JP2009168569A - Monitoring system of molten metal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To monitor a state or the like of molten metal during operation in a remote place. <P>SOLUTION: This system communicates a monitor having a host computer to a monitoring object having an individual computer on a network. The individual computer measures melting temperature of a molten metal tub at a suitable interval, and uploads the measured temperature to the host computer. A metal sample is sampled from the molten metal tub, a lot signal including the specified monitoring object and the sampling time is applied to the sample, the sample is analyzed, and the analysis data is input into the host computer with the lot signal. The host computer analyzes the uploaded melting temperature and the analysis data with a previously provided analysis program, and downloads this analysis result to the monitoring object. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention appropriately monitors whether or not the metal composition in the molten metal is at an appropriate value, and informs the operating source without delay when there is a possibility of deviating from the appropriate range, and performs appropriate measures. More particularly, the present invention relates to a system suitable for a system for monitoring a solder composition in a molten solder bath.

  In recent years, solder alloys are shifting to lead-free solder alloys that do not contain lead from the viewpoint of environment and the like. As lead-free solder alloys, Sn-Ag-Cu alloys and Sn-Cu alloys are the mainstream, but any alloy has a Ni content in a composition in which Ag, Cu, or Ni is added. The permissible range is relatively strict, and if the permissible value is exceeded, the fluidity of the molten solder alloy may deteriorate, the wettability may deteriorate, and further the occurrence of dross increases, This leads to poor solder joints.

  However, at present, the operator measures the composition of the molten solder bath in operation at an appropriate period, and notifies the manufacturer of the solder alloy of the measured value, which the solder manufacturer analyzes and analyzes it appropriately. It takes a considerable amount of time to give instructions, so when this instruction reaches the solder bath operator, the composition of the solder bath has changed greatly, and the received instruction lacks appropriateness. There is a problem of end. In other words, in order to realize proper soldering, it is possible to reduce the time from measuring the state of the molten solder in the solder bath to giving instructions from the manufacturer. It is greatly influenced by this point.

  Of course, such a problem is not limited to a solder alloy, and if a molten metal composition is operated under similar conditions, the same problem may occur.

JP 2004-246650 A JP 2002-285901 A

  As a general rule, when the monitoring target and the monitoring person exist in a remote place, a method of communicating via the network, uploading information from the monitoring target, and downloading the result analyzed by the monitoring person has spread. ing. The prior art illustrated is this example. However, there is no known network system for monitoring the composition of the molten solder alloy in an operating solder bath and controlling it appropriately.

  The present invention transfers information between a molten metal such as a molten solder in a solder bath to be monitored, which is related by a network, and an analyst such as a solder manufacturer who is a monitor, and a metal composition in an appropriate range. It is an object of the present invention to disclose a system capable of giving instructions without delay for recovering a problem.

  In the present invention, in order to achieve the above-described object, a system is constructed in which a supervisor having a host computer and a monitoring target having an individual computer communicate with each other via a network. The individual computer measures at least the melting temperature of the molten metal tank at appropriate intervals, and uploads the measured temperature to the host computer in accordance with a predetermined period or an upload command from the host computer. On the other hand, the metal sample collected from the molten metal tank is assigned a lot symbol including the identification of the monitoring target and the collection time, and this analysis data is input to the host computer together with the lot symbol. The host computer uses a series of means for analyzing the uploaded melting temperature and the analysis data using an analysis program provided in advance and downloading the analysis result to the monitoring target.

  The monitoring target includes an individual computer. The individual computer controls the molten metal operating device to be monitored and manages the temperature and operating status of the molten metal as data. Then, these data are transmitted to the host computer via the network at a predetermined cycle. Alternatively, if an upload instruction command is downloaded from the host computer, data subsequent to the previously transmitted data is transmitted accordingly. On the other hand, not only regularly or irregularly, a sample of molten metal is collected for analysis as a monitoring target, and an ID for identifying the monitoring target, a sampling time, etc. are added to this and a lot symbol is given. . The sample given the lot symbol is used for analysis, and the analysis value is input to the host computer together with the lot symbol. The input means may be direct input or data transmission means. Then, the host computer determines whether the composition of the sample is appropriate from the analysis value of the sample and the transmitted data relating to the monitoring target, and deviates from the appropriate range if it is not appropriate or determined from the operation status If there is a possibility, this is instructed to the monitoring target, and for example, an additional amount of a specific alloy or pure metal is clearly indicated.

