JPH09179084A - Heat treating device for glass substrate for liquid crystal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make uniform the temperature distribution of the device which thermally treats a materials applied over the glass substrate for liquid crystal display for various purposes. SOLUTION: A cavity part 4 having an entrance part 2 and an exit part 3 for the glass substrate is provided, and on the reverse surface in the cavity part 4, single or plural hot plates 5 and cold plates 21 for a temperature raising part 7, a soaking part 8, and a cooling part 9 are provided in this order. On the top surface, a pin is stood and reflecting plates 6 are installed at the parts facing the respective plates 5; and cavity parts 4 are stacked in plural stages, a conveyance driving part 11 is driven in all directions by a driving motor 10 provided at the bottom part, and the movement is transmitted to a conveyance beam 12 provided to each cavity part 4 by a beam support 15, Consequently, the respective cavity parts 4 are conveyed by a sheet type conveying mechanism at the same time while the glass substrate is supported by a metallic support.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for a glass substrate for liquid crystal after applying a polyimide film, a top coat film, a sealant and the like.

[0002]

2. Description of the Related Art In a heat treatment apparatus for a glass substrate for liquid crystal coated with a polyimide film, a top coat film, a sealing agent, etc., there are some differences in set temperature and processing time. It is like this.

That is, referring to FIGS. 5 and 6, an inlet portion 2 is provided on one side of the heat treatment apparatus main body 1 and an outlet portion 3 is provided on the other side thereof, and a tunnel-shaped cavity portion 4 is formed. From the inlet part 2 to the outlet part 3, a plurality of hot plates 5 for the temperature raising part 7, a plurality of hot plates 5 for the soaking part 8, and a plurality of hot parts for the cooling part 9 are provided on the lower surface inside the cavity 4. The plate 5 and the cold plate 21 are sequentially arranged in a line, and a plurality of reflecting plates 6 are installed on the upper surface facing each hot plate 5. Note that the distance between the hot plate 5 and the reflection plate 6 is often set to 15 to 30 mm in consideration of the glass substrate 16 to be passed therethrough. Reference numeral 24 denotes a purge pipe provided above each reflecting plate 6 in order to maintain the cleanliness of the inside of the cavity 4, and clean air at room temperature is purged.

The transport mechanism drives the transport drive unit 11 in the vertical and horizontal directions by the drive motor 10, and the transport drive unit 11 is driven.
The carrier beam 1 by means of a beam support 15 connected to
2 is conveyed while supporting the glass substrates 16 one by one by each of the four support fittings 14 installed on the carrier beam 12, and is placed on the pins 13 standing on the upper part of the hot plate 5 for a certain time. A single-wafer type is used in which the sheets can be transferred one after another after a certain period of time. The pin 13 used here is rod-shaped as shown in FIG. 7, and is simply inserted into a hole formed in the hot plate 5.

A temperature sensor (not shown) and a heater (not shown) are incorporated in the hot plate 5 for the temperature raising section 7 and the hot plate 5 for the soaking section 8, respectively.
The heater is ON-OFF controlled to reach the set temperature. In the hot plate 5 for the cooling unit 9, a cooling pipe (not shown) is incorporated in addition to the temperature sensor and the heater,
The heater is ON-OFF controlled so as to reach the set temperature, and the control valve of the cooling pipe is opened and closed. Cooling unit 9
Room temperature water is always passed through the cold plate 21.

[0006]

However, in the conventional heat treatment apparatus for a liquid crystal glass substrate as shown in FIGS. 5 and 6, the temperature sensor incorporated in each hot plate 5 controls ON / OFF of the heater. Just because
The hot plate 5 for the temperature raising portion 7 closest to the inlet portion 2 side where there is no adjacent hot plate 5 has a large amount of heat radiated to the inlet portion 2 side, and the upper surface temperature becomes low on the inlet portion 2 side. Further, for the same reason, the hot plate 5 for the soaking section 8 adjacent to the hot plate 5 for the cooling section 9 also radiates a large amount of heat to the hot plate 5 for the cooling section 9, and the upper surface temperature is the hot plate 5 for the cooling section 9. The side becomes low. Therefore, the temperature distribution of the glass substrate 16 is large and the temperature distribution is not uniform. Further, there is a problem that the room temperature air purged from the purge pipe 24 enters through the gap between the reflection plate 6 and the carrier beam 12 and cools both sides of the glass substrate 16. These also cause distortion in the glass substrate and also cause damage when the distortion increases.

