US20050126590A1 - Cleaning sheet for a probe - Google Patents
Cleaning sheet for a probe Download PDFInfo
- Publication number
- US20050126590A1 US20050126590A1 US11/051,030 US5103005A US2005126590A1 US 20050126590 A1 US20050126590 A1 US 20050126590A1 US 5103005 A US5103005 A US 5103005A US 2005126590 A1 US2005126590 A1 US 2005126590A1
- Authority
- US
- United States
- Prior art keywords
- probe
- sheet
- layer
- cleaning
- polishing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools, brushes, or analogous members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
- B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/14—Layered products comprising a layer of synthetic resin next to a particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/30—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being formed of particles, e.g. chips, granules, powder
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2432/00—Cleaning articles, e.g. mops, wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249955—Void-containing component partially impregnated with adjacent component
- Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/249991—Synthetic resin or natural rubbers
Definitions
- This invention relates to a cleaning sheet for and a method of removing foreign substances attached to the tip and side surfaces of a probe used for inspecting a planar target object such as a semiconductor device having integrated circuits installed thereon.
- Chips are produced by installing semiconductor elements and integrated circuits on a semiconductor wafer through various wafer-producing processes. The chips thus produced on a semiconductor wafer are cut off from the wafer after a current-passing test and are packaged. Tests with a current are carried out also before and after the packaging to separate faulty products stringently from qualified products.
- Such current-passing tests are carried out by means of a test apparatus of a known kind such as a wafer prober.
- a position-matching process by moving a prober needle (“probe”) serving as an electrode of a tester and the electrodes on the chip (pads or lead lines) and a contacting process between the probe and the chip electrodes are repeated for carrying out electrical measurements of different kinds.
- the foreign substances that thus become attached to the probe, are metals such as aluminum. If such a metal is oxidized, the electrical contact resistance between the probe and the electrodes on the chip becomes larger, making it impossible to carry out accurate electrical measurements. Thus, it is necessary to clean the tip portion of the probe regularly after each time a specified number of contact processes have been carried out in order to remove such foreign substances from the probe.
- Removal of such foreign substances from the tip portion of a probe is carried out by using the same apparatus used for the current-passing tests such as the aforementioned wafer prober, except the target object to be tested such as a semiconductor wafer attached to the apparatus is replaced with a cleaning device having a similar shape.
- a prior art cleaning device of this kind include hard polishing plates of a grinding stone, glass and a ceramic material (as disclosed, for example, in Japanese Patent Publications Tokkai 7-199141, 5-209896, 5-166893, 4-96342 and 3-105940) and sheets with a polishing layer formed on an uneven surface of an elastic member having protrusions and indentations (as disclosed, for example, in Japanese Patent Publication Tokkai 2000-332069).
- the probe is pressed against the surface of such a cleaning device, as done in the aforementioned current-passing test.
- a cleaning sheet embodying this invention may characterized as comprising a base sheet, a first polishing layer formed on the base sheet, a porous foamed layer having air bubbles inside formed on the base sheet, and a second polishing layer formed on the foamed layer.
- the surface of the foamed layer may be flat or preferably porous with the second polishing layer having openings corresponding to those on the porous surface of the foamed layer.
- the tip of the probe is caused to penetrate the surface of the second polishing layer, to pass through the foamed layer and to be pressed against the first polishing layer.
- a single cleaning sheet can clean both the tip and the side surfaces of a probe. If an adhesive with a high heat resistance is used to paste the cleaning sheet of this invention to a dummy wafer, furthermore, the tip portion of a probe can be cleaned without stopping the apparatus during a current-passing inspection process.
- FIGS. 1A and 1B are each a sectional view of a cleaning sheet embodying this invention.
- FIG. 2 is a schematic sectional view of a probe being cleaned with a cleaning sheet embodying this invention.
- FIG. 3 is a schematic side view of a wafer prober.
- FIG. 3 shows a wafer prober 20 of a known kind.
