WO2018198838A1 - Solder sample management system, solder management server device, and solder sample management method - Google Patents

Solder sample management system, solder management server device, and solder sample management method Download PDF

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Publication number
WO2018198838A1
WO2018198838A1 PCT/JP2018/015603 JP2018015603W WO2018198838A1 WO 2018198838 A1 WO2018198838 A1 WO 2018198838A1 JP 2018015603 W JP2018015603 W JP 2018015603W WO 2018198838 A1 WO2018198838 A1 WO 2018198838A1
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WO
WIPO (PCT)
Prior art keywords
sample
solder
identification information
bath
information
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PCT/JP2018/015603
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French (fr)
Japanese (ja)
Inventor
西村　哲郎
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株式会社日本スペリア社
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Application filed by 株式会社日本スペリア社 filed Critical 株式会社日本スペリア社
Priority to JP2019514393A priority Critical patent/JPWO2018198838A1/en
Publication of WO2018198838A1 publication Critical patent/WO2018198838A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans

Definitions

  • the present invention relates to a solder sample management system, a solder management server device, and a solder sample management method for managing solder samples.
  • a metal sample collected from the solder bath of a dip soldering device is assigned a lot symbol including the identification of the monitoring target and the sampling time, and this analysis is performed.
  • An invention is known in which a melting temperature and the analysis data are input and analyzed in advance by an analysis program provided in a host computer (see, for example, Patent Document 1).
  • an analysis device such as a fluorescent X-ray analyzer is required for component analysis of a metal sample. Since such an analyzer is expensive and requires a large installation space, it is difficult to install the analyzer for each solder bath. Therefore, it is necessary to send the sample collected from the solder bath to an analyzer installed far away. In addition, because it is necessary to specify the solder bath from which the sample was taken, the worker enters the location of the solder bath and the management number of the solder bath on the form. Therefore, it was necessary to send the sample with the sample to the place with the analyzer.
  • An object of the present invention is a solder sample management system capable of easily associating a sample collected from a solder bath with a solder bath from which the sample has been collected, and reducing the risk of erroneous association.
  • a solder management server device and a solder sample management method are provided.
  • a solder sample management system includes a terminal device operated by a user and a server device for solder management that can communicate with the terminal device, and the terminal device is a solder bath for melting solder. And reading the tank identification information from the solder tank to which the tank identification information for identifying the solder tank is readable, and a sample identification for identifying the sample, which is a container that can contain a solder sample.
  • a reading unit capable of reading the sample identification information from the container to which the information is readable, and the tank management information and the sample identification information read by the reading unit.
  • the solder management server device includes the tank identification information transmitted from the terminal device.
  • a sample information storage unit for storing the sample identification information in association with each other, a component analysis result of the sample contained in the container and the sample identification information given to the container, and acquiring the component analysis result and the sample identification
  • An analysis result acquisition unit that associates information with each other and stores the information in the sample information storage unit.
  • the server device for solder management is a solder bath for melting solder, and the bath identification information from the solder bath to which the bath identification information for identifying the solder bath is readable.
  • a reading unit capable of receiving a sample of solder and reading the sample identification information from a container to which sample identification information for identifying the sample is readable.
  • a solder management server device that can communicate with a terminal device that includes an identification information acquisition unit that transmits the tank identification information and the sample identification information read to the solder management server device.
  • a sample information storage unit that is transmitted from the apparatus and stores the tank identification information and the sample identification information in association with each other; Samples of the component analysis results and sample identification information given to the container acquires, including an analysis result obtaining unit to be stored in the component analysis results and the sample information storage unit in association with the sample identification information.
  • a solder sample management method includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed.
  • An information providing step, a sample identification information providing step for allowing sample identification information for identifying the sample to be readable in a container capable of accommodating a solder sample, and a sample for collecting the solder in the solder bath in the container
  • An identification information transmission step for transmitting the bath identification information and the sample identification information to the solder management server device by the terminal device; and the bath identification information read by the terminal device by the solder management server device.
  • a sample information storage step for receiving the sample identification information and the tank identification information and the sample identification information in association with each other and storing them in the sample information storage unit, and a component for analyzing the components of the sample contained in the container
  • a solder sample management method includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed.
  • a solder sample management method for managing solder component analysis results using a solder management server device, wherein bath identification information is provided in a readable manner, and the solder sample in the solder bath is identified by the bath identification information
  • Sample container acquisition step of acquiring a container to which sample identification information for identifying the sample is readable is provided, and the solder management server device is read by the terminal device. The tank identification information and the sample identification information are received, and the tank identification information and the sample identification information are associated with each other.
  • a sample information storage step to be stored in the sample information storage unit, a component analysis step for analyzing the components of the sample stored in the container acquired in the container acquisition step, and a component analysis result of the sample stored in the container An analysis result storing step of storing the sample identification information given to the container in association with the sample information storage unit.
  • FIG. 1 is a conceptual diagram for schematically explaining a solder sample management system and a solder sample management method according to an embodiment of the present invention.
  • FIG. 1 shows an example in which a factory A that manufactures electronic devices and an analysis laboratory B that analyzes solder samples collected at the factory A are located apart from each other.
  • a solder management server device 1 and an analysis device 2 are installed in the laboratory B.
  • the factory A and the analysis laboratory B may be operated by the same company or may be operated by different companies.
  • the solder sample management system 10 is not limited to an example in which the solder sample management system 10 is divided into the factory A and the analysis laboratory B.
  • solder bath 3 for melting solder is installed.
  • the solder bath 3 is provided in a flow soldering apparatus or the like for performing so-called flow soldering.
  • a molten solder 4 is stored in the solder bath 3.
  • FIG. 1 descriptions of a transport mechanism for transporting the substrate to the solder bath 3 and a solder jet mechanism are omitted.
  • a bath identification label L1 on which a two-dimensional code indicating bath identification information for identifying the solder bath 3 is printed is attached to the outer surface of the solder bath 3.
  • a display device 5 capable of communicating with the solder management server device 1 is attached to the outer surface of the solder bath 3.
  • the two-dimensional code for example, a QR code (registered trademark) can be used.
  • the container 6 is a cup-shaped container for sample collection made of heat-resistant paper, for example.
  • a sample identification label L2 on which a two-dimensional code indicating sample identification information for identifying a sample collected in the container 6 is printed is attached to the container 6.
  • the sample identification label L2 preferably has sample identification information written in characters so that an operator who performs analysis with the analyzer 2 can read it.
  • the user U working in the factory A wears a name tag L3 on which a two-dimensional code indicating user identification information for identifying the user U is printed.
  • FIG. 2 is a block diagram showing an example of the electrical configuration of the solder sample management system 10 according to an embodiment of the present invention.
  • a solder sample management system 10 shown in FIG. 2 includes a solder management server device 1, an analysis device 2, a display device 5, and a smartphone 7 (terminal device).
  • the solder management server device 1 and the smartphone 7, and the solder management server device 1 and the display device 5 are configured to be able to communicate with each other via the network 8.
  • the network 8 is, for example, various wired or wireless communication networks such as the Internet, a WAN (Wide Area Network), a LAN (Local Area Network), and a mobile communication network, or a communication network in which these are combined.
  • WAN Wide Area Network
  • LAN Local Area Network
  • mobile communication network or a communication network in which these are combined.
  • the smartphone 7 includes a camera 71 (reading unit) and an identification information acquisition unit 72.
  • the smartphone 7 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, a non-volatile storage unit such as a flash memory that stores a predetermined control program, etc.
  • a mobile communication circuit, a wireless communication circuit such as WiFi (Wireless Fidelity), a touch screen (touch panel display) capable of touch operation, an RTC (Real Time Clock), and peripheral circuits thereof are configured.
  • the smartphone 7 functions as the identification information acquisition unit 72 by executing the control program stored in the storage unit.
  • a program for causing the smartphone 7 to function as the identification information acquisition unit 72 can be downloaded to the smartphone 7 via the network 8 as a so-called application, for example.
  • a program for causing the smartphone 7 to function as the identification information acquisition unit 72 is referred to as a code reading application.
  • the camera 71 is configured using an imaging element such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device).
  • the user U accommodates the molten solder 4 in the solder tank 3 in the container 6, operates the smartphone 7 to start the code reading application, and is applied to the tank identification label L ⁇ b> 1 given to the solder tank 3 and the container 6.
  • a shooting end button indicating that the operation for acquiring the identification information is ended is touched.
  • the photographing end button is displayed on the touch screen by a code reading application, for example.
  • the identification information acquisition unit 72 extracts a two-dimensional code from the images of the tank identification label L1, the sample identification label L2, and the name tag L3 captured by the camera 71, respectively. And the identification information acquisition part 72 decodes the extracted two-dimensional code, acquires tank identification information, sample identification information, and user identification information, matched these identification information, and was obtained by RTC The date and time information indicating the current date and time is transmitted to the solder management server device 1 via the network 8.
  • the identification information acquisition unit 72 does not necessarily have to decode the two-dimensional code.
  • the identification information acquisition unit 72 transmits the read two-dimensional code as it is to the solder management server device 1 as tank identification information, sample identification information, and user identification information, and the solder management server device 1 decodes the two-dimensional code. May be.
  • the tank identification information, the sample identification information, and the user identification information are not limited to the example displayed as a two-dimensional code.
  • the tank identification information, the sample identification information, and the user identification information may be displayed as barcodes or as characters.
  • the identification information acquisition unit 72 uses the OCR (OpticalOptCharacter Recognition / Reader), from the images of the tank identification label L1, the sample identification label L2, and the name tag L3, to identify the tank identification information, the sample identification information, And it is good also as a structure which reads user identification information.
  • the present invention is not limited to the example in which the tank identification information, the sample identification information, and the user identification information are displayed by a two-dimensional code, a barcode, and characters.
  • bath identification information, sample identification information, and user identification information may be provided to the solder bath 3, the container 6, and the user U using a so-called ID tag, and the terminal device may be provided with an ID tag reader.
  • the method of giving the bath identification information, the sample identification information, and the user identification information to the solder bath 3, the container 6, and the user U may be different from each other.
  • the identification information acquisition unit 72 can easily acquire each identification information, and the ID tag Less expensive.
  • the analyzer 2 is an analyzer that analyzes the components of the solder sample collected in the container 6.
  • the analyzer 2 for example, a fluorescent X-ray analyzer can be used.
  • the analysis device 2 analyzes the components of the solder sample and generates information indicating the component analysis results.
  • the component analysis result is information indicating the content ratio of the components contained in the solder sample such as Sn (tin), Cu (copper), Ni (nickel), Ge (germanium), Pb (lead) contained in the sample. is there.
  • sample identification information When performing analysis with the analyzer 2, for example, the operator reads the sample identification information written in characters on the sample identification label L ⁇ b> 2 of the container 6, and uses the unillustrated keyboard to analyze the sample identification information. To enter.
  • sample identification information may be read from the sample identification label L2 using a reading device (not shown) such as a two-dimensional code or a barcode, and input to the analysis device 2.
  • a reading device such as a two-dimensional code or a barcode
  • the analysis device 2 is connected to the solder management server device 1 through a network such as a LAN so as to be communicable.
  • the analysis device 2 associates the component analysis results with the sample identification information and transmits them to the solder management server device 1 via the network.
  • the analysis device 2 stores information in which the component analysis result and the sample identification information are associated with each other in a storage medium such as a memory card, and reads the storage medium with the solder management server device 1 so that it can be used for solder management.
  • the server device 1 may be configured to acquire the component analysis result associated with the sample identification information.
  • the solder management server device 1 includes, for example, a CPU that executes predetermined arithmetic processing, a RAM that temporarily stores data, an HDD (Hard Disk Drive), an SSD (Solid State Drive), and the like that store predetermined control programs.
  • a nonvolatile storage device, a communication interface circuit that can access the network 8, a keyboard, a mouse, a display, and peripheral circuits thereof are configured.
  • the solder management server device 1 functions as a storage processing unit 11, an analysis result acquisition unit 12, a handling method determination unit 13, and a notification processing unit 14 by executing a control program stored in the storage device.
  • the storage device is used as the solder bath information storage unit 16 and the sample information storage unit 17.
  • the solder tank information storage unit 16 stores in advance solder tank information related to the solder tank identified by the tank identification information.
  • FIG. 3 is an explanatory diagram in a tabular format showing an example of the solder bath information D1.
  • the company name of the company that is the administrator of the solder tank identified by the tank identification information in association with the tank identification information, the name of the factory where the solder tank is installed, and The line name of the production line, the communication address of the display device 5 attached to the solder tank, and reference component information that is a reference for determining the component analysis result are associated with each other.
