JPH09181469A - Electronic component mounting board manufacturing method - Google Patents
Electronic component mounting board manufacturing methodInfo
- Publication number
- JPH09181469A JPH09181469A JP35209495A JP35209495A JPH09181469A JP H09181469 A JPH09181469 A JP H09181469A JP 35209495 A JP35209495 A JP 35209495A JP 35209495 A JP35209495 A JP 35209495A JP H09181469 A JPH09181469 A JP H09181469A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- substrate
- electronic component
- adhesive
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Abstract
Description
【０００１】[0001]
【技術分野】本発明は，電子部品搭載用基板の製造方法
に関し，特に，ヒートシンクを絶縁基板に接着する方法
に関する。TECHNICAL FIELD The present invention relates to a method for manufacturing a substrate for mounting electronic components, and more particularly to a method for adhering a heat sink to an insulating substrate.
【０００２】[0002]
【従来技術】従来，電子部品搭載用基板としては，図４
に示すごとく，絶縁基板９３１の表面に設けた導体回路
９５と，電子部品を搭載するための搭載部９７を設けた
ものがある。搭載部９７は，絶縁基板９３１に設けた搭
載穴９３０と，該搭載穴の下方開口部を被覆するヒート
シンク９０とにより形成されている。ヒートシンク９０
は，樹脂接着剤９２により，絶縁基板９３１の下面に接
着されている。ヒートシンク９０の表面は，ヒートシン
クの酸化防止のため，金被膜９１により被覆されてい
る。2. Description of the Related Art Conventionally, as a board for mounting electronic parts, a board shown in FIG.
As shown in FIG. 2, there are those in which a conductor circuit 95 provided on the surface of the insulating substrate 931 and a mounting portion 97 for mounting an electronic component are provided. The mounting portion 97 is formed by a mounting hole 930 provided in the insulating substrate 931 and a heat sink 90 that covers the lower opening of the mounting hole. Heat sink 90
Are adhered to the lower surface of the insulating substrate 931 with a resin adhesive 92. The surface of the heat sink 90 is covered with a gold coating 91 to prevent oxidation of the heat sink.
【０００３】[0003]
【解決しようとする課題】しかしながら，上記従来の電
子部品搭載用基板９９においては，ヒートシンク９０を
被覆する金被膜９１と絶縁基板９３１との間の接着力が
弱いという問題がある。そこで，金被膜９１の代わりに
ニッケル被膜によりヒートシンク９０の表面を被覆する
ことが考えられている（特公平６─５６９９号公報）。
これにより，ヒートシンクと絶縁基板との間の接着強度
が高くなる。しかし，その一方で，ヒートシンクとニッ
ケル被膜との間に酸化膜（ＮｉＯなど）が形成されてし
まい，耐腐食性に劣るという問題がある。However, in the above-mentioned conventional electronic component mounting substrate 99, there is a problem that the adhesive force between the gold coating 91 that covers the heat sink 90 and the insulating substrate 931 is weak. Therefore, it has been considered to cover the surface of the heat sink 90 with a nickel film instead of the gold film 91 (Japanese Patent Publication No. 6-5699).
This increases the adhesive strength between the heat sink and the insulating substrate. However, on the other hand, there is a problem in that an oxide film (NiO or the like) is formed between the heat sink and the nickel film, and the corrosion resistance is poor.
【０００４】本発明はかかる従来の問題点に鑑み，ヒー
トシンクと絶縁基板との間の接着力を強くし，かつヒー
トシンクの酸化膜形成を防止することができる，電子部
品搭載用基板の製造方法を提供しようとするものであ
る。In view of the above conventional problems, the present invention provides a method for manufacturing an electronic component mounting substrate which can strengthen the adhesive force between the heat sink and the insulating substrate and prevent the formation of an oxide film on the heat sink. It is the one we are trying to provide.
