The position of 5 is Y ₂ , the position of the flux coating device 3 is Y ₃ ,
The position of the radiation thermometer 26 for measuring the preheating temperature of the wiring board 1 is Y ₄ , the position of the first jet wave 12A of the solder bath device 6 is Y ₅ , and the position of the second jet wave 12B is Y _{6 as well} . The position of the radiation thermometer 27 for measuring the cooling temperature of the wiring board 1 is represented by Y ₇ . When the reading device is used instead of the marking device 24, the coordinate Y _{1 is set} to Y.
The manufacturing number is read when the entry of the wiring board 1 is detected by superimposing it on ₀ . That is,
Place at the same coordinates.

(2) Configuration Example of Each Part FIGS. 2 (a) and 2 (b) are diagrams showing an example of a process detection system of the flux coating apparatus, and FIG. 2 (a) shows an example of a foaming type flux coating apparatus. 2B is a side sectional view showing an example of the spray type flux coating apparatus, and the same reference numerals as those in FIG. 1 denote the same portions.

2A, the liquid temperature sensor 43 for measuring the temperature of the flux liquid 4 in the flux tank 42, the specific gravity sensor 44 for measuring the specific gravity of the flux liquid 4, and the flux 4 is provided with a level sensor 45 for measuring the foaming height and an ambient temperature sensor 46 for measuring the ambient temperature. Then, the data signals S _TF , S _SG , S _LF , and S _A1 are output, respectively.
The nozzle 47 is a means for guiding bubbles of the flux 4 generated from the foam tube 48 to which air is supplied and forming bubbles of the flux 4 in a mountain shape.

In the spray type flux applicator 51 of FIG. 2B, a liquid temperature sensor 43 for measuring the temperature of the flux liquid 4 in the flux tank 52, a specific gravity sensor 44 for measuring the specific gravity of the flux liquid 4, and a flux. 4 is provided with a flow rate sensor 53 for measuring the spray flow rate and an ambient temperature sensor 46 for measuring the ambient temperature. Then, the respective data signals S _TF , S _SG , S _Q and S _A1 are output.

The signal S _CB is an open / close drive signal for the open / close valve 54. That is, the opening / closing drive signal S _CB is output according to the entry of the wiring board 1 to open / close the opening / closing valve 54, and the flux 4 is sprayed and applied only when the wiring board 1 is conveyed onto the spray nozzle 55. -It is a signal to be applied. Further, compressed air 56 is supplied to the flux tank 52.

The process data shown in FIGS. 2 (a) and 2 (b) is sent from the communication section 49 of the flux management apparatus 8 via the communication bus to the data management apparatus 3 by the communication signal S _COM-F.
0, or data signals S _TF , S _SG , S _LF , S _A1 and S respectively obtained from each sensor.
_{The Q} is directly transmitted to the data management device 30.
Reference numeral 50 indicates an instruction input unit.

FIG. 3 is a block diagram showing the process detection system of the preheating device 5. That is, a temperature sensor (thermocouple type) 62 provided on the surface of the heater 61 of the preheating device 5.
The temperature control device (thermostat) 63 is provided for controlling the electric power supplied to the heater 61 based on the temperature data signal S _TP from the controller 61 to keep the surface temperature of the heater 61 at a predetermined value.

The temperature control device 63 is provided with a manual instruction input section 64 for instructing and inputting the set temperature, and the set temperature can be instructed also from the general control device 18 of FIG. 1 via the communication bus. is there. That is, the instruction is given by the communication signal S _COM-P . The communication unit 65 communicates with the integrated management device 18 to send and receive commands and data, and sets the temperature of the heater 61 from the integrated management device 18 and transmits data requested by the integrated management device 18. It is for doing.

In addition, an atmosphere temperature sensor 66 for measuring the temperature of the atmosphere of the preheating device 5 is provided, and the obtained data signal S _A2 is sent via the preheating management device 9 or directly to the data management device 30. It may be configured to send to. 67 is a commercial power source.

FIG. 4 is a block diagram showing a process detection system of the solder bath device 6. That is, the temperature control for controlling the electric power supplied to the heater 72 based on the temperature signal S _TH from the temperature sensor 71 provided in the solder bath device 6 to maintain the temperature of the molten solder 10 in the solder bath 73 at a predetermined value. A device (thermostat) 74 is provided.