  • the reference component information is information indicating the appropriate content ratio of each component of the solder used in the corresponding solder bath.
  • the storage processing unit 11 receives the tank identification information, the sample identification information, the user identification information, and the date / time information transmitted from the smartphone 7 and stores these information in the sample information storage unit 17 in association with each other.
  • FIG. 4 is an explanatory diagram of a table format showing an example of information stored in the sample information storage unit 17. As illustrated in FIG. 4, the storage processing unit 11 stores tank identification information, sample identification information, user identification information, and date / time information transmitted from the smartphone 7 in association with each other.
  • the analysis result acquisition unit 12 is accommodated in the container 6 by receiving the component analysis result associated with the sample identification information from the analysis device 2 or reading it from the storage medium storing the component analysis result.
  • the component analysis result of the sample and the sample identification information given to the container 6 are acquired in association with each other. Then, as shown in FIG. 4, the analysis result acquisition unit 12 causes the sample information storage unit 17 to store the component analysis result in association with the sample identification information.
  • the response method determination unit 13 determines a response method for improving the solder component in the corresponding solder bath based on the component analysis result and the reference component information.
  • the notification processing unit 14 notifies the component analysis result or the handling method as notification information.
  • FIG. 5 and 6 are flowcharts showing an example of a solder sample management method.
  • the execution order of the following steps is also an example, and is not limited to the following order.
  • step S1 bath identification information applying step
  • step S2 the operator of the laboratory B operates the solder management server device 1 to store the solder bath information corresponding to the bath identification information of the bath identification label L1 in the solder bath information storage unit 16 (step S2). : Tank information storage step).
  • step S3 sample identification information adding step.
  • an operator of the laboratory B may apply sample identification labels L2 on which different sample identification information is printed to a plurality of containers 6 and distribute the plurality of containers 6 to the user U in advance.
  • step S4 sample collection step
  • step S4 the user U activates the code reading application of the smartphone 7 and images the tank identification label L1, the sample identification label L2, and the name tag L3, and reads the tank identification information, the sample identification information, and the user identification information.
  • Step S5 reading step
  • the identification information acquisition unit 72 extracts the two extracted from the images of the tank identification label L1, the sample identification label L2, and the name tag L3.
  • the dimension code is decoded, the tank identification information, the sample identification information, and the user identification information are acquired.
  • These identification information are associated with each other and soldered via the network 8 together with the date / time information indicating the current date / time obtained by the RTC. It is transmitted to the management server device 1 (step S6: identification information transmission step).
  • the solder management server device 1 receives the tank identification information, the sample identification information, the user identification information, and the date / time information from the smartphone 7, and stores them in the sample information storage unit 17 in association with each other (step S7: Sample information storage step).
  • the user U sends the container 6 containing the solder sample to the laboratory B by mailing, for example (step S8).
  • step S11 sample container acquisition process
  • step S12 Component analysis step
  • the operator reads the sample identification information written on the sample identification label L ⁇ b> 2 of the container 6 and inputs it to the analyzer 2.
  • the analysis device 2 associates the component analysis result with the sample identification information and transmits the result to the solder management server device 1.
  • the solder management server device 1 that has received the component analysis result and the sample identification information given to the container 6 stores the component analysis result and the sample identification information in association with each other in the sample information storage unit 17 (S13: Analysis). Result storage step).
  • the solder tank information storage unit 16 stores in advance the solder tank information D1 indicating the company name, the installation location, and the like, which is the manager of the solder tank 3, in association with the tank identification information.
  • the handling method determination unit 13 responds based on the component analysis result stored in the sample information storage unit 17 and the reference component information included in the solder bath information D1 stored in the solder bath information storage unit 16. A response method for improving the solder component in the solder bath is determined (S14: response method determination step).
  • the handling method determination unit 13 compares the content ratio of each component indicated by the component analysis result with the content ratio of each component indicated by the reference component information, and uses the reference component information for all the components. When the difference from the indicated content ratio is equal to or less than a criterion set in advance for each component, for example, 30% or less, it is determined to be appropriate. On the other hand, if the difference between the content ratio of the component indicated by the component analysis result and the content ratio indicated by the reference component information exceeds the determination criterion, the handling method determination unit 13 determines that it is inappropriate.
  • the response method determination unit 13 determines a response method for improving the solder component in the solder bath 3 for the component whose difference exceeds the determination criterion. Specifically, there is a method in which when the difference exceeds the determination criterion and there is an excessive component, other components excluding the component are put into the solder bath 3. For example, when the components indicated by the reference component information are Sn (tin), Cu (copper), and Ni (nickel), and the excess component is Cu (copper), Sn (tin) and Ni (nickel) are used as a solder bath. The solder component in the solder bath 3 can be improved by putting it into 3.
  • solder component in the solder bath 3 can be improved.
  • the handling method determination unit 13 By storing such an improvement method in the case of inappropriateness in advance in the storage device of the solder management server device 1 for each component, the handling method determination unit 13 allows the component whose difference exceeds the determination criterion. It is possible to determine a corresponding method for improving the solder component in the solder bath 3.
  • the notification processing unit 14 refers to the solder bath information storage unit 16 and acquires a communication address associated with the target bath identification information based on the solder bath information D1.
  • reporting process part 14 refers to the sample information storage part 17, the analysis result matched with the target tank identification information, the judgment result of appropriateness or improperness, and the correspondence for improving a solder component Broadcast information indicating a method is transmitted to this communication address.
  • the notification processing unit 14 may not display the display device 5 and may display the notification information on the display device of the solder management server device 1 or print the notification information with a printer. Even in such a case, since the user identification information is stored in the sample information storage unit 17 in association with the sample identification information, the operator of the laboratory B can use the user U indicated by the user identification information. Can be notified of notification information.
  • the user U collects the solder sample in the container 6 and sends it to the laboratory B, and the smartphone 7 only takes an image of the tank identification label L1, the sample identification label L2, and the name tag L3. Since it is possible to know the component analysis result of the solder 4 in the solder bath 3, the determination result of appropriateness or inappropriateness, and the handling method for improving the solder component, the convenience of the user U is improved.
  • the solder sample management method may be a method implemented in the laboratory B, and may not include steps S1, S5, S6, and S8. Also, the solder management server device 1 does not necessarily need to determine the component analysis result, does not include the handling method determination unit 13, and does not have to execute step S14. Also, the solder management server device 1 does not include the notification processing unit 14 and does not have to execute Step S15.
  • a solder sample management system includes a terminal device operated by a user and a solder management server device capable of communicating with the terminal device, and the terminal device is a solder bath for melting solder. And reading the tank identification information from the solder tank to which the tank identification information for identifying the solder tank is readable, and a container capable of accommodating a solder sample, and identifying the sample A reading unit capable of reading the sample identification information from a container to which sample identification information is readable, and the tank identification information and the sample identification information read by the reading unit are used for the solder management.
  • An identification information acquisition unit for transmitting to the server device, wherein the solder management server device is transmitted from the terminal device,
  • the sample information storage unit for storing the different information and the sample identification information in association with each other, the component analysis result of the sample stored in the container, and the sample identification information given to the container are acquired, and the component analysis result And an analysis result acquisition unit that associates the sample identification information with each other and stores the sample identification information in the sample information storage unit.
  • the server device for solder management is a solder bath for melting solder, and the bath identification information from the solder bath to which the bath identification information for identifying the solder bath is readable.
  • a reading unit capable of receiving a sample of solder and reading the sample identification information from a container to which sample identification information for identifying the sample is readable.
  • a solder management server device that can communicate with a terminal device that includes an identification information acquisition unit that transmits the tank identification information and the sample identification information read to the solder management server device.
  • a sample information storage unit that is transmitted from the apparatus and stores the tank identification information and the sample identification information in association with each other; Samples of the component analysis results and sample identification information given to the container acquires, including an analysis result obtaining unit to be stored in the component analysis results and the sample information storage unit in association with the sample identification information.
  • a solder sample management method includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed.
  • An information providing step, a sample identification information providing step for allowing sample identification information for identifying the sample to be readable in a container capable of accommodating a solder sample, and a sample for collecting the solder in the solder bath in the container
  • An identification information transmission step for transmitting the bath identification information and the sample identification information to the solder management server device by the terminal device; and the bath identification information read by the terminal device by the solder management server device.
  • a sample information storage step for receiving the sample identification information and the tank identification information and the sample identification information in association with each other and storing them in the sample information storage unit, and a component for analyzing the components of the sample contained in the container
  • a solder sample management method includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed.
  • a solder sample management method for managing solder component analysis results using a solder management server device, wherein bath identification information is provided in a readable manner, and the solder sample in the solder bath is identified by the bath identification information
  • Sample container acquisition step of acquiring a container to which sample identification information for identifying the sample is readable is provided, and the solder management server device is read by the terminal device. The tank identification information and the sample identification information are received, and the tank identification information and the sample identification information are associated with each other.
  • a sample information storage step to be stored in the sample information storage unit, a component analysis step for analyzing the components of the sample stored in the container acquired in the container acquisition step, and a component analysis result of the sample stored in the container An analysis result storing step of storing the sample identification information given to the container in association with the sample information storage unit.
  • the user collects a solder sample in a container, and simply uses the terminal device to read the tank identification information of the solder tank and the sample identification information given to the container.
  • the identification information and the sample component analysis result can be associated with each other and stored in the sample information storage unit. That is, by collecting a solder sample in a container and using a terminal device, simply reading the tank identification information of the solder tank and the sample identification information given to the container, the sample collected from the solder tank and the sample are collected. Therefore, it is not necessary to manually enter these pieces of information, so that the risk of erroneous association can be reduced.
  • a notification processing unit that notifies the component analysis result as notification information.
  • the solder management server device further includes a solder bath information storage unit that stores in advance solder bath information related to the solder bath identified by the bath identification information.
  • the solder bath information includes at least information indicating an administrator of the solder bath identified by the bath identification information.
  • the solder bath information including at least information indicating the manager of the solder bath identified by the bath identification information is stored in the solder management server device in advance, the solder bath information is stored in the sample information storage unit. Based on the information and the solder bath information, it becomes easy to inform the appropriate manager of the component analysis result.
  • the solder bath information includes reference component information indicating a solder component set in advance corresponding to the bath identification information, and the solder sample management system is based on the component analysis result and the reference component information. It is preferable to further include a handling method determination unit that determines a handling method for improving the solder component in the solder bath, and a notification processing unit that reports the handling method as notification information.
  • the apparatus further includes a display device that can be attached to the solder bath and can communicate with the solder management server device, and the solder bath information is identified by the bath identification information in association with the bath identification information.
  • a communication address for communicating with a display device attached to the solder bath is further included, and the notification processing unit is a display device attached to the solder bath identified by the bath identification information corresponding to the notification information. It is preferable that the notification is executed by transmitting to the communication address.
  • the reading unit can further read user identification information for identifying the user
  • the identification information acquiring unit further reads the user identification information read by the reading unit for the solder management. It is preferable to transmit to the server device, and the sample information storage unit stores the tank identification information, sample identification information, and user identification information in association with each other.
  • the user identification information for identifying the user is associated with the tank identification information and the sample identification information. Therefore, it becomes easy to inform an appropriate user of a component analysis result or a corresponding method for improving the solder component.
  • the bath identification information is given to the solder bath by a barcode or a two-dimensional code
  • the sample identification information is given to the container by a barcode or a two-dimensional code
  • the tank identification information and the sample identification information are displayed by a bar code or a two-dimensional code, it can be easily read by the terminal device.
  • solder sample management system the solder management server device, and the solder sample management method configured as described above, it is possible to easily associate the sample collected from the solder bath with the solder bath from which the sample was collected. In addition, it is possible to reduce the possibility of erroneous matching.
  • This application is based on Japanese Patent Application No. 2017-89654 filed on Apr. 28, 2017, the contents of which are included in the present application. It should be noted that the specific embodiments or examples made in the section for carrying out the invention are merely to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples. It should not be interpreted in a narrow sense only as a limitation.

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Abstract

A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquiring unit 72 which transmits the tank identification information and the sample identification information to a solder management server device 1, wherein the solder management server device 1 includes: a sample information storage unit 17 which associates with one another and stores the tank identification information and the sample identification information transmitted from the smartphone 7; and an analysis result acquiring unit 12 which acquires a component analysis result of a sample accommodated in the container 6 and the sample identification information assigned to the container 6, and causes the same to be associated with one another and stored by the sample information storage unit 17.