- a cleaning sheet 10 embodying this invention to be described below and shown in FIG. 1 is attached to such a wafer prober 20 instead of a target object such as a semiconductor wafer which is normally attached thereto in order to be inspected thereby.
- the cleaning sheet 10 is comprised of a base sheet 11 , a first polishing layer 12 formed on the surface of the base sheet 11 , a porous foamed layer 13 having air bubbles 15 inside formed on the surface of the first polishing layer 12 , and a second polishing layer 14 formed on the surface of this foamed layer 13 .
- a sheet with thickness 50 ⁇ m-200 ⁇ m and a flat surface of a plastic material such as polyester and polyethylene terephthalate (PET) may be used as the base sheet 11 .
- the first polishing layer 12 is formed by using particles of a material such as silica, aluminum oxide and diamond with average diameter of 0.001 ⁇ m-10 ⁇ m as abrading particles and fixing them by means of a polyester or urethane resin binder. Such a layer may be formed on the surface of the base sheet 11 by dispersing abrading particles inside a resin solution obtained by dissolving a resin binder with a solvent such as methylethyl ketone to prepare a polishing paint, applying this polishing paint on the surface of the base sheet 11 a known coating method such as the reverse coating method and drying the polishing paint thus applied.
- the thickness of the first polishing layer 12 is within the range of 10 ⁇ m-50 ⁇ m.
- the foamed layer 13 is a sheet of a foamed material such as foamed urethane having a thickness within the rage of 50 ⁇ m-300 ⁇ m. This foamed sheet is pasted to the surface of the first polishing layer 12 formed on the base sheet 11 .
- the surface of this foamed sheet may be flat as shown in FIG. 1A or may have portions removed by a buffing process to form a porous surface by causing openings 16 made of air bubbles to appear exposed on this porous surface as shown in FIG. 1B .
- a foaming sheet to be used as the foaming layer 13 with a flat surface as shown in FIG. 1A , may be formed as follows. First, a plastic sheet serving as a form-providing film with a flat and smooth surface is coated with a foaming resin solution obtained by dissolving a foaming resin material in a solvent. Foaming polyurethane resin and an organic solvent such as dimethyl formaldehyde may be used. If necessary, water, a foaming aid such as fleon and a foam stabilizer such as silicone oil may also added. After the solvent in the foaming resin solution is replaced with water inside water, this foaming resin solution is dried so as to remove the water component. Air bubbles are thereby formed where the solvent was replaced by water.
- the foamed layer formed on the plastic sheet is thereafter peeled off from the plastic sheet to obtain a foamed sheet.
- the surface at which the foamed layer was peeled off from the plastic sheet is smooth and flat, like the surface of the plastic sheet on which the foaming resin solution was applied.
- the foamed sheet (forming the foamed layer 13 ) thus prepared is pasted to the surface of the first polishing layer 12 formed on the base sheet 11 by using a polyester or urethane resin adhesive.
- the second polishing layer 14 is formed by coating the surface of this foamed layer 13 with the polishing paint described above by a known coating method such as the reverse coating method and then drying it.
- the second polishing layer 14 is preferably formed to be thin enough to allow the probe 22 to penetrate it, as shown in FIG. 2 .
- the thickness of the second polishing layer 14 is in the range of 10 ⁇ m-50 ⁇ m.
- a probe for inspecting a planar object such as a semiconductor device with integrated circuits installed thereon may be cleaned to remove foreign substances attached to its tip and side surfaces by using a test apparatus of a known kind such as shown at 20 in FIG. 3 for carrying out a current-passing test.
- the test apparatus 20 has a table 23 on which a target object for inspection such as a semiconductor device is intended to be attached. After such a target object for inspection is attached, the table 23 is moved horizontally and vertically for positioning and the target object is pressed against a probe 22 of a probe card 21 in order to carry out electrical measurements of different kinds on the target object.
- the cleaning sheet 10 as described above is attached to the table 23 , instead of the target object for inspection and the table 23 is similarly moved similarly to press the probe 22 against the surface of the cleaning sheet 10 attached to the table 23 .
