JPH09172043A - Tab tape carrier and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent disconnection of traces and short-circuiting even if a gap is produced in the boundary between a TAB tape and sealing resin due to thermal stress during mounting, by covering the TAB tape carrier, except the ends of the wiring, with a protective film the surface of which is flattened. SOLUTION: Rolled copper foil is laminated on an insulating film 2 with adhesive 3 in-between, and wiring 4 is formed by photoetching or the like. A protective film 5 is applied to the wiring 4, and the application surface is flattened with a sheet or the like in-between using a roller or the like. The protective film 5 is cured to form a TAB tape carrier 10. The insulating film 2 uses a film made of polyimide or the like having a device hole 1 and LB holes 13 formed thereon. The protective film 5, having a flat surface, is formed so that the wiring, except for their ends, will be covered therewith, and phenol resin or the like identical with the adhesive 3 is used for the material of the protective film.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a TAB tape carrier and a semiconductor device using the TAB tape carrier.

[0002]

2. Description of the Related Art In recent years, packages for mounting semiconductor chips have been reduced in size and increased in number of pins. With the increase in the number of pins, the pitch of the internal leads of the lead frame becomes narrower. In the case of a long internal lead, there is a problem that a short circuit between leads occurs. As a countermeasure, a method of connecting a semiconductor chip and external leads by using wiring of a TAB tape capable of forming finer leads as internal leads has been frequently used. Hereinafter, a conventional TAB tape carrier and a semiconductor device will be described with reference to the drawings.

FIGS. 4A and 4B are a top view and an enlarged sectional view taken along line BB of a conventional TAB tape carrier, and FIG. 5 is a sectional view of a semiconductor device using the conventional TAB tape carrier.

In FIGS. 4A and 4B, a TAB tape carrier 10A has a thickness of about 200 μm in which a device hole 1 and a lead bonding (LB) hole 13 are formed.
An insulating film 2 made of polyimide or the like, and a wiring 4 made of copper foil or the like having a thickness of about 50 μm and formed on the film 2 via an adhesive 3 and extending into the device hole 1. In FIG. 4A, reference numeral 6 denotes a sprocket hole.

Next, the conventional TAB constructed as described above
A method for manufacturing a semiconductor device using a tape carrier will be described with reference to FIG. First, the semiconductor chip 7 is die-mounted on the island 11 of the lead frame. Next, the semiconductor chip 7 is positioned in the device hole 1 of the TAB tape carrier 10A, and the tip of the wiring 4 is bonded on the bonding pad of the chip 7. I do. Then L
In the B hole 13, the end of the wiring 4 is bonded to the external lead 8 by pressing using a mold, and the wiring 4 is
Separate from AB tape. Then, resin 9 such as epoxy
After sealing the semiconductor chip 7 and the like with the external leads 8
To complete a resin-sealed semiconductor device.

[0006]

Generally, a semiconductor device sealed with a resin absorbs moisture due to humidity in a storage environment. In particular, since the insulating film 2 of the TAB tape carrier is formed of an organic material such as polyimide, it absorbs much water. When the semiconductor device is solder-mounted on a printed circuit board or the like in a state where the moisture is absorbed, the absorbed moisture is vaporized and expanded due to thermal stress of 200 ° C. or more at the time of mounting. Evaporation of water becomes significant near the insulating film 2.

That is, as shown in FIG.
6, the interface between the wiring 4 having the lowest adhesion and the resin 9 is peeled off due to the generation of water vapor.
As shown in (b), a gap 12 </ b> A occurs and the wiring 4 comes off the resin 9. After that, even if the water vapor is released to the outside of the package or is compressed by cooling to restore the insulating film 2, the wiring 4 does not return to its original position as shown in FIG. In addition, there is a problem that the wirings 4 are short-circuited.

This is because the interface between the TAB tape having the wiring 4 and the resin 9 is uneven.

SUMMARY OF THE INVENTION It is an object of the present invention to eliminate the above-mentioned drawbacks and to provide a reliability that prevents disconnection or short-circuit of wiring even if a gap is formed at the interface between the TAB tape and the sealing resin due to thermal stress during mounting of the semiconductor device. An object of the present invention is to provide a TAB tape carrier and a semiconductor device with improved performance.

[0010]

A TAB tape carrier according to a first aspect of the present invention is a TAB tape carrier having a plurality of wirings made of a metal foil formed through an adhesive on an insulating film in which device holes are formed. The surface of the wiring is covered with a flattened protective film except for the end portions.

According to a second aspect of the present invention, there is provided a semiconductor device having an insulating film in which a device hole is formed, a wiring made of a metal foil formed on the insulating film via an adhesive and extending into the device hole, and A flattened protective film formed on the surface excluding the end of the semiconductor chip, a semiconductor chip provided in the device hole portion and having a bonding pad connected to one end of the wiring, and the other end of the wiring And a resin for sealing the semiconductor chip, the wiring, the protective film, the insulating film, and a part of the lead.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIGS. 1A and 1B are a top view and an enlarged cross-sectional view taken along line AA of a TAB tape carrier for explaining a first embodiment of the present invention.

