JPH09148784A - Taping material and taping method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the cost of taping material and an apparatus for setting a device thereon or taking out the device therefrom. SOLUTION: A tape 2 made of a material having expanding/contracting elasticity, e.g. rubber, is provided, in the longitudinal direction thereof, with openings 3 for setting an electronic device 1a at a constant interval and pin holes 4 are provided independently for each opening 3 at four circumferential fringe parts thereof. The opening 3 is enlarged or reduced by means of a guide pin 6 inserted into the pin hole 4 by taking advantage of the elasticity of rubber thus setting the electronic device 1a in the opening 3 or taking out therefrom.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a taping material and a taping processing method for accommodating or removing parts from the taping material.

[0002]

2. Description of the Related Art Small surface-mounting electronic components such as semiconductor devices, capacitors, resistors, etc. are mounted on a long tape packaging material at equal intervals and wound on a reel for mounting by an automatic mounting machine. It is packaged. As a tape wrapping material used in this method, a so-called embossed carrier tape in which a carrier pocket made of paper or a resin and a feed hole are provided in a carrier pocket having a size capable of storing electronic parts are often used. It is the mainstream that it is covered with a cover tape to hold the.

[0003]

However, in the case of the above-mentioned conventional tape packaging material, after the electronic parts are stored in the pocket, the cover tape is superposed on the carrier tape by thermocompression in order to cover the pocket with the cover tape. Therefore, the taping device was complicated and the cost was high. Further, when mounting the electronic component by the automatic mounting machine, the electronic component must be taken out while peeling off the cover tape from the carrier tape, and the automatic mounting machine becomes complicated and the cost becomes high. Furthermore, if a defective product is stored,
After removing the cover tape and replacing the electronic parts,
The cover tape had to be thermocompression bonded again, and replacement of parts was troublesome. Further, since the carrier tape and the cover tape have the steps of thermocompression bonding and peeling, they are deformed or broken and cannot be reused, which is uneconomical. The present invention has been made to solve the above-mentioned drawbacks, and an object thereof is to obtain a reusable taping material that does not require a cover tape, and uses this taping material to store or take out parts. The purpose is to obtain a taping treatment method that

[0004]

The taping material of the present invention has a plurality of openings for accommodating parts formed in the longitudinal direction of a tape having elastic elasticity and a pair of openings facing the peripheral edge of the openings. , The tape has a certain thickness, and the opening has a dimension that is smaller than the dimension between the side surfaces of the part that sandwiches the component by reducing the dimension between the wall surfaces facing each other in the same direction as the retaining part so that the opening can clamp the component. It is set. Further, the other taping material described above forms a plurality of openings for accommodating parts in the longitudinal direction of the tape having elastic elasticity, and forms a pair of locking portions facing the peripheral edge of the opening. , The tape has a certain thickness, the opening has a bottom and an inlet portion, the inner wall dimension of the opening is larger than the component dimension by a predetermined value, and the frontage dimension facing the locking portion of the inlet portion in the same direction is It is set smaller than the unidirectional dimension of the part by a specified value. When the above taping material is used for an electronic component that is sensitive to static electricity, the tape is preferably a conductive substance. According to the taping method of the present invention, a plurality of openings formed in the longitudinal direction of a tape having elastic elasticity are enlarged by using locking means, and parts are stored in the openings or stored from the openings. I try to take out the parts. In the above method, specifically, the locking means is a pair of pin hole locking portions formed facing the opening peripheral edge portion,
A guide pin locking jig. Further, in the above method, the locking means may be a holding means for holding the peripheral edge of the tape from both sides.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION A taping material and a taping processing method according to the present invention will be described below with reference to FIGS. First, a first embodiment of a taping material of the present invention will be described with reference to FIGS. Reference numeral 1a denotes a component housed in this taping material, which is a surface mount electronic component of a type in which leads are provided in two opposite directions. 2 is a tape made of, for example, a rubber-based material having elastic elasticity,
Openings 3 penetrating the tape 2 for accommodating the electronic component 1a are formed at equal intervals in the longitudinal direction of the tape 2. Further, guide pins of a locking jig that constitutes locking means are independently locked to the tape 2 on each side of the opening 3 in the four peripheral edges of the opening 3 between the opening 3 and both ends in the width direction of the tape 2. The pin hole 4 of the locking portion which forms the locking means for inserting and enlarging the opening 3 is formed. The pin hole 4 is also used as the feed hole 5. The thickness of the tape 2 is constant, and is set to be slightly thicker than the thickness of the electronic component 1a so that the electronic component 1a is not housed in a state of protruding from the tape. In addition, the tape 2 is made of a material that takes into consideration the force of enlarging the opening 3 and the force of holding the electronic component 1a in the opening 3, ease of winding on the reel, pitch deviation during feeding, and static electricity as necessary. Select in consideration of prevention, etc. In particular, when accommodating an electronic component such as a semiconductor integrated circuit which is not sensitive to static electricity, a material having conductivity is selected. Further, the vertical and horizontal dimensions of the opening 3 should be determined in consideration of the material of the tape 2 as described above when the only lead-free side is clamped by only two vertically or horizontally opposed wall surfaces like the electronic component 1a. In order to secure a holding force that does not easily drop with, the dimension between the two wall surfaces to be clamped is set smaller than the side dimension of the electronic component 1a to be clamped, as shown by the broken line in FIG. The wall-to-wall dimension on the holding side is set larger than the dimension including the leads so that the leads do not deform. Further, in the case of the leadless type electronic component 1b shown in FIG. 4 as well, like the electronic component 1a, it may be sandwiched only by two vertically or horizontally opposed wall surfaces, but it may be sandwiched by the four wall surfaces of the opening 3. In that case, as shown in the figure, both the vertical and horizontal dimensions of the opening 3 (shown by the broken line) are set by a predetermined value from the vertical and horizontal dimensions of the leadless type electronic component 1b so as to secure a holding force that does not easily drop. Set smaller. The feed hole 5 may be provided independently of the pin hole 4. Further, as shown in FIG. 5, the pin holes 4 may be provided at four corners of the opening 3. Further, when the opening 3 is enlarged in only two directions, at least one pair of pin holes 4 may be opposed to each other in two directions in which the peripheral edge of the opening 3 is enlarged.