【０００５】[0005]
【課題の解決手段】請求項１に記載の発明は，導体回路
を設けた合成樹脂製の絶縁基板に，銅製のヒートシンク
を接着剤を介して接着するに当たり，上記ヒートシンク
の表面にニッケル被膜を形成し，次いで，これらを還元
雰囲気において加熱することにより，上記ニッケル被膜
の表面を還元処理し，次いで，上記ニッケル被膜と上記
絶縁基板との間を上記接着剤により接着することを特徴
とする電子部品搭載用基板の製造方法である。According to a first aspect of the present invention, a nickel film is formed on the surface of the heat sink when a heat sink made of copper is adhered to an insulating substrate made of synthetic resin provided with a conductor circuit with an adhesive. Then, these are heated in a reducing atmosphere to reduce the surface of the nickel coating, and then the nickel coating and the insulating substrate are bonded by the adhesive. It is a method of manufacturing a mounting substrate.
【０００６】本発明において最も注目すべきことは，ヒ
ートシンクにニッケル被膜を形成した後に，還元処理を
することである。What is most noticeable in the present invention is that the nickel coating is formed on the heat sink and then the reduction treatment is performed.
【０００７】上記還元処理を行うことにより，ニッケル
被膜の表面に形成された酸化膜を還元し，表面をニッケ
ル金属膜とすることができる。また，このように表面が
金属ニッケル膜となっているので，上記ニッケル被膜
は，接着剤を用いて絶縁基板に接着されたとき，優れた
接着強度を発揮することができる。By performing the above-mentioned reduction treatment, the oxide film formed on the surface of the nickel coating film can be reduced to form a nickel metal film on the surface. In addition, since the surface is a metal nickel film in this way, the nickel film can exhibit excellent adhesive strength when it is adhered to the insulating substrate using an adhesive.
【０００８】次に，請求項２に記載のように，上記ニッ
ケル被膜の厚みは，１〜５０μｍであることが好まし
い。１μｍ未満の場合には，ニッケル被膜を形成する際
に，ニッケル被膜とヒートシンクとの境界又はニッケル
被膜の内部に気孔が形成され易く，ヒートシンクの耐腐
食性が低下するおそれがある。一方，５０μｍを越える
場合には，熱抵抗が増加して本来の目的であるヒートシ
ンクの放熱性を妨げることになるおそれがある。Next, as described in claim 2, it is preferable that the nickel coating has a thickness of 1 to 50 μm. When the thickness is less than 1 μm, when forming the nickel coating, pores are likely to be formed at the boundary between the nickel coating and the heat sink or inside the nickel coating, which may reduce the corrosion resistance of the heat sink. On the other hand, if the thickness exceeds 50 μm, the thermal resistance may increase, and the heat dissipation of the heat sink, which is the original purpose, may be hindered.
【０００９】次に，請求項３に記載のように，上記還元
雰囲気は，Ｈ2 ，ＣＯ，Ｎ2 又はそれらの混合物を主と
してなる雰囲気であることが好ましい。これにより，ヒ
ートシンク表面に酸化膜が形成されるおそれがある。Next, as described in claim 3, it is preferable that the reducing atmosphere is an atmosphere mainly containing H 2 , CO, N 2 or a mixture thereof. As a result, an oxide film may be formed on the surface of the heat sink.
【００１０】次に，請求項４に記載のように，上記還元
処理の加熱温度は，３００〜１０００℃であることが好
ましい。３００℃未満の場合には，ヒートシンク表面に
酸化膜が形成されるおそれがある。一方，１０００℃を
越える場合には，ヒートシンクの材料である銅が溶融
し，ヒートシンクの変形やニッケル被膜の剥がれを生じ
るおそれがある。また，酸化膜が完全に除去されないお
それがある。Next, as described in claim 4, it is preferable that the heating temperature of the reduction treatment is 300 to 1000 ° C. If the temperature is lower than 300 ° C., an oxide film may be formed on the heat sink surface. On the other hand, when the temperature exceeds 1000 ° C., copper, which is the material of the heat sink, is melted, which may cause deformation of the heat sink and peeling of the nickel coating. Moreover, the oxide film may not be completely removed.