Further, level sensors 75 and 76 for measuring the height of the first jet wave 12A and the height of the second jet wave 12B are respectively provided, and the detection data signal S thereof is provided.
_{Based on LH1} and S _LH2 , first and second wave height control devices 79 and 80 for controlling the rotational speeds of the first and second jet motors (shown by impellers) 77 and 78 are provided, and the jet motors 77 and 78 are provided.
Is output to the first and second jet motor drive units 81 and 82 for driving.

Further, an atmosphere temperature sensor 83 for measuring the soldering atmosphere temperature is provided, and a data signal S _A3 is obtained.

The instruction input units 84, 85, 86 provided in the temperature control device 74 and the first and second wave height control devices 79, 80 are means for manually inputting set instruction values. is there. In addition, the communication unit 87
Transmits and receives commands and data by communicating with the integrated management device 18 of FIG.
This is for setting the temperature of 0 and the heights of the jet waves 12A and 12B, and for transmitting the data requested by the total control device 18.

FIG. 5 is a block diagram showing a process detection system of the cooling device 7. That is, the cooling device 7 is a cooling device by forced air cooling, and has a configuration in which the motor drive unit 92 included in the cooling management device 13 controls the rotation speed of the drive motor 14 to adjust the flow rate of air sent from the fan 91. is there. The cooling management device 13 is provided with a manual instruction input unit 93 and a communication unit 94, and the cooling capacity (rotation speeds of the drive motor 14 and the fan 91) can also be instructed from the general management device 18 via a communication bus. It is a composition.

In addition, an atmosphere temperature sensor 95 for measuring the temperature of the cooling atmosphere is provided, and the data signal S _A4 is sent to the data management apparatus 30 via the cooling management apparatus 13 or directly.
It is configured to send to.

(3) Operation The soldering apparatus constructed as in the above example is capable of collecting the soldering process data from each part of the conventional soldering apparatus. Therefore, the conveyor 2, the flux applying device 3, the preheating device 5, the solder bath device 6, the cooling device 7 and the like, which are means for carrying the wiring board 1, operate in the same manner as in the conventional case.

Then, the process data management device 32 is
Process data obtained from each part of the soldering machine
While giving ID (Identity) to the wiring board 1, or ID
Read and collect and record each data in the soldering process. Since the process data management device 32 is composed of a microcomputer system, its data collection procedure can be realized by software.

FIG. 6 traces and measures the coordinates of the wiring board 1 that has entered the soldering apparatus, and displays the serial number I and other information.
It is a flowchart which shows the procedure for allocating D. In addition, the ID such as a bar code is assigned to the wiring board 1 in advance.
, The procedure for assigning a new serial number is unnecessary. Further, (21) to (27) indicate each step.

That is, in step (21) after starting the soldering apparatus, the manufacturing number is initialized (i is a variable giving the manufacturing number, i = 0), and step (2)
In step 2), the counter number for coordinate measurement is initialized (n is the counter number for coordinate measurement, and a plurality of counters are prepared by software. This m is the maximum number of wiring boards 1 that can enter the soldering apparatus. Set it.
The number of the specific counter is n and n = 0. ) Subsequently, the process proceeds to step (23), it is judged whether or not the wiring board 1 has entered, and if it has entered, step (24)
Then, the counter number for measuring the coordinates of the wiring board 1 is determined (n = n + 1).

After that, the process proceeds to step (25) to determine the manufacturing number of the entry wiring board 1 (i = i + 1).
Then, the process shifts to step (26) to request the coordinate measurement counter (counter n) to start counting (the "counter n" program is requested to start counting. This program will be described later).

Subsequently, the process proceeds to step (27), it is judged whether or not the counter number n has reached the assigned maximum value m (n = m?), And if it has not reached the maximum value, step (23). And wait for the next wiring board 1 to enter, n = m
If so, the process returns to step (22) to initialize the counter number.

In this way, when the ID for identifying the wiring board 1 is determined and the counter number for measuring / tracking the transport coordinates, that is, the position of the wiring board 1 is determined, the numerical value of the counter n is the wiring number. The coordinates of the substrate 1 are indicated.

If the wiring board 1 is provided with a serial number in advance by a bar code or the like, the step of assigning the serial number is not necessary, so steps (21) and (25) are deleted.

When the wiring board 1 reaches the predetermined coordinates for measuring the process state, that is, the positions (Y _{1 to} Y ₇ ) shown in FIG. 1, the predetermined measurement described later is performed. Become.