Another problem is that the pins 13 on which the glass substrate 16 is placed are easily removed from the holes due to the influence of heat. That is, since the pin 13 is simply placed in the hole formed in the hot plate 5, if the pin 13 adheres to the glass substrate 16, the pin 13 will move out together with the glass substrate 16. . Pin 13 is 1
If the book is removed, it becomes impossible to place the glass substrate 16 horizontally, and the glass substrate is damaged.

In view of the above problems, the present invention provides a heat treatment apparatus for a glass substrate for liquid crystal, which has a small temperature distribution, minimizes distortion of the glass substrate, and does not pull out a pin for mounting the glass substrate. Has an aim.

[0009]

The present invention provides a glass substrate 1
6, a cavity portion 4 having an inlet portion 2 and an outlet portion 3 is provided, and one or more hot plates 5 for the temperature raising portion 7 facing the inlet portion 2 to the outlet portion 3 are provided on the inner lower surface of the cavity portion 4, A plurality of hot plates 5 for soaking section 8, a plurality of hot plates 5 for cooling section 9 and a cold plate 21 are provided in this order, and each hot plate 5 and cold plate 21 is provided.
A pin 13 is erected on the upper surface of each of the cavities 4, a reflector plate 6 is installed in each portion of the cavity 4 that faces the plates 5, and the cavities 4 are stacked in a plurality of stages and provided at the bottom. The motor 10 drives the transport drive unit 11 vertically and horizontally and the beam support 15 connected to the transport drive unit 11 transmits motion to the transport beams 12 respectively provided in the respective cavity portions 4, and the transport beams 12 are transmitted to the respective transport beams 12. A heat treatment apparatus having a single-wafer-type transfer mechanism that simultaneously transfers each cavity 4 while supporting a glass substrate 16 by a plurality of supporting metal fittings 14 installed, and is a heating unit 7 closest to the inlet 2. Of the hot plate 5 for the cooling unit 9 and the end of the hot plate 5 for the soaking unit 8 closest to the hot plate 5 for the cooling unit 9 on the side of the hot plate 5 for the cooling unit 9 are independently controlled. Hi It is characterized in that it has attached the data 22.

The second aspect of the present invention is characterized in that shield plates 23 are provided on both sides of the reflection plate 6 so as to shield the carrier beam 12.

In the third aspect of the present invention, the pins 13 erected on the upper surfaces of the hot plate 5 and the cold plate 21 are locked to the side surfaces of the holes formed in the plates 5 and 21 by the elastic force of the pins themselves. It is characterized by that.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION A temperature sensor and a heater are respectively incorporated in the hot plate 5 for the temperature raising section 7 and the soaking section 8 used in the present invention, and control is performed so as to maintain the set temperature. Further, in the hot plate 5 for the cooling unit 9, a cooling pipe is incorporated in addition to the temperature sensor and the heater. Basically, if the hot plate 5 for the cooling unit 9 also has a heater, it is possible to control the temperature, but there is a possibility that the temperature from the adjacent hot plate 5 having a higher temperature may be higher than the set temperature. There is a cooling pipe to prevent this.

In the present invention, in addition to the above-mentioned heater, an independently controlled heater is provided, which is the heating portion 7 closest to the inlet portion 2 side.
The hot plate 5 is attached to the end of the hot plate 5 on the inlet side 2 and the end of the hot plate 5 for the soaking part 8 closest to the hot plate 5 for the cooling part 9 on the hot plate 5 side for the cooling part 9. As a result, the heat dissipation and cooling unit 9 at the entrance
It becomes possible to prevent heat radiation to the hot plate 5, and the temperature distribution on the upper surface of the hot plate 5 becomes uniform.

Further, by disposing the shielding plates 23 on both sides of the reflection plate 6 so as to shield the carrier beam 12, the room temperature air purged from the purge pipe 24 is discharged from the gap between the reflector plate 6 and the carrier beam 12. It is possible to prevent both sides of the entering glass substrate 16 from being cooled.

