JPH09178637A - Non-adhesive liquid type sample adhesion method in hardness tester - Google Patents

Non-adhesive liquid type sample adhesion method in hardness tester

Info

Publication number
JPH09178637A
JPH09178637A JP35065495A JP35065495A JPH09178637A JP H09178637 A JPH09178637 A JP H09178637A JP 35065495 A JP35065495 A JP 35065495A JP 35065495 A JP35065495 A JP 35065495A JP H09178637 A JPH09178637 A JP H09178637A
Authority
JP
Japan
Prior art keywords
sample
adhesive liquid
hardness tester
adhesion method
silicon wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35065495A
Other languages
Japanese (ja)
Inventor
Takeji Kitamura
竹司 北村
Hirotaka Hayashi
浩孝 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Akashi Corp
Original Assignee
Konica Minolta Inc
Akashi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc, Akashi Corp filed Critical Konica Minolta Inc
Priority to JP35065495A priority Critical patent/JPH09178637A/en
Publication of JPH09178637A publication Critical patent/JPH09178637A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To attach the very thin sample such as a film tightly to the sample stage of a hardness tester. SOLUTION: A silicon wafer substrate 13 having high smoothness is mounted so as to form a sample mounting surface on a sample stage 10. A minute amount of non-adhesive liquid is supplied on the upper surface of the wafer by a spray nozzle. Then, a sample 1 is mounted. Thus, the very thin sample 1 such as a film can be tightly attached on the sample stage 10 by utilizing the surface tension of the liquid described above. Furthermore, the sample may be directly mounted on the smooth mounting surface in the sample stage 10.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、硬さ試験機に試料
を密着させる試料密着方法に関し、特にフィルムのよう
な極肉薄試料を試料台に密着固定するのに好適な、硬さ
試験機における非接着性液体式試料密着方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sample contact method for bringing a sample into close contact with a hardness tester, and particularly in a hardness tester suitable for closely fixing an extremely thin sample such as a film to a sample stand. A non-adhesive liquid sample contact method.

【0002】[0002]

【従来の技術】一般に、材料に圧子によって微小な荷重
を与え、その圧子に加えられた荷重と圧子の材料への侵
入量とを測定して、材料の微小領域強度を試験する手段
が用いられている。そして、このような硬さ試験におい
ては、材料を試料台に密着固定することが測定精度の点
から極めて重要なこととされている。
2. Description of the Related Art Generally, a means for testing a micro region strength of a material by applying a minute load to the material by an indenter, measuring the load applied to the indenter and the amount of intrusion of the indenter into the material are used. ing. In such hardness test, it is considered extremely important from the viewpoint of measurement accuracy that the material is closely fixed to the sample table.

【0003】[0003]

【発明が解決しようとする課題】被測定材料(試料)
が、フィルムのような可撓性でかつ極肉薄な場合、試料
台の上に試料を載置し(その後軽く押圧し)ただけで
は、図2に示すように、試料1と金属試料台10との間に
空隙2,2・・・が生じ、密着不良による誤差が発生す
るという問題点がある。そこで、試料台に試料を密着固
定する手段として、接着剤を使用することが従来提案さ
れたが、接着剤を使用した場合、圧子を試料上面から押
し込んだときに接着剤の薄膜層が弾性変形し、これが異
常データ(クリープ変形がマイナス値)の原因となると
いう問題点が生じる。なお図2中の符号11は圧子,符号
12は試料押えをそれぞれ示している。本発明は、従来技
術における上述のような問題点を解決しようとするもの
である。
Material to be measured (sample)
However, when the sample is flexible and extremely thin like a film, simply placing the sample on the sample table (and then gently pressing it) will cause the sample 1 and the metal sample table 10 to move as shown in FIG. There is a problem that gaps 2, 2 ... Therefore, it has been conventionally proposed to use an adhesive as a means for closely fixing the sample to the sample table.However, when using the adhesive, the thin film layer of the adhesive elastically deforms when the indenter is pushed in from the upper surface of the sample. However, there arises a problem that this causes abnormal data (creep deformation is a negative value). In addition, reference numeral 11 in FIG.
12 shows the sample holders respectively. The present invention is intended to solve the above-mentioned problems in the prior art.