- the cleaning sheet 10 may be cut into a circular, quadrangular or any other shape and pasted on the table 23 by means of a double-side adhesive sheet. Alternatively the cleaning sheet 10 may be pasted on a flat plate of an appropriate shape and this plate may then be attached to the table 23 . In summary, the manner of attaching the cleaning sheet 10 onto the table 23 does not limit the scope of the invention.
- the cleaning sheet 10 may be attached to the table 23 or to such a flat plate by preliminarily coating the back surface of the base sheet 11 with an adhesive agent (not shown), say, to a thickness in the range of 20 ⁇ m-30 ⁇ m.
- Chips on a semiconductor wafer are tested usually by varying the temperature in the range of ⁇ 40° C.-150° C. and in the manner of an assembly line.
- the cleaning of the tip of the probe 22 is carried out according to this invention by inserting a dummy wafer of the same shape as semiconductor wafers but having a cleaning sheet of this invention pasted thereon at a regular interval in this assembly line.
- This method is advantageous because the tests can carried out continuously and hence more efficiently without stopping the test apparatus but when the temperature exceeds 100° C., the adhesive force of the cleaning sheet to the dummy wafer becomes adversely affected and the cleaning sheet may become displaced or peeled off.
- an adhesive agent with resistance against heat such as acryl resin should preferably be used in order to stabilize the adhesive force of the cleaning sheet 10 to the dummy wafer especially under higher-temperature environment.
- the tip of the probe 22 When the tip of the probe 22 is pressed against the surface of the cleaning sheet 10 on the table 23 , it penetrates the second polishing layer 14 , passes through the foamed layer 13 as shown in FIG. 2 and is pressed against the surface of the first polishing layer 12 .
- the side surfaces of the probe 22 are cleaned while its tip is penetrating the second polishing layer 14 , passing the foamed layer 13 and being pressed against the first polishing layer 12 .
- the tip of the probe 22 is cleaned while being pressed against the surface of the first polishing layer 12 .
- the cleaning method explained above with reference to FIG. 2 is carried out after the test apparatus is stopped by attaching the cleaning sheet 10 at a proper place on the test apparatus. As explained above, however, this is not intended to limit the scope of the invention.
- the probe 22 may be cleaned during a current-passing test by pasting the cleaning sheet on a dummy wafer by using a heat-resistant adhesive agent.
- a cleaning sheet embodying this invention was produced first by coating a surface of a plastic sheet of polyethylene terephthalate (PET) with thickness 75 ⁇ m with a polishing paint having silica particles with average particle diameter of 0.3 ⁇ m dispersed in a resin solution obtained by dissolving a polyester resin in a solvent such as methylethyl ketone by the reverse coating method, forming a first polishing layer with thickness of 20 ⁇ m on the surface of the plastic sheet by drying it and aging it for three days at 40° C.
- PET polyethylene terephthalate
- a foamed sheet of foamed urethane resin with thickness 100 ⁇ m was attached to the surface of this first polishing layer to form a foamed layer of thickness 50 ⁇ m on the surface of the first polishing layer and it was then aged for three days at 40° C.
- the aforementioned polishing paint was applied on the surface of this foamed layer by the reverse coating method, dried to form a second polishing layer with thickness 10 ⁇ m and aged for 3 days at 40° C.
- the second polishing layer had a porous surface with openings corresponding to those on the surface of the foamed layer.
Abstract
A cleaning sheet has a base sheet, a first polishing layer formed on the base sheet, a porous foamed layer having air bubbles inside formed on the base sheet, and a second polishing layer formed on the foamed layer. The surface of the foamed layer may be flat or preferably porous with the second polishing layer having openings corresponding to those on the porous surface of the foamed layer. For cleaning a probe by using such a cleaning sheet, the tip of the probe is caused to penetrate the surface of the second polishing layer, to pass through the foamed layer and to be pressed against the first polishing layer.