【００１１】次に，請求項５に記載のように，上記還元
処理は，Ｈ2 の還元雰囲気において，５００〜９００℃
の条件で行うことが好ましい。これにより，ヒートシン
ク表面への酸化膜の形成を更に防止することができる。
５００℃未満の場合には，ヒートシンク表面に酸化膜が
形成されるおそれがある。一方，９００℃を越える場合
には，酸化膜が完全に除去されないおそれがある。Next, as described in claim 5, the reducing treatment is carried out in a reducing atmosphere of H 2 at 500 to 900 ° C.
It is preferable to carry out under the conditions of. This can further prevent the formation of an oxide film on the surface of the heat sink.
If the temperature is lower than 500 ° C., an oxide film may be formed on the heat sink surface. On the other hand, if the temperature exceeds 900 ° C, the oxide film may not be completely removed.
【００１２】次に，請求項６に記載のように，上記接着
剤は，エポキシ，ビスマレイミドトリアジン，ポリイミ
ドを主とする樹脂あるいはそれらの混合物のいずれかで
あることが好ましい。これにより，ヒートシンクを絶縁
基板に対してより一層強固に接着することができる。Next, as described in claim 6, it is preferable that the adhesive is any of epoxy, bismaleimide triazine, a resin mainly containing polyimide, or a mixture thereof. As a result, the heat sink can be more firmly adhered to the insulating substrate.
【００１３】上記合成樹脂製の絶縁基板としては，例え
ば，ガラスエポキシ系基板，ガラスポリイミド基板，又
はガラスビスマレイミドトリアジン基板を用いる。上記
の製造方法は，電子部品搭載用基板がボールグリッドア
レイ，ピングリッドアレイ，リードレスチップキャリ
ア，ＱＦＰ（クオードフラットパッケージ）等で，ヒー
トシンクが形成されたプラスチックパッケージのいずれ
の場合にも適用可能である。As the insulating substrate made of synthetic resin, for example, a glass epoxy substrate, a glass polyimide substrate, or a glass bismaleimide triazine substrate is used. The above-mentioned manufacturing method can be applied to any case where the electronic component mounting substrate is a ball grid array, a pin grid array, a leadless chip carrier, a QFP (quad flat package), or a plastic package having a heat sink. is there.
【００１４】[0014]
【発明の実施の形態】本発明の実施形態例にかかる電子
部品搭載用基板の製造方法について，図１，図２を用い
て説明する。本例により製造される電子部品搭載用基板
は，図１，図２に示すごとく，導体回路５を設けた合成
樹脂製の絶縁基板３１，３２，３３からなる多層基板３
と，電子部品８を搭載するための搭載部７とを有してい
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing an electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the electronic component mounting substrate manufactured by this example is a multi-layer substrate 3 made of synthetic resin insulating substrates 31, 32 and 33 provided with conductor circuits 5.
And a mounting portion 7 for mounting the electronic component 8.
【００１５】搭載部７は，図２に示すごとく，絶縁基板
３１〜３３に設けた搭載穴３０と，その下方開口部を被
覆するように接着剤２を介して接着したヒートシンク１
０とにより形成されている。搭載部７に搭載した電子部
品８は，ボンディングワイヤー８１を介して導体回路５
と接続され，封止用樹脂により封止される。電子部品搭
載用基板９は，各絶縁基板に設けた導体回路５の間の導
通を図るためのスルーホール（図示略）を設けている。As shown in FIG. 2, the mounting portion 7 has a mounting hole 30 formed in the insulating substrates 31 to 33 and a heat sink 1 bonded with an adhesive 2 so as to cover the lower opening thereof.
