JPH09162233A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a cooling means capable of simultaneously attaining the high performance and compactness and light weight of a semiconductor device. SOLUTION: A cooling plate 6 is fixed to the surface on the opposite side to formed the surface of the bump electrode 1a of a semiconductor chip 1. The semiconductor chip 1 and the cooling plate 6 are coated with sealing resin 4 excluding the surface on the opposite side of the bonded surface of the cooling plate 6 onto the semiconductor chip 1. Furthermore, the sealing resin 4 coats the surface of a flexible resin tape 2 wherein no wiring lead 3 is formed in even thickness extending over the parts near the four end parts of the surface excluding said exposed surface 8 of the cooling plate 6. At this time, the sides of the cooling plate 6 is covered with the sealing resin 4 while the resin surface and the surface of the cooling plate 6 are made almost flush with each other.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor device,
Particularly, the present invention relates to a heat dissipation structure of a tape BGA (Ball Grid Array) package in a surface mounting semiconductor device using a tape carrier.

[0002]

2. Description of the Related Art A tape carrier is a device in which a metal foil is adhered to one surface of a flexible resin tape having a device hole at the center, and the metal foil is etched to form a predetermined conductive pattern. This is a semiconductor device in which a conductor lead is projected into a hole and an electrode pad of a semiconductor chip is connected to the conductor lead, which is a technique that enables continuous mounting on a circuit board. A semiconductor chip sealed with resin or the like is called a tape carrier package (TCP).

In addition, BGA is proposed as a new package in which a solder ball for connecting to a circuit board is formed on the semiconductor device side by using TCP technology to improve the mountability on the circuit board. As such, a plastic BGA using a glass epoxy substrate and a tape BGA using a flexible resin tape have been put into practical use.

As a heat dissipating means in the TCP system, for example, as disclosed in Japanese Utility Model Laid-Open No. 3-88350, there is a type in which the heat dissipating means is embedded in a mold resin and the surface of the heat dissipating means is not exposed to the outside. is there.

Further, as disclosed in Japanese Patent Application Laid-Open No. 4-245462, the heat dissipation means is externally attached to the semiconductor device, and the surface of the heat dissipation means or the heat dissipation means including the heat dissipation fin is exposed to the outside. Those are also commonly used as heat dissipation means for bipolar semiconductor devices and power transistors that require large power.

[0006]

The BGA type or TCP (Tape Carrier Package) type semiconductor device described above is often used as a high-density mounting package in small and lightweight electronic devices.

However, as electronic devices become more sophisticated and faster, the required specifications for semiconductor elements are becoming more and more stringent. In particular, thermal characteristics are important factors along with frequency characteristics for improving the performance of semiconductor elements. It has become to.

Among the above-mentioned technical trends, in the above-mentioned heat radiating means: 1) Since the heat radiating means is embedded in the mold resin, the heat radiating characteristic is greatly affected by the heat transfer characteristic of the resin, and the heat radiating characteristic is sufficient. It is difficult to obtain the heat dissipation effect. 2) The external dimensions of the heat dissipation means are large and do not meet the needs for downsizing and weight saving of electronic devices. Problems such as these were becoming apparent.

In view of the above-mentioned problems of the prior art, the present invention provides a semiconductor device which is a high-density packaging package having a heat dissipation means capable of simultaneously achieving high performance and small size / light weight of a semiconductor element. With the goal.

[0010]

In order to achieve the above object, a semiconductor device of the present invention comprises a flexible resin tape having a device hole at the center, and a first flexible resin tape.
A tape carrier provided on the main surface, having one end protruding into the device hole to be an inner lead and having a wiring lead having a land formed at the other end; and a semiconductor chip having an electrode terminal connected to the inner lead. And having at least an electrode terminal forming surface of the semiconductor chip resin-sealed, and forming a guard ring on the second main surface of the flexible resin tape except for a region facing the land of the first main surface, Further, a conductive bump is provided on the land.

The surface of the semiconductor chip opposite to the surface on which the electrode terminals are formed is resin-sealed, and the resin-sealed portion and the guard ring are formed on the land of the first main surface of the flexible resin tape. Except for the opposing portions, those connected via ribs are preferable for improving the planarity of the device.

Another feature of the present invention is that the semiconductor chip is provided with heat radiating means, and the end surface of the heat radiating means is exposed from the sealing resin.