Description

はんだサンプル管理システム、はんだ管理用サーバ装置、及びはんだサンプル管理方法Solder sample management system, solder management server device, and solder sample management method
　本発明は、はんだのサンプルを管理するためのはんだサンプル管理システム、はんだ管理用サーバ装置、及びはんだサンプル管理方法に関する。 The present invention relates to a solder sample management system, a solder management server device, and a solder sample management method for managing solder samples.
　従来より、ディップはんだ付装置のはんだ槽から採取した金属サンプルに、監視対象の特定、及び採取時間を含めたロット記号を付与したうえでこれを分析し、この分析データをロット記号と共にホストコンピュータに入力し、溶融温度と前記分析データを予めホストコンピュータに備えた分析プログラムで分析する発明が知られている（例えば、特許文献１参照。）。 Conventionally, a metal sample collected from the solder bath of a dip soldering device is assigned a lot symbol including the identification of the monitoring target and the sampling time, and this analysis is performed. An invention is known in which a melting temperature and the analysis data are input and analyzed in advance by an analysis program provided in a host computer (see, for example, Patent Document 1).
特開２００９－１６８５６９号公報JP 2009-168869 A
　ところで、金属サンプルの成分分析には、蛍光Ｘ線分析装置等の分析装置が必要となる。このような分析装置は、高価であり、かつ大きな設置スペースを必要とするため、はんだ槽毎に分析装置を設置することは困難である。そのため、はんだ槽から採取したサンプルを、遠方に設置された分析装置まで、送付する必要がある。また、そのサンプルがどこのはんだ槽から採取されたものかを特定する必要があるため、そのはんだ槽が設置されている場所やそのはんだ槽の管理番号等を、作業者が用紙に記入するなどしてサンプルと一緒に分析装置の有るところへ送付する必要があった。 By the way, an analysis device such as a fluorescent X-ray analyzer is required for component analysis of a metal sample. Since such an analyzer is expensive and requires a large installation space, it is difficult to install the analyzer for each solder bath. Therefore, it is necessary to send the sample collected from the solder bath to an analyzer installed far away. In addition, because it is necessary to specify the solder bath from which the sample was taken, the worker enters the location of the solder bath and the management number of the solder bath on the form. Therefore, it was necessary to send the sample with the sample to the place with the analyzer.
　しかしながら、はんだ槽の設置場所や管理番号を用紙に記入するのは手間がかかり、記入しても誤記入や記入漏れ等があるとせっかくサンプルの成分分析を行ってもその分析結果をはんだ槽に正しく反映することができない。 However, it takes a lot of time to enter the location and control number of the solder bath on the paper, and if there is an error or omission of entry even if it is entered, the analysis result will be stored in the solder bath. It cannot be reflected correctly.
　本発明の目的は、はんだ槽から採取されたサンプルと、そのサンプルが採取されたはんだ槽とを容易に対応付けることができ、かつその対応付けを誤るおそれを低減することができるはんだサンプル管理システム、はんだ管理用サーバ装置、及びはんだサンプル管理方法を提供することである。 An object of the present invention is a solder sample management system capable of easily associating a sample collected from a solder bath with a solder bath from which the sample has been collected, and reducing the risk of erroneous association. A solder management server device and a solder sample management method are provided.
　本発明の一局面に従うはんだサンプル管理システムは、ユーザが操作する端末装置と、前記端末装置と通信可能なはんだ管理用サーバ装置とを備え、前記端末装置は、はんだを溶融するはんだ槽であって、かつ当該はんだ槽を識別する槽識別情報が読み取り可能に付与されたはんだ槽からの前記槽識別情報の読み取りと、はんだのサンプルを収容可能な容器であって、かつ当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器からの前記サンプル識別情報の読み取りとが可能な読取部と、前記読取部によって読み取られた、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信する識別情報取得部とを備え、前記はんだ管理用サーバ装置は、前記端末装置から送信された、前記槽識別情報と前記サンプル識別情報とを対応付けて記憶するサンプル情報記憶部と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを取得し、その成分分析結果とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果取得部とを含む。 A solder sample management system according to an aspect of the present invention includes a terminal device operated by a user and a server device for solder management that can communicate with the terminal device, and the terminal device is a solder bath for melting solder. And reading the tank identification information from the solder tank to which the tank identification information for identifying the solder tank is readable, and a sample identification for identifying the sample, which is a container that can contain a solder sample. A reading unit capable of reading the sample identification information from the container to which the information is readable, and the tank management information and the sample identification information read by the reading unit. The solder management server device includes the tank identification information transmitted from the terminal device. A sample information storage unit for storing the sample identification information in association with each other, a component analysis result of the sample contained in the container and the sample identification information given to the container, and acquiring the component analysis result and the sample identification An analysis result acquisition unit that associates information with each other and stores the information in the sample information storage unit.
　また、本発明の一局面に従うはんだ管理用サーバ装置は、はんだを溶融するはんだ槽であって、かつ当該はんだ槽を識別する槽識別情報が読み取り可能に付与されたはんだ槽からの前記槽識別情報の読み取りと、はんだのサンプルを収容可能であって、かつ当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器からの前記サンプル識別情報の読み取りとが可能な読取部と、前記読取部によって読み取られた、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信する識別情報取得部とを備えた端末装置と通信可能なはんだ管理用サーバ装置であって、前記端末装置から送信された、前記槽識別情報と前記サンプル識別情報とを対応付けて記憶するサンプル情報記憶部と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを取得し、その成分分析結果とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果取得部とを含む。 Further, the server device for solder management according to one aspect of the present invention is a solder bath for melting solder, and the bath identification information from the solder bath to which the bath identification information for identifying the solder bath is readable. And a reading unit capable of receiving a sample of solder and reading the sample identification information from a container to which sample identification information for identifying the sample is readable. A solder management server device that can communicate with a terminal device that includes an identification information acquisition unit that transmits the tank identification information and the sample identification information read to the solder management server device. A sample information storage unit that is transmitted from the apparatus and stores the tank identification information and the sample identification information in association with each other; Samples of the component analysis results and sample identification information given to the container acquires, including an analysis result obtaining unit to be stored in the component analysis results and the sample information storage unit in association with the sample identification information.
　また、本発明の一局面に従うはんだサンプル管理方法は、ユーザが操作する端末装置と、前記端末装置と通信可能であって管理対象のはんだサンプルに関する情報を記憶するためのサンプル情報記憶部を備えたはんだ管理用サーバ装置とを用いてはんだの成分分析結果を管理するはんだサンプル管理方法であって、はんだを溶融するはんだ槽に、当該はんだ槽を識別する槽識別情報を読み取り可能に付与する槽識別情報付与工程と、はんだのサンプルを収容可能な容器に、当該サンプルを識別するサンプル識別情報を読み取り可能に付与するサンプル識別情報付与工程と、前記容器に、前記はんだ槽内のはんだを採取するサンプル採取工程と、前記端末装置によって、前記槽識別情報と前記サンプル識別情報とを読み取らせる読取工程と、前記端末装置によって、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信させる識別情報送信工程と、前記はんだ管理用サーバ装置が、前記端末装置によって読み取られた前記槽識別情報と前記サンプル識別情報とを受信し、その槽識別情報とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させるサンプル情報記憶工程と、前記容器に収容されたサンプルの成分を分析する成分分析工程と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果記憶工程とを含む。 In addition, a solder sample management method according to one aspect of the present invention includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed. A solder sample management method for managing a component analysis result of solder using a server device for solder management, wherein a bath identification information for identifying the solder bath is provided to a solder bath for melting the solder in a readable manner An information providing step, a sample identification information providing step for allowing sample identification information for identifying the sample to be readable in a container capable of accommodating a solder sample, and a sample for collecting the solder in the solder bath in the container A collection step, and a reading step for reading the tank identification information and the sample identification information by the terminal device; An identification information transmission step for transmitting the bath identification information and the sample identification information to the solder management server device by the terminal device; and the bath identification information read by the terminal device by the solder management server device. A sample information storage step for receiving the sample identification information and the tank identification information and the sample identification information in association with each other and storing them in the sample information storage unit, and a component for analyzing the components of the sample contained in the container An analysis step, and an analysis result storage step of associating the component analysis result of the sample stored in the container with the sample identification information given to the container and storing the result in the sample information storage unit.
　また、本発明の一局面に従うはんだサンプル管理方法は、ユーザが操作する端末装置と、前記端末装置と通信可能であって管理対象のはんだサンプルに関する情報を記憶するためのサンプル情報記憶部を備えたはんだ管理用サーバ装置とを用いてはんだの成分分析結果を管理するはんだサンプル管理方法であって、槽識別情報が読み取り可能に付与され、当該槽識別情報により識別されるはんだ槽内のはんだのサンプルが採取された容器であって、当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器を取得するサンプル容器取得工程と、前記はんだ管理用サーバ装置が、前記端末装置によって読み取られた前記槽識別情報と前記サンプル識別情報とを受信し、その槽識別情報とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させるサンプル情報記憶工程と、前記容器取得工程で取得された容器に収容されたサンプルの成分を分析する成分分析工程と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果記憶工程とを含む。 In addition, a solder sample management method according to one aspect of the present invention includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed. A solder sample management method for managing solder component analysis results using a solder management server device, wherein bath identification information is provided in a readable manner, and the solder sample in the solder bath is identified by the bath identification information Sample container acquisition step of acquiring a container to which sample identification information for identifying the sample is readable is provided, and the solder management server device is read by the terminal device. The tank identification information and the sample identification information are received, and the tank identification information and the sample identification information are associated with each other. A sample information storage step to be stored in the sample information storage unit, a component analysis step for analyzing the components of the sample stored in the container acquired in the container acquisition step, and a component analysis result of the sample stored in the container An analysis result storing step of storing the sample identification information given to the container in association with the sample information storage unit.
本発明の一実施形態に係るはんだサンプル管理システム、及びはんだサンプル管理方法を大略的に説明するための概念図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a conceptual diagram for demonstrating roughly the solder sample management system and solder sample management method which concern on one Embodiment of this invention. 本発明の一実施形態に係るはんだサンプル管理システムの電気的構成の一例を示すブロック図である。It is a block diagram which shows an example of the electrical constitution of the solder sample management system which concerns on one Embodiment of this invention. はんだ槽情報の一例を示す表形式の説明図である。It is explanatory drawing of the table format which shows an example of solder tank information. 図２に示すサンプル情報記憶部に記憶された情報の一例を示す表形式の説明図である。It is explanatory drawing of the table format which shows an example of the information memorize | stored in the sample information storage part shown in FIG. はんだサンプル管理方法の一例を示すフローチャートである。It is a flowchart which shows an example of the solder sample management method. はんだサンプル管理方法の一例を示すフローチャートである。It is a flowchart which shows an example of the solder sample management method.
　以下、本発明に係る実施形態を図面に基づいて説明する。なお、各図において同一の符号を付した構成は、同一の構成であることを示し、その説明を省略する。図１は、本発明の一実施形態に係るはんだサンプル管理システム、及びはんだサンプル管理方法を大略的に説明するための概念図である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted. FIG. 1 is a conceptual diagram for schematically explaining a solder sample management system and a solder sample management method according to an embodiment of the present invention.
　図１に示す例では、電子機器の製造を行う工場Ａと、工場Ａで採取されたはんだサンプルの分析を行う分析所Ｂとが、離れて立地している例を示している。分析所Ｂには、はんだ管理用サーバ装置１と、分析装置２とが設置されている。工場Ａと分析所Ｂとは、同じ事業者が運営していてもよく、異なる事業者が運営していてもよい。また、はんだサンプル管理システム１０が、工場Ａと分析所Ｂとに分かれて配置される例に限らない。 The example shown in FIG. 1 shows an example in which a factory A that manufactures electronic devices and an analysis laboratory B that analyzes solder samples collected at the factory A are located apart from each other. In the laboratory B, a solder management server device 1 and an analysis device 2 are installed. The factory A and the analysis laboratory B may be operated by the same company or may be operated by different companies. Further, the solder sample management system 10 is not limited to an example in which the solder sample management system 10 is divided into the factory A and the analysis laboratory B.
　工場Ａには、はんだを溶融するためのはんだ槽３が設置されている。はんだ槽３は、いわゆるフローソルダリングを行うためのフローはんだ付け装置等に設けられている。はんだ槽３内に、溶融したはんだ４が貯留されている。図１では、はんだ槽３に基板を搬送する搬送機構やはんだの噴流機構等の記載は省略している。 In the factory A, a solder bath 3 for melting solder is installed. The solder bath 3 is provided in a flow soldering apparatus or the like for performing so-called flow soldering. A molten solder 4 is stored in the solder bath 3. In FIG. 1, descriptions of a transport mechanism for transporting the substrate to the solder bath 3 and a solder jet mechanism are omitted.