0. The electronic component 8 mounted on the mounting portion 7 is connected to the conductor circuit 5 via the bonding wire 81.
And is sealed with a sealing resin. The electronic component mounting board 9 is provided with through holes (not shown) for establishing conduction between the conductor circuits 5 provided on each insulating board.
【００１６】また，最上層である絶縁基板３３の表面に
は，半田ボール６が接合されている。上記電子部品搭載
用基板９は，半田ボール６により他部材に接合，固定さ
れるボールグリッドアレイである。The solder balls 6 are joined to the surface of the uppermost insulating substrate 33. The electronic component mounting substrate 9 is a ball grid array that is joined and fixed to another member by the solder balls 6.
【００１７】次に，上記電子部品搭載用基板を製造する
方法について説明する。まず，各絶縁基板３１，３２，
３３に導体回路５を形成すると共に搭載穴３０を穿設す
る。上記絶縁基板としてはガラスエポキシ基板を用い
る。次いで，これらを積層して，多層基板３を得る。次
に，多層基板３にスルーホール（図示略）を形成する。Next, a method of manufacturing the electronic component mounting board will be described. First, each insulating substrate 31, 32,
The conductor circuit 5 is formed in 33 and the mounting hole 30 is formed. A glass epoxy substrate is used as the insulating substrate. Then, these are laminated to obtain the multilayer substrate 3. Next, through holes (not shown) are formed in the multilayer substrate 3.
【００１８】次に，図１に示すごとく，銅製のヒートシ
ンク１０の表面にニッケル被膜１を電解めっき方法によ
り形成する。ニッケル被膜１の厚みは，３μｍである。
次いで，これらを還元雰囲気において加熱して，上記ニ
ッケル被膜の表面を還元処理する。還元処理条件は，１
００％Ｈ2 の還元雰囲気において，７００℃，５〜１０
分間である。次に，ニッケル被膜１と多層基板３との間
を，エポキシ樹脂製の接着剤２により接着する。Next, as shown in FIG. 1, a nickel coating 1 is formed on the surface of the copper heat sink 10 by an electrolytic plating method. The nickel coating 1 has a thickness of 3 μm.
Then, these are heated in a reducing atmosphere to reduce the surface of the nickel coating. The reduction condition is 1
In a reducing atmosphere of 00% H 2 , 700 ° C., 5 to 10
Minutes. Next, the nickel coating 1 and the multilayer substrate 3 are bonded to each other with an adhesive 2 made of epoxy resin.
【００１９】次に，多層基板３の上面における導体回路
５に半田ボール６を配置し，これらを加熱炉において２
００〜２３０℃で加熱することにより，半田ボール６を
リフローさせて導体回路５に接合する。これにより，図
２に示す電子部品搭載用基板９が得られる。Next, the solder balls 6 are arranged on the conductor circuit 5 on the upper surface of the multilayer substrate 3, and these are placed in a heating furnace.
The solder balls 6 are reflowed and joined to the conductor circuit 5 by heating at 00 to 230 ° C. As a result, the electronic component mounting substrate 9 shown in FIG. 2 is obtained.
【００２０】次に，本例の作用効果について説明する。
本例の製造方法においては，ヒートシンク１０を多層基
板３に接着剤２を介して接着するに当たり，ヒートシン
ク１０の表面を被覆するニッケル被膜１に対して上記の
還元処理を行っている。Next, the function and effect of this example will be described.
In the manufacturing method of this example, when the heat sink 10 is bonded to the multilayer substrate 3 via the adhesive 2, the above-described reduction treatment is performed on the nickel coating 1 that covers the surface of the heat sink 10.