That is, heat dissipation means is joined to the surface of the semiconductor chip opposite to the surface on which the electrode terminals are formed, with an adhesive layer interposed therebetween.
In addition, the second portion of the flexible resin tape is formed so as to be flush with the surface of the heat dissipation means opposite to the surface bonded to the semiconductor chip.
The main surface side is resin-sealed and the surface of the heat dissipation means is exposed from the sealing resin surface, or the heat dissipation means is joined to the electrode terminal formation surface of the semiconductor chip via an adhesive layer, and the heat dissipation means Of the flexible resin tape, the surface opposite to the surface joined to the semiconductor chip is projected from the wiring lead forming surface, and the protruding amount is larger than the wiring lead forming surface and smaller than the conductive bump tip exposed height. Can be considered. (Operation) In the invention as described above, in the so-called TCP structure in which the semiconductor chip is mounted on the tape carrier, at least the electrode terminal forming surface of the semiconductor chip is resin-sealed, and the second main surface (wiring) of the flexible resin tape is formed. By arranging a guard ring at the outer end of the surface opposite to the surface where leads and lands are formed, the flatness of the flexible resin tape is improved and the coplanarity of bumps formed on the lands is made uniform. Accordingly, the mounting yield on the circuit board is improved.

The guard ring formed on the second main surface is arranged outside the area facing the land on the first main surface, so that the connection state between the land and the bump and the bump and the circuit board is flexible. Using the transmitted light from the second main surface side of the resin tape, it is possible to visually inspect the connection appearance.

In addition, the heat radiation plate is directly joined to the semiconductor chip and the end surface of the heat radiation plate is exposed from the sealing resin, so that the heat generated from the semiconductor chip can be radiated to the outside of the apparatus very efficiently. Is possible.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a diagram for explaining a first embodiment of a semiconductor device according to the present invention.
3A is a plan view, and FIG. 1B is a cross-sectional view of the semiconductor device shown in FIG.

In the semiconductor device of this embodiment, as shown in FIG. 1, a copper foil is adhered to the surface of a flexible resin tape 2 made of a polyimide film or the like, which has a device hole 2a formed in the center thereof, to bond the device. A tape carrier having a wiring lead 3 which is patterned so as to project into the hole 2a is used as a package substrate.

The projecting portion of the wiring lead 3 into the device hole 2 is formed as an inner lead 3a, and the wiring lead 3 is made wider than other portions at the opposite end of the inner lead 3a or in the middle thereof. It has a land 3b. Further, the conductive bumps 5 are formed on the land 3b.
Are formed.

The bump electrodes 1a of the semiconductor chip 1 are bonded to the inner leads 3a. A heat dissipation plate 6 is fixed by an adhesive 7 to the surface of the semiconductor chip 1 opposite to the surface on which the bump electrodes 1a are formed.

The semiconductor chip 1 and the heat radiating plate 6 are covered with a sealing resin 4 which is a molding resin, except for the surface of the heat radiating plate 6 opposite to the surface bonded to the semiconductor chip 1. Further, the sealing resin 4 fills the inside of the device hole 2a, and the surface of the flexible resin tape 2 on which the wiring leads 3 are not formed is uniform to the vicinity of the four side edges except the exposed surface 8 of the heat dissipation plate 6. It is coated with a thickness. At this time,
As shown in FIG. 1, the side surface of the heat sink 6 is covered with the sealing resin 4,
By making the resin surface and the surface of the heat dissipation plate 6 approximately at the same height,
No force is inadvertently applied between the heat sink 6 and the resin, and it is difficult for defects such as cracks to come off to occur.

In the semiconductor device of this embodiment, rigidity is imparted by the strength of the above-mentioned sealing resin, and it is possible to prevent deformation of the tape carrier with a simple structure without disposing another component such as a reinforcing material. .

Further, since the heat dissipation plate 6 is adhered to the semiconductor chip 1 and the opposite surface which is not adhered to the semiconductor chip 1 is the exposed surface 8 exposed from the sealing resin, the semiconductor chip 1 is not exposed. It is possible to radiate the heat generated by the operation extremely efficiently.

(Second Embodiment) FIG. 2 is a diagram for explaining a second embodiment of the semiconductor device according to the present invention.
In FIG. 2, the same components as those of the first embodiment shown in FIG. 1 are designated by the same reference numerals, and the duplicated description of the first embodiment will be omitted.

In the semiconductor device of this embodiment, as shown in FIG. 2, the same tape carrier as that of the first embodiment is used as a package substrate. Then, similarly to the first embodiment, the inner leads of the wiring leads 3 and the bump electrodes 1 are formed.
The semiconductor chip 1 connected via a is arranged in the device hole.

On the surface of the semiconductor chip 1 on which the pump electrode 1a is formed, an adhesive layer 9 is formed except for the electrode, and the heat dissipation plate 10 is attached by this adhesive layer 9.