  Further, as a more detailed means of the present invention, the molten metal is a solder alloy, and the monitoring object is an example of a dip soldering device or a leveler device for providing a solder foil on the surface of a printed circuit board. This is applied to an apparatus using the. The solder alloy is surely consumed according to the number of substrates to be processed if a dip soldering operation or the like is performed, but the composition of the remaining molten solder alloy gradually changes due to elution of Cu from a printed circuit board or the like. In this case, for example, if the Cu content increases, the flowability of the molten solder may be adversely affected, which is not preferable. The information can be immediately provided to the monitoring target.

  The individual computer may also collect other data. In addition to the melting temperature of the solder, the workpiece conveyance speed and preheating temperature are measured, and the means of uploading the data to the host computer together with the melting temperature is selectively used. Use. By uploading these data to the host computer, the host computer can more accurately determine the current status of the monitoring target, and can provide more accurate instructions.

  By adopting the system of the present invention, the monitor can constantly monitor a plurality of monitoring targets connected to the host computer via a network at the same time, and immediately sends a warning for abnormal heat generation during operation. can do. In addition, by collecting a sample for analysis together with a lot symbol and inputting this analysis result, it is possible to instruct the composition and input amount of the additional alloy while referring to the history of the monitoring target at the time of sample collection, Contributes to precise soldering work.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 schematically shows a network for realizing the system of the present invention, where 1 is a network, 2 is a supervisor, 3... 3 are monitoring targets. The network 1 schedules a known Internet link in the present invention, but is not limited to a network provided to the public, and may be an intranet or a LAN. This includes both the case where the monitoring target 3 is singular and has a one-to-one relationship with the monitor, and the case where there are a plurality of monitoring targets 3 and the monitor 1 monitors the monitoring targets 3. .

  FIG. 2 is a block diagram showing an object to be monitored, and a soldering apparatus is used as an example. In the figure, 11 is a soldering device, 12 is a solder bath in which a molten solder alloy is accommodated, 13 is a line for soldering work, 14 is a temperature suitable for soldering a work arranged on the line 13 with a chuck or the like. It is a preheater for preheating up to. This soldering apparatus is a kind of dip soldering apparatus called a jet flow soldering apparatus, in which the molten solder alloy in the solder bath 12 is jetted, and the molten solder jetted on the necessary part of the printed circuit board is brought into contact with the soldering apparatus. Is to do. Reference numeral 15 denotes an individual computer installed in the soldering apparatus 11, which controls and acquires information on a soldering apparatus to be described later while performing normal operation control.

  By the way, since the molten solder in the solder bath 12 comes into contact with the metal foil of the printed circuit board or the lead wire of the mounting component in the soldering operation, the metal is eluted from the surface of the metal foil or the lead wire. The composition changes over time. For example, when the lead wire is Cu, so-called copper cracks occur, and the Cu concentration of the molten solder in the solder bath increases. However, when the Cu concentration exceeds the allowable range in this way, the flowability of the molten solder is deteriorated and a bridge is generated during soldering. It is preferable to monitor at a high frequency.

  Therefore, in the present embodiment, such monitoring is achieved by the following configuration. FIG. 3 shows an individual computer installed in the soldering apparatus shown in FIG. 2 connected to the network 1, and is connected via a terminal adapter 31 when the network is the Internet. The terminal adapter 31 can be adopted as long as it has a publicly known configuration. For example, by connecting the connector 33 to the commercial power source 32, a configuration for performing data communication using the outer shell of the power supply line, etc. Can also be applied. If connected in this way, communication with a host computer (not shown) installed in the supervisor 2 can be performed under the control of the individual computer 15 installed in the soldering apparatus 11. The connection between the individual computer 15 of the monitoring target 3 and the host computer of the monitoring person 2 is not particularly limited as long as it is configured via a network. If there is no need to limit the area where remote monitoring and technically connected monitoring targets are installed as in the present invention, the Internet is currently optimal.

  In addition, what is monitored about the solder bath in operation is not absolute, but at least the following information is required. In other words, the information necessary in the present invention is to confirm whether the soldering operation is proper or whether the solder alloy composition in the solder bath will deviate from the allowable value in the future which is not so long. Show minimal information. This information includes solder bath temperature, preheat temperature, workpiece supply speed during operation, number of sheets supplied, solder melting time, melting period, and usage time. The temperature of the molten solder itself is determined by, for example, calculating the average value by measuring the temperature of the solder bath at a plurality of locations because there is temperature segregation in the solder bath portion. In this embodiment, the solder bath temperature and the temperature of the solder itself are regarded as substantially the same. Further, how to determine the solder temperature to be output as information is not the main purpose of the present invention, but assumes that the temperature is output after appropriate temperature management is performed. In addition to this information, the solder melting time, melting time, usage time, and the like may be monitored. The use time indicates the total use time and the time after the addition when the consumed solder is added without completely replacing the solder bath.