Description
- This invention relates to a cleaning sheet for and a method of removing foreign substances attached to the tip and side surfaces of a probe used for inspecting a planar target object such as a semiconductor device having integrated circuits installed thereon.
- Chips are produced by installing semiconductor elements and integrated circuits on a semiconductor wafer through various wafer-producing processes. The chips thus produced on a semiconductor wafer are cut off from the wafer after a current-passing test and are packaged. Tests with a current are carried out also before and after the packaging to separate faulty products stringently from qualified products.
- Such current-passing tests are carried out by means of a test apparatus of a known kind such as a wafer prober. A position-matching process by moving a prober needle (“probe”) serving as an electrode of a tester and the electrodes on the chip (pads or lead lines) and a contacting process between the probe and the chip electrodes are repeated for carrying out electrical measurements of different kinds.
- While such position-matching and contacting processes are repeated by moving the probe and the electrodes on the chips, the tip of the probe slides over the electrodes on the chips, scraping off portions of the electrodes. Such portions of the electrodes that have been scraped off become attached to the tip and the side surfaces of the probe as foreign substances.
- The foreign substances, that thus become attached to the probe, are metals such as aluminum. If such a metal is oxidized, the electrical contact resistance between the probe and the electrodes on the chip becomes larger, making it impossible to carry out accurate electrical measurements. Thus, it is necessary to clean the tip portion of the probe regularly after each time a specified number of contact processes have been carried out in order to remove such foreign substances from the probe.
- Removal of such foreign substances from the tip portion of a probe is carried out by using the same apparatus used for the current-passing tests such as the aforementioned wafer prober, except the target object to be tested such as a semiconductor wafer attached to the apparatus is replaced with a cleaning device having a similar shape. Examples of a prior art cleaning device of this kind include hard polishing plates of a grinding stone, glass and a ceramic material (as disclosed, for example, in Japanese Patent Publications Tokkai 7-199141, 5-209896, 5-166893, 4-96342 and 3-105940) and sheets with a polishing layer formed on an uneven surface of an elastic member having protrusions and indentations (as disclosed, for example, in Japanese Patent Publication Tokkai 2000-332069). The probe is pressed against the surface of such a cleaning device, as done in the aforementioned current-passing test.
- If a polishing plate of a hard material is used as the cleaning device and the probe is pressed too hard against it, its tip portion will become deformed and hence it is necessary to reduce the pressure with which the probe can be pressed against the cleaning device. As a result, only the portions very close to the tip can be cleaned. If a cleaning device of the type with a polishing layer formed on an elastic member is used, on the other hand, the tip of the probe penetrates the polishing layer and cannot be cleaned sufficiently. Thus, the common practice has been to provide separately a device for cleaning the tip and another device for cleaning the side surfaces, attaching them to a current-passing test apparatus consecutively one at a time. It was therefore both cumbersome and time-consuming to clean a probe.
- It is therefore an object of this invention in view of the above to provide a single cleaning sheet capable of simultaneously cleaning both the tip and the side surfaces of a probe.
- A cleaning sheet embodying this invention, with which the above and other objects can be accomplished, may characterized as comprising a base sheet, a first polishing layer formed on the base sheet, a porous foamed layer having air bubbles inside formed on the base sheet, and a second polishing layer formed on the foamed layer. The surface of the foamed layer may be flat or preferably porous with the second polishing layer having openings corresponding to those on the porous surface of the foamed layer.
- For cleaning a probe by using such a cleaning sheet, the tip of the probe is caused to penetrate the surface of the second polishing layer, to pass through the foamed layer and to be pressed against the first polishing layer.
- With the present invention, a single cleaning sheet can clean both the tip and the side surfaces of a probe. If an adhesive with a high heat resistance is used to paste the cleaning sheet of this invention to a dummy wafer, furthermore, the tip portion of a probe can be cleaned without stopping the apparatus during a current-passing inspection process.
