JPH09180961A - Nonflammable electronic part and manufacture thereof - Google Patents
Nonflammable electronic part and manufacture thereofInfo
- Publication number
- JPH09180961A JPH09180961A JP33648195A JP33648195A JPH09180961A JP H09180961 A JPH09180961 A JP H09180961A JP 33648195 A JP33648195 A JP 33648195A JP 33648195 A JP33648195 A JP 33648195A JP H09180961 A JPH09180961 A JP H09180961A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- nonflammable
- low melting
- combustible
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は磁器コンデンサー，
マイカーコンデンサー，有材フィルムコンデンサー，金
属化紙コンデンサー，タンタル固体電解コンデンサー，
抵抗品等の電子部品を不燃化した不燃性電子部品及びそ
の製造方法に関するものである。TECHNICAL FIELD The present invention relates to a porcelain capacitor,
My car capacitor, material film capacitor, metallized paper capacitor, tantalum solid electrolytic capacitor,
The present invention relates to a nonflammable electronic component in which an electronic component such as a resistor is made nonflammable, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】近年、電子部品の分野において、その不
燃化対策が大きな課題となっている。従来、有機系およ
び無機系塗料を用いた不燃化対策が提案されている。し
かしながら、いずれの不燃化対策も電子部品の本来の性
質を低下させることなく、不燃化を達成させることはい
ずれも不十分であった。2. Description of the Related Art In recent years, in the field of electronic parts, countermeasures against non-combustion have become a major issue. Heretofore, measures against incombustibility using organic and inorganic coatings have been proposed. However, none of the measures to achieve incombustibility has been sufficient to achieve incombustibility without deteriorating the original properties of the electronic component.
【０００３】たとえば、磁器コンデンサーの分野におい
ては、難燃化処理されたエポキシ樹脂系塗料、シリコー
ン樹脂系塗料等の塗料が一般的に使用されている。この
ようなコンデンサーは電気的な特性に優れており、また
その製造上の作業性においても優れている。For example, in the field of porcelain capacitors, flame-retardant epoxy resin-based paints, silicone resin-based paints, and the like are generally used. Such a capacitor has excellent electrical characteristics and also has good workability in manufacturing.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上記従来
の不燃性電子部品及びその製造方法では、不慮の落雷等
で電器製品中の磁器コンデンサーが絶縁破壊され、異常
電流の発生によりコンデンサーが赤熱された場合、現在
使用されている外装材はこの発熱に耐えられない可能性
がある。このため不燃性を有する外装材の開発が行われ
ているものの、電子部品用として必要な絶縁性、防湿性
および作業性に優れているという条件を満足し、かつ不
燃性を有するものは得られていない。However, in the above-mentioned conventional non-combustible electronic component and the manufacturing method thereof, when the porcelain capacitor in the electric appliance is dielectrically broken down due to an unexpected lightning strike or the like, and the capacitor is red-heated due to the generation of an abnormal current. The currently used exterior materials may not be able to withstand this heat generation. Therefore, although non-flammable exterior materials have been developed, a non-flammable one that satisfies the conditions of excellent insulation, moisture resistance and workability required for electronic parts is not obtained. Not not.
【０００５】従来絶縁性および不燃性に優れている材料
で被覆する試みでは、逆にその軟化温度が４００度以上
と高いために外装時に素子の構造を破壊したり、電気特
性を劣化させるため電子部品への外装材としての適応が
困難という問題点を有していた。On the contrary, in an attempt to coat with a material excellent in insulation and incombustibility, conversely, the softening temperature thereof is as high as 400 ° C. or higher, so that the structure of the element is destroyed at the time of packaging or the electrical characteristics are deteriorated, so that electronic It has a problem that it is difficult to apply it as an exterior material to parts.