The pin 13 used in the present invention is preferably made of stainless steel, and it is preferable that the pin 13 has an inverted U-shape, an inverted V-shape, and a V-shape in terms of elastic force. Further, the tip end on which the glass substrate 16 is placed is a grinder,
If scissors or the like is used to form a flat surface, it is difficult to scratch the glass substrate 16.

[0016]

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 4. The heat treatment apparatus for a glass substrate for liquid crystal of the present invention is as follows.
The glass substrate 16 has a tunnel-shaped hollow portion 4 provided with an inlet portion 2 and an outlet portion 3, and a temperature raising portion 7 (one plate is provided on the lower surface inside the hollow portion 4 from the inlet portion 2 toward the outlet portion 3). ), Soaking part 8 (two plates), cooling part 9 (two plates),
The cold plate 21 (one piece) is provided in this order.
Further, six reflection plates 6 are provided on the upper surface of the hollow portion 4 so as to face the hot plate 5 to reduce the temperature difference between the front and back of the glass substrate 16. Hot plate 5 and reflector 6
The distance was set to 25 mm.

The cavity for carrying the glass substrate 16 is shown in FIG.
As shown in FIG. 3, three stages are stacked in the vertical direction, and it is possible to achieve efficiency and space saving of the device itself as compared with one stage.

Temperature sensors and heaters are attached to the hot plates 5 of the temperature raising section 7 and the soaking section 8 shown in FIG. 2, respectively, so that the set temperature can be freely determined and controlled. A cooling pipe is incorporated in the hot plate 5 of the cooling unit 9 in addition to the temperature sensor and the heater, and the temperature of the plate 5 is controlled by opening and closing the control valve of the cooling pipe.
It should be noted that normal temperature water is always passed through the cold plate 21.

The set temperature of each hot plate 5 is set higher in the temperature raising section 7 than in the soaking section 8, and in the soaking section 8 it is set to a common temperature for the two plates. In the cooling unit 9, the temperature is set to decrease as the distance from the inlet 2 increases.

The transport mechanism is of the single-wafer type as described above, and as shown in FIGS. 3 and 4, the drive motor 10 drives the transport drive unit 11 up, down, front, back, left and right to connect the beam to the transport drive unit 11. The support 15 conveys the movement to the carrier beams 12 respectively provided in the respective cavity parts 4, and the four supporting metal fittings 14 installed in the respective carrier beams 12 support the glass substrates 16 one by one while each cavity part 4 is provided. Are simultaneously conveyed and placed on the pins 13 provided on the upper surface of the hot plate 5 for a certain period of time, and after the lapse of a certain period of time, they are sequentially remounted.
Shielding plates 23 are attached to both sides of the reflecting plate 6 so as to shield the carrier beam 12 so that purged air does not flow into the glass substrate 16 side from between the reflecting plate 6 and the carrier beam 12.

The pin 13 used here has an inverted V-shape as shown in FIG. 8 and is made of stainless steel. Further, a part of the bent portion of the pin 13 is cut horizontally with scissors to form a flat surface.

An independently controlled heater 22 is provided at the end of the hot plate 5 for the temperature raising section 7 closest to the inlet on the side of the inlet section 2, and the set temperature is a hot plate for the temperature raising section 7. It is set higher than the set temperature of 5. This makes it possible to compensate for heat loss due to heat radiation to the inlet portion 2 side. On the other hand, the heater 22 that also controls another system at the end of the hot plate 5 for the soaking section 8 closest to the hot plate 5 for the cooling section 9 on the cooling unit 9 hot plate 5 side.
Is attached, and the set temperature thereof is set higher than the temperature of the hot plate 5 for the soaking section 8. This makes it possible to compensate for heat loss due to heat radiation to the cooling unit 9 side.

As a result of heat-treating the glass substrate for liquid crystal with the takt time of 60 seconds, the temperature of the hot plate can be made uniform, and the polyimide film, the top coat film and the sealing agent applied on the surface of the glass substrate 16 can be obtained. In addition, there was no burning unevenness due to non-uniform temperature. Further, the installation area of the heat treatment apparatus main body 1 can be suppressed to 60% as compared with the conventional heat treatment apparatus (one-stage type), and the size can be reduced.