For example, as shown in FIG. 6 (a), a method of accommodating the leadless type electronic component 1b in the above taping material is to insert guide pins 6 into the pin holes 4 from above or below and move them in all directions. The opening 3 is expanded in all directions. Next, as shown in FIG. 6B, the electronic component 1b is inserted into the enlarged opening 3 with a suction nozzle (not shown). Next, FIG.
As shown in (c), by returning the guide pin 6 to the original position, the opening 3 is reduced and the side surface of the electronic component 1b is clamped by the wall surface of the opening 3, and then the guide pin 6 is removed from the pin hole 4. When the electronic component 1b is separated from the suction nozzle while being pulled out, the storage of the electronic component 1b in the opening 3 is completed. Electronic component 1
The method of taking out the electronic component 1b from the taping material in which the electronic component 1b is stored is the reverse of the storage method shown in FIG.
While sucking b from above or below with the suction nozzle, the guide pin 6 is inserted into the pin hole 4 from above or below and is moved in all directions to enlarge the opening 3 in all directions. Next, the suction nozzle is moved upward or downward to take out the electronic component 1b sucked by the suction nozzle from the enlarged opening 3. Next, the suction nozzle is moved upward or downward to return the guide pin 6 to the original position to reduce the opening 3 to the original size, and then the guide pin 6 is pulled out from the pin hole 4.

As described above, when the taping material of the present invention is used, when the electronic component is stored, the guide pin is inserted into the pin hole by utilizing the extending property of the tape having elastic elasticity and the size of the electronic component is increased. The opening of smaller size is enlarged larger than the size of the electronic component, the electronic component is inserted into the enlarged opening from above or below, and after insertion, the opening is reduced by utilizing the shrinking property of the stretched tape due to the elastic force. The electronic component is clamped by the inner wall of the opening by the force of shrinking to the original size of the opening. Further, when the electronic component is taken out, the guide pin is inserted into the pin hole to expand the opening, and the electronic component is taken out from above or below, contrary to the case of storing. In addition, the taping material after taking out the electronic component has stretchable elastic force and can be reused without being deformed or damaged because it does not undergo the process of thermocompression bonding and peeling.

Next, a second embodiment of the taping material of the present invention will be described with reference to FIGS. It is difficult to apply the first embodiment to an electronic component having leads in four directions, and it is preferable to apply the second embodiment. In the figure, the same parts as those in FIG. The difference from FIG. 1 is that openings 13 having a bottom are provided at equal intervals in the longitudinal direction of the tape 2 instead of the openings 3 penetrating the tape 2. In order to prevent the lead of the electronic component from being deformed by the inner wall of the opening 13 when the tape 2 is expanded and contracted from the expanded state, as shown in FIG. It is set larger than the vertical and horizontal dimensions including the leads of the protruding electronic component 1c, and the depth is also set to the electronic component 1c.
The size is set so that can be stored easily. Further, the size of the inlet portion 13a of the opening 13 is set so that at least the vertical or horizontal dimension thereof is smaller than the vertical or horizontal dimension of the package portion so that the package portion of the electronic component 1c does not stick out. In addition, you may apply the taping material of 2nd Embodiment to the electronic component 1a of the type which the lead has protruded in the two directions which oppose, and the electronic component 1b of the leadless type.
The taping method for storing and taking out the electronic component 1c using the above taping material is almost the same as that shown in FIG.

