JPH0918057A - Chip-arrangement structure for light-emitting diode - Google Patents

Chip-arrangement structure for light-emitting diode

Info

Publication number
JPH0918057A
JPH0918057A JP7183525A JP18352595A JPH0918057A JP H0918057 A JPH0918057 A JP H0918057A JP 7183525 A JP7183525 A JP 7183525A JP 18352595 A JP18352595 A JP 18352595A JP H0918057 A JPH0918057 A JP H0918057A
Authority
JP
Japan
Prior art keywords
chips
light
emitting diode
chip
emitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7183525A
Other languages
Japanese (ja)
Inventor
Fuminori Sato
文典 佐藤
Shoji Fujino
昭二 藤野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATSUDEN CORP
ATSUDEN KK
Original Assignee
ATSUDEN CORP
ATSUDEN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATSUDEN CORP, ATSUDEN KK filed Critical ATSUDEN CORP
Priority to JP7183525A priority Critical patent/JPH0918057A/en
Publication of JPH0918057A publication Critical patent/JPH0918057A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: To increase the luminous performance of a light-emitting diode provided with a plurality of built-in chips. CONSTITUTION: In a light-emitting diode 1 of a constitution, wherein a plurality of square chips 3 and 3 which emit through each surface thereof by current conduction are mounted onto a base plate 2 and lights a which are emitted from these chips 3 are condensed in front reflecting by the reflective plate 8, and emitted, the chips are provided so that the side surfaces 3a of the plurality of pieces of the chips 3 are turned in a direction to intersect each other. Either of the lights (a), which are emitted from the four side surfaces 3a of each chip 3, does not be affected by its neighboring chip 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、カラオケ用のマイクロ
ホン等に使用される、発光ダイオードのチップ配設構造
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode chip arrangement structure used in a microphone for karaoke.

【0002】[0002]

【従来の技術】図3について従来の発光ダイオードを説
明する。1は発光ダイオードで、ベース板2に2個のチ
ップ3,3を、その隣接する側面3a,3aが対向する
ように向かせて配設したものである。このチップ3,3
は、ガリウム燐、ガリウム・アルミニウム燐など金属間
化合物半導体のPN接合からなるものである。ベース板
2に2個配設したのは、1個より大きな光量を得るため
である。これらチップ3,3には上下面に電極があり、
上面の電極は、絶縁材4を介してベース板2から植立さ
せたピン5にリード線6で接続されている。一方、下部
の電極はベース板2に直接接続されている。7はベース
板2の電極ピンである。8は反射板であり、2個のチッ
プ3,3の発する光を前方に集光して発光するものであ
る。発光ダイオードの完成品としては、この反射板8の
上部をドーム状の樹脂材で覆ったものとなる。
2. Description of the Related Art A conventional light emitting diode will be described with reference to FIG. Reference numeral 1 denotes a light emitting diode, which is provided with two chips 3 and 3 on a base plate 2 so that their adjacent side surfaces 3a and 3a face each other. This tip 3,3
Is a PN junction of an intermetallic compound semiconductor such as gallium phosphide or gallium-aluminum phosphide. Two of them are arranged on the base plate 2 in order to obtain a light amount larger than one. These chips 3 and 3 have electrodes on the upper and lower surfaces,
The electrodes on the upper surface are connected by leads 6 to pins 5 which are erected from the base plate 2 via an insulating material 4. On the other hand, the lower electrode is directly connected to the base plate 2. Reference numeral 7 is an electrode pin of the base plate 2. Reference numeral 8 denotes a reflector, which collects the light emitted from the two chips 3 and 3 to the front and emits the light. The finished product of the light emitting diode is one in which the upper portion of the reflection plate 8 is covered with a dome-shaped resin material.

【0003】[0003]

【発明が解決しようとする課題】チップ3,3は、ベー
ス板2に密着させた底面を含めて、上面および4つの側
面の計6面の全体から発光する。この発光を反射板8で
同一方向(図における上方)に向けて外部に放射するの
である。ところで2個のチップ3,3は、前述のように
隣接する側面3a,3aが対向するように向かせて配設
されてあるので、図4に示すようにその対向した側面3
a,3aから発光する光線a,aが相手側の同面に当た
って干渉し、外部に有効に取り出せないという問題があ
る。
The chips 3 and 3 emit light from the entire top surface and four side surfaces, including the bottom surface closely attached to the base plate 2, for a total of six surfaces. This emitted light is emitted to the outside in the same direction (upward in the figure) by the reflector 8. By the way, since the two chips 3 and 3 are arranged so that the adjacent side surfaces 3a and 3a face each other as described above, as shown in FIG.
There is a problem that the light rays a and a emitted from a and 3a impinge on the same surface of the other side and interfere with each other, so that they cannot be effectively extracted to the outside.

【0004】チップ3,3を2個用いた場合(もちろん
2個以上用いることもできる)、ベース板2に密着する
1面は犠牲となるが、残る5面の2個分の10面は効率
のよき発光が望まれる。しかしながら実際にはそのうち
のまた2面が上述のように効率が落ちてしまうのであ
る。本発明はこの点に鑑みてなされたものであり、チッ
プ3,3の向きを変えることによって、従来は発光効率
が悪かった面を他の面と同様な効率に引き上げることが
できるようにしたものである。したがって全体的な発光
効率が上昇する。
When two chips 3 and 3 are used (two or more can be used, of course), one surface that is in close contact with the base plate 2 is sacrificed, but the remaining five surfaces, 10 of the two, are efficient. Good light emission is desired. However, in reality, two more of them lose their efficiency as described above. The present invention has been made in view of this point, and by changing the directions of the chips 3 and 3, it is possible to raise the surface, which has conventionally been poor in light emission efficiency, to the same efficiency as other surfaces. Is. Therefore, the overall luminous efficiency is increased.

