JPH01199868A - Embossing tape - Google Patents

Abstract

PURPOSE:To prevent the invasion of moisture into the cavity during the storage of a semi-conductor device, and suppress the generation of cracks at the time of surface packaging, by constructing the cavity bottom wall on the carrier tape so as to close completely the lower side of the cavity, and forming a drain part, which is removable, at the center of the cavity bottom wall. CONSTITUTION:On a carrier tape 12, in the longitudinal direction, a large number of cavities 15, the lower side of which is closed, are arranged with a prescribed interval. In each cavity 15, a semi-conductor unit 16 is stored, and on the upper surface of the carrier tape 12, a cover tape 13 is bonded to completely close the cavity 15. At the center of a cavity bottom wall 15a, a circle shaped notch N is formed on the upper and lower surfaces, and the part divided by the notch N is made to be a drain part 21. This drain part 21 can be easily removed. Therefore, since the cavity 15 is completely closed during the storage of the semi-conductor device, the invasion of moisture to the cavity from outside can be prevented. As a result, the generation of cracks at the time of surface mounting can be suppressed.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a technique particularly effective when applied to a technique for handling semiconductor devices, such as an embossed tape for storing a large number of single semiconductor devices. It is related to effective technology that can be used for.

[Prior art] With the demand for smaller semiconductor devices and the improvement of mounting technology to achieve this, surface-mounted semiconductor devices have appeared, and when packaging these surface-mounted semiconductor devices, embossing is used. Tape has come into use.

For such embossed tapes 1 e.g. 198
rFIND, published by Fujitsu in April 2007, page 55. An example of the prior art will be summarized as follows.

An example of a conventional embossed tape is shown in FIGS. 7 to 9.

In the figure, reference numeral 1 represents the entire embossed tape, and this embossed tape 1 is composed of a carrier tape 2 and a cover tape 3.

Here, the carrier tape 2 is molded from a flexible material (for example, polyethylene or polyethylene terephthalate, etc.), and is configured so that it can be wound around the reel 4, as shown in FIG. The surface is treated with antistatic treatment. A large number of cavities 5 are arranged in the carrier tape 2 at predetermined pitch intervals in its longitudinal direction, and each cavity 5 can accommodate, for example, a surface-mounted (for example, gull-wing type) semiconductor device 6. It looks like this. Further, as shown in FIG. 8, the carrier tape 2 is provided with feeding round holes 7 formed at predetermined pitch intervals along the longitudinal direction on the negative side in the width direction. When the embossed tape 1 is fed out from the roll 4 or wound onto the roll 4, the feeding round hole 7 engages with a pawl (not shown) in the feeding device, so that the embossed tape 1 is moved by the feeding device. It works to ensure smooth feeding, and also works to intermittently feed the embossed tape 1 at predetermined pitch intervals by engaging with claws in a feeding device during surface mounting, which will be described later.

On the other hand, the cover tape 3 is made of polyvinyl chloride, for example, and can be bonded to the upper surface of the carrier tape 2 by thermocompression bonding. This cover tape 3 has a depth of 111i of the cavity 5? (width in the vertical direction in FIG. 8). Note that the surface of the cover tape 3 is subjected to antistatic treatment.

Then, in this embossed tape 1, for example, after the semiconductor device 6 is housed in the cavity 5, a cover tape 3 is bonded to the upper surface of the carrier tape 2, so that the cavity 5 can be closed from above. It has become. As a result, this embossed tape 1 can prevent the semiconductor device 6 from falling off from the embossed tape 1 and prevent the leads of the semiconductor device 6 from bending when the semiconductor device 6 is stored.

By the way, in the conventional embossed tape 1, a round hole 8 is formed in the center of the cavity bottom wall 5a. This round hole 8 is used for introducing into the cavity 5 a push-up pin 9 used to take out the semiconductor device 6 during surface mounting.

By the way, to explain an example of a method for taking out the semiconductor device 6 during surface mounting using FIG. The semiconductor device 6 is placed on the upper suction pad 1o.
The semiconductor device 6 is vacuum-adsorbed and transported to a predetermined portion of the semiconductor device 6 on the printed circuit board. Then, mounting onto a printed circuit board is performed.

[Problems to be Solved by the Invention] However, such an embossed tape 1 has the following problems.

That is, since the embossed tape 1 has the round holes 8 formed in the cavity bottom wall 5a, when the semiconductor device 6 is stored, moisture easily enters into the cavity 5 through the round holes 9.
This moisture is absorbed by the resin package in the semiconductor device 6, and the absorbed moisture reaches deep into the resin package (
For example, it enters the interface between the back surface of the tab and the resin package in the semiconductor device 6). Then, during the subsequent flow soldering during surface mounting, the semiconductor device 6 is heated, so that the moisture is rapidly vaporized and expanded. As a result, there is a problem in that cracks occur in the resin package and the airtightness of the semiconductor device 6 is impaired.