　はんだ槽３の外表面には、はんだ槽３を識別する槽識別情報を示す二次元コードが印刷された槽識別ラベルＬ１が貼付されている。また、はんだ槽３の外表面には、はんだ管理用サーバ装置１と通信可能な表示装置５が取り付けられている。二次元コードとしては、例えばＱＲコード（登録商標）を用いることができる。 A bath identification label L1 on which a two-dimensional code indicating bath identification information for identifying the solder bath 3 is printed is attached to the outer surface of the solder bath 3. A display device 5 capable of communicating with the solder management server device 1 is attached to the outer surface of the solder bath 3. As the two-dimensional code, for example, a QR code (registered trademark) can be used.
　容器６は、例えば耐熱紙などで構成されたサンプル採取用のカップ状の容器である。容器６には、容器６に採取されたサンプルを識別するサンプル識別情報を示す二次元コードが印刷されたサンプル識別ラベルＬ２が貼付されている。サンプル識別ラベルＬ２には、二次元コードの他に、分析装置２で分析を行う作業者が読み取れるように、サンプル識別情報が文字で表記されていることが好ましい。 The container 6 is a cup-shaped container for sample collection made of heat-resistant paper, for example. A sample identification label L2 on which a two-dimensional code indicating sample identification information for identifying a sample collected in the container 6 is printed is attached to the container 6. In addition to the two-dimensional code, the sample identification label L2 preferably has sample identification information written in characters so that an operator who performs analysis with the analyzer 2 can read it.
　工場Ａで作業するユーザＵは、例えば、ユーザＵを識別するユーザ識別情報を示す二次元コードが印刷された名札Ｌ３を、身に付けている。 For example, the user U working in the factory A wears a name tag L3 on which a two-dimensional code indicating user identification information for identifying the user U is printed.
　図２は、本発明の一実施形態に係るはんだサンプル管理システム１０の電気的構成の一例を示すブロック図である。図２に示すはんだサンプル管理システム１０は、はんだ管理用サーバ装置１、分析装置２、表示装置５、及びスマートフォン７（端末装置）を備えている。はんだ管理用サーバ装置１とスマートフォン７、はんだ管理用サーバ装置１と表示装置５は、それぞれネットワーク８を介して互いに通信可能に構成されている。 FIG. 2 is a block diagram showing an example of the electrical configuration of the solder sample management system 10 according to an embodiment of the present invention. A solder sample management system 10 shown in FIG. 2 includes a solder management server device 1, an analysis device 2, a display device 5, and a smartphone 7 (terminal device). The solder management server device 1 and the smartphone 7, and the solder management server device 1 and the display device 5 are configured to be able to communicate with each other via the network 8.
　ネットワーク８は、例えばインターネット、ＷＡＮ（Wide Area Network）、ＬＡＮ（Local Area Network）、及び移動体通信網等、有線又は無線の種々の通信ネットワーク、あるいはこれらが組み合わせられた通信ネットワークである。 The network 8 is, for example, various wired or wireless communication networks such as the Internet, a WAN (Wide Area Network), a LAN (Local Area Network), and a mobile communication network, or a communication network in which these are combined.
　スマートフォン７は、カメラ７１（読取部）と、識別情報取得部７２とを備えている。スマートフォン７は、例えば所定の演算処理を実行するＣＰＵ（Central Processing Unit）、データを一時的に記憶するＲＡＭ（Random Access Memory）、所定の制御プログラム等を記憶するフラッシュメモリ等の不揮発性の記憶部、移動体通信回路やＷｉｆｉ（Wireless Fidelity）等の無線通信回路、タッチ操作可能なタッチスクリーン（タッチパネルディスプレイ）、ＲＴＣ（Real Time Clock）、及びこれらの周辺回路等を備えて構成されている。 The smartphone 7 includes a camera 71 (reading unit) and an identification information acquisition unit 72. The smartphone 7 includes, for example, a CPU (Central Processing Unit) that executes predetermined arithmetic processing, a RAM (Random Access Memory) that temporarily stores data, a non-volatile storage unit such as a flash memory that stores a predetermined control program, etc. A mobile communication circuit, a wireless communication circuit such as WiFi (Wireless Fidelity), a touch screen (touch panel display) capable of touch operation, an RTC (Real Time Clock), and peripheral circuits thereof are configured.
　そして、スマートフォン７は、記憶部に記憶された制御プログラムを実行することによって、識別情報取得部７２として機能する。スマートフォン７を識別情報取得部７２として機能させるためのプログラムは、例えば、いわゆるアプリとしてネットワーク８を介してスマートフォン７へダウンロード可能とされている。以下、スマートフォン７を識別情報取得部７２として機能させるためのプログラムを、コード読取アプリと称する。 The smartphone 7 functions as the identification information acquisition unit 72 by executing the control program stored in the storage unit. A program for causing the smartphone 7 to function as the identification information acquisition unit 72 can be downloaded to the smartphone 7 via the network 8 as a so-called application, for example. Hereinafter, a program for causing the smartphone 7 to function as the identification information acquisition unit 72 is referred to as a code reading application.
　カメラ７１は、例えばＣＭＯＳ（Complementary Metal Oxide Semiconductor）やＣＣＤ（Charge Coupled Device）等の撮像素子を用いて構成されている。ユーザＵは、はんだ槽３内の溶融はんだ４を容器６に収容し、スマートフォン７を操作してコード読取アプリを起動し、はんだ槽３に付与された槽識別ラベルＬ１と容器６に付与されたサンプル識別ラベルＬ２とユーザＵの名札Ｌ３とをカメラ７１によって撮像させた後、例えば識別情報の取得操作が終了した旨を示す撮影終了ボタンをタッチする。撮影終了ボタンは、例えばコード読取アプリによってタッチスクリーンに表示されるようになっている。 The camera 71 is configured using an imaging element such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device). The user U accommodates the molten solder 4 in the solder tank 3 in the container 6, operates the smartphone 7 to start the code reading application, and is applied to the tank identification label L <b> 1 given to the solder tank 3 and the container 6. After the sample identification label L2 and the name tag L3 of the user U are imaged by the camera 71, for example, a shooting end button indicating that the operation for acquiring the identification information is ended is touched. The photographing end button is displayed on the touch screen by a code reading application, for example.
　識別情報取得部７２は、撮影終了ボタンがタッチされると、カメラ７１によって撮像された、槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３の画像からそれぞれ二次元コードを抽出する。そして、識別情報取得部７２は、抽出された二次元コードをデコードして、槽識別情報、サンプル識別情報、及びユーザ識別情報を取得し、これらの識別情報を対応付けて、ＲＴＣで得られた現在日時を示す日時情報と共にネットワーク８を介してはんだ管理用サーバ装置１へ送信する。 When the photographing end button is touched, the identification information acquisition unit 72 extracts a two-dimensional code from the images of the tank identification label L1, the sample identification label L2, and the name tag L3 captured by the camera 71, respectively. And the identification information acquisition part 72 decodes the extracted two-dimensional code, acquires tank identification information, sample identification information, and user identification information, matched these identification information, and was obtained by RTC The date and time information indicating the current date and time is transmitted to the solder management server device 1 via the network 8.
　なお、識別情報取得部７２は、必ずしも二次元コードをデコードしなくてもよい。識別情報取得部７２は、読み取られた二次元コードをそのまま槽識別情報、サンプル識別情報、及びユーザ識別情報としてはんだ管理用サーバ装置１へ送信し、はんだ管理用サーバ装置１で二次元コードをデコードしてもよい。 Note that the identification information acquisition unit 72 does not necessarily have to decode the two-dimensional code. The identification information acquisition unit 72 transmits the read two-dimensional code as it is to the solder management server device 1 as tank identification information, sample identification information, and user identification information, and the solder management server device 1 decodes the two-dimensional code. May be.
　また、槽識別情報、サンプル識別情報、及びユーザ識別情報は、二次元コードで表示される例に限らない。槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３には、槽識別情報、サンプル識別情報、及びユーザ識別情報は、バーコードで表示されていてもよく、文字で表示されていてもよい。文字で表示されていた場合、識別情報取得部７２は、ＯＣＲ（Optical Character Recognition/Reader）によって、槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３の画像から、槽識別情報、サンプル識別情報、及びユーザ識別情報を読み取る構成としてもよい。また、ラベルを用いずに直接識別情報を表示してもよい。 Further, the tank identification information, the sample identification information, and the user identification information are not limited to the example displayed as a two-dimensional code. On the tank identification label L1, the sample identification label L2, and the name tag L3, the tank identification information, the sample identification information, and the user identification information may be displayed as barcodes or as characters. When displayed in characters, the identification information acquisition unit 72 uses the OCR (OpticalOptCharacter Recognition / Reader), from the images of the tank identification label L1, the sample identification label L2, and the name tag L3, to identify the tank identification information, the sample identification information, And it is good also as a structure which reads user identification information. Moreover, you may display identification information directly, without using a label.
　また、二次元コード、バーコード、及び文字等により槽識別情報、サンプル識別情報、及びユーザ識別情報を表示する例に限らない。例えば、いわゆるＩＤタグを用いて槽識別情報、サンプル識別情報、及びユーザ識別情報を、はんだ槽３、容器６、及びユーザＵに付与し、端末装置にＩＤタグの読取装置を備えてもよい。また、はんだ槽３、容器６、及びユーザＵへの槽識別情報、サンプル識別情報、及びユーザ識別情報の付与方法は、互いに異なっていてもよい。 Further, the present invention is not limited to the example in which the tank identification information, the sample identification information, and the user identification information are displayed by a two-dimensional code, a barcode, and characters. For example, bath identification information, sample identification information, and user identification information may be provided to the solder bath 3, the container 6, and the user U using a so-called ID tag, and the terminal device may be provided with an ID tag reader. Moreover, the method of giving the bath identification information, the sample identification information, and the user identification information to the solder bath 3, the container 6, and the user U may be different from each other.
　しかしながら、槽識別情報、サンプル識別情報、及びユーザ識別情報を、二次元コード又はバーコードで表示する構成とすれば、識別情報取得部７２による各識別情報の取得処理が容易であり、かつＩＤタグよりも安価である。 However, if the tank identification information, the sample identification information, and the user identification information are displayed in a two-dimensional code or a barcode, the identification information acquisition unit 72 can easily acquire each identification information, and the ID tag Less expensive.
　分析装置２は、容器６に採取されたはんだサンプルの成分を分析する分析装置である。分析装置２としては、例えば蛍光Ｘ線分析装置等を用いることができる。分析装置２は、はんだサンプルの成分を分析し、その成分分析結果を示す情報を生成する。成分分析結果は、例えば、サンプルに含まれるＳｎ（錫）、Ｃｕ（銅）、Ｎｉ（ニッケル）、Ｇｅ（ゲルマニウム）、Ｐｂ（鉛）等、はんだサンプルに含まれる成分の含有比率を示す情報である。 The analyzer 2 is an analyzer that analyzes the components of the solder sample collected in the container 6. As the analyzer 2, for example, a fluorescent X-ray analyzer can be used. The analysis device 2 analyzes the components of the solder sample and generates information indicating the component analysis results. The component analysis result is information indicating the content ratio of the components contained in the solder sample such as Sn (tin), Cu (copper), Ni (nickel), Ge (germanium), Pb (lead) contained in the sample. is there.
　分析装置２で分析を行う際に、作業者は、例えば容器６のサンプル識別ラベルＬ２に文字で記載されたサンプル識別情報を読み取って、図略のキーボードを用いてそのサンプル識別情報を分析装置２に入力する。あるいは、二次元コードやバーコード等の図略の読取装置を用いてサンプル識別ラベルＬ２からサンプル識別情報を読み取って、分析装置２に入力するようにしてもよい。これにより、分析装置２によるはんだサンプルの成分分析結果とサンプル識別情報とを対応付けることができる。 When performing analysis with the analyzer 2, for example, the operator reads the sample identification information written in characters on the sample identification label L <b> 2 of the container 6, and uses the unillustrated keyboard to analyze the sample identification information. To enter. Alternatively, sample identification information may be read from the sample identification label L2 using a reading device (not shown) such as a two-dimensional code or a barcode, and input to the analysis device 2. Thereby, the component analysis result of the solder sample by the analyzer 2 can be associated with the sample identification information.
