JPH04189789A - Semiconductor device containing tape - Google Patents

Abstract

PURPOSE:To press-fix a semiconductor device to a tape main body, and prevent the lead from being bent assuredly due to vibration, etc., during transport by providing an air filled bag which faces a recessed part of a tape main body, and comes into press-contact with a semiconductor device which is placed in the recessed part, on a cover tape. CONSTITUTION:In a cavity 2 on one end side of a tape main body 3, an SOP type IC 5 is inserted and placed. On the tape main body 3, one end of a cover tape 12 which is formed into a thin long bag shape by double tape materials is fixed. A more flexible tape material is located on the tape main body 3 side. The fixed part with the tape main body 3 is made to be the leading end of the bag while keeping airtightness. The bag-shaped cover tape 12 is expanded by blowing in air, and the cover tape 12, as it is, is fixed again at a location between the cavity 2 and the adjacent cavity 2. The more flexible tape material enters the cavity 2 by air pressure, and an air filled bag l2a is formed, and this air filled bag l2a comes into press-contact with the SPO type IC 5 in the cavity 2.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an embossed cavity tape used for housing small outline (SOP) type semiconductor integrated circuits (hereinafter simply referred to as ICs). .

[Conventional technology]

2. Description of the Related Art Conventionally, embossed cavity tapes have been used to store semiconductor devices, for example, when they are transported from a semiconductor manufacturing factory to a mounting factory. This tape is shown in Figure 4 (a) ~
This will be explained with reference to (c) and FIGS. 5(a) and (b).

71,4 Figures (a) to (c) are diagrams showing a conventional embossed type cavity tape, in which figure (a) is a plan view, figure (b) is a sectional view taken along the line BB in figure (a), Same figure (c)
is a sectional view taken along the line CC in FIG. Figure 5 (a
), (b) are diagrams showing a state in which a semiconductor device is housed in a conventional embossed cavity tape, in which (a) is a plan view and (b) is a cross-sectional view taken along the line v-v in (a). It is. In these figures, 1 is a conventional embossed type cavity tape (hereinafter simply referred to as cavity tape).
This cavity tape 1 is made up of a tape body 3 in which a cavity 2 as a recess into which a semiconductor device to be described later is inserted is integrally molded by embossing or the like, and a cover tape 4 stuck on this tape body 3. has been done.

The entire tape body 3 is elongated, and a large number of cavities 2 are arranged in parallel along its longitudinal direction. The cavity portion 2 is formed in a rectangular shape in plan view, and in the conventional tape body 3, the number of cavities 2 is several hundred to several thousand. In addition, the cover tape 4
is formed into an elongated plate shape, and its width is larger than the opening dimension of the cavity portion 2. In order to store elements such as ICs in the conventional cavity tape l constructed in this way, the ICs are placed in the cavity part 2 of the tape body 3.
A cover tape 4 is then pasted onto the tape body 3 to prevent the element from coming out from the cavity portion 2. Note that this work will be simply referred to as taping hereinafter. The cavity tape 1 containing the elements in this manner is wound into a spiral, and each cavity tape 1 is transported as one unit. To mount the elements inside the cavity tape 1 onto a printed circuit board (not shown) using an automatic mounting machine, first, the cover tape 4 is peeled off from the tape body 3 to expose the elements inside the cavity part 2. Next, the element is taken out from the cavity part 2, transferred onto a printed circuit board, and soldered.

Incidentally, IC packages come in a variety of shapes, but in recent years, from the perspective of improving packaging density, small and surface-mount type packages, such as the small outline package (hereinafter simply referred to as SOP) type, have been increasingly used. It has started to be done. And this SOP
type of IC may be used by taping it with the cavity tape 1 described above. This will be explained with reference to FIG. In FIG. 5, 5 is a small outline package (hereinafter simply referred to as SOP) type IC, and this SOP type IC 5 has a plurality of leads 5b protruding from two sides of a package body 5a. And lead 5
The tip of b is unevenly distributed on the lower surface side of the puff cage main body 5a with respect to the base.

In order to store this SOP type IC 5 in the cavity tape 1, the bottom surface of the package body 5a is placed on the inner bottom surface of the cavity portion 2, and in this state, as shown in FIG. 5(a).
, by taping as shown in (b).

[Problem to be solved by the invention]

However, when the SOP type ICs 5 are stored in the cavity tape 1 and fed by each cavity tape 1 in this manner, the leads 5b may be bent during transportation.

This is because the opening width of the cavity part 2 is SOP type IC5.
It is set larger than the full width of cavity part 2 and S.
OP type■There is a gap between C5 and SOP type I.
This is because C5 moves within the cavity tape l. That is, when vibrations or the like are applied during transportation, the SOP type IC 5 moves within the cavity 2 and comes into strong contact with the side surfaces and inner bottom surface of the cavity 2.

[Means to solve the problem]

In the semiconductor device storage tape according to the present invention, a cover tape is provided with an air-filled bag that faces into the recess of the tape body and is pressed into contact with the semiconductor device placed in the recess.

[For production]

The semiconductor device is pressed and fixed against the tape body by the air-filled bag.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to FIGS. 1(a) and 2(b) and FIG.

FIGS. 1(a) and 1(b) are diagrams showing a state in which a sop type IC is housed in a cavity tape according to the present invention, in which FIG. 1(a) is a plan view and FIG. ■-1
FIG. FIG. 2 is a sectional view for explaining the cavity tape taping method.

In these figures, the same or equivalent members as those explained in FIGS. 4(a) to 5(c) and FIG. 5 are designated by the same reference numerals, and detailed explanation thereof will be omitted.