[0024]

As described above, the heat treatment apparatus for a glass substrate for liquid crystal according to the present invention is closest to the inlet side end of the temperature raising hot plate closest to the inlet and the cooling hot plate. An independently controlled heater is attached to each end of the hot plate for soaking part on the hot plate side for the cooling part, so that the surface temperature of the hot plate is uniform without being affected by heat radiation to the inlet side and the cooling part side. It has become possible to keep the temperature constant on the glass substrate and to make the temperature distribution of the glass substrate uniform. Further, since the glass plate with the shielding plate attached does not cool both side portions of the glass substrate, the temperature distribution can be made more uniform. In addition, the pin does not come off even if it adheres to the glass substrate, and it is possible to stop in place by its elastic force.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of essential parts of a heat treatment apparatus for a glass substrate for liquid crystal according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a main part of a heat treatment apparatus for a glass substrate for liquid crystal shown in FIG.

[FIG. 3] A of the heat treatment apparatus for the glass substrate for liquid crystal shown in FIG.
It is -A sectional drawing.

FIG. 4 is an enlarged view of a main part of a heat treatment apparatus for a glass substrate for liquid crystal shown in FIG.

FIG. 5 is a cross-sectional view of essential parts of a heat treatment apparatus for a glass substrate for liquid crystal according to a conventional example.

FIG. 6 is an A of the heat treatment apparatus for the glass substrate for liquid crystal shown in FIG.
It is -A sectional drawing.

FIG. 7 is an enlarged view of a pin portion according to a conventional example.

FIG. 8 is an enlarged view of a pin portion according to an embodiment of the present invention.

[Explanation of symbols]

1. Heat treatment equipment body 2. Entrance 3. Exit
4. Cavity 5. Hot plate 6. reflector
7. Temperature raising unit 8. Soaking part 9. Cooling unit 10. Drive motor 11. Transport drive unit 12. Carrier beam
13. Pin 14. Support bracket 15. Beam support 16. Glass substrate 18. Carry-in robot 19. Carry-out robot 20. Coro conveyor 21. Cold plate 22. Independently controlled heater 23. Shield plate 2
4. Purge pipe

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tadashi Sato, 3-chome, Surugadai, Kanda, Chiyoda-ku, Tokyo 2 In Hitachi Chemical Techno Plant Co., Ltd. (72) Makoto Saito, 3-chome, Surugadai, Kanda, Chiyoda-ku, Tokyo Inside Hitachi Chemical Techno Plant Co., Ltd. (72) Inventor Yusuke Miyamae 3-chome, Surugadai, Kanda, Chiyoda-ku, Tokyo 2 Inside Hitachi Chemical Techno Plant Co., Ltd.

Claims (3)

[Claims] 1. A cavity part having an inlet part and an outlet part of a glass substrate is provided, and one or a plurality of hot plates for temperature raising parts facing from the inlet part to the outlet part are provided on the inner lower surface of the cavity part, and a plurality of them. A hot plate for soaking section, a plurality of hot plates for cooling section and a cold plate are provided in this order, and pins are erected on the upper surface of each of the hot plate and the cold plate to face each plate in the cavity. A reflective plate is installed on each of the cavities, and the hollow portions are stacked in a plurality of stages, and the transport driving unit is driven vertically, forward, backward, leftward, and rightward by a driving motor provided at the bottom, and each hollow portion is connected by a beam support connected to the transport driving unit. A sheet that transfers movement to each of the carrier beams and simultaneously carries each of the cavities while supporting the glass substrate with each of the plurality of support fittings installed on each carrier beam. A heat treatment apparatus having a leaf type conveyance mechanism, wherein an inlet end of a hot plate for a temperature raising section closest to an inlet section and a cooling section of a hot plate for a soaking section closest to a hot plate for a cooling section A heat treatment device for a glass substrate for liquid crystal, characterized in that an independently controlled heater is attached to each of the end portions on the hot plate side. 2. The heat treatment apparatus for a glass substrate for liquid crystal according to claim 1, wherein shield plates are provided on both sides of the reflection plate so as to shield the carrier beam. 3. A pin standing upright on the upper surface of the hot plate and the cold plate is locked by the elastic force of the pin itself on the side surface of the hole formed in each plate. A heat treatment apparatus for a glass substrate for liquid crystal as described above.