【0004】[0004]

【課題を解決するための手段】本発明の硬さ試験機にお
ける非接着性液体式試料密着方法は、硬さ試験機の試料
台に試料を密着させるに際し、同試料台における試料載
置面に上記試料を載置する前に、同試料(載置)面に微
量の非接着性液体を供給して課題解決の手段としてい
る。
A non-adhesive liquid sample adhesion method in a hardness tester of the present invention is such that when a sample is brought into close contact with a sample table of the hardness tester, the sample is placed on the sample mounting surface of the sample table. Before mounting the sample, a small amount of non-adhesive liquid is supplied to the sample (mounting) surface to solve the problem.

【0005】また、本発明の硬さ試験機における非接着
性液体式試料密着方法は、硬さ試験機の試料台に試料を
密着させるに際し、上記試料台にシリコンウエハー基板
を載置し、同シリコンウエハー基板の表面に微量の非接
着性液体を供給した後に同シリコンウエハー基板の表面
に上記試料を載置して課題解決の手段としている。上述
の本発明の方法では、試料台における試料載置面あるい
はシリコンウエハー基板の表面にスプレーノズル等によ
り供給された微量の非接着性液体の表面張力の作用によ
り、試料の吸着による密着が行なわれる。
Further, the non-adhesive liquid-type sample adhesion method in the hardness tester of the present invention, when the sample is adhered to the sample stand of the hardness tester, the silicon wafer substrate is placed on the sample stand, After supplying a small amount of non-adhesive liquid to the surface of the silicon wafer substrate, the sample is placed on the surface of the silicon wafer substrate to solve the problem. In the above-described method of the present invention, the sample is adhered to the sample mounting surface of the sample table or the surface of the silicon wafer substrate by the action of the surface tension of a small amount of the non-adhesive liquid supplied by the spray nozzle or the like. .

【0006】特に試料台における試料載置面の平滑度が
高い場合、密着作用が顕著となり、試料(フィルム)の
試料台等への密着が良好となる。そして、上記非接着性
液体の供給手段として、スプレーノズルを用いると、微
量液体の供給が能率よく行なわれるようになる。また非
接着性液体としては、試料の材質に応じ、水,アルコー
ル,エチレングリコール等がそのまま又は適切に混合さ
れて用いられる。
In particular, when the smoothness of the sample mounting surface of the sample table is high, the close contact effect becomes remarkable, and the close contact of the sample (film) to the sample table and the like becomes good. When a spray nozzle is used as the non-adhesive liquid supply means, the trace liquid can be efficiently supplied. As the non-adhesive liquid, water, alcohol, ethylene glycol or the like may be used as it is or appropriately mixed depending on the material of the sample.

【0007】[0007]

【発明の実施の形態】以下、図面により本発明の一実施
形態としての硬さ試験機における非接着性液体式試料密
着方法について説明すると、図1はその方法を説明する
ための試料台付近の側面図である。なお図1中、図2と
同じ符号はほぼ同一の部材を示している。
BEST MODE FOR CARRYING OUT THE INVENTION A non-adhesive liquid sample adhesion method in a hardness tester as an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows the vicinity of a sample table for explaining the method. It is a side view. In FIG. 1, the same reference numerals as those in FIG. 2 indicate almost the same members.

【0008】図1において、符号10は硬さ試験機の金属
試料台を示しており、この金属試料台10の表面(上面)
に、平滑度の高いシリコンウエハー基板13が載置され、
このシリコンウエハー基板13の表面(試料載置面)に、
試料としてのフィルムが載置される。本実施形態では、
特にシリコンウエハー基板13の表面に試料1を載置する
前に、同シリコンウエハー基板13の表面に、霧吹き等の
スプレーノズルにより、微量の水を供給し、その後に試
料1を載置する。符号14はスプレーノズルにより供給さ
れた水(の薄層)を示す。
In FIG. 1, reference numeral 10 indicates a metal sample table of the hardness tester, and the surface (upper surface) of the metal sample table 10 is shown.
, A silicon wafer substrate 13 with high smoothness is placed,
On the surface (sample mounting surface) of the silicon wafer substrate 13,
A film as a sample is placed. In this embodiment,
In particular, before mounting the sample 1 on the surface of the silicon wafer substrate 13, a small amount of water is supplied to the surface of the silicon wafer substrate 13 by a spray nozzle such as a sprayer, and then the sample 1 is mounted. Reference numeral 14 indicates (a thin layer of) water supplied by the spray nozzle.