In these figures, reference numeral 11 denotes a cavity tape according to the present invention, and this cavity tape 11 is formed in the same manner as the conventional one except for the cover tape. Reference numeral 12 denotes a cover tape, and this cover tape 12 is made of double tape material, and is configured so that it can be inflated by blowing air between both tape materials. For example, if one tape material is made of a hard material,
When the other tape material is made of a soft material and inflated,
The softer tape material will expand due to air pressure. This cover tape 12 is fixed to the tape body 3 by thermocompression bonding or the like with the softer tape material facing toward the cavity portion 2 side. That is, if the tape material is fixed in an expanded state, the softer tape material will expand and enter into the cavity portion 2. In other words, the air-filled bag 12a is provided within the cavity portion 2. Note that the fixing method is not limited to thermocompression bonding, and can be changed as appropriate.

Next, a procedure for taping the SOP type IC 5 with the cavity tape 11 using this cover tape 12 will be explained. First, the SOP type IC 5 is inserted and placed in the cavity portion 2 at one end of the tape body 3. Then, one end of the cover tape 12, which is shaped like an elongated bag, is fixed onto the tape body 3 using double tape material. At this time, the softer tape material is positioned on the tape body 3 side, and the part that is fixed to the tape body 3 is kept airtight and becomes the tip of the bag. Next, as shown in FIG. 2, air is blown into the bag-shaped cover tape 12 to inflate it, and the cover tape 12 is left as it is.
is fixed again between the adjacent cavity parts 2 by crossing the opening of the cavity part 2. At this time, the softer tape material enters into the cavity part 2 by air pressure to form an air-filled bag 12a, and this air-filled bag 12a comes into pressure contact with the SOP type IC 5 inside the cavity part 2. Next, the next SOP type IC 5 is installed in the adjacent cavity section 2, and this cavity section 2 is closed with the cover tape 12 in the same manner as described above. By repeating this taping operation, the SOP type IC 5 is housed in the cavity tape 11.

Therefore, in the cavity tape 11 using this cover tape 12, by taping, the SOP type IC 5 is pressed against the tape body 3 by the air-filled bag and fixed.

In the embodiment described above, the cover tape 12 was formed of two types of tape materials having different hardnesses, but the cover tape 12 is not limited to this and may be formed of tape materials of the same quality.

Further, in the above embodiment, an example was shown in which the cover tape 12 was formed by doubling the tape material, but as shown in FIG. can.

FIG. 3 is a sectional view showing another embodiment, in which the same or equivalent members as those explained in FIGS. 1(a), (b) and 2 are designated by the same reference numerals and detailed Further explanation will be omitted. In FIG. 3, 13 is a cover tape, and this cover tape 13 includes a tape material 13a and an air bag portion 1 provided on the tape body 3 side of this tape material 13a.
3b. The air bladder portions 13b are arranged at intervals equal to the formation interval of the cavity portions 2 in the tape body 3, and are inflated in advance with air pressure so as to face the inside of the cavity portions 2.

In order to perform taping using the cover tape 13 configured in this way, an SOP type IC is placed inside the cavity portion 2.
5 is inserted and placed, a cover tape 13 is pasted onto the tape body 3.

When attaching the cover tape 13, the air bag portion 13b is made to face the inside of the cavity portion 2. At this time, the air bag portion 13b is
It will come into pressure contact with the OP type IC5. therefore,
Even if this cover tape 13 is used, SOP type IC5
can be fixed within the cavity part 2.

Furthermore, in the two embodiments described above, an example in which an SOP type IC is housed has been described, but the I
C may be used, and the same effect as in the above embodiment can be achieved.

In particular, in ultra-thin small outline package (TSOP) ICs used for high-density packaging, the distance between the leads is very small, so if the leads are even slightly bent, they cannot be used. Therefore, taping with embossed type cavity tape has not been performed, but according to the present invention, taping without bending the leads is possible, so even TSOP type ICs can be taped with embossed type cavity tape.

〔Effect of the invention〕

As explained above, in the semiconductor device storage tape according to the present invention, the cover tape is provided with an air-filled bag that faces into the recess of the tape body and is pressed against the semiconductor device placed in the recess. is pressed and fixed against the tape body by an air-filled bag. Therefore, since the semiconductor device does not move within the recess after being stored, it is possible to reliably prevent the leads from being bent due to vibrations or the like during transportation.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are diagrams showing the state in which an SOP type IC is housed in the cavity tape according to the present invention, in which FIG. 1(a) is a plan view and FIG. I-1
FIG. FIG. 2 is a sectional view for explaining the cavity tape taping method. FIG. 3 is a sectional view showing another embodiment, and FIGS. 4(a) to (c)
) is a diagram showing a conventional embossed type cavity tape, where (a) is a plan view, (b) is a sectional view taken along line B-B in (a), and (c) is a diagram in (a). C-C in
FIG. FIGS. 5(a) and 5(b) are diagrams showing a state in which a semiconductor device is housed in a conventional embossed type cavity tape; FIG. 5(a) is a plan view, and FIG. 5(b) is a
) is a sectional view taken along line V-V in the figure. 2... Cavity part, 3... Tape body, 5...
・、・SoP type IC111・・・Cavity tape, 12.13・・・Cover tape, 12a・・・
Air bag, 13b...air bag part.

Claims (1)

[Claims] A tape for storing semiconductor devices comprising a tape body in which a large number of recesses for storing semiconductor devices are arranged in parallel along the longitudinal direction, and a cover tape stuck to the tape body to close the recesses. A tape for storing semiconductor devices, characterized in that an air-filled bag is provided that faces into the recess of the tape body and is pressed into contact with the semiconductor device placed in the recess.