JPH09172273A - Electronic apparatus constituted of printed board, frame and cover, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a frame from attaching to and leaving from a printed board and bending, by filling and closing the gap between the frame and the printed board, along the gap, with solder and/or thermosetting resin. SOLUTION: Cut-out tongue segments 5 as earth terminals of a frame 2 are soldered to the pattern of a printed board 1. In the vicinity of the soldering parts where frame 2 partition is little, the gap 3 between the printed board 1 and the frame 2 is filled and closed with solder 4, 6 and thermosetting resin 4, 6. When a force is applied to the frame 2 at the time of engaging a cover, the space where the frame 2 is bent is not left. Hence the frame 2 is not bent, and stress is not generated between the cut-out tongue segments 5 and the pattern of the printed board 1, so that solder crack and pattern peeling defect and not generated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device including a printed circuit board and a frame that constitute an electronic circuit, and more particularly to a technique for securely fixing the frame to the printed circuit board to prevent the frame from bending.

[0002]

2. Description of the Related Art In an electronic equipment structure composed of a printed circuit board 10 and a frame 20 as shown in FIG. 3, when the printed circuit board 10 on which electronic components are mounted is housed in the frame 20, the printed circuit board 10 smoothly enters the frame 20. The outer circumferential dimension of the printed circuit board is designed to be slightly smaller than the inner circumferential dimension of the frame so as not to impair workability. In addition, recent electronic devices have been reduced in size and weight, and the thickness of the frame has been reduced, so that the frame is easily bent during assembly.

The assembling method is as follows.
0 is housed in the frame 20, and the cut-out tongue piece 50 provided on the periphery of the frame 20 by the fitting jig is attached to the printed circuit board 10.
Bend the printed circuit board 10 to the side and cut out the tongue piece 50.
Then, it is pressed and fixed to the partition plate in the frame 20.
Then, as shown in FIG. 4, the cut-out tongue piece 50 bent to the ground pattern 40 of the printed circuit board 10 is soldered with the solder 60, and the printed circuit board 10 is fixed with the solder 60 simultaneously with the grounding of the circuit.

After that, a cover is fitted to the frame 20 to complete an electronic device. When the cover is fitted, the frame 20 partially covers the printed circuit board 10 and the frame 20.
The gap 30 is bent. In that case, a stress due to the bending of the frame 20 acts between the soldered cut-out tongue piece 50 and the pattern 40 of the printed circuit board 10,
As shown in FIG. 5, problems such as pattern peeling and solder cracking may occur. Japanese Utility Model Laid-Open No. 63-9188 discloses a method in which a linear small protrusion 23 is provided on a frame as shown in FIG. 6 and the printed circuit board 10 is soldered and fixed with a solder 60. However, the frame 20 and the printed circuit board 10 are disclosed. The problem of stress due to the gap between and has not been solved, and the risk of solder peeling due to stress still remained.

[Problems to be solved by the invention]

The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic apparatus structure in which a frame does not bend and a manufacturing method thereof.

[0006]

In order to achieve the above object, the present invention provides an electronic apparatus comprising a printed circuit board and a frame for accommodating the printed circuit board with a gap between the printed circuit board and the frame. There is provided an electronic device in which a gap between the printed circuit board and the printed circuit board is filled with solder and / or a thermosetting resin. Further, in the vicinity of the cut-out tongue provided on the periphery of the frame and bent and soldered to the ground pattern side of the printed circuit board, a gap between the frame and the printed circuit board is soldered and / or a thermosetting resin. Provide an electronic device filled with. Further, in a method of manufacturing an electronic device including a printed circuit board and a frame that accommodates the printed circuit board, cream solder or / and a thermosetting resin are applied / heated to a side surface of the printed circuit board to heat the printed circuit board and the frame. Provided is a method of manufacturing an electronic device that fills a gap. Further, in a method of manufacturing an electronic device including a printed circuit board and a frame that accommodates the printed circuit board, cream solder is applied / heated to the outermost peripheral portion of the printed circuit board through a print pattern to heat the printed circuit board and the frame. Provided is a method for manufacturing an electronic device in which a gap is filled with cream solder.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a connection relationship between a printed circuit board 1 and a frame 2 in an embodiment of the present invention,
As for the size of the printed circuit board 1, the inner peripheral dimension of the frame 2 is 0.1 more than the outer peripheral dimension of the printed circuit board 1 as in the conventional example.
~ 0.3 mm, usually about 0.2 mm larger.
This is due to the dimensional error of the parts and the printed circuit board 1 to the frame 2
This is because it was designed in consideration of workability when inserting into. The frame of this embodiment has a size of 0.4 to reduce size and weight.
A thin solder-plated steel plate of mm is used.