【0009】このように、シリコンウエハー基板13の表
面に、微量の水を供給してから試料1を載置し押付ける
ようにすると、シリコンウエハー基板13の表面の平滑度
の高さと水の表面張力との相互作用により、極肉薄の試
料をシリコンウエハー基板13に密着させることができ
る。なお水の供給量としては、1例として厚さ約0.3mm
の試料の場合、0.1cc/1cm2が適量であることが実験の
結果判明した。また、水に活性剤を加えた場合、さらに
効果的で、少量の水でも良好な密着性を得られることが
実験により判明している。
As described above, when a small amount of water is supplied to the surface of the silicon wafer substrate 13 and then the sample 1 is placed and pressed, the high smoothness of the surface of the silicon wafer substrate 13 and the surface of the water. By interacting with the tension, an extremely thin sample can be brought into close contact with the silicon wafer substrate 13. The amount of water supplied is about 0.3 mm, for example.
As a result of the experiment, it was found that 0.1 cc / 1 cm 2 was an appropriate amount in the case of the above sample. Further, it has been proved by experiments that the addition of an activator to water is more effective and good adhesion can be obtained even with a small amount of water.

【0010】そして、このようにして、金属試料台10に
載置されたシリコンウエハー基板13の表面に、水により
試料を密着させたそのままの状態で、つまりその後に試
料1を強く押圧したりすることなく、従来通り試料押え
12で試料1の周縁部を押えてから、圧子11を押し付け
て、試験を行ない、信号(試験値)の偏差を従来の場合
の1/2ないし1桁弱まで小さくすることに成功した。
In this way, the sample 1 is strongly pressed in the state where the sample is brought into close contact with water on the surface of the silicon wafer substrate 13 placed on the metal sample table 10, that is, after that. Sample holding as before without
After pressing the peripheral portion of the sample 1 with 12 and pressing the indenter 11, a test was performed, and the deviation of the signal (test value) was successfully reduced to 1/2 or a little less than an order of magnitude.

【0011】試験結果の1例を示すと次のとおりであ
る。 例:1mmごと25点測定 従来法(図2の場合) h2(最大変形量 単位um) 平均値 1.56 標準偏差 0.223 h3(塑性変形とクリープ変形の合計) 平均値 0.43 標準偏差 0.078 本発明の場合 h2(試験荷重保持終了時の押し込み深さ)平均値 1.10 標準偏差 0.028 h3(試験荷重除荷終了時の押し込み深さ)平均値 0.37 標準偏差 0.030 この実施形態の方法は、フィルムのほか、水に反応しな
い極肉薄の試料に対して有効である。また金属試料台10
がその表面の平滑度を高く仕上げられているときは、シ
リコンウエハー基板13を必ずしも介在させる必要はな
い。
An example of the test results is as follows. Example: 25-point measurement every 1 mm Conventional method (in the case of FIG. 2) h2 (maximum deformation amount unit um) Average value 1.56 standard deviation 0.223 h3 (total of plastic deformation and creep deformation) Average value 0.43 standard deviation 0.078 In the case of the present invention h2 (Pushing depth at end of holding test load) Average value 1.10 standard deviation 0.028 h3 (Pushing depth at end of unloading test load) average value 0.37 Standard deviation 0.030 Not effective for very thin samples. Also a metal sample stand 10
The silicon wafer substrate 13 does not necessarily have to be interposed if the surface of the is finished with high smoothness.