Next, how the serial number is given to the wiring board 1 and the coordinates are traced will be described. FIG. 7 is a flowchart showing this procedure. Note that (31)-
(38) indicates each step.

That is, in step (31), the counter n labels the serial number of the wiring board 1 which is in charge of coordinate measurement (P _i = i). After that, the process proceeds to step (32) to request P _i registration in the “data set”.
(A “data set” is a program for storing the process data of the wiring board 1 in a file device. This program will be described later).

At this time, if the serial number is previously given to the wiring board 1 by a bar code or the like, step (3)
In 1), the serial number data signal S _B read by the reader (not shown) is input, and the counter labels the serial number of the wiring board 1 in charge of coordinate measurement (P _i = i). . Then, the process proceeds to step (32).

[0062] Then the operation proceeds to Step (33) judges whether or not there is carrier pulse signal S _E, the count value C of the counter n goes to step (34) if there is the conveying pulse signal S _E increment _n (C _n = C
_n + 1).

Thereafter, the process proceeds to step (35), and it is judged whether or not the count value C _n is a predetermined process data measurement coordinate (C _n = Y _j (j = 1,2,3, ...
., 7)), if it is the coordinate, the process proceeds to step (36) to notify the serial number P _i and the coordinate Y _j of the wiring board 1 to the “data set”. However, step (3
When C _n = Y _j in 5) is not satisfied, the step (3
Returning to 3), the counting of the carrier pulse signal S _E is continued.

[0064] _{Subsequently,} when the process proceeds to step (37),
It is determined whether or not the count value C _n has reached a predetermined maximum value Y _{7 of} coordinates (C _n = Y ₇ ), and C _n = Y _7, that is, the wiring board 1 must reach the final coordinates Y _7. For example, returning to step (33), the counting of the carrier pulse signal S _E is continued, and if C _n = Y ₇ , the count value C _n is initialized (C _n = 0) and the process ends. Note that m programs "counter n" are prepared as described above.

FIG. 8 is a flowchart showing the procedure for storing process data. That is, the "dataset" program. Note that (41) to (59) indicate each step.

First, in step (41), it is determined whether or not there is a registration request for the serial number Pi of the wiring board 1. If there is a registration request, the process moves to step (42) and the serial number is stored in the data buffer. An area for setting the data of P _i is secured, and then the process proceeds to step (43) to read the date and time data from the calendar / clock section, and the temperature data S _TA , temperature data S _TS , and transportation. Elevation angle data θ _S , carrier velocity data v _P (This can be obtained by software calculation from the carrier pulse signal. That is, the period of the carrier pulse signal S _E is measured by the clock section, and the reciprocal thereof is obtained, and the calculation result is obtained. the transport distance for example obtained by multiplying the 0.5 mm) per one pulse is stored in the P _i area.

Thereafter, the process proceeds to step (44), where P _i ,
It is determined whether or not the coordinate notification of Y _j is from “counter n”. In the step (41), the serial number P
Even when it is determined that there is no _i registration request, the step (4
Go to 4).

If the coordinates of P _i and Y _j are notified in step (44), the process proceeds to steps (45) to (55) to determine whether _j of the coordinates Y j is 1 to 7. to decide. Then, in the case of step (45) where j = 1, the process proceeds to step (46) and requests the "marking" program to mark the date and the serial number P _i . However, if the wiring board 1 is provided with a serial number in advance by a barcode or the like, the marking device 24
In place of the above, a reading device is used, and the manufacturing number is read in the above-mentioned step (31), so steps (45) and (46) are deleted.

Next, in the case of step (47) where j = 2, the process proceeds to step (48) and the temperature S _T1 of the entry wiring board 1 is stored in the P _i area.

[0070] j = in the case of the third step (49), it proceeds to step (50), fluxer management device 8 to the foam height data S _LF, the flux density data S _SG, flux liquid temperature data S _TF, ambient temperature Request the data S _A1 and store the received data in the P _i area.

In the case of step (51) where j = 4, the process proceeds to step (52) to request the heater surface temperature data S _TP and the ambient temperature data S _A2 to the preheating management device 9, and to receive the received data and wiring. Preheating temperature data S _T2 of the substrate 1 is stored in the P _i area.

In the case of step (53) of j = 5, the process proceeds to step (54), and the temperature data S _TH of the molten solder 10 and the height data S _{LH1 of} the first jet wave 12A are sent to the solder bath management device 11. , Request ambient temperature data S _A3 ,
Request the oxygen concentration data S _O from the oxygen concentration management device 17,
The received data is stored in the P _i area.