  Then, the example which monitors the solder tank in operation using the structure of this invention is demonstrated based on the flow sheet of FIG. First, it is necessary to analyze the composition of the molten solder at a predetermined time in order to monitor the solder bath and to give appropriate instructions. Prior to this, the solder alloy first put into the solder bath must be analyzed. The composition is input in advance to the host computer on the monitor side. At the time of this input, the allowable value of the composition range of the solder alloy is naturally input. Subsequently, if the soldering apparatus in the monitoring target 3 is operated, the preheating temperature, the workpiece conveyance speed, the solder bath temperature, etc. are measured, and the individual computer 15 stores these information if necessary, and the unnecessary ones. Skips. Next, an analysis sample is taken from the solder bath to be monitored by some means, and a lot symbol is assigned to the analysis sample. The content of the lot symbol is arbitrary, but at least the solder bath to which the collected sample belongs and the sampling time are specified by a series of numeric strings, character strings, binary bit strings, or the like. Here, collected samples and lot symbols are inseparably managed until analysis is completed and analysis results are converted into data in order to avoid errors such as misplacement. The analysis sample to which the lot symbol is assigned is applied to an analysis device to analyze its composition, and the analysis result is input to the host computer together with the lot symbol. The analysis device may be set in the vicinity of the soldering device, or may exist at a location remote from the soldering device. In any case, the analysis data is input to the host computer in association with the lot symbol.

  It should be noted that constantly determined information is acquired for the solder bath to be monitored, and these data are controlled by the individual computer 15. For example, if it is temperature information of a solder tank, the data of the temperature sensor installed in the appropriate location of a solder tank are managed, and if it is a conveyance speed of a workpiece | work, this will be managed as a numerical value. Then, the data managed in this way is uploaded to the host computer provided on the monitor side via the network. The data upload may be a means that the individual computer 15 voluntarily performs at a predetermined interval or a means that performs it in response to an upload command output from the host computer. As described above, the collection of the analysis sample to which the lot symbol is attached and the uploading of various pieces of information of the soldering apparatus to the host computer are performed by separate procedures. Note that the information attached to the lot symbol can make the judgment on the host computer side more detailed by adding not only the solder bath identification and sampling time as described above but also the temperature of the solder bath. Is possible.

  With the configuration as described above, the composition of the molten solder in the solder bath of the soldering apparatus in operation will be grasped at the same time as the operation history of the soldering apparatus, so that not only the composition of the analysis sample but also the operation It is possible to give instructions or suggestions from the observer over the entire conditions even at a remote place, and enable precise soldering. The instruction or suggestion here is generally information on the composition of how much alloy or pure metal is added to the composition of the current solder bath, or temperature control of the solder bath. Information widely required for soldering, such as preheating temperature control. In addition, since a large number of data to be monitored is accumulated in the monitor, it becomes easy to learn about defective soldering and the like whose cause has been unknown so far, and this is fed back to the monitor. By this, it becomes possible to use for precise soldering.

Schematic showing the system of the present invention Schematic diagram showing the monitoring target Schematic diagram of the monitoring target connected to the network Flow diagram showing the work of the observer and the monitoring target

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Network 2 Monitor 3 Monitoring object 11 Soldering device 12 Solder tank 14 Preheater

Claims (3)

A system in which a supervisor having a host computer and a monitoring target having an individual computer communicate with each other via a network, the individual computer measuring at least the melting temperature of the molten metal tank at appropriate intervals, While uploading to the host computer in accordance with a predetermined period or an upload command from the host computer, the metal sample collected from the molten metal tank is assigned a lot symbol including the identification of the monitoring target and the collection time The analysis data is input to the host computer together with the lot symbol, and the uploaded melting temperature and the analysis data are analyzed in advance by an analysis program provided in the host computer. To download to the monitoring target Monitoring system of the molten metal to symptoms. The molten metal monitoring system according to claim 1, wherein the molten metal is a solder alloy, and a monitored object is a dip soldering apparatus. 3. The molten metal monitoring system according to claim 2, wherein the individual computer measures the workpiece conveyance speed and the preheating temperature in addition to the melting temperature of the solder and uploads the data together with the melting temperature as data to a host computer.

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