JPH0431258A - Electronic part mounting tape - Google Patents

Abstract

PURPOSE:To effectively receive parts per unit roll of tape so as to reduce packaging cost and improve efficiency in mounting electronic parts on a wiring board by arranging electronic part mounting positions in a number of rows on a tape. CONSTITUTION:Enbossings 3 for mounting electronic parts are arranged in a number of rows, the electronic parts 4 are received in these embossings 3 and a cover tape 5 is laid thereon to effect sealing thereof with adhesive agent, etc. Such tape is shipped in a condition of being wound on a reel, etc. When the electronic parts are received in the tape or removed therefrom for mounting on a wiring board, the mounting positions are moved by feed holes 2. Since the mounted electronic parts are arranged in a number of rows, the reception or mounting efficiency is improved in comparison with the parts in a single row.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a taping technique for mounting electronic components, mainly semiconductor products, onto a tape.

[Conventional technology]

2. Description of the Related Art Tape has been known to be used as a means for wrapping small electronic components such as packaged semiconductor devices. Electronic components are arranged and mounted on a long piece of tape by some means, then wound on a reel and packaged.
The electronic components are transported, and then the electronic components are taken out and mounted on the wiring printed circuit board. Using such a tape allows continuous work to be carried out using automatic machines and increases mounting efficiency. Methods for attaching electronic components onto the tape include a method of attaching the electronic components to an adhesive section or an adhesive section provided on a part of the tape, and a method of attaching the electronic components to an adhesive section provided on a part of the tape, and a method of attaching the electronic components to a raised recess (
A method is known in which electronic components are individually housed in embossed parts and then sealed with cover tape, and the latter method is currently the mainstream.

As this type of taping technology, for example,
It is described in Publication No. 72898, Publication No. 62-6360, etc.

[Problem to be solved by the invention]

In the above-mentioned conventional technology, electronic components are placed in a single row (one row) on the tape.
Therefore, the mounting space on the tape surface is limited, and the material cost per component is not necessarily lower than that of a long magazine or the like. Furthermore, the mounting speed is limited to a certain range in order to take out one row of electronic components. Furthermore, there were also problems when switching the shipping form by taping.

The present invention has been made to solve the above-mentioned problems, and its purpose is to reduce the cost of taping and improve the mounting efficiency of electronic components.

[Means to solve the problem]

To achieve the above object, the present invention is a tape in which electronic component mounting portions are formed along the winding direction, and the electronic component mounting portions are provided in multiple rows. be.

The present invention also provides the electronic component mounting tape described above, in which a conductive material is provided only along the electronic component mounting portion.

The present invention also provides the electronic component mounting tape described above, in which the electronic component mounting portion is provided with an adhesive film, or the electronic component mounting portion is comprised of a recessed portion, and the recessed portion is sealed with a cover tape. It is something that is true.

[Effect]

By arranging the electronic component mounting parts in multiple rows on the tape, material removal per tape roll is effective, reducing packaging costs and reducing mounting work when mounting electronic components on wiring boards. The effect is that efficiency is improved.

〔Example〕

Hereinafter, the present invention will be explained along with examples with reference to the drawings.

FIG. 1 is a plan view showing an embodiment of an embossed tape according to the present invention.

1 is a tape with feed holes 2 provided along both edges thereof.

Reference numeral 3 denotes embossments (embossed recesses) that serve as electronic component mounting portions, and conventionally a single row of embossments is arranged in multiple rows (three rows). As shown in FIG. 2, an electronic component (for example, a semiconductor IC package) 4 is housed within the embossment, and a cover tape 5 is placed thereon and sealed with an adhesive or the like.

Such tape is shipped wound on a reel or the like. The mounting position is moved by the feed hole 2 when electronic components are stored on the tape, when components are taken out from the tape, and when mounted on a wiring board or the like.

By forming the electronic component mounting area in multiple rows on the tape in this way, it is possible to improve the storage and mounting efficiency of electronic components compared to the case of a single row. It is clear that since the tape feed holes can be used in common, material removal from the tape stock is more effective than in the case of a single row, and therefore costs can be reduced.

FIG. 3 shows an example in which only the portion of the tape where electronic components are attached is made of conductive material.

Electronic parts such as ICs are susceptible to electrostatic damage due to a small amount of current, so conductive tape containing black carbon is used, but carbon-containing tape is expensive. In the present invention, the conductive film 6 is formed in advance on only the part where the electronic parts are attached (including the cover tape), and the other parts are formed with a normal non-conductive material 7, thereby reducing costs. can.

FIG. 4 and FIG. 5 show various embodiments of a multi-row embossed tape in which a cover tape is provided for each row and in common for the multiple rows.

That is, FIG. 4 shows an example in which cover tapes 8 are individually adhered or bonded so that multiple rows of components can be stored and mounted separately for each row.

Further, FIG. 5 shows an example in which cover tape 8 is attached to the entire component mounting surface of multiple rows so that multiple rows of components can be mounted simultaneously.

In Fig. 6(a) and (b), the tape width is set to the standard width Wo,
An example will be shown in which the number of rows of component mounting parts can be changed depending on the dimensions of the component.

(a) is an example in which the mounting parts (embossed parts) 3 are arranged in two rows because the width of the mounting parts (embossed parts) 3 becomes large for large-sized electronic parts.

(b) is an example in which the mounting portions are arranged in three rows because the width of the mounting portion is small for a small-sized electronic component.

By standardizing the tape width, we can standardize the tape feeding mechanism in mounting machines, making it possible to mount a wide variety of electronic components.
Easy to automate.

In the above embodiments, an embossed type tape is used, but it goes without saying that the present invention can be similarly applied to an adhesive type tape.

〔Effect of the invention〕

Since the present invention is configured as described above, it produces the effects described below.

(1) By using a tape in which electronic component mounting portions are formed in multiple rows, the mounting efficiency of electronic components is improved compared to a tape with a single row.

For example, the work of setting the tape on a mounting machine, which previously required three times for a single side, can now be done once if three rows of tape are used.

(2) When material is removed from the original tape in multiple rows, it is more effective than in a single row, and material costs and costs can be reduced. This is particularly effective for small-sized electronic components such as transistors and small IC chips.

(3) By standardizing the tape width, it becomes possible to mount a variety of electronic components using one mounting machine.

[Brief explanation of drawings]

FIG. 1 is a partial top view of a tape showing an embodiment of the present invention. FIG. 2 is a sectional view taken along the line AA in FIG. 1. FIG. 3 is a partial plan view of an embodiment of the present invention in which a conductive material is used. FIGS. 4 and 5 are partial plan views showing aspects of a cover tape in an embodiment of the present invention. FIGS. 6(a) and 6(b) are partial plan views showing an embodiment of the present invention in which the tape width is standardized and used for various types of electronic components. 1...Tape, 2...Sprocket hole, 3...Emboss (
recess) 4... electronic component, 5... cover tape, 6...
... Conductive material, 7... Non-conductive material, 8... Cover tape. Figures A, - Figure B -n Hights. Diagram

Claims (4)

[Claims] 1. 1. A tape for mounting electronic components, characterized in that the tape has electronic component mounting portions formed along the winding direction, and the electronic component mounting portions are provided in multiple rows. 2. The electronic component mounting tape according to claim 1,
A conductive material is provided only along the electronic component mounting portion. 3. In the electronic component mounting tape according to claim 1 or 2, an adhesive film is provided on the electronic component mounting portion. 4. In the electronic component mounting tape according to claim 1 or 2, the electronic component mounting portion includes a recess, and the recess is sealed with a cover tape.