【００２１】そのため，ニッケル被膜１の表面に形成さ
れた酸化膜を還元して，表面をニッケル金属膜とするこ
とができる。また，還元処理後にも，ニッケル被膜の表
面は，酸化膜が形成されにくい。そのため，ヒートシン
クの耐腐食性を向上させることができる。また，このよ
うに表面が金属ニッケル被膜となっているので，上記ニ
ッケル被膜１は，接着剤２を用いて，合成樹脂製の多層
基板３に接着されたとき，優れた接着強度を発揮するこ
とができる。Therefore, the oxide film formed on the surface of the nickel coating 1 can be reduced to form a nickel metal film on the surface. Further, even after the reduction treatment, an oxide film is hard to be formed on the surface of the nickel coating. Therefore, the corrosion resistance of the heat sink can be improved. In addition, since the surface is a metallic nickel film in this way, the nickel film 1 exhibits excellent adhesive strength when it is adhered to the synthetic resin multilayer substrate 3 using the adhesive 2. You can
【００２２】（実験例１）本例においては，ヒートシン
クの絶縁基板に対する接着強度を測定した。測定に当た
り，実施形態例で製造した電子部品搭載用基板を試料１
として用いた。また，比較のために，銅製のヒートシン
クをそのまま接着剤を用いて絶縁基板に接着した場合を
試料Ｃ１とした。また，銅製のヒートシンクに黒化処理
を施した後に絶縁基板に接着した場合を試料Ｃ２とし
た。また，銅製のヒートシンクの表面に厚み３μｍのニ
ッケル被膜を形成して，還元処理を行うことなく絶縁基
板に接着した場合を試料Ｃ３とした。ここで説明した点
を除いては，上記試料Ｃ１〜Ｃ３の製造方法は，実施形
態例と同様である。Experimental Example 1 In this example, the adhesive strength of the heat sink to the insulating substrate was measured. In the measurement, the electronic component mounting substrate manufactured in the embodiment is used as a sample 1
Used as For comparison, Sample C1 was prepared by directly bonding a copper heat sink to an insulating substrate using an adhesive. A sample C2 was prepared by blackening a copper heat sink and then bonding it to an insulating substrate. A sample C3 was prepared by forming a nickel coating having a thickness of 3 μm on the surface of a copper heat sink and adhering it to an insulating substrate without reduction treatment. Except for the points described here, the manufacturing method of the samples C1 to C3 is the same as that of the embodiment.
【００２３】測定方法は，上記試料１，Ｃ１〜Ｃ３につ
いて，常温（２５℃），及びプレッシャークッカーテス
ト（以下，ＰＣＴという。）における接着強度とを測定
した。測定結果を図３に示した。同図より知られるよう
に，常温及びＰＣＴの双方において，試料１の接着強度
は２８ｋｇｆであり，試料Ｃ１〜Ｃ３の接着強度１５ｋ
ｇｆ以下に対して高い値を示した。このことから，ヒー
トシンクの表面を被覆するニッケル被膜に還元処理を行
うことにより，ヒートシンクと絶縁基板の間の優れた接
着強度が得られることがわかる。As the measuring method, the adhesive strength in the normal temperature (25 ° C.) and the pressure cooker test (hereinafter referred to as PCT) was measured for each of the samples 1 and C1 to C3. The measurement results are shown in FIG. As is known from the figure, the adhesive strength of the sample 1 is 28 kgf and the adhesive strength of the samples C1 to C3 is 15 k at both room temperature and PCT.
A high value was shown for gf or less. From this, it can be seen that by performing the reduction treatment on the nickel coating that covers the surface of the heat sink, excellent adhesion strength between the heat sink and the insulating substrate can be obtained.
【００２４】（実験例２）本例においては，半田ボール
のリフロー時におけるヒートシンクの接着強度について
評価した。この評価により，半田ボールのリフロー工程
がヒートシンクの接着強度に与える影響を知ることがで
きる。Experimental Example 2 In this example, the adhesive strength of the heat sink during reflow of the solder balls was evaluated. From this evaluation, it is possible to know the effect of the solder ball reflow process on the adhesive strength of the heat sink.