【０００６】本発明は上記従来の問題点を解決するもの
で、素子の電気特性を劣化させることがなく、不燃化を
達成でき高品質で絶縁性、防湿性に優れた不燃性電子部
品の提供、及び不燃性に優れ高品質の不燃性電子部品を
高い生産性で生産作業性に優れた不燃性電子部品の製造
方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and provides a nonflammable electronic component which is capable of achieving nonflammability without deteriorating the electrical characteristics of the element and which is of high quality and excellent in insulation and moisture resistance. It is also an object of the present invention to provide a method for producing a non-combustible electronic component having excellent non-combustibility and high quality non-combustible electronic component with high productivity and excellent workability.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に本発明の不燃性電子部品は素子が絶縁被覆を施された
又は容器内に絶縁材で密封された電子部品であって、絶
縁被覆又は絶縁材として軟化温度が４００℃以下の低融
点ガラスを用いた構成を有している。In order to achieve this object, the nonflammable electronic component of the present invention is an electronic component in which an element is provided with an insulating coating or is sealed in a container with an insulating material. Alternatively, a low melting point glass having a softening temperature of 400 ° C. or lower is used as an insulating material.
【０００８】この構成により、予期しない異常電流によ
る発熱に対して品質の安定な電子部品が得ることができ
る。With this configuration, it is possible to obtain an electronic component having stable quality against heat generation due to an unexpected abnormal current.
【０００９】また、本発明の不燃性電子部品の製造方法
は、製造工程において、軟化温度が低い低融点ガラスを
用い、素子をディッピングする工程又は容器内で素子を
密封、固定する密封工程を備えた構成を有している。Further, the manufacturing method of the non-combustible electronic component of the present invention comprises a step of dipping the element or a sealing step of sealing and fixing the element in a container by using a low melting point glass having a low softening temperature in the manufacturing step. It has a different configuration.
【００１０】この構成により、簡単な作業で不燃性に優
れ、電気特性を損なうことのない高品質な不燃性電子部
品を低原価で量産することができる。With this construction, it is possible to mass-produce high-quality non-combustible electronic parts which are excellent in non-combustibility and do not impair electrical characteristics by a simple operation at low cost.
【００１１】[0011]
【発明の実施の形態】本発明の請求項１に記載の発明
は、素子が絶縁被覆を施された又は容器内に絶縁材で密
封された電子部品であって、前記絶縁被覆又は前記絶縁
材が溶融することによって電子部品の発火を防止する不
燃性電子部品に関するものであり、素子が予期せぬ異常
電流により加熱されても溶融したガラスがその表面を覆
うので、炎や煙、有害ガスなどを発生させないという作
用を有する。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is an electronic component in which an element is provided with an insulating coating or is sealed in a container with an insulating material, wherein the insulating coating or the insulating material is used. It relates to non-combustible electronic parts that prevent ignition of electronic parts by melting, and even if the element is heated by an unexpected abnormal current, the molten glass covers the surface, so flames, smoke, harmful gases, etc. Has the effect of not generating.
【００１２】請求項２に記載の発明は、前記絶縁被覆又
は前記絶縁材が１５０℃〜４００℃の軟化点を有する低
融点ガラスで形成された請求項１に記載の不燃性電子部
品に関するものであり、素子が予期せぬ異常電流により
加熱されても軟化点が１５０℃〜４００℃の低融点ガラ
スが溶融流動し完全に素子を覆うので、炎や煙、有害ガ
スなどが発生させないという作用が有する。The invention according to claim 2 relates to the nonflammable electronic component according to claim 1, wherein the insulating coating or the insulating material is formed of a low melting point glass having a softening point of 150 ° C to 400 ° C. Even if the element is heated by an unexpected abnormal current, the low melting point glass having a softening point of 150 ° C. to 400 ° C. melts and flows to completely cover the element, so that there is an effect that flame, smoke, harmful gas, etc. are not generated. Have.
【００１３】請求項３に記載の発明は、前記低融点ガラ
スがＰｂＯ−ＳｎＯ−Ｐ2Ｏ5系のガラスである請求項１
又は請求項２に記載の不燃性電子部品に関するものであ
る。ここで、ＰｂＯ−ＳｎＯ−Ｐ2Ｏ5系のガラスとして
は１０ＰｂＯ−５０ＳｎＯ−４０Ｐ2Ｏ5等が用いられ
る。その他ＰｂＯ−Ｓｂ2Ｏ3系、ＳｎＯ−Ｐ2Ｏ5系が使
用することができる。素子が予期せぬ異常電流により加
熱されてもこの組成のガラスが溶融流動し素子等を完全
に覆うので、炎や煙、有害ガスなどが発生させないとい
う作用を有する。[0013] The invention according to claim 3, claim 1 low melting point glass is a PbO-SnO-P 2 O 5 based glass
Alternatively, the present invention relates to the nonflammable electronic component according to claim 2. Here, the PbO-SnO-P 2 O 5 based glass 10PbO-50SnO-40P 2 O 5 or the like is used. Other PbO-Sb 2 O 3 system, are SnO-P 2 O 5 system can be used. Even if the element is heated by an unexpected abnormal current, the glass of this composition melts and flows to completely cover the element and the like, so that it has an effect of preventing generation of flame, smoke, harmful gas and the like.