【0012】試料を密着させるための非接着性液体とし
ては、通常の水道水や蒸留水あるいは純水のほか、試料
の種類に応じて適切に選択することができ、アルコール
やエチレングリコール,アセトン,ラッカーシンナー等
は、金属箔や磁性材料等の試料を密着させる場合に効率
よく用いられる。特に銹を生じる恐れのある金属箔につ
いては、水以外の非接着性液体を用いることが好まし
い。
The non-adhesive liquid for adhering the sample can be selected from ordinary tap water, distilled water or pure water, and can be appropriately selected according to the type of sample, such as alcohol, ethylene glycol, acetone, The lacquer thinner or the like is efficiently used when closely adhering a sample such as a metal foil or a magnetic material. Especially for the metal foil that may cause rust, it is preferable to use a non-adhesive liquid other than water.

【0013】[0013]

【発明の効果】以上詳述したように、本発明の硬さ試験
機における試料密着方法によれば、試料載置面に予め微
量の非接着性液体を供給しておくという極めて簡単な操
作を付加することにより、フィルムのような極肉薄の試
料を硬さ試験機の試料台における試料載置面に密着させ
ることができ、試験精度を向上させることができる。ま
た、試料台上に試料を直接載置する代わりに、シリコン
ウエハー基板を介在させて、同基板上に微量の非接着性
液体を供給してから試料を載置する場合も、十分な試料
の密着性が得られるようになる。そして、上記非接着性
液体の供給手段としては、スプレーノズルを用いると、
微量の液体供給が能率よく行なわれるようになる。さら
に非接着性液体として、水のほか試料の材質に応じて、
アルコール,エチレングリコール,アセトン等を適切に
用いることができ、試料に悪影響を与えることなく、試
料台における試料載置面への試料の密着を行なえる効果
がある。
As described above in detail, according to the sample adhesion method in the hardness tester of the present invention, a very simple operation of previously supplying a small amount of non-adhesive liquid to the sample mounting surface can be performed. By adding the sample, an extremely thin sample such as a film can be brought into close contact with the sample mounting surface of the sample table of the hardness tester, and the test accuracy can be improved. In addition, instead of placing the sample directly on the sample table, even if a small amount of non-adhesive liquid is supplied onto the substrate by interposing a silicon wafer substrate, the sample can be placed sufficiently. Adhesion can be obtained. When a spray nozzle is used as the non-adhesive liquid supply means,
A small amount of liquid can be efficiently supplied. Furthermore, as a non-adhesive liquid, depending on the material of the sample besides water,
Alcohol, ethylene glycol, acetone or the like can be appropriately used, and there is an effect that the sample can be adhered to the sample mounting surface of the sample table without adversely affecting the sample.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施形態としての硬さ試験機におけ
る非接着性液体式試料密着方法を実施するための試料台
の側面図である。
FIG. 1 is a side view of a sample table for carrying out a non-adhesive liquid sample adhesion method in a hardness tester as one embodiment of the present invention.

【図2】従来の硬さ試験機における試料密着方法を実施
するための試料台の側面図である。
FIG. 2 is a side view of a sample table for carrying out a sample adhesion method in a conventional hardness tester.

【符号の説明】[Explanation of symbols]

1 試料 2 空隙 10 金属試料台 11 圧子 12 試料押え 13 シリコンウエハー基板 14 スプレーノズルにより供給された水(の薄層) 1 sample 2 void 10 metal sample stand 11 indenter 12 sample holder 13 silicon wafer substrate 14 water (thin layer) supplied by spray nozzle