In the case of step (55) where j = 6, the process proceeds to step (56), and the temperature data S _TH of the molten solder 10 and the height data S _{LH2 of} the second jet wave 12B are sent to the solder bath management device 11. , Request ambient temperature data S _A3 ,
Request the oxygen concentration data S ₀ from the oxygen concentration management device 17,
Each of them is received and the data is stored in the P _i area.

If it is judged in step (55) that j = 6 is not satisfied, then j = 7 is satisfied, so that step (5)
7), and the ambient temperature data S is sent to the cooling management device 13.
_A4 is requested, the data and the cooling temperature data S _T3 of the wiring board 1 are stored in the P _i area, and then the process proceeds to step (58) to store all the data of the P _i area in the file device 31, and thereafter. The process proceeds to step (59) to initialize the P _i area of the data buffer and then step (41)
Return to Then repeat the above procedure.

The steps (46), (48),
After the work of (50), (52), (54), and (56) is completed, the process returns to step (41) and the above procedure is repeated.

Note that m "data set" programs are also prepared.

The above, that is, the serial number of the wiring board 1 and each process data corresponding to the wiring board 1 are stored and stored in the file device 31 as one set.

FIG. 9 is a flowchart showing the marking procedure. That is, the "marking" program. In addition, (61) and (62) show each step.

In step (61), it is determined whether or not there is a request for the marking P _i. If there is a request, the process proceeds to step (62) to output the date and the serial number P _i to the marking device 24, Print the manufacturing date and serial number. If the manufacturing number is given to the wiring board 1 in advance, this "marking" program is unnecessary.

Next, the procedure when there is a process data read request from the operation unit 33 of the data management device 30 will be described. FIG. 10 is a flowchart explaining this procedure. Note that (71) to (73) indicate each step.

That is, it is determined whether or not there is a read request for data in which the manufacturing date and the manufacturing number P _i are designated (step 7).
If it is determined in 1) and there is the request, step (7)
In step 2), the file device 31 is requested to search the process data of the required manufacturing date and the manufacturing number.
The searched data is displayed on the display unit 20 in step (73). As a result, it becomes possible to know in what process soldering was performed for each wiring board 1.

Therefore, even if there is a problem in the soldering quality of a wiring board 1, the soldering process data of the wiring board 1 can be immediately read and analyzed.

FIG. 11 is a flowchart showing a response procedure when online access is made via a communication network such as a LAN. Note that (81) to (85) indicate each step.

That is, it is judged in step (81) whether there is a file data read request (read request in which the manufacturing date and the manufacturing number P _i are designated). If there is a read request, step (82) Then, the file device 31 is requested to search the process data of the required manufacturing date and the manufacturing number, and the searched data is transmitted to the requesting terminal in step (83).

If it is determined in step (81) that the request is not a file data read request, the process moves to step (84) to determine whether or not the measurement data (measurement data at the time of request) is a read request. . Only when it is determined that the measurement data read request is made, the process proceeds to step (85), and the date, time, temperature S _TA , humidity S _TS , transport speed v _P , transport elevation angle θ, and each management device at that time. And data obtained by requesting the radiation thermometer, that is, the temperature S _T1 of the wiring board 1 that has entered, the foaming height S _{LF of} the flux 4, the specific gravity S _{SG of the} flux 4,
Liquid temperature S _{TF of} flux 4, ambient temperature S of flux application
_A1 , surface temperature S _TP of heater 61 of preheating device 5, preheating temperature S _T2 of soldering surface of wiring board 1, ambient temperature S _{A2 of} preheating, temperature S _TH of molten solder 10, first jet wave The height S _{LH1 of} 12A and the height S of the second jet wave 12B
_{The LH2} , the soldering atmosphere temperature S _A3 , the oxygen concentration S _O in the soldering atmosphere, the cooling atmosphere temperature S _A4 , and the temperature S _T3 of the soldering surface of the wiring board 1 after cooling are transmitted to the requesting terminal.

Finally, the operating system of the data management device 30 is a time sharing system, and these programs are executed in parallel.

(4) Refinement of Process Information In the above examples, each data was collected one by one at each coordinate (Y _{2 to} Y ₇ ). This is wiring board 1
It means that data is collected only for the points.