The present invention has been made in view of this point, and an object of the present invention is to provide an embossed tape with high moisture resistance, and thereby to prevent the occurrence of cracks in semiconductor devices.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for Solving the Problems] Representative inventions disclosed in Suido are summarized as follows.

The first embossed tape is configured such that the bottom wall of the cavity in the carrier tape can close the bottom side of the cavity, and also forms a cutout in the center of the bottom wall of the cavity that can be easily removed by pressure from below. This is what I did.

Further, the second embossed tape has an opening provided in the center of the bottom wall of the cavity of the carrier tape body, and this opening is closed by a moisture-proof sheet attached to the bottom wall of the cavity.

[Function] According to the above-mentioned means, the cavity is completely closed by the cavity bottom wall or the moisture-proof sheet and the carrier tape when the semiconductor device is stored, so that it is possible to prevent moisture from entering the cavity from the outside. Due to this effect, the amount of moisture absorbed by the resin package can be suppressed as much as possible, and as a result, the occurrence of cracks during surface mounting is suppressed.

[Example] Hereinafter, an example of the embossed tape according to the present invention will be described in detail based on the drawings.

FIG. 1 shows a longitudinal sectional view of a first embodiment of the embossed tape according to the present invention, FIG. 2 shows a plan view thereof, FIG. 3 shows an enlarged longitudinal sectional view of the carrier tape, and FIG. 2 shows a perspective view of a reel that winds and supports a carrier tape.

In these figures, reference numeral 11 represents the entire embossed tape, and this embossed tape 11 is composed of a carrier tape 12 and a cover tape 13.

Here, the carrier tape 12 is made of polyethylene.

It is made of a flexible material such as polypropylene or polyethylene terectate, and is adapted to be wound around a reel 14, as shown in FIG.
Further, the carrier tape 12 is subjected to antistatic treatment. A large number of cavities 15 are arranged in the carrier tape 12 at predetermined pitch intervals in the longitudinal direction, and a semiconductor device 16 for surface mounting (for example, gull wing type) is housed in each cavity 15. It is now possible to do so. By the way, in this carrier tape 11, a conventional round hole (indicated by reference numeral 8 in FIGS. 7 and 8) is not formed in the center of the cavity bottom wall 15a. At the center of 15a, a circular notch N is formed on the upper and lower surfaces.

This notch N is formed at the same time as the carrier tape 12 is molded, and the area defined by this notch N is a punched part 21, and this punched part 21 is constructed so that it can be easily removed by a relatively small load. There is. Also,
As shown in FIG. 2, the carrier tape 12 has feeding round holes 17 formed at predetermined pitch intervals along the longitudinal direction on the negative side of the carrier tape 12 in the width direction. This feed round hole 17 is used for feeding the embossed tape 11 from the reel 14 or for feeding the embossed tape 11 from the reel 14
When winding the machine, the claws (not shown) on the feeding device
The embossed tape 11 is moved smoothly by the feeding device by engaging with the claws of the feeding device during surface mounting, which will be described later. Works to deliver the desired results.

On the other hand, the cover tape 13 is made of polyvinyl chloride, for example, and can be joined to the carrier tape 12 by thermocompression bonding. This cover tape 13 is formed to have a width slightly larger than the depth width of the cavity 15 (width in the vertical direction in FIG. 2). In addition, cover tape 1
3 is subjected to antistatic treatment.

In this embossed tape 11, for example, after the semiconductor device 16 is housed in the cavity 15, the cover tape 13 is bonded to the upper surface of the carrier tape 12.
This allows the cavity 15 to be completely closed.

In addition, when removing the semiconductor device 16 during surface mounting, as shown in FIG. The device 16 is vacuum-adsorbed by the suction pad 20 and transported to a predetermined location on the printed circuit board. Then, mounting onto a printed circuit board is performed.

According to the embossed tape 11 configured in this way, the following effects can be obtained.

That is, according to the embossed tape 11, the cavity 15 is completely closed by the carrier tape 12 and the cover tape 13, so that moisture is prevented from entering the cavity 15 when the semiconductor device 16 is stored. By this action, the amount of moisture absorbed by the resin package in the semiconductor device M16 can be reduced as much as possible, and as a result, the occurrence of cracks can be suppressed during flow soldering in surface mounting, and the airtightness of the semiconductor device 16 can be improved. becomes possible.

Further, according to the embossed tape 11, the cavity bottom wall 15a can be easily removed by the push-up pins 19, so that the semiconductor device 16 can be easily removed.

FIGS. 5 and 6 show longitudinal sectional views of second and third embodiments of the embossed tape according to the invention, respectively.