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 硬さ試験機の試料台に試料を密着させる
に際し、同試料台に上記試料を載置する前に、同試料台
における試料載置面に微量の非接着性液体を供給するこ
とを特徴とする、硬さ試験機における非接着性液体式試
料密着方法。
1. When bringing a sample into close contact with a sample table of a hardness tester, a small amount of non-adhesive liquid is supplied to a sample mounting surface of the sample table before mounting the sample on the sample table. A non-adhesive liquid-type sample adhesion method in a hardness tester.
【請求項2】 硬さ試験機の試料台に試料を密着させる
に際し、上記試料台にシリコンウエハー基板を載置し、
同シリコンウエハー基板の表面に微量の非接着性液体を
供給した後に同シリコンウエハー基板の表面に上記試料
を載置するようにしたことを特徴とする、硬さ試験機に
おける非接着性液体式試料密着方法。
2. When the sample is brought into close contact with the sample table of the hardness tester, a silicon wafer substrate is placed on the sample table,
A non-adhesive liquid type sample in a hardness tester, characterized in that the sample is placed on the surface of the silicon wafer substrate after supplying a small amount of the non-adhesive liquid to the surface of the silicon wafer substrate. Adhesion method.
【請求項3】 請求項1または2に記載の硬さ試験機に
おける非接着性液体式試料密着方法において、上記非接
着性液体の供給がスプレーノズルにより行なわれること
を特徴とする、硬さ試験機における非接着性液体式試料
密着方法。
3. The hardness test according to claim 1 or 2, wherein the non-adhesive liquid sample adhering method is characterized in that the non-adhesive liquid is supplied by a spray nozzle. Non-adhesive liquid sample adhesion method in a machine.
【請求項4】 請求項1〜3のいずれか1つに記載の硬
さ試験機における非接着性液体式試料密着方法におい
て、上記非接着性液体が水であることを特徴とする、硬
さ試験機における非接着性液体式試料密着方法。
4. The non-adhesive liquid sample adhesion method in the hardness tester according to claim 1, wherein the non-adhesive liquid is water. Non-adhesive liquid sample adhesion method in testing machine.
【請求項5】 請求項1〜4のいずれか1つに記載の硬
さ試験機における非接着性液体式試料密着方法におい
て、上記非接着性液体がアルコールであることを特徴と
する、硬さ試験機における非接着性液体式試料密着方
法。
5. The non-adhesive liquid-type sample contacting method in the hardness tester according to claim 1, wherein the non-adhesive liquid is alcohol. Non-adhesive liquid sample adhesion method in testing machine.
【請求項6】 請求項1〜4のいずれか1つに記載の硬
さ試験機における非接着性液体式試料密着方法におい
て、上記非接着性液体がエチレングリコールであること
を特徴とする、硬さ試験機における非接着性液体式試料
密着方法。
6. The non-adhesive liquid sample adhering method in the hardness tester according to claim 1, wherein the non-adhesive liquid is ethylene glycol. Non-adhesive liquid sample adhesion method in a tester.
【請求項7】 請求項1〜4のいずれか1つに記載の硬
さ試験機における非接着性液体式試料密着方法におい
て、上記非接着性液体がアセトンであることを特徴とす
る、硬さ試験機における非接着性液体式試料密着方法。
7. The non-adhesive liquid-type sample contacting method in the hardness tester according to claim 1, wherein the non-adhesive liquid is acetone. Non-adhesive liquid sample adhesion method in testing machine.
JP35065495A 1995-12-22 1995-12-22 Non-adhesive liquid type sample adhesion method in hardness tester Pending JPH09178637A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35065495A JPH09178637A (en) 1995-12-22 1995-12-22 Non-adhesive liquid type sample adhesion method in hardness tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35065495A JPH09178637A (en) 1995-12-22 1995-12-22 Non-adhesive liquid type sample adhesion method in hardness tester

Publications (1)

Publication Number Publication Date
JPH09178637A true JPH09178637A (en) 1997-07-11

Family

ID=18411955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35065495A Pending JPH09178637A (en) 1995-12-22 1995-12-22 Non-adhesive liquid type sample adhesion method in hardness tester

Country Status (1)

Country Link
JP (1) JPH09178637A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010091409A (en) * 2008-10-08 2010-04-22 Hitachi Chem Co Ltd Method for evaluating resin film
JP2012002722A (en) * 2010-06-18 2012-01-05 Mitsutoyo Corp Indentation tester

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010091409A (en) * 2008-10-08 2010-04-22 Hitachi Chem Co Ltd Method for evaluating resin film
JP2012002722A (en) * 2010-06-18 2012-01-05 Mitsutoyo Corp Indentation tester

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