【００１４】請求項４に記載の発明は、素子が絶縁被覆
を施された不燃性電子部品の製造方法であって、請求項
２又は請求項３に記載の低融点ガラスを用い、ディッピ
ングにより外装するディッピング工程を備えた不燃性電
子部品の製造方法に関するものであり、素子が予期せぬ
異常電流により加熱されても軟化点が１５０℃〜４００
℃の低融点ガラスが溶融流動し表面を完全に被覆するの
で発火のおそれのない不燃性電子部品をディッピングす
る簡単な工程で作製することができ、高い生産性と作業
性で低原価で製造することができるという作用を有す
る。A fourth aspect of the present invention is a method for manufacturing a nonflammable electronic component in which an element is provided with an insulating coating, wherein the low melting point glass according to the second or third aspect is used, and the exterior is made by dipping. The present invention relates to a method for manufacturing a non-combustible electronic component including a dipping step, which has a softening point of 150 ° C. to 400 ° C. even when an element is heated by an unexpected abnormal current.
Since the low melting point glass at ℃ melts and flows and completely covers the surface, it can be manufactured by a simple process of dipping non-combustible electronic parts that do not cause ignition, and it is manufactured at low cost with high productivity and workability. It has the effect of being able to.
【００１５】請求項５に記載の発明は電子部品素体が容
器内に絶縁材で密封された不燃性電子部品の製造方法で
あって、請求項２又は請求項３に記載の低融点ガラスを
用い、電子部品素体を容器内に密封、固定する密閉工程
を備えた不燃性電子部品の製造方法に関するものであ
り、電子部品が予期せぬ異常電流により加熱されても軟
化点が１５０℃〜４００℃の低融点ガラスが溶融流動し
表面を完全に被覆するので発火のおそれのない不燃性電
子部品をディッピングする簡単な工程で作製することが
でき、高い生産性と作業性で低原価で製造することがで
きるという作用を有する。以下本発明の実施の形態につ
いて、図１及び図２を用いて説明する。A fifth aspect of the present invention is a method for manufacturing a non-combustible electronic component in which an electronic component element body is sealed in a container with an insulating material, and the low melting point glass according to the second or third aspect is used. The present invention relates to a method for producing a non-combustible electronic component including a sealing step of sealing and fixing an electronic component element body in a container, the softening point of which is 150 ° C or higher even when the electronic component is heated by an unexpected abnormal current. Since the low melting point glass of 400 ℃ melts and flows and completely covers the surface, it can be manufactured by a simple process of dipping non-combustible electronic parts that do not cause ignition, and it is manufactured at low cost with high productivity and workability. It has the effect of being able to. Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.
【００１６】（実施の形態１）図１は実施例１及び実施
例２の試験用試料の断面図である。図１において、１は
磁器コンデンサー、２は低融点ガラスからなる外装、３
は端子である。外装２は、磁器コンデンサー１が予期せ
ぬ異常電流により加熱されても炎、煙、有害ガスなどの
発生を防止するという作用を行うもので、加熱により溶
解する材質、その軟化点が１５０℃〜４００℃の低融点
ガラス、またはＰｂＯ−ＳｎＯ−Ｐ2Ｏ5系の低融点ガラ
スから構成されている。(Embodiment 1) FIG. 1 is a cross-sectional view of test samples of Examples 1 and 2. In FIG. 1, 1 is a porcelain capacitor, 2 is an exterior made of low melting point glass, 3
Is a terminal. The exterior 2 has a function of preventing the generation of flame, smoke, harmful gas, etc. even if the porcelain capacitor 1 is heated by an unexpected abnormal current. It is composed of a low melting point glass of 400 ° C. or a PbO—SnO—P 2 O 5 type low melting point glass.