【００２５】この評価にあたり，実験例１において用い
た試料１，Ｃ１〜Ｃ３のヒートシンクを用いた。これら
のヒートシンクをエポキシ樹脂製の接着剤により多層基
板に接着した。この多層基板について，８５℃／８５％
ＲＨの環境下で５時間放置した。その後，多層基板表面
の導体回路上に半田ボールを配置し，２１５℃で加熱す
ることにより半田ボールのリフローを行った。このリフ
ローは３回繰り返した。その後，ヒートシンクの接着強
度を測定した。In this evaluation, the heat sinks of Sample 1 and C1 to C3 used in Experimental Example 1 were used. These heat sinks were adhered to the multilayer substrate with an epoxy resin adhesive. About this multilayer board, 85 ℃ / 85%
It was left for 5 hours under the environment of RH. Then, solder balls were placed on the conductor circuits on the surface of the multilayer substrate and heated at 215 ° C. to reflow the solder balls. This reflow was repeated 3 times. Then, the adhesive strength of the heat sink was measured.
【００２６】その結果，試料１の接着強度は，２８ｋｇ
ｆで強度の変化がなかった。また，比較例としての試料
Ｃ１〜Ｃ３の接着強度は，試料Ｃ１が１８ｋｇｆ，試料
Ｃ２が１６ｋｇｆ，試料Ｃ３が１１ｋｇｆであった。こ
のことから，試料１は，試料Ｃ1 〜Ｃ３に比べて高い接
着強度であることがわかる。以上の２つの測定より，ヒ
ートシンク表面のニッケル被膜に還元処理を行うことに
より，ヒートシンクの接着強度が向上することがわか
る。As a result, the adhesive strength of sample 1 was 28 kg.
There was no change in strength at f. The adhesive strengths of the samples C1 to C3 as comparative examples were 18 kgf for the sample C1, 16 kgf for the sample C2, and 11 kgf for the sample C3. From this, it is understood that the sample 1 has higher adhesive strength than the samples C1 to C3. From the above two measurements, it can be seen that the reduction of the nickel coating on the heat sink surface improves the adhesive strength of the heat sink.
【００２７】[0027]
【発明の効果】本発明によれば，ヒートシンクと絶縁基
板との間の接着力を強くし，かつヒートシンクの酸化膜
形成を防止することができる，電子部品搭載用基板の製
造方法を提供することができる。According to the present invention, there is provided a method of manufacturing a substrate for mounting electronic parts, which can strengthen the adhesive force between the heat sink and the insulating substrate and prevent the oxide film from being formed on the heat sink. You can
【図１】実施形態例における電子部品搭載用基板の要部
断面図。FIG. 1 is a sectional view of an essential part of a board for mounting electronic components according to an embodiment.
【図２】実施形態例における，電子部品搭載用基板の断
面図。FIG. 2 is a cross-sectional view of the electronic component mounting board according to the embodiment.
【図３】実験例１における，ヒートシンクと絶縁基板と
の間の接着強度を示す説明図。FIG. 3 is an explanatory diagram showing adhesive strength between a heat sink and an insulating substrate in Experimental Example 1.
【図４】従来例における電子部品搭載用基板の要部断面
図。FIG. 4 is a cross-sectional view of a main part of a conventional electronic component mounting board.