　分析装置２は、例えばＬＡＮ等のネットワークを介してはんだ管理用サーバ装置１と通信可能に接続されている。分析装置２は、成分分析結果とサンプル識別情報とを対応付けてネットワークを介してはんだ管理用サーバ装置１へ送信する。なお、分析装置２は、成分分析結果とサンプル識別情報とを対応付けた情報を、メモリカード等の記憶媒体に記憶し、その記憶媒体をはんだ管理用サーバ装置１で読み取ることで、はんだ管理用サーバ装置１が、サンプル識別情報と対応付けられた成分分析結果を取得する構成であってもよい。 The analysis device 2 is connected to the solder management server device 1 through a network such as a LAN so as to be communicable. The analysis device 2 associates the component analysis results with the sample identification information and transmits them to the solder management server device 1 via the network. The analysis device 2 stores information in which the component analysis result and the sample identification information are associated with each other in a storage medium such as a memory card, and reads the storage medium with the solder management server device 1 so that it can be used for solder management. The server device 1 may be configured to acquire the component analysis result associated with the sample identification information.
　はんだ管理用サーバ装置１は、例えば所定の演算処理を実行するＣＰＵ、データを一時的に記憶するＲＡＭ、所定の制御プログラム等を記憶するＨＤＤ（Hard Disk Drive）やＳＳＤ（Solid State Drive）等の不揮発性の記憶装置、ネットワーク８にアクセス可能な通信インターフェイス回路、キーボード、マウス、ディスプレイ、及びこれらの周辺回路等を備えて構成されている。 The solder management server device 1 includes, for example, a CPU that executes predetermined arithmetic processing, a RAM that temporarily stores data, an HDD (Hard Disk Drive), an SSD (Solid State Drive), and the like that store predetermined control programs. A nonvolatile storage device, a communication interface circuit that can access the network 8, a keyboard, a mouse, a display, and peripheral circuits thereof are configured.
　はんだ管理用サーバ装置１は、記憶装置に記憶された制御プログラムを実行することによって、記憶処理部１１、分析結果取得部１２、対応方法判断部１３、及び報知処理部１４として機能する。また、記憶装置は、はんだ槽情報記憶部１６及びサンプル情報記憶部１７として用いられる。 The solder management server device 1 functions as a storage processing unit 11, an analysis result acquisition unit 12, a handling method determination unit 13, and a notification processing unit 14 by executing a control program stored in the storage device. The storage device is used as the solder bath information storage unit 16 and the sample information storage unit 17.
　はんだ槽情報記憶部１６には、槽識別情報により識別されるはんだ槽に関するはんだ槽情報が予め記憶されている。図３は、はんだ槽情報Ｄ１の一例を示す表形式の説明図である。図３に示すはんだ槽情報Ｄ１では、槽識別情報と対応付けて、その槽識別情報により識別されるはんだ槽の管理者である会社の会社名と、そのはんだ槽が設置されている工場名及び製造ラインのライン名称と、そのはんだ槽に取り付けられた表示装置５の通信アドレスと、成分分析結果を判断するための基準となる基準成分情報とが対応付けられている。 The solder tank information storage unit 16 stores in advance solder tank information related to the solder tank identified by the tank identification information. FIG. 3 is an explanatory diagram in a tabular format showing an example of the solder bath information D1. In the solder tank information D1 shown in FIG. 3, the company name of the company that is the administrator of the solder tank identified by the tank identification information in association with the tank identification information, the name of the factory where the solder tank is installed, and The line name of the production line, the communication address of the display device 5 attached to the solder tank, and reference component information that is a reference for determining the component analysis result are associated with each other.
　基準成分情報は、対応するはんだ槽で用いられているはんだの、適切な各成分の含有比率を示す情報である。 The reference component information is information indicating the appropriate content ratio of each component of the solder used in the corresponding solder bath.
　記憶処理部１１は、スマートフォン７から送信された、槽識別情報、サンプル識別情報、ユーザ識別情報、及び日時情報を受信し、これらの情報を対応付けてサンプル情報記憶部１７に記憶させる。図４は、サンプル情報記憶部１７に記憶された情報の一例を示す表形式の説明図である。図４に示すように、記憶処理部１１には、スマートフォン７から送信された槽識別情報、サンプル識別情報、ユーザ識別情報、及び日時情報が、対応付けられて記憶されている。 The storage processing unit 11 receives the tank identification information, the sample identification information, the user identification information, and the date / time information transmitted from the smartphone 7 and stores these information in the sample information storage unit 17 in association with each other. FIG. 4 is an explanatory diagram of a table format showing an example of information stored in the sample information storage unit 17. As illustrated in FIG. 4, the storage processing unit 11 stores tank identification information, sample identification information, user identification information, and date / time information transmitted from the smartphone 7 in association with each other.
　分析結果取得部１２は、サンプル識別情報と対応付けられた成分分析結果を、分析装置２から受信したり、あるいは成分分析結果が記憶された記憶媒体から読み取ったりすることによって、容器６に収容されたサンプルの成分分析結果と当該容器６に付与されたサンプル識別情報とを対応付けて取得する。そして、分析結果取得部１２は、図４に示すように、サンプル情報記憶部１７に、サンプル識別情報と対応付けてその成分分析結果を記憶させる。 The analysis result acquisition unit 12 is accommodated in the container 6 by receiving the component analysis result associated with the sample identification information from the analysis device 2 or reading it from the storage medium storing the component analysis result. The component analysis result of the sample and the sample identification information given to the container 6 are acquired in association with each other. Then, as shown in FIG. 4, the analysis result acquisition unit 12 causes the sample information storage unit 17 to store the component analysis result in association with the sample identification information.
　対応方法判断部１３は、成分分析結果と基準成分情報とに基づいて、対応するはんだ槽内のはんだ成分を改善するための対応方法を判断する。報知処理部１４は、成分分析結果、又は対応方法を報知情報として報知する。 The response method determination unit 13 determines a response method for improving the solder component in the corresponding solder bath based on the component analysis result and the reference component information. The notification processing unit 14 notifies the component analysis result or the handling method as notification information.
　次に、上述のように構成されたはんだサンプル管理システム１０を用いたはんだサンプル管理方法について説明する。図５、図６は、はんだサンプル管理方法の一例を示すフローチャートである。以下の各ステップの実行順序も一例であって、下記の順序に限らない。 Next, a solder sample management method using the solder sample management system 10 configured as described above will be described. 5 and 6 are flowcharts showing an example of a solder sample management method. The execution order of the following steps is also an example, and is not limited to the following order.
　まず、ユーザＵは、はんだ槽３に槽識別ラベルＬ１を貼付し、はんだ槽３に槽識別情報を付与する（ステップＳ１：槽識別情報付与工程）。 First, the user U affixes the bath identification label L1 to the solder bath 3 and gives bath identification information to the solder bath 3 (step S1: bath identification information applying step).
　次に、分析所Ｂの作業者が、はんだ管理用サーバ装置１を操作して、槽識別ラベルＬ１の槽識別情報と対応するはんだ槽情報を、はんだ槽情報記憶部１６に記憶させる（ステップＳ２：槽情報記憶工程）。 Next, the operator of the laboratory B operates the solder management server device 1 to store the solder bath information corresponding to the bath identification information of the bath identification label L1 in the solder bath information storage unit 16 (step S2). : Tank information storage step).
　次に、分析所Ｂの作業者が、サンプル識別ラベルＬ２を容器６に貼付してユーザＵに配布する（ステップＳ３： サンプル識別情報付与工程）。例えば分析所Ｂの作業者が、互いに異なるサンプル識別情報が印字されたサンプル識別ラベルＬ２を複数の容器６に貼付し、それら複数の容器６を予めユーザＵに配布しておくとよい。 Next, the worker of the laboratory B attaches the sample identification label L2 to the container 6 and distributes it to the user U (step S3: sample identification information adding step). For example, an operator of the laboratory B may apply sample identification labels L2 on which different sample identification information is printed to a plurality of containers 6 and distribute the plurality of containers 6 to the user U in advance.
　次に、ユーザＵが、成分分析しようとするはんだ槽３内のはんだ４を容器６に採取する（ステップＳ４：サンプル採取工程）。次に、ユーザＵが、スマートフォン７のコード読取アプリを起動し、槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３を撮像し、槽識別情報、サンプル識別情報、及びユーザ識別情報の読み取りを実行する（ステップＳ５：読取工程）。 Next, the user U collects the solder 4 in the solder tank 3 to be subjected to component analysis into the container 6 (step S4: sample collection step). Next, the user U activates the code reading application of the smartphone 7 and images the tank identification label L1, the sample identification label L2, and the name tag L3, and reads the tank identification information, the sample identification information, and the user identification information. (Step S5: reading step).
　次に、ユーザＵが、スマートフォン７のタッチスクリーンに表示された撮影終了ボタンをタッチすると、識別情報取得部７２によって、槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３の画像から抽出された二次元コードがデコードされ、槽識別情報、サンプル識別情報、及びユーザ識別情報が取得され、これらの識別情報が対応付けられて、ＲＴＣで得られた現在日時を示す日時情報と共にネットワーク８を介してはんだ管理用サーバ装置１へ送信される（ステップＳ６：識別情報送信工程）。 Next, when the user U touches the shooting end button displayed on the touch screen of the smartphone 7, the identification information acquisition unit 72 extracts the two extracted from the images of the tank identification label L1, the sample identification label L2, and the name tag L3. The dimension code is decoded, the tank identification information, the sample identification information, and the user identification information are acquired. These identification information are associated with each other and soldered via the network 8 together with the date / time information indicating the current date / time obtained by the RTC. It is transmitted to the management server device 1 (step S6: identification information transmission step).
　一方、はんだ管理用サーバ装置１は、スマートフォン７から、槽識別情報、サンプル識別情報、ユーザ識別情報、及び日時情報を受信し、これらを対応付けてサンプル情報記憶部１７に記憶させる（ステップＳ７：サンプル情報記憶工程）。 On the other hand, the solder management server device 1 receives the tank identification information, the sample identification information, the user identification information, and the date / time information from the smartphone 7, and stores them in the sample information storage unit 17 in association with each other (step S7: Sample information storage step).
　また、ユーザＵは、はんだサンプルの入った容器６を、例えば郵送するなどして分析所Ｂへ送付する（ステップＳ８）。 Further, the user U sends the container 6 containing the solder sample to the laboratory B by mailing, for example (step S8).
　分析所Ｂでは、送付されてきたはんだサンプル入りの容器６を受け取って（ステップＳ１１：サンプル容器取得工程）、分析装置２を用いて容器６に収容されたはんだサンプルの成分を分析する（ステップＳ１２：成分分析工程）。このとき、作業者は、容器６のサンプル識別ラベルＬ２に記載されたサンプル識別情報を読み取って分析装置２に入力する。分析装置２は、成分分析結果とサンプル識別情報とを対応付けて、はんだ管理用サーバ装置１へ送信する。 In the laboratory B, the received container 6 containing the solder sample is received (step S11: sample container acquisition process), and the components of the solder sample contained in the container 6 are analyzed using the analyzer 2 (step S12). : Component analysis step). At this time, the operator reads the sample identification information written on the sample identification label L <b> 2 of the container 6 and inputs it to the analyzer 2. The analysis device 2 associates the component analysis result with the sample identification information and transmits the result to the solder management server device 1.
　成分分析結果と容器６に付与されたサンプル識別情報とを受信したはんだ管理用サーバ装置１は、その成分分析結果とサンプル識別情報とを対応付けてサンプル情報記憶部１７に記憶する（Ｓ１３：分析結果記憶工程）。 The solder management server device 1 that has received the component analysis result and the sample identification information given to the container 6 stores the component analysis result and the sample identification information in association with each other in the sample information storage unit 17 (S13: Analysis). Result storage step).
　これにより、サンプル情報記憶部１７には、図４に示すように、検査対象のはんだ槽３を識別する槽識別情報と、サンプルを特定するサンプル識別情報と、サンプルを採取したユーザＵのユーザ識別情報と、そのサンプルの成分分析結果とが対応付けられて記憶されるので、はんだサンプルの成分分析結果を適切に管理することが可能となる。また、はんだ槽情報記憶部１６には、槽識別情報と対応付けて、はんだ槽３の管理者である会社名や設置場所等を示すはんだ槽情報Ｄ１が予め記憶されているので、サンプル情報記憶部１７とはんだ槽情報Ｄ１とを参照することで、槽識別情報に基づいて、はんだ槽３のはんだ成分の分析結果と、そのはんだ槽３の管理者やそのはんだ槽３が何処に設置されているかとを、容易に知ることができる。 Thereby, in the sample information storage unit 17, as shown in FIG. 4, the bath identification information for identifying the solder bath 3 to be inspected, the sample identification information for specifying the sample, and the user identification of the user U who collected the sample Since the information and the component analysis result of the sample are stored in association with each other, the component analysis result of the solder sample can be appropriately managed. In addition, the solder tank information storage unit 16 stores in advance the solder tank information D1 indicating the company name, the installation location, and the like, which is the manager of the solder tank 3, in association with the tank identification information. By referring to the section 17 and the solder bath information D1, based on the bath identification information, the analysis result of the solder component of the solder bath 3, the manager of the solder bath 3, and the solder bath 3 are installed. You can easily know if you are.