The embossed tapes of the second and third embodiments differ from that of the first embodiment in that the carrier tape body 12a
A round hole 18 is formed in the bottom wall 15a of the cavity, and this round hole (opening) 18 is closed with an easily tearable moisture-proof sheet 22 (for example, a metal sheet such as aluminum foil or a resin film such as polypropylene). This is the point.

That is, in the embossed tape 11 of the second embodiment.

As shown in FIG. 5, in the embossed tape 11 of the third embodiment, the upper surface of the cavity bottom wall 15a in the carrier tape main body 12a is Moisture-proof sheets 22 are adhered to the lower surfaces of each with adhesive tapes 23 interposed therebetween.

According to the embodiments shown in FIGS. 2 and 3, the portion corresponding to the round hole 18 is torn by the pressure applied by the push-up pin 19;
That is, the armpit portion functions as the cutout portion 21.

As a result, the same effect as the embossed tape 11 of the first embodiment can be obtained, and the embossed tape 11 that has been used once can be used again by replacing the moisture-proof sheet 22. Incidentally, if we compare the embossed tape 11 of the second embodiment and the embossed tape 11 of the third embodiment, the moisture-proof sheet 22 in the third embodiment is better when pressurized by the push-up pins 19. The back of the cavity is the bottom wall 1
Since it is supported by the lower surface of 5a, the moisture-proof sheet 22 is easily torn. On the other hand, in the embossed tape 11 of the second embodiment, if the adhesive strength is weak, the moisture-proof sheet 22 may not tear and the adhesive sheet 23 may peel off from the cavity 15a. Semiconductor device 1 via adhesive sheet 23 and moisture-proof sheet 22
6 is pushed up, there is no problem in pushing up the semiconductor device 16.

Note that it is also possible to modify this embodiment to use a rubber material for the moisture-proof sheet 22, and to push up the semiconductor device 16 through the rubber material. In this case, since the moisture-proof sheet is not torn, it can be used any number of times without any processing.

[Effects of the Invention] The effects obtained by typical inventions disclosed in this application are briefly explained below.

In the first embossed tape, the bottom wall of the cavity in the carrier tape is configured so that the lower side of the cavity can be completely closed, and a cutout part is provided in the center of the bottom wall of the cavity that can be easily removed by pressure from the outside. Because of this, when the semiconductor device is stored, moisture can be prevented from entering the cavity from the outside, and therefore, the amount of moisture absorbed by the resin package can be suppressed as much as possible. As a result, the occurrence of cracks during surface mounting is suppressed.

In addition, in the second embossed tape, an opening was provided in the center of the bottom wall of the cavity of the carrier tape body, and this opening was closed by a moisture-proof sheet attached to the bottom wall of the cavity. It is possible to prevent moisture from entering the cavity, and therefore, the amount of moisture absorbed by the resin package can be suppressed as much as possible. As a result, the occurrence of cracks during surface mounting is suppressed.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view along the longitudinal direction of the first embodiment of the embossed tape according to the present invention, FIG. 2 is a plan view of the embossed tape of the first embodiment, and FIG. 3 is the first embodiment. FIG. 4 is a perspective view of a reel that winds and supports the embossed tape of the first embodiment, and FIG. 5 is a second embodiment of the embossed tape of the present invention. FIG. 6 is a vertical cross-sectional view along the longitudinal direction of the third embodiment of the embossed tape according to the present invention, FIG. 7 is a longitudinal cross-sectional view of the conventional embossed tape along the longitudinal direction. Longitudinal cross-sectional view. FIG. 8 is a plan view of a conventional embossed tape. FIG. 9 is a front view of a reel that winds and supports the embossed tape. DESCRIPTION OF SYMBOLS 11... Embossed tape, 12... Carrier tape, 13... Cover tape, 15... Cavity, 16... Semiconductor device, 21... Cutout part.

Claims (2)

[Claims] 1. A carrier tape in which a large number of cavities are formed at a predetermined pitch interval in the longitudinal direction; and a cover tape that is attached to the top surface of the carrier tape and closes the cavities from above while semiconductor devices are housed in the cavities. In the embossed tape, the bottom wall of the cavity in the carrier tape is configured to be able to close the bottom side of the cavity, and a embossed tape in the center of the bottom wall of the cavity that can be easily removed by pressure from below. An embossed tape characterized by forming a punched part. 2. A carrier tape in which a large number of cavities are formed at a predetermined pitch interval in the longitudinal direction; and a cover tape that is attached to the top surface of the carrier tape and closes the cavities from above while semiconductor devices are housed in the cavities. An embossed tape comprising: an embossed tape comprising: an opening in the center of the bottom wall of the cavity in the carrier tape; and the opening is closed by a moisture-proof sheet adhered to the bottom wall of the cavity.