【００１７】（実施の形態２）図２は実施例３及び実施
例４の試験用試料の断面図である。図２において、実施
の形態１と異なるのは、低融点ガラスからなる外装２が
不燃性容器４中に充填密封され、磁器コンデンサー１が
予期せぬ異常電流により加熱されても炎、煙、有害ガス
などの発生を防止するという作用を行うもので、外装２
は加熱により溶解する材質、その軟化点が１５０℃〜４
００℃の低融点ガラス、またはＰｂＯ−ＳｎＯ−Ｐ2Ｏ5
系の低融点ガラスから構成され、不燃性容器４はセラミ
ッス製容器、金属製容器から構成されている。(Embodiment 2) FIG. 2 is a cross-sectional view of test samples of Examples 3 and 4. In FIG. 2, the difference from the first embodiment is that the exterior 2 made of low-melting glass is filled and sealed in the noncombustible container 4, and even if the porcelain capacitor 1 is heated by an unexpected abnormal current, flame, smoke, harmful It acts to prevent the generation of gas, etc.
Is a material that melts when heated, and its softening point is 150 ° C-4
00 ° C. Low melting glass or PbO-SnO-P 2 O 5 ,
The non-combustible container 4 is made of a low-melting-point glass, and is made of a ceramics container or a metal container.
【００１８】[0018]
【実施例】次に本発明の具体例を説明する。Next, specific examples of the present invention will be described.
【００１９】低融点ガラスの作製は、原料としてＰｂ
Ｏ、ＳｎＯ、Ｐ2Ｏ5及びＮＨ4Ｃｌの試薬を用いた。Ｐ
ｂＯ、ＳｎＯ及びＰ2Ｏ5を（表２）に示す２種類の比率
に秤量した。合計量を３０ｇとし、これに対してＮＨ4
Ｃｌを３０ｗｔ％加えた。これらの原料試薬をアルミナ
乳鉢で十分混合した後、アルミナるつぼに移した。５０
０℃に保持した炉内にアルミナるつぼを挿入し、９０分
間溶解した。溶融後空冷したものを電子部品への外装材
として用いた。A low melting point glass is produced by using Pb as a raw material.
Reagents of O, SnO, P 2 O 5 and NH 4 Cl were used. P
bO, SnO and P 2 O 5 were weighed in two ratios shown in (Table 2). The total amount is 30g, and NH 4
30 wt% of Cl was added. After thoroughly mixing these raw material reagents in an alumina mortar, they were transferred to an alumina crucible. 50
An alumina crucible was inserted into the furnace maintained at 0 ° C. and melted for 90 minutes. The melted and air-cooled product was used as an exterior material for electronic parts.
【００２０】定格２ｋＶＤＣ、１０００ｐＦの円盤型磁
器コンデンサー１に低融点ガラス及び従来品のエポキシ
樹脂系塗料、シリコーン樹脂系塗料、及び従来の低融点
ガラスを塗装、硬化させたものを試料とし、それぞれ、
実施例１、２及び従来例１、２、３として（表１）に示
した。A disk-type porcelain capacitor 1 rated at 2 kVDC and 1000 pF was coated and cured with a low-melting glass, conventional epoxy resin-based paint, silicone resin-based paint, and conventional low-melting glass, as a sample.
The results are shown in Table 1 as Examples 1 and 2 and Conventional Examples 1, 2 and 3.
【００２１】[0021]
【表１】 [Table 1]
【００２２】それぞれの外装材の加工条件は以下に示す
通りであった。ただし、低融点ガラスについては、これ
をるつぼ炉内で３５０℃に加熱、溶融したものに磁器コ
ンデンサー１をディッピング、除冷したものを試料とし
た。このときの低融点ガラスの塗装膜厚は薄いところで
０．２ｍｍ、薄いところで１．００ｍｍであった。The processing conditions of the respective exterior materials were as shown below. However, for the low melting point glass, a sample was prepared by heating and melting the glass in a crucible furnace at 350 ° C., dipping the porcelain capacitor 1 and then cooling. At this time, the coating film thickness of the low melting point glass was 0.2 mm in the thin portion and 1.00 mm in the thin portion.