-
FIGS. 1A and 1B are each a sectional view of a cleaning sheet embodying this invention. -
FIG. 2 is a schematic sectional view of a probe being cleaned with a cleaning sheet embodying this invention. -
FIG. 3 is a schematic side view of a wafer prober. -
FIG. 3 shows awafer prober 20 of a known kind. When a cleaning process according to this invention is effected, acleaning sheet 10 embodying this invention to be described below and shown inFIG. 1 is attached to such awafer prober 20 instead of a target object such as a semiconductor wafer which is normally attached thereto in order to be inspected thereby. As shown inFIGS. 1A and 1B , thecleaning sheet 10 is comprised of abase sheet 11, afirst polishing layer 12 formed on the surface of thebase sheet 11, a porousfoamed layer 13 havingair bubbles 15 inside formed on the surface of thefirst polishing layer 12, and asecond polishing layer 14 formed on the surface of thisfoamed layer 13. - A sheet with thickness 50 μm-200 μm and a flat surface of a plastic material such as polyester and polyethylene terephthalate (PET) may be used as the
base sheet 11. - The
first polishing layer 12 is formed by using particles of a material such as silica, aluminum oxide and diamond with average diameter of 0.001 μm-10 μm as abrading particles and fixing them by means of a polyester or urethane resin binder. Such a layer may be formed on the surface of thebase sheet 11 by dispersing abrading particles inside a resin solution obtained by dissolving a resin binder with a solvent such as methylethyl ketone to prepare a polishing paint, applying this polishing paint on the surface of the base sheet 11 a known coating method such as the reverse coating method and drying the polishing paint thus applied. The thickness of thefirst polishing layer 12 is within the range of 10 μm-50 μm. - The
foamed layer 13 is a sheet of a foamed material such as foamed urethane having a thickness within the rage of 50 μm-300 μm. This foamed sheet is pasted to the surface of thefirst polishing layer 12 formed on thebase sheet 11. The surface of this foamed sheet may be flat as shown inFIG. 1A or may have portions removed by a buffing process to form a porous surface by causingopenings 16 made of air bubbles to appear exposed on this porous surface as shown inFIG. 1B . - A foaming sheet, to be used as the
foaming layer 13 with a flat surface as shown inFIG. 1A , may be formed as follows. First, a plastic sheet serving as a form-providing film with a flat and smooth surface is coated with a foaming resin solution obtained by dissolving a foaming resin material in a solvent. Foaming polyurethane resin and an organic solvent such as dimethyl formaldehyde may be used. If necessary, water, a foaming aid such as fleon and a foam stabilizer such as silicone oil may also added. After the solvent in the foaming resin solution is replaced with water inside water, this foaming resin solution is dried so as to remove the water component. Air bubbles are thereby formed where the solvent was replaced by water. The foamed layer formed on the plastic sheet is thereafter peeled off from the plastic sheet to obtain a foamed sheet. The surface at which the foamed layer was peeled off from the plastic sheet is smooth and flat, like the surface of the plastic sheet on which the foaming resin solution was applied. - The foamed sheet (forming the foamed layer 13) thus prepared is pasted to the surface of the
first polishing layer 12 formed on thebase sheet 11 by using a polyester or urethane resin adhesive. - The
second polishing layer 14 is formed by coating the surface of thisfoamed layer 13 with the polishing paint described above by a known coating method such as the reverse coating method and then drying it. Thesecond polishing layer 14 is preferably formed to be thin enough to allow theprobe 22 to penetrate it, as shown inFIG. 2 . The thickness of thesecond polishing layer 14 is in the range of 10 μm-50 μm. - A probe for inspecting a planar object such as a semiconductor device with integrated circuits installed thereon may be cleaned to remove foreign substances attached to its tip and side surfaces by using a test apparatus of a known kind such as shown at 20 in