The semiconductor chip 1 and the heat radiating plate 10 are covered with a sealing resin 4 which is a mold resin except for the surface of the heat radiating plate 10 opposite to the surface bonded to the semiconductor chip 1. The surface of the heat dissipation plate 10 opposite to the surface bonded to the adhesive layer 9 is projected from the surface of the sealing resin 4, and the projecting dimension is larger than the surface of the wiring lead 3 and lower than the tip of the conductive bump 5. Has an exposed height. Further, the sealing resin 4 fills the inside of the device hole so as to surround the heat sink 10, and covers the surface of the flexible resin tape 2 on which the wiring leads 3 are not formed with a uniform thickness up to the vicinity of the four side edges. doing.

It is needless to say that the material of the adhesive layer 9 has an insulating property and has an extremely low impurity concentration, which is one of the important factors for achieving high performance of the semiconductor element. It is important to select a material that does not generate dendrites due to the operation of the semiconductor chip.

Further, when the semiconductor device of this embodiment is mounted on a circuit board, the heat dissipation plate 10 comes into contact with the circuit board due to the deformation of the bumps 5, and the semiconductor chip can be more efficiently radiated through the portion. .

(Third Embodiment) FIG. 3 is a view for explaining a third embodiment of the semiconductor device according to the present invention.
3A is a plan view, and FIG. 1B is a cross-sectional view of the semiconductor device shown in FIG. Also in this figure, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and the description overlapping with the first embodiment will be omitted here.

In the semiconductor device of the present embodiment, as shown in FIG. 3, the device hole 2a and the outer periphery of the semiconductor chip 1 are covered with the sealing resin 4, and the guard ring 11 is provided to prevent the flexible resin tape 2 from being deformed. It was installed. The guard ring 11 is installed in a range excluding the area of the second main surface opposite to the first main surface on which the wiring leads 3 and the lands 3b of the flexible resin tape 2 are formed. That is, the guard ring 1 is attached to the outer peripheral edge of the second main surface of the flexible resin tape 2.
1 is installed.

As described above, since the guard ring 11 is installed to reinforce the flexible resin tape 2 and the land 3b is not shielded by the guard ring 11, the land 3b, the bump 5, the bump 5 and the circuit board (not shown). The connection appearance can be visually inspected by using the transmitted light from the second main surface side of the flexible resin tape 2 (for example, when the polyimide tape is used, the light transmittance is used). Becomes

(Fourth Embodiment) FIG. 4 is a plan view showing a fourth embodiment of the semiconductor device according to the present invention. Also in this figure, the same components as those of the first embodiment shown in FIG. 1 are denoted by the same reference numerals, and the description overlapping with the first embodiment will be omitted here.

In addition to the structure of the guard ring 11 of the third embodiment, the semiconductor device of the present embodiment, as shown in FIG.
The guard ring 12 is provided on the second main surface side of the flexible resin tape 2.
The flexible resin tape 2 is further prevented from being deformed by connecting the portion of the sealing resin 4 with the sealing resin 4 via the rib 12, and the mountability on the circuit board is improved. Further, the ribs 12 are provided except for the portion facing the land on the first main surface of the flexible resin tape 2 in order to enable visual inspection of the connection as in the third embodiment.

In the third and fourth embodiments described above, as shown in the first and second embodiments, the surface opposite to the surface where the heat sink is bonded to the semiconductor chip is exposed on the package surface. It is fully possible to install it on the ground and improve the electrical and thermal characteristics.

[0036]

Since the present invention is configured as described above, the following effects can be obtained.

According to a first aspect of the present invention, one end of the flexible resin tape having a device hole in the center is an inner lead protruding into the device hole and the other end has a land on the first main surface. A tape carrier having a wiring lead formed thereon and a semiconductor chip having an electrode terminal connected to the inner lead, and at least the electrode terminal forming surface of the semiconductor chip is resin-sealed, and the flexible resin tape Since the second main surface is a semiconductor device in which a guard ring is formed except for a region facing the land of the first main surface and further conductive bumps are provided on the land, the flatness of the resin tape surface is improved. As the coplanarity of the bumps becomes uniform, the yield of mounting on the printed circuit board can be improved. Further, since the guard ring is formed excluding the area facing the land on the first main surface, the connection state between the land and the bump and between the bump and the circuit board is controlled from the second main surface side of the flexible resin tape. It is possible to visually inspect the connection using transmitted light.

According to a second aspect of the present invention, the surface of the semiconductor chip opposite to the surface on which the electrode terminals are formed is resin-sealed, and
The flexible resin tape is further deformed by connecting the resin-sealed portion and the guard ring via a rib except for a portion facing the land on the first main surface of the flexible resin tape. It is prevented and the mountability on the circuit board is improved.