　また、ユーザＵは、はんだサンプルを取得する際に、はんだ槽が設置されている場所やそのはんだ槽の管理番号等を、用紙に記入するなどする必要がなく、スマートフォン７で槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３を撮像するだけでよいので、はんだ槽から採取されたサンプルと、そのサンプルが採取されたはんだ槽とを対応付ける作業が容易となる。また、ユーザＵによる誤記や記入漏れが防止されるので、サンプルとそのサンプルが採取されたはんだ槽との対応付けを誤るおそれが低減される。 Further, when the user U obtains a solder sample, it is not necessary to fill in a sheet with the location where the solder tank is installed, the management number of the solder tank, etc. Since it is only necessary to image the sample identification label L2 and the name tag L3, the work of associating the sample taken from the solder bath with the solder bath from which the sample was taken is facilitated. Moreover, since a user's U's mistaken entry and omission of an entry are prevented, a possibility that a sample and a solder tank from which the sample is collected is erroneously associated is reduced.
　次に、対応方法判断部１３は、サンプル情報記憶部１７に記憶された成分分析結果と、はんだ槽情報記憶部１６に記憶されたはんだ槽情報Ｄ１に含まれる基準成分情報とに基づいて、対応するはんだ槽内のはんだ成分を改善するための対応方法を判断する（Ｓ１４：対応方法判断工程）。 Next, the handling method determination unit 13 responds based on the component analysis result stored in the sample information storage unit 17 and the reference component information included in the solder bath information D1 stored in the solder bath information storage unit 16. A response method for improving the solder component in the solder bath is determined (S14: response method determination step).
　具体的には、対応方法判断部１３は、成分分析結果で示される各成分の含有比率と、基準成分情報で示される各成分の含有比率とを比較し、すべての成分について、基準成分情報で示される含有比率との差が、成分毎に予め設定された判定基準以下の場合、例えば３０％以下の場合、適正であると判定する。一方、対応方法判断部１３は、成分分析結果で示される成分の含有比率と基準成分情報で示される含有比率との差が、判定基準を超える成分があった場合、不適正と判定する。 Specifically, the handling method determination unit 13 compares the content ratio of each component indicated by the component analysis result with the content ratio of each component indicated by the reference component information, and uses the reference component information for all the components. When the difference from the indicated content ratio is equal to or less than a criterion set in advance for each component, for example, 30% or less, it is determined to be appropriate. On the other hand, if the difference between the content ratio of the component indicated by the component analysis result and the content ratio indicated by the reference component information exceeds the determination criterion, the handling method determination unit 13 determines that it is inappropriate.
　さらに、不適正と判定された場合、対応方法判断部１３は、差が判定基準を超えた成分について、はんだ槽３内のはんだ成分を改善するための対応方法を判断する。具体的には、差が判定基準を超えて過剰な成分があった場合、その成分を除いた他の成分をはんだ槽３に投入する方法がある。例えば、基準成分情報で示される成分がＳｎ（錫）、Ｃｕ（銅）、Ｎｉ（ニッケル）であり、過剰な成分がＣｕ（銅）の場合、Ｓｎ（錫）とＮｉ（ニッケル）をはんだ槽３に投入することによってはんだ槽３内のはんだ成分を改善できる。 Furthermore, when it is determined as inappropriate, the response method determination unit 13 determines a response method for improving the solder component in the solder bath 3 for the component whose difference exceeds the determination criterion. Specifically, there is a method in which when the difference exceeds the determination criterion and there is an excessive component, other components excluding the component are put into the solder bath 3. For example, when the components indicated by the reference component information are Sn (tin), Cu (copper), and Ni (nickel), and the excess component is Cu (copper), Sn (tin) and Ni (nickel) are used as a solder bath. The solder component in the solder bath 3 can be improved by putting it into 3.
　あるいは、はんだに含まれる各成分の融点の差に基づいて、過剰な成分を取り除く方法がある。例えば、過剰な成分がＣｕ（銅）の場合、Ｃｕ（銅）の融点は他の成分より高いので、溶融はんだの温度をゆっくり低下させるとＣｕ（銅）が析出する。析出したＣｕ（銅）を取り除くことによって、はんだ槽３内のはんだ成分を改善できる。 Alternatively, there is a method of removing excess components based on the difference in melting point of each component contained in the solder. For example, when the excess component is Cu (copper), the melting point of Cu (copper) is higher than that of the other components, and therefore when the temperature of the molten solder is slowly lowered, Cu (copper) is precipitated. By removing the deposited Cu (copper), the solder component in the solder bath 3 can be improved.
　不適正となった場合のこのような改善方法を、成分毎に予めはんだ管理用サーバ装置１の記憶装置に記憶しておくことによって、対応方法判断部１３は、差が判定基準を超えた成分について、はんだ槽３内のはんだ成分を改善するための対応方法を判断することが可能となる。 By storing such an improvement method in the case of inappropriateness in advance in the storage device of the solder management server device 1 for each component, the handling method determination unit 13 allows the component whose difference exceeds the determination criterion. It is possible to determine a corresponding method for improving the solder component in the solder bath 3.
　次に、報知処理部１４は、はんだ槽情報記憶部１６を参照し、はんだ槽情報Ｄ１によって、対象の槽識別情報と対応付けられている通信アドレスを取得する。そして、報知処理部１４は、サンプル情報記憶部１７を参照し、対象の槽識別情報と対応付けられている分析結果と、適正か不適正かの判断結果と、はんだ成分を改善するための対応方法とを示す報知情報を、この通信アドレス宛に送信する。これにより、対象のはんだ槽３に取り付けられた表示装置５によって、そのはんだ槽３内の溶融はんだの成分分析結果と、適正か不適正かの判断結果と、はんだ成分を改善するための対応方法とが表示される（ステップＳ１５：報知処理工程）。 Next, the notification processing unit 14 refers to the solder bath information storage unit 16 and acquires a communication address associated with the target bath identification information based on the solder bath information D1. And the alerting | reporting process part 14 refers to the sample information storage part 17, the analysis result matched with the target tank identification information, the judgment result of appropriateness or improperness, and the correspondence for improving a solder component Broadcast information indicating a method is transmitted to this communication address. Thereby, by the display device 5 attached to the target solder tank 3, the component analysis result of the molten solder in the solder tank 3, the determination result of appropriate or inappropriate, and the corresponding method for improving the solder component Is displayed (step S15: notification processing step).
　なお、表示装置５を備えず、報知処理部１４は、はんだ管理用サーバ装置１のディスプレイ装置に報知情報を表示させたり、プリンターで報知情報を印刷したりしてもよい。このような場合であっても、サンプル情報記憶部１７にはユーザ識別情報がサンプル識別情報と対応付けて記憶されているので、分析所Ｂの作業者は、そのユーザ識別情報で示されるユーザＵに対して報知情報を知らせることができる。 The notification processing unit 14 may not display the display device 5 and may display the notification information on the display device of the solder management server device 1 or print the notification information with a printer. Even in such a case, since the user identification information is stored in the sample information storage unit 17 in association with the sample identification information, the operator of the laboratory B can use the user U indicated by the user identification information. Can be notified of notification information.
　ステップＳ１～Ｓ１５の工程により、ユーザＵは、はんだサンプルを容器６に採取して分析所Ｂへ送付し、スマートフォン７で槽識別ラベルＬ１、サンプル識別ラベルＬ２、及び名札Ｌ３を撮像するだけで、そのはんだ槽３内のはんだ４の成分分析結果、適正か不適正かの判断結果、及びはんだ成分を改善するための対応方法を知ることができるので、ユーザＵの利便性が向上する。 By the steps S1 to S15, the user U collects the solder sample in the container 6 and sends it to the laboratory B, and the smartphone 7 only takes an image of the tank identification label L1, the sample identification label L2, and the name tag L3. Since it is possible to know the component analysis result of the solder 4 in the solder bath 3, the determination result of appropriateness or inappropriateness, and the handling method for improving the solder component, the convenience of the user U is improved.
　なお、サンプル情報記憶部１７には、必ずしもユーザ識別情報を記憶する必要はなく、ステップＳ５において、名札Ｌ３からユーザ識別情報を読み取らなくてもよい。また、はんだサンプル管理方法は、分析所Ｂで実施される方法であってもよく、ステップＳ１，Ｓ５，Ｓ６，Ｓ８を含んでいなくてもよい。また、はんだ管理用サーバ装置１は、必ずしも成分分析結果の判断を行う必要はなく、対応方法判断部１３を備えず、ステップＳ１４を実行しなくてもよい。また、はんだ管理用サーバ装置１は、報知処理部１４を備えず、ステップＳ１５を実行しなくてもよい。 Note that it is not always necessary to store the user identification information in the sample information storage unit 17, and it is not necessary to read the user identification information from the name tag L3 in step S5. Further, the solder sample management method may be a method implemented in the laboratory B, and may not include steps S1, S5, S6, and S8. Also, the solder management server device 1 does not necessarily need to determine the component analysis result, does not include the handling method determination unit 13, and does not have to execute step S14. Also, the solder management server device 1 does not include the notification processing unit 14 and does not have to execute Step S15.
　すなわち、本発明の一局面に従うはんだサンプル管理システムは、ユーザが操作する端末装置と、前記端末装置と通信可能なはんだ管理用サーバ装置とを備え、前記端末装置は、はんだを溶融するはんだ槽であって、かつ当該はんだ槽を識別する槽識別情報が読み取り可能に付与されたはんだ槽からの前記槽識別情報の読み取りと、はんだのサンプルを収容可能な容器であって、かつ当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器からの前記サンプル識別情報の読み取りとが可能な読取部と、前記読取部によって読み取られた、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信する識別情報取得部とを備え、前記はんだ管理用サーバ装置は、前記端末装置から送信された、前記槽識別情報と前記サンプル識別情報とを対応付けて記憶するサンプル情報記憶部と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを取得し、その成分分析結果とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果取得部とを含む。 That is, a solder sample management system according to one aspect of the present invention includes a terminal device operated by a user and a solder management server device capable of communicating with the terminal device, and the terminal device is a solder bath for melting solder. And reading the tank identification information from the solder tank to which the tank identification information for identifying the solder tank is readable, and a container capable of accommodating a solder sample, and identifying the sample A reading unit capable of reading the sample identification information from a container to which sample identification information is readable, and the tank identification information and the sample identification information read by the reading unit are used for the solder management. An identification information acquisition unit for transmitting to the server device, wherein the solder management server device is transmitted from the terminal device, The sample information storage unit for storing the different information and the sample identification information in association with each other, the component analysis result of the sample stored in the container, and the sample identification information given to the container are acquired, and the component analysis result And an analysis result acquisition unit that associates the sample identification information with each other and stores the sample identification information in the sample information storage unit.
　また、本発明の一局面に従うはんだ管理用サーバ装置は、はんだを溶融するはんだ槽であって、かつ当該はんだ槽を識別する槽識別情報が読み取り可能に付与されたはんだ槽からの前記槽識別情報の読み取りと、はんだのサンプルを収容可能であって、かつ当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器からの前記サンプル識別情報の読み取りとが可能な読取部と、前記読取部によって読み取られた、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信する識別情報取得部とを備えた端末装置と通信可能なはんだ管理用サーバ装置であって、前記端末装置から送信された、前記槽識別情報と前記サンプル識別情報とを対応付けて記憶するサンプル情報記憶部と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを取得し、その成分分析結果とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果取得部とを含む。 Further, the server device for solder management according to one aspect of the present invention is a solder bath for melting solder, and the bath identification information from the solder bath to which the bath identification information for identifying the solder bath is readable. And a reading unit capable of receiving a sample of solder and reading the sample identification information from a container to which sample identification information for identifying the sample is readable. A solder management server device that can communicate with a terminal device that includes an identification information acquisition unit that transmits the tank identification information and the sample identification information read to the solder management server device. A sample information storage unit that is transmitted from the apparatus and stores the tank identification information and the sample identification information in association with each other; Samples of the component analysis results and sample identification information given to the container acquires, including an analysis result obtaining unit to be stored in the component analysis results and the sample information storage unit in association with the sample identification information.