1 (a) and 1 (b), a TAB tape carrier 10 has an insulating film 2 of about 200 μm in thickness, such as polyimide, in which device holes 1 and LB holes 13 are formed. A wiring 4 having a thickness of about 50 μm made of copper foil or the like and extending into the device hole 1 formed through an adhesive 3 made of a resin, and a surface formed so as to cover a surface excluding an end of the wiring 4 And a protective film 5 made of flat resin and having a thickness of about 50 μm. In FIG. 1A, reference numeral 6 denotes a sprocket hole. As the adhesive 3 and the protective film 5, a phenol resin, an epoxy resin, or a polyimide resin can be used.

In order to form such a TAB tape carrier 10, a rolled copper foil is laminated on an insulating film 2 via an adhesive (about 20 μm thick) 3 as in the prior art, and the wiring is formed by photo-etching technology. 4 is formed. Next, after applying the same resin as the adhesive 3 on the wiring 4 as the protective film 5, the applied surface is flattened by a roller or the like via a sheet or the like. Then, the protective film 5 is cured to complete the TAB tape carrier 10 having the flattened protective film 5.

FIG. 2 is a sectional view of a semiconductor device for explaining a second embodiment of the present invention. This will be described with reference to FIG.

In FIG. 2, a semiconductor device includes an insulating film 2 having a device hole 1 formed therein, and a wiring 4 made of copper foil formed on the insulating film 2 via an adhesive 3 and extending into the device hole 1. A protective film 5 formed on the surface excluding the end of the wiring 4 and flattened; and a semiconductor on the island 11 provided in the device hole 1 and having a bonding pad connected to one end of the wiring 4. Chip 7
And an external lead 8 connected to the other end of the wiring 4,
It is mainly composed of a semiconductor chip 7, a protective film 5, wires 4, an insulating film 2, and a resin 9 such as epoxy which seals a part of the external leads 8.

Next, a case where the semiconductor device thus configured is mounted on a printed circuit board by soldering will be described with reference to FIG.

The resin-sealed semiconductor device absorbs moisture in a storage environment. This moisture evaporates due to the heat during mounting,
As shown in FIG. 3A, the thermal stress causes the protective film 5 and the resin 9 to be curved and separated, and a gap 12 is formed at the interface.

However, when water vapor is released to the outside of the package or when the insulating film 2 is restored by cooling, the gap 12 at the interface between the resin 9 and the protective film 5 almost disappears, as shown in FIG. Even when the insulating film 2 is restored, the wiring 4 is held by the protective film 5, so that the wiring 4 does not hit the uneven portion of the resin 9 as in the related art, so that the wiring is not disconnected or short-circuited. In particular, by forming the adhesive 3 and the protective film 5 with the same resin, the wiring 4
Is completely embedded in the adhesive 3 and the protective film 5, so that the wiring 4 does not peel off due to thermal stress. For this reason, the displacement of the wiring 4 can be completely suppressed.

[0020]

As described above, according to the present invention, a resin-encapsulated semiconductor device is formed on a wiring formed on an insulating film by using a TAB tape carrier having a flattened protective film. As a result, even in the solder mounting, the wiring is not shifted due to the thermal stress as in the related art, so that the disconnection or the short-circuit failure does not occur, so that a semiconductor device with improved reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a TA for explaining a first embodiment of the present invention;
The top view and sectional drawing of B tape carrier.

FIG. 2 is a sectional view of a semiconductor device for explaining a second embodiment of the present invention;

FIG. 3 is a cross-sectional view showing the vicinity of a wiring for explaining the effect of the present invention.

FIG. 4 is a top view and a cross-sectional view of a conventional TAB tape carrier.

FIG. 5 is a cross-sectional view of a conventional semiconductor device.

FIG. 6 is a cross-sectional view near a wiring for explaining a defect of a conventional semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Device hole 2 Insulating film 3 Adhesive 4 Wiring 5 Protective film 6 Sprocket hole 7 Semiconductor chip 8 External lead 9 Resin 10, 10A TAB tape carrier 11 Island 12, 12A Gap 13 LB hole

Claims (5)

[Claims] 1. A TAB tape carrier having a plurality of wirings made of a metal foil formed on an insulating film having device holes formed thereon with an adhesive therebetween via a bonding agent, wherein the wirings have flat surfaces except for ends. A TAB tape carrier, which is covered with a protective film. 2. The TAB tape carrier according to claim 1, wherein the protective film is formed of the same material as the adhesive. 3. The TAB tape carrier according to claim 1, wherein the protective film is formed of a phenol resin, an epoxy resin, or a polyimide resin. 4. An insulating film having a device hole formed therein, a wiring made of a metal foil formed on the insulating film via an adhesive and extending into the device hole, and a surface excluding an end of the wiring. A formed and flattened protective film, a semiconductor chip disposed in the device hole portion and having a bonding pad connected to one end of the wiring, and a lead connected to the other end of the wiring, A semiconductor device comprising: a resin for sealing the semiconductor chip, the wiring, the protective film, the insulating film, and a part of the lead. 5. The semiconductor device according to claim 4, wherein the protective film is formed of the same resin as the adhesive.