FIG. 3 for carrying out a current-passing test. As shown inFIG. 3 , thetest apparatus 20 has a table 23 on which a target object for inspection such as a semiconductor device is intended to be attached. After such a target object for inspection is attached, the table 23 is moved horizontally and vertically for positioning and the target object is pressed against aprobe 22 of aprobe card 21 in order to carry out electrical measurements of different kinds on the target object. When theprobe 22 is to be cleaned, thecleaning sheet 10 as described above is attached to the table 23, instead of the target object for inspection and the table 23 is similarly moved similarly to press theprobe 22 against the surface of thecleaning sheet 10 attached to the table 23. - The
cleaning sheet 10 may be cut into a circular, quadrangular or any other shape and pasted on the table 23 by means of a double-side adhesive sheet. Alternatively thecleaning sheet 10 may be pasted on a flat plate of an appropriate shape and this plate may then be attached to the table 23. In summary, the manner of attaching thecleaning sheet 10 onto the table 23 does not limit the scope of the invention. Thecleaning sheet 10 may be attached to the table 23 or to such a flat plate by preliminarily coating the back surface of thebase sheet 11 with an adhesive agent (not shown), say, to a thickness in the range of 20 μm-30 μm. - Chips on a semiconductor wafer are tested usually by varying the temperature in the range of −40° C.-150° C. and in the manner of an assembly line. The cleaning of the tip of the
probe 22 is carried out according to this invention by inserting a dummy wafer of the same shape as semiconductor wafers but having a cleaning sheet of this invention pasted thereon at a regular interval in this assembly line. This method is advantageous because the tests can carried out continuously and hence more efficiently without stopping the test apparatus but when the temperature exceeds 100° C., the adhesive force of the cleaning sheet to the dummy wafer becomes adversely affected and the cleaning sheet may become displaced or peeled off. In view of such occurrences, an adhesive agent with resistance against heat such as acryl resin should preferably be used in order to stabilize the adhesive force of thecleaning sheet 10 to the dummy wafer especially under higher-temperature environment. - When the tip of the
probe 22 is pressed against the surface of thecleaning sheet 10 on the table 23, it penetrates thesecond polishing layer 14, passes through the foamedlayer 13 as shown inFIG. 2 and is pressed against the surface of thefirst polishing layer 12. The side surfaces of theprobe 22 are cleaned while its tip is penetrating thesecond polishing layer 14, passing the foamedlayer 13 and being pressed against thefirst polishing layer 12. The tip of theprobe 22 is cleaned while being pressed against the surface of thefirst polishing layer 12. - The cleaning method explained above with reference to
FIG. 2 is carried out after the test apparatus is stopped by attaching thecleaning sheet 10 at a proper place on the test apparatus. As explained above, however, this is not intended to limit the scope of the invention. Theprobe 22 may be cleaned during a current-passing test by pasting the cleaning sheet on a dummy wafer by using a heat-resistant adhesive agent. - As a test example, a cleaning sheet embodying this invention was produced first by coating a surface of a plastic sheet of polyethylene terephthalate (PET) with thickness 75 μm with a polishing paint having silica particles with average particle diameter of 0.3 μm dispersed in a resin solution obtained by dissolving a polyester resin in a solvent such as methylethyl ketone by the reverse coating method, forming a first polishing layer with thickness of 20 μm on the surface of the plastic sheet by drying it and aging it for three days at 40° C. Next, a foamed sheet of foamed urethane resin with thickness 100 μm was attached to the surface of this first polishing layer to form a foamed layer of thickness 50 μm on the surface of the first polishing layer and it was then aged for three days at 40° C. Next, the aforementioned polishing paint was applied on the surface of this foamed layer by the reverse coating method, dried to form a second polishing layer with
thickness 10 μm and aged for 3 days at 40° C. The second polishing layer had a porous surface with openings corresponding to those on the surface of the foamed layer.
Claims (5)
1. A cleaning sheet comprising:
a base sheet;
a first polishing layer formed on said base sheet;
a porous foamed layer formed on said base sheet, said foamed layer having air bubbles inside; and
a second polishing layer formed on said foamed layer.