【0005】[0005]

【課題を解決するための手段】本発明は、上記課題を解
決するための手段として、ベース板に、通電により各面
から発光する方形のチップを複数個取付け、これらチッ
プの発する光を反射板で前方に集光して発光する発光ダ
イオードにおいて、前記複数個のチップの側面が、相互
に交差する方向を向くように配設したことを特徴とす
る。
As a means for solving the above-mentioned problems, the present invention mounts a plurality of rectangular chips, which emit light from each surface upon energization, on a base plate, and reflects the light emitted by these chips. In the light emitting diode which collects and emits light in the forward direction, the side surfaces of the plurality of chips are arranged so as to face each other.

【0006】[0006]

【作用】このような構成とすれば、4つの側面のどの面
から発せられる光線も隣接する他のチップに当たること
がなく、すべて同じ条件で放射方向に向かうことにな
る。
With such a structure, the light rays emitted from any of the four side surfaces do not strike other adjacent chips, and all rays travel in the radial direction under the same conditions.

【0007】[0007]

【実施例】以下本発明の一実施例を図1および図2につ
いて、図3と同一の符号を付してすると、本発明を適用
したものにあっては、2個のチップ3,3をベース板2
に取付けるに当たり、その側面3a,3aが相互に交差
する方向を向くように、換言すれば2個のチップ3,3
の角部が近接するように向けて配設してある。これによ
って光線a,aは交差はするがチップ3,3の側面3
a,3aが光線a,aの進行を妨げることがない。よっ
て、下面を除く各5面、計10面の発する光線が反射板
8で屈折して前方に放射される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to FIGS. 1 and 2 by the same reference numerals as those in FIG. Base plate 2
When it is attached to, the side surfaces 3a, 3a are directed so as to intersect with each other, in other words, the two chips 3, 3 are attached.
Are arranged so that their corners are close to each other. As a result, the rays a, a intersect, but the side surface 3 of the chips 3, 3
The a and 3a do not hinder the progress of the light rays a and a. Therefore, light rays emitted from each of the five surfaces except the lower surface, that is, ten surfaces are refracted by the reflecting plate 8 and are emitted forward.

【0008】[0008]

【発明の効果】本発明は、以上説明したように構成され
た発光ダイオードのチップ配設構造であるから、ベース
板に対するチップの向きを変えるのみの簡単な構成によ
って、従来は発光効率が高くとれなかった側面からも、
光線を外部に有効に取り出すことが可能となる。したが
って、同一のチップを用いて全体的な発光効率を上げる
ことができる。
As described above, the present invention has the structure of arranging the chips of the light emitting diode configured as described above. Therefore, it is possible to obtain a high luminous efficiency in the prior art by a simple structure in which the direction of the chip is changed with respect to the base plate. From the side that did not exist,
It is possible to effectively extract the light rays to the outside. Therefore, it is possible to increase the overall luminous efficiency by using the same chip.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例の斜視図である。FIG. 1 is a perspective view of one embodiment of the present invention.

【図2】光線の流れを説明する図1の要部平面図であ
る。
FIG. 2 is a plan view of an essential part of FIG. 1 for explaining the flow of light rays.

【図3】従来の発光ダイオードを図1と同様角度で示し
た斜視図である。
FIG. 3 is a perspective view showing a conventional light emitting diode at an angle similar to FIG.

【図4】光線の流れを説明する図3の要部平面図であ
る。
FIG. 4 is a plan view of an essential part of FIG. 3 for explaining the flow of light rays.

【符号の説明】[Explanation of symbols]

1 発光ダイオード 2 ベース板 3 チップ 3a 側面 8 反射板 a 光線 1 Light emitting diode 2 Base plate 3 Chip 3a Side surface 8 Reflector a Ray

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ベース板に、通電により各面から発光す
る方形のチップを複数個取付け、これらチップの発する
光を反射板で前方に集光して発光する発光ダイオードに
おいて、前記複数個のチップの側面が、相互に交差する
方向を向くように配設したことを特徴とする発光ダイオ
ードのチップ配設構造。
1. A light-emitting diode in which a plurality of rectangular chips, each of which emits light from each surface when energized, are attached to a base plate, and the light emitted from these chips is condensed forward by a reflecting plate to emit light, wherein the plurality of chips are provided. The chip arrangement structure of the light emitting diode, wherein the side surfaces of the light emitting diode are arranged so as to face each other.
JP7183525A 1995-06-27 1995-06-27 Chip-arrangement structure for light-emitting diode Pending JPH0918057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7183525A JPH0918057A (en) 1995-06-27 1995-06-27 Chip-arrangement structure for light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7183525A JPH0918057A (en) 1995-06-27 1995-06-27 Chip-arrangement structure for light-emitting diode

Publications (1)

Publication Number Publication Date
JPH0918057A true JPH0918057A (en) 1997-01-17

Family

ID=16137371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7183525A Pending JPH0918057A (en) 1995-06-27 1995-06-27 Chip-arrangement structure for light-emitting diode

Country Status (1)

Country Link
JP (1) JPH0918057A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10454010B1 (en) 2006-12-11 2019-10-22 The Regents Of The University Of California Transparent light emitting diodes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10454010B1 (en) 2006-12-11 2019-10-22 The Regents Of The University Of California Transparent light emitting diodes
US10593854B1 (en) 2006-12-11 2020-03-17 The Regents Of The University Of California Transparent light emitting device with light emitting diodes
US10644213B1 (en) 2006-12-11 2020-05-05 The Regents Of The University Of California Filament LED light bulb
US10658557B1 (en) 2006-12-11 2020-05-19 The Regents Of The University Of California Transparent light emitting device with light emitting diodes

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