　また、本発明の一局面に従うはんだサンプル管理方法は、ユーザが操作する端末装置と、前記端末装置と通信可能であって管理対象のはんだサンプルに関する情報を記憶するためのサンプル情報記憶部を備えたはんだ管理用サーバ装置とを用いてはんだの成分分析結果を管理するはんだサンプル管理方法であって、はんだを溶融するはんだ槽に、当該はんだ槽を識別する槽識別情報を読み取り可能に付与する槽識別情報付与工程と、はんだのサンプルを収容可能な容器に、当該サンプルを識別するサンプル識別情報を読み取り可能に付与するサンプル識別情報付与工程と、前記容器に、前記はんだ槽内のはんだを採取するサンプル採取工程と、前記端末装置によって、前記槽識別情報と前記サンプル識別情報とを読み取らせる読取工程と、前記端末装置によって、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信させる識別情報送信工程と、前記はんだ管理用サーバ装置が、前記端末装置によって読み取られた前記槽識別情報と前記サンプル識別情報とを受信し、その槽識別情報とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させるサンプル情報記憶工程と、前記容器に収容されたサンプルの成分を分析する成分分析工程と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果記憶工程とを含む。 In addition, a solder sample management method according to one aspect of the present invention includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed. A solder sample management method for managing a component analysis result of solder using a server device for solder management, wherein a bath identification information for identifying the solder bath is provided to a solder bath for melting the solder in a readable manner An information providing step, a sample identification information providing step for allowing sample identification information for identifying the sample to be readable in a container capable of accommodating a solder sample, and a sample for collecting the solder in the solder bath in the container A collection step, and a reading step for reading the tank identification information and the sample identification information by the terminal device; An identification information transmission step for transmitting the bath identification information and the sample identification information to the solder management server device by the terminal device; and the bath identification information read by the terminal device by the solder management server device. A sample information storage step for receiving the sample identification information and the tank identification information and the sample identification information in association with each other and storing them in the sample information storage unit, and a component for analyzing the components of the sample contained in the container An analysis step, and an analysis result storage step of associating the component analysis result of the sample stored in the container with the sample identification information given to the container and storing the result in the sample information storage unit.
　また、本発明の一局面に従うはんだサンプル管理方法は、ユーザが操作する端末装置と、前記端末装置と通信可能であって管理対象のはんだサンプルに関する情報を記憶するためのサンプル情報記憶部を備えたはんだ管理用サーバ装置とを用いてはんだの成分分析結果を管理するはんだサンプル管理方法であって、槽識別情報が読み取り可能に付与され、当該槽識別情報により識別されるはんだ槽内のはんだのサンプルが採取された容器であって、当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器を取得するサンプル容器取得工程と、前記はんだ管理用サーバ装置が、前記端末装置によって読み取られた前記槽識別情報と前記サンプル識別情報とを受信し、その槽識別情報とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させるサンプル情報記憶工程と、前記容器取得工程で取得された容器に収容されたサンプルの成分を分析する成分分析工程と、前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果記憶工程とを含む。 In addition, a solder sample management method according to one aspect of the present invention includes a terminal device operated by a user and a sample information storage unit that can communicate with the terminal device and store information related to a solder sample to be managed. A solder sample management method for managing solder component analysis results using a solder management server device, wherein bath identification information is provided in a readable manner, and the solder sample in the solder bath is identified by the bath identification information Sample container acquisition step of acquiring a container to which sample identification information for identifying the sample is readable is provided, and the solder management server device is read by the terminal device. The tank identification information and the sample identification information are received, and the tank identification information and the sample identification information are associated with each other. A sample information storage step to be stored in the sample information storage unit, a component analysis step for analyzing the components of the sample stored in the container acquired in the container acquisition step, and a component analysis result of the sample stored in the container An analysis result storing step of storing the sample identification information given to the container in association with the sample information storage unit.
　これらの構成によれば、ユーザが、容器にはんだサンプルを採取し、端末装置を用いて、はんだ槽の槽識別情報と容器に付与されたサンプル識別情報とを読み取るだけで、槽識別情報とサンプル識別情報とサンプルの成分分析結果とを対応付けてサンプル情報記憶部に記憶させることができる。すなわち、容器にはんだサンプルを採取し、端末装置を用いて、はんだ槽の槽識別情報と容器に付与されたサンプル識別情報とを読み取るだけで、はんだ槽から採取されたサンプルと、そのサンプルが採取されたはんだ槽とを容易に対応付けることができ、かつこれらの情報を手作業で記入する必要がないから、その対応付けを誤るおそれを低減することができる。 According to these configurations, the user collects a solder sample in a container, and simply uses the terminal device to read the tank identification information of the solder tank and the sample identification information given to the container. The identification information and the sample component analysis result can be associated with each other and stored in the sample information storage unit. That is, by collecting a solder sample in a container and using a terminal device, simply reading the tank identification information of the solder tank and the sample identification information given to the container, the sample collected from the solder tank and the sample are collected. Therefore, it is not necessary to manually enter these pieces of information, so that the risk of erroneous association can be reduced.
　また、前記成分分析結果を報知情報として報知する報知処理部をさらに備えることが好ましい。 Further, it is preferable to further include a notification processing unit that notifies the component analysis result as notification information.
　この構成によれば、報知処理部によって成分分析結果が報知されるから、成分分析結果を知るためにサンプル情報記憶部を参照する手間が省ける。 According to this configuration, since the component analysis result is notified by the notification processing unit, it is possible to save the trouble of referring to the sample information storage unit in order to know the component analysis result.
　また、前記はんだ管理用サーバ装置は、前記槽識別情報により識別されるはんだ槽に関するはんだ槽情報を予め記憶するはんだ槽情報記憶部をさらに備えることが好ましい。 In addition, it is preferable that the solder management server device further includes a solder bath information storage unit that stores in advance solder bath information related to the solder bath identified by the bath identification information.
　この構成によれば、はんだ槽情報に基づいて、サンプル情報記憶部に記憶された情報に対してはんだ槽に関するさらに詳しい情報を対応付けることが容易である。 According to this configuration, it is easy to associate more detailed information regarding the solder bath with the information stored in the sample information storage unit based on the solder bath information.
　また、前記はんだ槽情報は、前記槽識別情報により識別されるはんだ槽の管理者を示す情報を少なくとも含むことが好ましい。 Moreover, it is preferable that the solder bath information includes at least information indicating an administrator of the solder bath identified by the bath identification information.
　この構成によれば、槽識別情報により識別されるはんだ槽の管理者を示す情報を少なくとも含むはんだ槽情報が、はんだ管理用サーバ装置に予め記憶されているので、サンプル情報記憶部に記憶された情報と、はんだ槽情報とに基づいて、成分分析結果を適切な管理者に連絡することが容易となる。 According to this configuration, since the solder bath information including at least information indicating the manager of the solder bath identified by the bath identification information is stored in the solder management server device in advance, the solder bath information is stored in the sample information storage unit. Based on the information and the solder bath information, it becomes easy to inform the appropriate manager of the component analysis result.
　また、前記はんだ槽情報は、前記槽識別情報と対応して予め設定されたはんだ成分を示す基準成分情報を含み、前記はんだサンプル管理システムは、前記成分分析結果と前記基準成分情報とに基づいて、前記はんだ槽内のはんだ成分を改善するための対応方法を判断する対応方法判断部と、前記対応方法を報知情報として報知する報知処理部とをさらに備えることが好ましい。 The solder bath information includes reference component information indicating a solder component set in advance corresponding to the bath identification information, and the solder sample management system is based on the component analysis result and the reference component information. It is preferable to further include a handling method determination unit that determines a handling method for improving the solder component in the solder bath, and a notification processing unit that reports the handling method as notification information.
　この構成によれば、はんだ槽内のはんだ成分を改善するための対応方法が報知されるので、ユーザが、はんだ槽内のはんだ成分を改善することが容易となる。 According to this configuration, since the corresponding method for improving the solder component in the solder bath is notified, it becomes easy for the user to improve the solder component in the solder bath.
　また、前記はんだ槽に取り付け可能であって、前記はんだ管理用サーバ装置と通信可能な表示装置をさらに備え、前記はんだ槽情報は、前記槽識別情報と対応付けて当該槽識別情報で識別されるはんだ槽に取り付けられる表示装置と通信するための通信アドレスをさらに含み、前記報知処理部は、前記報知情報を、その報知情報に対応する槽識別情報で識別されるはんだ槽に取り付けられる表示装置の前記通信アドレス宛に送信することによって前記報知を実行することが好ましい。 In addition, the apparatus further includes a display device that can be attached to the solder bath and can communicate with the solder management server device, and the solder bath information is identified by the bath identification information in association with the bath identification information. A communication address for communicating with a display device attached to the solder bath is further included, and the notification processing unit is a display device attached to the solder bath identified by the bath identification information corresponding to the notification information. It is preferable that the notification is executed by transmitting to the communication address.
　この構成によれば、はんだ槽に取り付けられた表示装置によって、成分分析結果又ははんだ成分を改善するための対応方法を表示させることができるので、ユーザの利便性が向上する。 According to this configuration, it is possible to display a component analysis result or a corresponding method for improving the solder component by the display device attached to the solder tank, so that convenience for the user is improved.
　また、前記読取部は、さらに、前記ユーザを識別するユーザ識別情報を読み取り可能とされており、前記識別情報取得部は、さらに、前記読取部によって読み取られたユーザ識別情報を、前記はんだ管理用サーバ装置へ送信し、前記サンプル情報記憶部は、前記槽識別情報、サンプル識別情報、及びユーザ識別情報を対応付けて記憶することが好ましい。 Further, the reading unit can further read user identification information for identifying the user, and the identification information acquiring unit further reads the user identification information read by the reading unit for the solder management. It is preferable to transmit to the server device, and the sample information storage unit stores the tank identification information, sample identification information, and user identification information in association with each other.
　この構成によれば、槽識別情報及びサンプル識別情報に対して、ユーザを識別するユーザ識別情報が対応付けられる。従って、成分分析結果又ははんだ成分を改善するための対応方法を、適切なユーザに知らせることが容易となる。 According to this configuration, the user identification information for identifying the user is associated with the tank identification information and the sample identification information. Therefore, it becomes easy to inform an appropriate user of a component analysis result or a corresponding method for improving the solder component.
　また、前記槽識別情報は、バーコード又は二次元コードによって前記はんだ槽に付与され、前記サンプル識別情報は、バーコード又は二次元コードによって前記容器に付与されることが好ましい。 Further, it is preferable that the bath identification information is given to the solder bath by a barcode or a two-dimensional code, and the sample identification information is given to the container by a barcode or a two-dimensional code.
　槽識別情報及びサンプル識別情報を、バーコード又は二次元コードによって表示すれば、端末装置によって読み取ることが容易となる。 If the tank identification information and the sample identification information are displayed by a bar code or a two-dimensional code, it can be easily read by the terminal device.
　このような構成のはんだサンプル管理システム、はんだ管理用サーバ装置、及びはんだサンプル管理方法によれば、はんだ槽から採取されたサンプルと、そのサンプルが採取されたはんだ槽とを容易に対応付けることができ、かつその対応付けを誤るおそれを低減することができる。
　この出願は、２０１７年４月２８日に出願された日本国特許出願特願２０１７－８９６５４を基礎とするものであり、その内容は、本願に含まれるものである。なお、発明を実施するための形態の項においてなされた具体的な実施態様又は実施例は、あくまでも、本発明の技術内容を明らかにするものであって、本発明は、そのような具体例にのみ限定して狭義に解釈されるべきものではない。 According to the solder sample management system, the solder management server device, and the solder sample management method configured as described above, it is possible to easily associate the sample collected from the solder bath with the solder bath from which the sample was collected. In addition, it is possible to reduce the possibility of erroneous matching.
This application is based on Japanese Patent Application No. 2017-89654 filed on Apr. 28, 2017, the contents of which are included in the present application. It should be noted that the specific embodiments or examples made in the section for carrying out the invention are merely to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples. It should not be interpreted in a narrow sense only as a limitation.