【００２３】また、定格２ｋＶＤＣ、１０００ｐＦの円
盤型磁器コンデンサー１をアルミニウム製の容器内に低
融点ガラスで密封したものを試料とし、実施例３、４と
して（表１）に示した。低融点ガラスとアルミニウム製
容器とを併用の際は、外径１１ｍｍ、内径１０ｍｍ，高
さ１１．５ｍｍの円筒状アルミニウム容器を用いた。予
めアルミニウム容器内に低融点ガラスを取り、これを３
５０℃に加温、溶解し、この中に磁器コンデンサー１を
挿入し除冷したものを試料とした。Further, a disk type ceramic capacitor 1 having a rating of 2 kVDC and 1000 pF sealed in a container made of aluminum with a low melting point glass was used as a sample and shown as Tables 3 and 4 (Table 1). When the low melting glass and the aluminum container were used together, a cylindrical aluminum container having an outer diameter of 11 mm, an inner diameter of 10 mm and a height of 11.5 mm was used. Take the low melting glass in an aluminum container in advance and
A sample was prepared by heating and melting at 50 ° C., inserting the porcelain capacitor 1 therein, and then cooling.
【００２４】実施例１から実施例４、従来例１と従来例
２の試料のいずれも３５０℃の加熱により静電容量等の
特性の変化は見られなかった。但し、従来例３は電極部
のはんだが溶融して静電特性を失った。In each of the samples of Examples 1 to 4, Conventional Example 1 and Conventional Example 2, no change in characteristics such as capacitance was observed by heating at 350 ° C. However, in Conventional Example 3, the solder in the electrode portion was melted and the electrostatic characteristics were lost.
【００２５】低融点ガラスは（表２）のものを用いた。The low melting point glass (Table 2) was used.
【００２６】[0026]
【表２】 [Table 2]
【００２７】これらの試料を不燃性試験用試料とした。
不燃性試験方法の詳細は以下の通りである。These samples were used as nonflammability test samples.
Details of the nonflammability test method are as follows.
【００２８】耐圧試験器（０〜１０ｋＶＤＣ）を用いて
それぞれの試料の絶縁破壊を行った。外装した磁器コン
デンサー１を耐圧試験器に接続し、電極の電圧を次第に
上げていき、絶縁破壊により電極間の電圧が低下するま
でこれを行った。一つの試料についてこの操作を１０回
行った。絶縁破壊したそれぞれの試料を過電流センサー
耐圧試験器（最大供給能力ＡＣ６００Ｖ，７Ａ）に接続
し、１秒間通電し磁器コンデンサー１を加熱したときの
外装材の燃焼の状態を観察した。Dielectric breakdown of each sample was performed using a withstand voltage tester (0 to 10 kVDC). The exterior porcelain capacitor 1 was connected to a withstand voltage tester, the voltage of the electrodes was gradually increased, and this was performed until the voltage between the electrodes decreased due to dielectric breakdown. This operation was repeated 10 times for one sample. Each of the samples subjected to dielectric breakdown was connected to an overcurrent sensor withstand voltage tester (maximum supply capacity AC600V, 7A), and the state of combustion of the exterior material was observed when the porcelain capacitor 1 was heated by energizing for 1 second.
【００２９】不燃性試験結果を（表３）に示した。The results of the nonflammability test are shown in (Table 3).
【００３０】[0030]
【表３】 [Table 3]
【００３１】この結果から明らかなように、本発明によ
ると不燃性は著しく高められていることが確認された。As is clear from these results, it was confirmed that the nonflammability was remarkably enhanced according to the present invention.
【００３２】[0032]
【発明の効果】以上のように本発明によればコンデンサ
ー、抵抗等の電子部品素子の表面にＰｂＯ−ＳｎＯ−Ｐ
2Ｏ5系の低融点ガラスの外装を施すことにより、従来の
特性を損なうことなく予期せぬ原因により電子部品が加
熱されても炎、煙、有害ガスなどを全く発生せず、硬
く、絶縁性に優れた外装が得られ、また、低温での外装
が可能であるために、外装形成工程において電子部品素
子をいためることの無い特性の安定した不燃性電子部品
を実現できる。また、本発明の不燃性電子部品の製造方
法によれば、簡単な作業で高い製品得率を得ることがで
き生産性を著しく向上させるとともに高品質で耐久性に
優れた不燃性電子部品を低原価で量産できるものであ
る。As described above, according to the present invention, PbO-SnO-P is formed on the surface of electronic component elements such as capacitors and resistors.