However, for example, if data is collected at two positions of Y ₂ and Y ₂ + Δy (where Δy is a value not exceeding the length in the carrying direction of the wiring board 1) at the coordinate Y ₂ , the wiring board 1 concerned can be obtained. It is possible to collect the temperature at two points. This also applies to the coordinates Y ₄ and Y ₇ . Therefore, it becomes possible to separately collect the temperature of the part A and the temperature of the part B mounted on the wiring board 1.

Similarly, Y ₂ and Y ₂ + Δy ₁ , Y
_By setting a large number of measurement points as in ₂ + Δy ₂ , ..., It becomes possible to collect data of a large number of points in one specific process for one wiring board 1. For example, it becomes possible to collect even the temperature distribution data of one wiring board and utilize the data later.

(5) Concrete role and meaning in management of each process data 1. Temperature and Humidity This defines the dew condensation condition, so it is possible to specify whether or not there was dew condensation on the wiring board 1 to be soldered. Generally, when dew condensation occurs on a soldered part, solderability is extremely deteriorated. Moreover, the oxidation of the soldered portion is promoted.

2. When the temperature of the wiring board 1 to be carried in is low, the final preheating temperature of the wiring board 1 heated in the preheating step also becomes low. That is, the preheating temperature of the wiring board 1 is defined by the temperature of the wiring board 1 at the time of loading.

3. Conveyance elevation angle θ of wiring board 1 Conveyance elevation angle θ defines the detachment angle of molten solder 10 at the peel back point, and finally defines the fillet shape.

4. Foaming Level of Flux 4 The amount of flux 4 applied to the wiring board 1 is defined.

5. Specific gravity of flux 4 The solid content in the flux 4 is specified.

6. Temperature of Flux 4 It is necessary when the temperature of the specific gravity of the flux 4 is corrected, and the activity of the flux 4 in the preheating process and the soldering process is specified.

7. Flow rate of flux 4 (in case of spray type) The amount of flux 4 applied to the wiring board 1 is defined.

8. Flux 4 coating atmosphere temperature In the foaming type flux coating device 41, the spraying type flux coating device 5 affects the foaming state (for example, the size of bubbles).
A value of 1 affects the atomization state (for example, the average particle size).

9. Transport speed v _p Specifies the processing speed in each step. For example, the contact time of the flux 4, the preheating time, the contact time of the molten solder 10, and the cooling time.

10. Surface temperature of heater 61 of preheating device 5 This temperature defines the amount of heat input to wiring board 1 in the case of infrared heating. That is, the preheating temperature of the wiring board 1 is finally specified.

11. Preheating Ambient Temperature This temperature affects the preheating temperature of the wiring board 1.

12. Preheating temperature of the wiring board 1 (surface temperature of the surface to be soldered) This temperature is the activity of the flux 4 applied to the wiring board 1, the solderability at the time of contact with the molten solder 10, the wiring board 1 and Specifies the amount of heat shock given to the mounted electronic parts.

13. Wave height of molten solder 10 The contact state between the wiring board 1 and the molten solder 10 is defined, and the jet pressure applied to the wiring board 1 and the contact time are defined.

14. Temperature of Molten Solder 10 Affects surface tension, wettability, and wetting speed of the molten solder 10.

15. Atmosphere temperature in the soldering process Affects the surface condition of the molten solder 10 flowing, and affects the wettability and the wetting speed.

16. Oxygen concentration in the soldering process defines the oxidation rate of the molten solder 10 and its surface tension, and also affects the fluidity. It also affects the activity of the flux 4.

17. Date and serial number Required to identify the wiring board 1.

18. Time of day Required to identify manufacturing time and manage diurnal quality changes.

19. Cooling ambient temperature and cooling capacity (cooling air volume) Specifies the cooling rate and cooling temperature. That is, it defines the cooling property. It also affects the stress associated with cooling. (6) Application in Reflow-type Soldering Device In the above embodiments, how to collect the process data in the flow-type soldering device has been specifically described. This technique can naturally be applied to a reflow type soldering device (not shown), and the preheating temperature and the reflow temperature of the wiring board 1 can be collected as data, for example, as shown in FIG.

That is, a rotary encoder 21 is provided on the transport conveyor 2 so that a transport pulse signal proportional to the transport distance can be obtained. On the other hand, a radiation thermometer is provided at a predetermined position of the reflow furnace and wiring is provided. When the substrate 1 reaches the coordinates, the surface temperature is measured and the data is collected and stored. That is, there is no difference from the configuration of FIG.