The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the invention described in 1, the heat dissipation means is installed in the semiconductor chip, and the end surface of the heat dissipation means is exposed from the sealing resin, so that the heat generated in the semiconductor chip is radiated to the outside of the semiconductor package very efficiently. It is possible to stabilize the high speed operation. Further, since a part of the heat dissipation plate has a structure in which the semiconductor device is encapsulated by a sealing resin, there is an advantage that the semiconductor device can be miniaturized at the same time while enhancing the heat dissipation effect.

The invention described in claim 4 is the first or second invention.
In addition to the invention described in, the heat dissipation means is joined to the surface of the semiconductor chip opposite to the electrode terminal formation surface via an adhesive layer, and is the same as the surface opposite to the surface of the heat dissipation means joined to the semiconductor chip. The second main surface side of the flexible resin tape is resin-sealed so that the surface becomes a surface, and the surface of the heat dissipation means is exposed from the sealing resin surface, so that a force is inadvertently applied between the heat dissipation plate and the resin. Does not enter, and it is difficult for defects such as cracks to come off. In addition, the strength of the sealing resin provides rigidity, so that it is possible to prevent deformation of the tape carrier with a simple structure without disposing another component such as a reinforcing material.

The invention according to claim 5 is the invention according to claim 1 or 2.
In addition to the invention described in, the heat dissipation means is joined to the electrode terminal formation surface of the semiconductor chip via an adhesive layer, and the surface opposite to the surface of the heat dissipation means joined to the semiconductor chip is the flexible resin. When the semiconductor device is mounted on a substrate, the heat sink is mounted along with the deformation of the bumps, because the protruding height of the tape is larger than that of the wiring lead formation surface and smaller than that of the conductive bump tip. It is possible to make more efficient heat dissipation to the mounting board by contacting the board and passing through that part.

[Brief description of the drawings]

1A and 1B are views for explaining a first embodiment of a semiconductor device according to the present invention, FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view of the semiconductor device shown in FIG.

FIG. 2 is a diagram for explaining a second embodiment of the semiconductor device according to the present invention.

3A and 3B are views for explaining a third embodiment of a semiconductor device according to the present invention, FIG. 3A is a plan view, and FIG. 3B is a sectional view of the semiconductor device shown in FIG.

FIG. 4 is a plan view showing a fourth embodiment of a semiconductor device according to the present invention.

[Explanation of symbols]

 1 semiconductor chip 1a bump electrode 2 flexible resin tape 2a device hole 3 wiring lead 3a inner lead 3b land 4 sealing resin 5 bump 6 heat sink 7, 9 adhesive layer 8 exposed surface 10 heat sink 11 guard ring 12 rib

Claims (5)

[Claims] 1. A flexible resin tape having a device hole formed in the center, and a flexible resin tape provided on the first main surface of the flexible resin tape, one end of which protrudes into the device hole to serve as an inner lead. A tape carrier having a wiring lead having a land formed on an end, and a semiconductor chip having an electrode terminal connected to the inner lead, and at least an electrode terminal forming surface of the semiconductor chip is resin-sealed, A semiconductor device in which a guard ring is formed on the second main surface of the flexible resin tape except a region facing the land of the first main surface, and a conductive bump is further provided on the land. 2. The surface of the semiconductor chip opposite to the surface on which the electrode terminals are formed is resin-sealed, and the resin-sealed portion and the guard ring are used as lands on the first main surface of the flexible resin tape. The semiconductor device according to claim 1, wherein the semiconductor device is connected via a rib except for the facing portions. 3. A heat dissipating means is installed on the semiconductor chip,
3. The semiconductor device according to claim 1, wherein the end surface of the heat dissipation means is exposed from the sealing resin. 4. A heat radiating means is bonded to the surface of the semiconductor chip opposite to the surface on which the electrode terminals are formed through an adhesive layer, and the heat radiating means is on the same surface as the surface opposite to the surface bonded to the semiconductor chip. 3. The semiconductor device according to claim 1, wherein the flexible resin tape is sealed on the second main surface side with a resin so that the surface of the heat radiating means is exposed from the sealing resin surface. 5. A heat radiating means is bonded to an electrode terminal forming surface of the semiconductor chip via an adhesive layer, and a surface of the heat radiating means opposite to a surface bonded to the semiconductor chip is the flexible resin tape. 3. The semiconductor device according to claim 1, wherein the semiconductor device has an exposed height that protrudes from the wiring lead forming surface and is larger than the wiring lead forming surface and smaller than the conductive bump tips.