By coating the exterior of 2 O 5 type low melting point glass, even if electronic parts are heated by an unexpected cause without damaging the conventional characteristics, no flame, smoke, harmful gas, etc. are generated at all, and it is hard and insulated. Since an exterior having excellent properties can be obtained and the packaging can be performed at a low temperature, a nonflammable electronic component having stable characteristics can be realized without damaging the electronic component element in the exterior forming process. Further, according to the method for producing a non-combustible electronic component of the present invention, it is possible to obtain a high product yield by a simple operation and significantly improve the productivity, and to reduce the non-combustible electronic component having high quality and excellent durability. It can be mass-produced at cost.
【図１】実施例１及び実施例２の試験用試料の断面図FIG. 1 is a cross-sectional view of test samples of Examples 1 and 2.
【図２】実施例３及び実施例４の試験用試料の断面図FIG. 2 is a cross-sectional view of test samples of Examples 3 and 4.
１ 磁器コンデンサー ２ 外装 ３ 端子 ４ 不燃性容器 1 Porcelain capacitor 2 Exterior 3 Terminal 4 Nonflammable container
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山本 益裕 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masuhiro Yamamoto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (5)
体が容器内に絶縁材で密封された不燃性電子部品であっ
て、前記絶縁被覆又は前記絶縁材が溶融することによっ
て前記電子部品の発火を防止することを特徴とする不燃
性電子部品。1. A non-combustible electronic component in which an element is provided with an insulating coating or an electronic component element body is sealed in a container with an insulating material, and the electronic component is produced by melting the insulating coating or the insulating material. Non-combustible electronic parts that prevent ignition of parts.
４００℃の軟化点を有する低融点ガラスで形成されてい
ることを特徴とする請求項１に記載の不燃性電子部品。2. The insulating coating or the insulating material is 150.degree.
The nonflammable electronic component according to claim 1, wherein the nonflammable electronic component is formed of a low melting point glass having a softening point of 400 ° C.
Ｏ5系のガラスであることを特徴とする請求項１又は請
求項２に記載の不燃性電子部品。3. The low melting glass is PbO—SnO—P 2
The nonflammable electronic component according to claim 1 or 2, which is O 5 type glass.
の製造方法であって、請求項２又は請求項３に記載の低
融点ガラスを用い、ディッピングにより外装するディッ
ピング工程を有することを特徴とする不燃性電子部品の
製造方法。4. A method for manufacturing a non-combustible electronic component in which an element is provided with an insulating coating, comprising a dipping step of dipping the low melting point glass according to claim 2 or 3 A method for manufacturing a characteristic non-combustible electronic component.
た不燃性電子部品の製造方法であって、請求項２又は請
求項３に記載の低融点ガラスを用い電子部品素体を容器
内に密封、固定する密封工程を備えていることを特徴と
する不燃性電子部品の製造方法。5. A method for producing a non-combustible electronic component, in which the electronic component body is sealed in a container with an insulating material, wherein the electronic component body is formed by using the low melting point glass according to claim 2. A method of manufacturing a nonflammable electronic component, comprising a sealing step of sealing and fixing in a container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33648195A JP3769795B2 (en) | 1995-12-25 | 1995-12-25 | Method for manufacturing non-combustible electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33648195A JP3769795B2 (en) | 1995-12-25 | 1995-12-25 | Method for manufacturing non-combustible electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09180961A true JPH09180961A (en) | 1997-07-11 |
| JP3769795B2 JP3769795B2 (en) | 2006-04-26 |
Family
ID=18299585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33648195A Expired - Lifetime JP3769795B2 (en) | 1995-12-25 | 1995-12-25 | Method for manufacturing non-combustible electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3769795B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135249A (en) * | 2007-11-30 | 2009-06-18 | Gemmy Electronics Co Ltd | Solid-state electrolytic capacitor |
-
1995
- 1995-12-25 JP JP33648195A patent/JP3769795B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135249A (en) * | 2007-11-30 | 2009-06-18 | Gemmy Electronics Co Ltd | Solid-state electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3769795B2 (en) | 2006-04-26 |
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