As described above, when the taping material according to the second embodiment of the present invention is used, the pin is inserted into the pin hole by utilizing the expanding property of the tape having elastic elasticity when the electronic component is stored. Then, the entrance part of the opening smaller than the size of the electronic part is enlarged larger than the size of the electronic part, and the electronic part is inserted into the opening from the expanded entrance part, and after insertion, it is contracted by the elastic force of the stretched tape. Utilizing the property, the inlet part is reduced to its original size, and the electronic component is stored in the opening. At this time, since the size of the inside of the opening is set larger than the size of the electronic component, an unnecessary force is not applied to the electronic component from the inner wall of the opening, and the lead bending due to it does not occur. Further, when the electronic component is taken out, the guide pin is inserted into the pin hole to expand the entrance of the opening, and the electronic component is pulled out from above and taken out, contrary to the case of storing. In addition, the taping material after taking out the electronic component has stretchable elastic force and can be reused without being deformed or damaged because it does not undergo the process of thermocompression bonding and peeling.

As described above, according to the first and second embodiments, since the cover tape is not used, the processing relating to the cover tape is unnecessary when the electronic parts are stored in the taping material and the electronic parts are taken out from the taping material. Thus, the configuration of these devices becomes simple and the device cost can be kept low. Further, since there is no thermocompression and peeling treatment of the cover tape, and a tape made of, for example, a rubber-based material having elastic elasticity is used, the taping material can be reused without being deformed or damaged after use, resulting in a material cost. Not only can it be kept low, but it also contributes to the reduction of industrial waste. In the above description, the electronic component is described as the component, but the component is not limited to the electronic component, and may be a mechanical component, for example. Further, although the opening has been described as a square, the shape is not limited to the square, and may have a shape corresponding to the shape of the component, for example. Further, although the guide pin and the pin hole are described as the locking means, the locking means is not limited to the guide pin and the pin hole, and for example, a holding means for holding the peripheral portion of the tape from both sides by the locking means. May be

[0011]

According to the present invention, a tape having elasticity and elasticity is used as the taping material, and the opening or the opening entrance portion can be enlarged larger than the size of the component when the component is stored or taken out. The tape does not need to be used, the structure of the device for storing or taking out parts is simple, and the device cost can be reduced. In addition, the taping material can be reused and the material cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of a taping material showing a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB of FIG. 1;

FIG. 4 is a plan view showing the relationship between the size of the opening shown in FIG. 1 and the size of the electronic component.

FIG. 5 is a plan view of a taping material of a modified example of the first embodiment of the present invention.

FIG. 6 is an explanatory view illustrating a taping treatment method for the taping material of FIG. 1.

FIG. 7 is a plan view of a taping material showing a second embodiment of the present invention.

8 is a sectional view taken along line AA of FIG. 7;

9 is a sectional view taken along line BB of FIG. 7;

FIG. 10 is a plan view showing the relationship between the dimensions of the opening shown in FIG. 7 and the dimensions of the electronic component.

[Explanation of symbols]

 1a, 1b, 1c Electronic parts 2 Tape 3 Opening 4 Pin hole (locking part) 6 Guide pin (locking jig) 13 Opening 13a Inlet part

Claims (7)

[Claims] 1. A plurality of openings for accommodating components are formed in a longitudinal direction of a tape having elastic elasticity, and a pair of engaging portions are formed at a peripheral edge portion of the openings. A taping material having a constant thickness, wherein a dimension between wall surfaces of the opening facing each other in the same direction as the locking portion so that the component can be clamped is set to be smaller than a dimension between lateral sides of the component clamped by a predetermined value. 2. A tape having a stretchable elastic force is formed with a plurality of openings for accommodating components in a longitudinal direction thereof, and a pair of locking portions facing each other is formed at a peripheral edge of the opening so that the tape is fixed. The opening has a bottom and an inlet portion, the inner wall dimension of the opening is larger than the component dimension by a predetermined value, and the frontage dimension of the inlet portion facing the locking portion in the same direction is A taping material that is set to a value smaller than the unidirectional dimension of the part. 3. The component is an electronic component that is sensitive to static electricity, and the tape is a conductive substance.
Or the taping material described in 2. 4. A plurality of openings are formed along the longitudinal direction, and a pair of locking portions are provided on the peripheral edge of the openings, and the locking portions enlarge the openings to store or take out parts. Flexible taping material. 5. A plurality of openings formed in the longitudinal direction of a tape having a stretchable elastic force are enlarged by using locking means, and parts are stored in the openings or the stored parts are taken out from the openings. Taping processing method. 6. The locking means comprises a pair of pin hole locking portions formed to face the opening peripheral edge portion, and a guide pin locking jig. Taping processing method. 7. The taping processing method according to claim 5, wherein the locking means is a holding means for holding the peripheral portion of the tape from both sides.