2. The cleaning sheet of claim 1 wherein said porous foamed layer has a flat surface.
3. The cleaning sheet of claim 1 wherein said porous foamed layer has a porous surface.
4. The cleaning sheet of claim 3 wherein said second polishing layer has a surface with openings which correspond to openings on said porous surface of said foamed layer.
5-8. (canceled)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/051,030 US20050126590A1 (en) | 2001-05-21 | 2005-02-04 | Cleaning sheet for a probe |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-150280 | 2001-05-21 | ||
JP2001150280A JP4832664B2 (en) | 2001-05-21 | 2001-05-21 | Contact cleaning sheet and method |
PCT/JP2002/003494 WO2002094508A1 (en) | 2001-05-21 | 2002-04-08 | Contactor cleaning sheet, and contactor cleaning method |
WOPCT/JP02/03494 | 2002-04-08 | ||
US10/300,188 US6884300B2 (en) | 2001-05-21 | 2002-11-19 | Method of cleaning a probe |
US11/051,030 US20050126590A1 (en) | 2001-05-21 | 2005-02-04 | Cleaning sheet for a probe |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/300,188 Division US6884300B2 (en) | 2001-05-21 | 2002-11-19 | Method of cleaning a probe |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050126590A1 true US20050126590A1 (en) | 2005-06-16 |
Family
ID=18995318
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/300,188 Expired - Lifetime US6884300B2 (en) | 2001-05-21 | 2002-11-19 | Method of cleaning a probe |
US11/051,030 Abandoned US20050126590A1 (en) | 2001-05-21 | 2005-02-04 | Cleaning sheet for a probe |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/300,188 Expired - Lifetime US6884300B2 (en) | 2001-05-21 | 2002-11-19 | Method of cleaning a probe |
Country Status (7)
Country | Link |
---|---|
US (2) | US6884300B2 (en) |
EP (1) | EP1391265B1 (en) |
JP (1) | JP4832664B2 (en) |
KR (1) | KR100831828B1 (en) |
DE (1) | DE60211890D1 (en) |
TW (1) | TW528654B (en) |
WO (1) | WO2002094508A1 (en) |
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US20060030247A1 (en) * | 2001-05-02 | 2006-02-09 | Satoru Sato | Cleaning sheet and method for a probe |
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US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
US10195648B2 (en) | 2009-12-03 | 2019-02-05 | International Test Solutions, Inc. | Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware |
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US11035898B1 (en) | 2020-05-11 | 2021-06-15 | International Test Solutions, Inc. | Device and method for thermal stabilization of probe elements using a heat conducting wafer |
US11211242B2 (en) | 2019-11-14 | 2021-12-28 | International Test Solutions, Llc | System and method for cleaning contact elements and support hardware using functionalized surface microfeatures |
US11318550B2 (en) | 2019-11-14 | 2022-05-03 | International Test Solutions, Llc | System and method for cleaning wire bonding machines using functionalized surface microfeatures |
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US9833818B2 (en) | 2004-09-28 | 2017-12-05 | International Test Solutions, Inc. | Working surface cleaning system and method |
US10239099B2 (en) | 2004-09-28 | 2019-03-26 | International Test Solutions, Inc. | Working surface cleaning system and method |
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Also Published As
Publication number | Publication date |
---|---|
EP1391265A1 (en) | 2004-02-25 |
KR100831828B1 (en) | 2008-05-28 |
US6884300B2 (en) | 2005-04-26 |
JP2002346939A (en) | 2002-12-04 |
EP1391265A4 (en) | 2005-08-31 |
WO2002094508A1 (en) | 2002-11-28 |
DE60211890D1 (en) | 2006-07-06 |
KR20030016420A (en) | 2003-02-26 |
EP1391265B1 (en) | 2006-05-31 |
JP4832664B2 (en) | 2011-12-07 |
TW528654B (en) | 2003-04-21 |
US20040096643A1 (en) | 2004-05-20 |
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STCB | Information on status: application discontinuation |
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