１    管理用サーバ装置
２    分析装置
３    はんだ槽
４    はんだ
５    表示装置
６    容器
７    スマートフォン（端末装置）
８    ネットワーク
１０  はんだサンプル管理システム
１１  記憶処理部
１２  分析結果取得部
１３  対応方法判断部
１４  報知処理部
１６  はんだ槽情報記憶部
１７  サンプル情報記憶部
７１  カメラ（読取部）
７２  識別情報取得部
Ａ    工場
Ｂ    分析所
Ｄ１  はんだ槽情報
Ｌ１  槽識別ラベル
Ｌ２  サンプル識別ラベル
Ｌ３  名札
Ｕ    ユーザ
  DESCRIPTION OF SYMBOLS 1 Management server apparatus 2 Analyzer 3 Solder tank 4 Solder 5 Display apparatus 6 Container 7 Smartphone (terminal apparatus)
8 Network 10 Solder Sample Management System 11 Storage Processing Unit 12 Analysis Result Acquisition Unit 13 Corresponding Method Determination Unit 14 Notification Processing Unit 16 Solder Tank Information Storage Unit 17 Sample Information Storage Unit 71 Camera (Reading Unit)
72 Identification information acquisition part A Factory B Laboratory D1 Solder tank information L1 Tank identification label L2 Sample identification label L3 Name tag U User

Claims (11)

  1. 　ユーザが操作する端末装置と、
    　前記端末装置と通信可能なはんだ管理用サーバ装置とを備え、
    　前記端末装置は、
    　はんだを溶融するはんだ槽であって、かつ当該はんだ槽を識別する槽識別情報が読み取り可能に付与されたはんだ槽からの前記槽識別情報の読み取りと、はんだのサンプルを収容可能な容器であって、かつ当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器からの前記サンプル識別情報の読み取りとが可能な読取部と、
    　前記読取部によって読み取られた、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信する識別情報取得部とを備え、
    　前記はんだ管理用サーバ装置は、
    　前記端末装置から送信された、前記槽識別情報と前記サンプル識別情報とを対応付けて記憶するサンプル情報記憶部と、
    　前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを取得し、その成分分析結果とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果取得部とを含むはんだサンプル管理システム。     A terminal device operated by a user;
    A solder management server device capable of communicating with the terminal device;
    The terminal device
    A solder bath for melting the solder, and a vessel capable of storing the bath identification information from the solder bath to which the bath identification information for identifying the solder bath is provided so as to be readable; A reading unit capable of reading the sample identification information from the container to which the sample identification information for identifying the sample is readable.
    An identification information acquisition unit that transmits the bath identification information and the sample identification information read by the reading unit to the solder management server device;
    The solder management server device includes:
    A sample information storage unit that stores the tank identification information and the sample identification information in association with each other, transmitted from the terminal device;
    An analysis result acquisition for acquiring the component analysis result of the sample contained in the container and the sample identification information given to the container, and storing the component analysis result and the sample identification information in association with each other in the sample information storage unit And a solder sample management system.
  2. 　前記成分分析結果を報知情報として報知する報知処理部をさらに備える請求項１記載のはんだサンプル管理システム。 The solder sample management system according to claim 1, further comprising a notification processing unit that notifies the component analysis result as notification information.
  3. 　前記はんだ管理用サーバ装置は、前記槽識別情報により識別されるはんだ槽に関するはんだ槽情報を予め記憶するはんだ槽情報記憶部をさらに備える請求項１又は２に記載のはんだサンプル管理システム。 The solder sample management system according to claim 1, wherein the solder management server device further includes a solder bath information storage unit that stores in advance solder bath information related to the solder bath identified by the bath identification information.
  4. 　前記はんだ槽情報は、前記槽識別情報により識別されるはんだ槽の管理者を示す情報を少なくとも含む請求項３記載のはんだサンプル管理システム。 The solder sample management system according to claim 3, wherein the solder bath information includes at least information indicating a solder bath manager identified by the bath identification information.
  5. 　前記はんだ槽情報は、前記槽識別情報と対応して予め設定されたはんだ成分を示す基準成分情報を含み、
    　前記はんだサンプル管理システムは、
    　前記成分分析結果と前記基準成分情報とに基づいて、前記はんだ槽内のはんだ成分を改善するための対応方法を判断する対応方法判断部と、
    　前記対応方法を報知情報として報知する報知処理部とをさらに備える請求項３又は４に記載のはんだサンプル管理システム。     The solder bath information includes reference component information indicating a preset solder component corresponding to the bath identification information,
    The solder sample management system includes:
    Based on the component analysis result and the reference component information, a response method determination unit that determines a response method for improving the solder component in the solder bath,
    The solder sample management system according to claim 3, further comprising a notification processing unit that notifies the correspondence method as notification information.
  6. 　前記はんだ槽に取り付け可能であって、前記はんだ管理用サーバ装置と通信可能な表示装置をさらに備え、
    　前記はんだ槽情報は、前記槽識別情報と対応付けて当該槽識別情報で識別されるはんだ槽に取り付けられる表示装置と通信するための通信アドレスをさらに含み、
    　前記報知処理部は、前記報知情報を、その報知情報に対応する槽識別情報で識別されるはんだ槽に取り付けられる表示装置の前記通信アドレス宛に送信することによって前記報知を実行する請求項２又は５に記載のはんだサンプル管理システム。     A display device that can be attached to the solder bath and can communicate with the solder management server device;
    The solder bath information further includes a communication address for communicating with a display device attached to the solder bath identified by the bath identification information in association with the bath identification information,
    The said alerting | reporting process part performs the said alerting | reporting by transmitting the said alerting | reporting information to the said communication address addressed to the display apparatus attached to the solder tank identified by the tank identification information corresponding to the alerting | reporting information. 5. The solder sample management system according to 5.
  7. 　前記読取部は、さらに、前記ユーザを識別するユーザ識別情報を読み取り可能とされており、
    　前記識別情報取得部は、さらに、前記読取部によって読み取られたユーザ識別情報を、前記はんだ管理用サーバ装置へ送信し、
    　前記サンプル情報記憶部は、前記槽識別情報、サンプル識別情報、及びユーザ識別情報を対応付けて記憶する請求項１～６のいずれか１項に記載のはんだサンプル管理システム。     The reading unit is further capable of reading user identification information for identifying the user,
    The identification information acquisition unit further transmits user identification information read by the reading unit to the solder management server device,
    The solder sample management system according to any one of claims 1 to 6, wherein the sample information storage unit stores the tank identification information, the sample identification information, and the user identification information in association with each other.
  8. 　前記槽識別情報は、バーコード又は二次元コードによって前記はんだ槽に付与され、
    　前記サンプル識別情報は、バーコード又は二次元コードによって前記容器に付与される請求項１～７のいずれか１項に記載のはんだサンプル管理システム。     The tank identification information is given to the solder tank by a bar code or a two-dimensional code,
    The solder sample management system according to any one of claims 1 to 7, wherein the sample identification information is given to the container by a barcode or a two-dimensional code.
  9. 　はんだを溶融するはんだ槽であって、かつ当該はんだ槽を識別する槽識別情報が読み取り可能に付与されたはんだ槽からの前記槽識別情報の読み取りと、はんだのサンプルを収容可能であって、かつ当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器からの前記サンプル識別情報の読み取りとが可能な読取部と、前記読取部によって読み取られた、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信する識別情報取得部とを備えた端末装置と通信可能なはんだ管理用サーバ装置であって、
    　前記端末装置から送信された、前記槽識別情報と前記サンプル識別情報とを対応付けて記憶するサンプル情報記憶部と、
    　前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを取得し、その成分分析結果とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果取得部とを含むはんだ管理用サーバ装置。     A solder bath that melts the solder, and can read the bath identification information from the solder bath to which bath identification information for identifying the solder bath is readable, and can contain a solder sample; and A reading unit capable of reading the sample identification information from a container to which sample identification information for identifying the sample is readable, and the tank identification information and the sample identification information read by the reading unit; A solder management server device capable of communicating with a terminal device including an identification information acquisition unit that transmits the information to the solder management server device,
    A sample information storage unit that stores the tank identification information and the sample identification information in association with each other, transmitted from the terminal device;
    An analysis result acquisition for acquiring the component analysis result of the sample contained in the container and the sample identification information given to the container, and storing the component analysis result and the sample identification information in association with each other in the sample information storage unit And a solder management server device.
  10. 　ユーザが操作する端末装置と、前記端末装置と通信可能であって管理対象のはんだサンプルに関する情報を記憶するためのサンプル情報記憶部を備えたはんだ管理用サーバ装置とを用いてはんだの成分分析結果を管理するはんだサンプル管理方法であって、
    　はんだを溶融するはんだ槽に、当該はんだ槽を識別する槽識別情報を読み取り可能に付与する槽識別情報付与工程と、
    　はんだのサンプルを収容可能な容器に、当該サンプルを識別するサンプル識別情報を読み取り可能に付与するサンプル識別情報付与工程と、
    　前記容器に、前記はんだ槽内のはんだを採取するサンプル採取工程と、
    　前記端末装置によって、前記槽識別情報と前記サンプル識別情報とを読み取らせる読取工程と、
    　前記端末装置によって、前記槽識別情報と前記サンプル識別情報とを前記はんだ管理用サーバ装置へ送信させる識別情報送信工程と、
    　前記はんだ管理用サーバ装置が、前記端末装置によって読み取られた前記槽識別情報と前記サンプル識別情報とを受信し、その槽識別情報とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させるサンプル情報記憶工程と、
    　前記容器に収容されたサンプルの成分を分析する成分分析工程と、
    　前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果記憶工程とを含むはんだサンプル管理方法。     Component analysis results of solder using a terminal device operated by a user and a solder management server device including a sample information storage unit capable of communicating with the terminal device and storing information on a solder sample to be managed A solder sample management method for managing
    A tank identification information providing step for imparting readable tank identification information for identifying the solder tank to the solder tank for melting the solder,
    A sample identification information providing step for giving a sample identification information for identifying the sample to a container capable of accommodating a sample of solder in a readable manner;
    A sample collecting step for collecting the solder in the solder bath in the container;
    A reading step for reading the tank identification information and the sample identification information by the terminal device;
    An identification information transmission step for transmitting the tank identification information and the sample identification information to the solder management server device by the terminal device,
    The solder management server device receives the bath identification information and the sample identification information read by the terminal device, and stores the bath identification information and the sample identification information in association with each other in the sample information storage unit. A sample information storage step;
    A component analysis step of analyzing the components of the sample contained in the container;
    A solder sample management method comprising: an analysis result storing step of associating a component analysis result of a sample stored in the container with sample identification information given to the container and storing the result in the sample information storage unit.
  11. 　ユーザが操作する端末装置と、前記端末装置と通信可能であって管理対象のはんだサンプルに関する情報を記憶するためのサンプル情報記憶部を備えたはんだ管理用サーバ装置とを用いてはんだの成分分析結果を管理するはんだサンプル管理方法であって、
    　槽識別情報が読み取り可能に付与され、当該槽識別情報により識別されるはんだ槽内のはんだのサンプルが採取された容器であって、当該サンプルを識別するサンプル識別情報が読み取り可能に付与された容器を取得するサンプル容器取得工程と、
    　前記はんだ管理用サーバ装置が、前記端末装置によって読み取られた前記槽識別情報と前記サンプル識別情報とを受信し、その槽識別情報とサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させるサンプル情報記憶工程と、
    　前記容器取得工程で取得された容器に収容されたサンプルの成分を分析する成分分析工程と、
    　前記容器に収容されたサンプルの成分分析結果と当該容器に付与されたサンプル識別情報とを対応付けて前記サンプル情報記憶部に記憶させる分析結果記憶工程とを含むはんだサンプル管理方法。     Component analysis results of solder using a terminal device operated by a user and a solder management server device including a sample information storage unit capable of communicating with the terminal device and storing information on a solder sample to be managed A solder sample management method for managing
    A container in which bath identification information is provided in a readable manner and a sample of solder in the solder bath identified by the bath identification information is collected, and a sample identification information for identifying the sample is provided in a readable manner Obtaining a sample container; and
    The solder management server device receives the bath identification information and the sample identification information read by the terminal device, and stores the bath identification information and the sample identification information in association with each other in the sample information storage unit. A sample information storage step;
    A component analysis step of analyzing the components of the sample contained in the container acquired in the container acquisition step;
    A solder sample management method comprising: an analysis result storing step of associating a component analysis result of a sample stored in the container with sample identification information given to the container and storing the result in the sample information storage unit.
PCT/JP2018/015603 2017-04-28 2018-04-13 Solder sample management system, solder management server device, and solder sample management method WO2018198838A1 (en)

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JP2006292688A (en) * 2005-04-14 2006-10-26 Matsushita Electric Ind Co Ltd Methods of manufacturing and analyzing solder sample, and control system for solder vessel
JP2009168569A (en) * 2008-01-15 2009-07-30 Nihon Superior Co Ltd Monitoring system of molten metal

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JPH06201831A (en) * 1992-09-30 1994-07-22 Westinghouse Electric Corp <We> Monitoring device for detecting environment parameter
JP2006292688A (en) * 2005-04-14 2006-10-26 Matsushita Electric Ind Co Ltd Methods of manufacturing and analyzing solder sample, and control system for solder vessel
JP2009168569A (en) * 2008-01-15 2009-07-30 Nihon Superior Co Ltd Monitoring system of molten metal

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11052479B2 (en) 2018-10-30 2021-07-06 Hakko Corp. Soldering device control method and apparatus

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