Also at that time, the process data is stored by clarifying the ID of the wiring board 1.
It is possible to collect and store the temperature of each part of.

[0111]

As described above, according to the present invention, there are the following effects corresponding to each claim.

According to the first aspect of the present invention, the soldering history of the work to be soldered such as the wiring board can be obtained accurately and finely in the actually passed process state. As a result, it becomes possible to accurately analyze the effects of slight fluctuations in the process state, accurately identify the factors that reduce soldering quality, and aim for bottom-up of soldering quality that appears statistically. It becomes possible to realize high quality soldering.

According to the invention of claim 2, in addition to the effect of claim 1, it becomes possible to accurately and finely specify the specified processing history for each of a large number of workpieces to be soldered. . As a result, traceability for long-term analysis of problems caused by soldering quality not only immediately after the soldering of the work to be soldered is completed, but also until it ends its life cycle as a product. Is greatly improved. And such process control is indispensable for the manufacturer who is responsible for the product, and the responsibility can be fully taken.

[Brief description of the drawings]

FIG. 1 is a block diagram showing one embodiment of the present invention.

FIG. 2 is a diagram showing an example of a process detection system of a flux coating device.

FIG. 3 is a block diagram showing a process detection system of a preheating device.

FIG. 4 is a block diagram showing a process detection system of the solder bath device.

FIG. 5 is a block diagram showing a process detection system of the cooling device.

FIG. 6 is a flowchart showing a procedure for tracking and measuring the coordinates of a wiring board that has entered a soldering device and assigning an ID such as a manufacturing number.

FIG. 7 is a flowchart showing a procedure of assigning a manufacturing number to a wiring board and coordinate tracking.

FIG. 8 is a flowchart showing a procedure for storing process data.

FIG. 9 is a flowchart showing a marking procedure.

FIG. 10 is a flowchart showing a procedure when there is a process data read request from the operation unit of the data management device.

FIG. 11 is a flowchart showing a response procedure when online access is made via a communication network such as a LAN.

FIG. 12 is a block diagram showing an example of a conventional flow soldering device.

FIG. 13 is a flowchart showing a control procedure of the integrated management apparatus of FIG.

[Explanation of symbols]

 1 Wiring Board 2 Conveyor 3 Flux Coating Device 4 Flux 5 Preheating Device 6 Solder Tank Device 7 Cooling Device 8 Fluxer Management Device 9 Preheating Management Device 10 Molten Solder 11 Solder Tank Management Device 12A First Jet Wave 12B Second Jet wave 13 Cooling management device 14 Drive motor 15 Transport management device 16 Oxygen concentration measurement device 17 Oxygen concentration management device 18 General management device 19 Operation part 20 Display part 21 Rotation encoder 22 Elevation angle sensor 23 Ingress sensor 24 Marking device 25 Radiation thermometer 26 Radiation thermometer 27 Radiation thermometer 28 Air temperature measurement sensor 29 Humidity measurement sensor 30 Data management device 31 File device 32 Process data management device 43 Liquid temperature sensor 44 Specific gravity sensor 46 Atmosphere temperature sensor 53 Flow rate sensor 62 Temperature sensor 66 Atmosphere temperature Capacitors 71 Temperature sensor 75 Level sensor 76 Level sensor 83 the ambient temperature sensor 95 the ambient temperature sensor

Claims (2)

[Claims] 1. A method of collecting process data in a soldering apparatus, which carries out soldering while a work to be soldered is carried by a carrying means, wherein the carrying means is provided with an encoder for outputting a carrying signal proportional to a carrying distance. , Each of which detects a plurality of process states when the work to be soldered is soldered, and is provided with a sensor that outputs these process data, while specifying the transfer position of the work to be soldered from the transfer signal A method for collecting process data in a soldering apparatus, comprising collecting the process data. 2. A method for collecting process data in a soldering apparatus for carrying out soldering while a work to be soldered is carried by a carrying means, wherein the carrying means is provided with an encoder for outputting a carrying signal proportional to a carrying distance. , A sensor for detecting each of a plurality of process states when the work to be soldered is soldered and outputting these process data, on the other hand, a notation for specifying the work to be soldered A marking device that is applied to a work to be attached, or a reading device that has an ID that is provided and written in advance on the work to be soldered, and a file device that is capable of writing and reading data are provided. Collecting each process data while specifying the transfer position of the soldering work, and A method for collecting process data in a soldering apparatus, characterized in that each process data is written and stored in a file device together with the notation data.