However, in the electronic device according to the present invention, the printed circuit board is provided in the vicinity of the cutout tongue 5 as the ground terminal of the frame 2 and the pattern 7 of the printed circuit board 1 being soldered, and in the part where the frame 2 is less partitioned. 1 and the frame 2 are filled with solder or resin to close the gap. Therefore, there is no room for the frame 2 to bend even when a force is applied to the frame 2 when the cover is fitted, and the bending of the frame 2 causes stress between the pattern 7 of the printed board 1 and the cut-out tongue piece 5 of the frame 2. It does not cause solder cracking and pattern peeling. The same applies because no stress is generated even in the case of a thin frame having a thickness of 0.4 mm or less if no deformation occurs. Further, there are many small partitions in the frame and soldering or resin filling is not necessary in a portion where there is no fear of bending of the frame, and it is selectively determined at the time of design.

In order to fill the portion of the frame 2 where the bending is difficult with solder or resin, cream solder or thermosetting resin is applied from the nozzle of the multi-dispenser to the side surface of the printed circuit board 1 at the portion where the solder or resin is to be filled. There is a method of injection coating. In this method, the printed circuit board 1 may be assembled on the frame 2 and then applied and heated at a predetermined position. However, in this example, before the printed circuit board 1 is assembled, the side surface is applied to a thickness of about 0.2 mm and cream solder Was in contact with the frame 2. Further, there is a method in which a solder print pattern made of a metal material such as copper for filling a gap is formed on the outermost peripheral portion of the printed circuit board 1 and cream solder is applied to the upper surface thereof. In this method, when the cream solder is softened, the cream solder penetrates into the gap between the printed circuit board and the frame due to the capillary phenomenon. In this method, it is necessary to adjust the amount so that the cream solder spreads over the printed pattern. This coating / heating method is for printed circuit board 1
Since it is possible to apply the cream solder to the print pattern at the same time, it is advantageous in terms of man-hours.

[0010]

The gap between the printed circuit board 1 and the frame 2 is filled with solder or resin, and the cut-out tongue piece and the pattern of the printed circuit board 1 which are soldered without the frame being bent even when a force is applied when the cover is covered. Since no stress is generated between them, solder cracking and pattern peeling defects do not occur.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic device structure of the present invention.

FIG. 2 is an enlarged view of a joint portion between a frame and a printed circuit board of the present invention.

FIG. 3 is a perspective view of a conventional electronic device structure.

FIG. 4 is an enlarged view of a joint portion between a conventional frame and a printed circuit board.

FIG. 5 is an enlarged view of a peeled portion of a conventional frame and a printed circuit board.

FIG. 6 is a sectional view of a conventional electronic device structure.

FIG. 7 is an enlarged view of a joint portion between the frame and the printed circuit board of the present invention.

[Explanation of symbols]

 1 Printed Circuit Board 2 Frame 3 Gap between Printed Circuit Board and Frame 4 Solder or Resin Filled 5 Cutout Tongue 6 Solder (or Thermosetting Resin)

Claims (3)

[Claims] 1. An electronic device comprising a frame and a printed circuit board accommodated in the frame, wherein solder or / or solder is provided along a gap between the frame and the printed circuit board.
And an electronic device in which the frame is filled with a thermosetting resin and closed so that the frame is prevented from being bent by being attached to or separated from the printed circuit board. 2. A gap between the frame and the printed board is soldered and / or heated near the cutout tongue provided on the periphery of the frame and bent and soldered to the ground pattern side of the printed board. The electronic device according to claim 1, wherein the electronic device is filled with a curable resin. 3. A method of manufacturing an electronic device comprising a printed circuit board and a frame for accommodating the printed circuit board, wherein cream solder is applied to the outer peripheral portion of the printed circuit board and heated to melt the cream solder, A method of manufacturing an electronic device, wherein a gap between a substrate and the frame is filled with cream solder.