１．．．ニッケル被膜， １０．．．ヒートシンク， ２．．．接着剤， ３．．．多層基板， ３１，３２，３３．．．絶縁基板， ５．．．導体回路， ６．．．半田ボール， ７．．．搭載部， ８．．．電子部品， ９．．．電子部品搭載用基板， 1. . . Nickel coating, 10. . . Heat sink, 2. . . Adhesive, 3. . . Multilayer substrate, 31, 32, 33. . . Insulating substrate, 5. . . Conductor circuit, 6. . . Solder balls, 7. . . 7. mounting part, . . Electronic components, 9. . . Electronic component mounting board,
Claims (7)
に，銅製のヒートシンクを接着剤を介して接着するに当
たり，上記ヒートシンクの表面にニッケル被膜を形成
し，次いで，これらを還元雰囲気において加熱すること
により，上記ニッケル被膜の表面を還元処理し，次い
で，上記ニッケル被膜と上記絶縁基板との間を上記接着
剤により接着することを特徴とする電子部品搭載用基板
の製造方法。1. When a copper heat sink is bonded to a synthetic resin insulating substrate provided with a conductor circuit with an adhesive, a nickel coating is formed on the surface of the heat sink and then these are heated in a reducing atmosphere. By doing so, the surface of the nickel coating is subjected to a reduction treatment, and then the nickel coating and the insulating substrate are bonded to each other with the adhesive, and a method for manufacturing an electronic component mounting substrate.
厚みは，１〜５０μｍであることを特徴とする電子部品
搭載用基板の製造方法。2. The method for manufacturing an electronic component mounting substrate according to claim 1, wherein the nickel coating has a thickness of 1 to 50 μm.
気は，Ｈ2 ，ＣＯ，又はＮ2 のいずれかあるいはそれら
の混合物を主としてなる雰囲気であることを特徴とする
電子部品搭載用基板の製造方法。3. The production of a substrate for mounting electronic parts according to claim 1 or 2, wherein the reducing atmosphere is an atmosphere mainly containing H 2 , CO, N 2 or a mixture thereof. Method.
上記還元処理の加熱温度は，３００〜１０００℃である
ことを特徴とする電子部品搭載用基板の製造方法。4. The method according to claim 1, wherein
The heating temperature of the reduction treatment is 300 to 1000 ° C., The manufacturing method of the electronic component mounting substrate.
上記還元処理は，Ｈ2の還元雰囲気において，５００〜
９００℃の条件で行うことを特徴とする電子部品搭載用
基板の製造方法。5. The method according to claim 1, wherein:
The above reduction treatment is performed in a reducing atmosphere of H 2 at 500 to
A method of manufacturing a substrate for mounting an electronic component, which is performed under the condition of 900 ° C.
上記接着剤は，エポキシ，ビスマレイミドトリアジン又
はポリイミドを主とする樹脂あるいはそれらの混合物の
いずれかであることを特徴とする電子部品搭載用基板の
製造方法。6. The method according to any one of claims 1 to 5,
The method for producing a substrate for mounting electronic parts, wherein the adhesive is any one of a resin mainly containing epoxy, bismaleimide triazine or polyimide, or a mixture thereof.
上記接着剤は，Ｈ2 ，ＣＯ，又はＮ2 のいずれかあるい
はそれらの混合物を主とした雰囲気において硬化させる
ことを特徴とする電子部品搭載用基板の製造方法。7. The method according to claim 1, wherein:
A method for manufacturing an electronic component mounting substrate, wherein the adhesive is cured in an atmosphere mainly containing H 2 , CO, N 2 or a mixture thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35209495A JPH09181469A (en) | 1995-12-26 | 1995-12-26 | Electronic component mounting board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35209495A JPH09181469A (en) | 1995-12-26 | 1995-12-26 | Electronic component mounting board manufacturing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005248946A Division JP2005354114A (en) | 2005-08-30 | 2005-08-30 | Electronic component mounting substrate and manufacturing method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09181469A true JPH09181469A (en) | 1997-07-11 |
Family
ID=18421747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35209495A Pending JPH09181469A (en) | 1995-12-26 | 1995-12-26 | Electronic component mounting board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09181469A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000064084A (en) * | 1998-08-20 | 2000-02-29 | Kobe Steel Ltd | Plating material for heat radiating board of electronic parts |
-
1995
- 1995-12-26 JP JP35209495A patent/JPH09181469A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000064084A (en) * | 1998-08-20 | 2000-02-29 | Kobe Steel Ltd | Plating material for heat radiating board of electronic parts |
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