JPH09141685A - Resin molding device with resin tablet temperature control mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To strictly control the temperatures of a resin tablet storage place by providing a cooling means for keeping the internal chamber in which a tablet supply means is stored below a specified temperature level. SOLUTION: When the internal temperatures of a chamber are above a temperature level of 30 deg.C on account of the repetition of a resin molding step, a control part 21 adjusts the internal temperatures of the chamber to a constant temperature level of 30 deg.C or less by increasing the cooling capability of a cooling unit 22, as the temperatures are detected by a temperature sensor 6a. Consequently, when only a molding die is replaced without replacing a resin tablet, for example, it is possible to maintain an ordinary temperature inside the chamber, if the storage time of the resin tablet in a part feeder is long. Thus the performance of the resin tablet is no longer deteriorated and a stable resin molding step can be operated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus equipped with a temperature management mechanism for a resin tablet which supplies a temperature-controlled resin tablet to a molding die for resin molding.

[0002]

2. Description of the Related Art In a multi-pot type transfer molding apparatus used for manufacturing a resin molding type semiconductor device, a resin tablet is supplied to each pot of a molding die for one molding operation to perform resin molding. FIG. 5 shows a conventional example of a resin molding apparatus that supplies a temperature-controlled resin tablet from a storage location to a molding die. In this resin molding apparatus, the resin tablet 101 is sequentially sent out in the longitudinal direction from a parts feeder 102 that houses a cylindrical resin tablet 101 onto a table 103. Then, the chuck mechanism 1 having the chuck claws
The holders 105a and 105b chucked by 04 and provided with storage holes in the longitudinal direction are aligned and stored. The chuck mechanism 104 opens a rotatable chuck on both sides,
Holder 105 with resin tablet 101 standing up
It is stored in the storage holes a and 105b.

The storage holes provided in the holders 105a, 105b are provided in accordance with the positions of the pots of the molding die, and after the resin tablets 101 are transferred from the parts feeder 102 to the storage holes, the holders 105a, 1b are formed.
05b is moved to the in-loader 106 that transfers the resin tablet 101 to the molding die 107, and the resin tablet 101 is pushed up by a push-up cylinder or the like and transferred to the in-loader 106. Further, a lead frame on which semiconductor elements are mounted is transferred from the supply magazine 110 to the in-loader 106 in accordance with a molded product accommodating portion of a molding die, and the lead frame is preheated by a hot plate having a built-in cartridge. . The in-loader 106 is moved onto the molding die 107 to supply the resin tablet 101 to the pot and the lead frame to the molded product accommodating portion. Then, the mold is clamped,
After the resin molding is performed, the resin is transferred to the take-out position 108, the gate break is performed to separate or remove the unnecessary resin, and then each molded product is collected in the storage unit 109.

In the resin molding apparatus, the temperature control mechanism of the parts feeder 102 installed in the tablet supply section will be described with reference to FIG. In the parts feeder 102, as the resin tablet 101 is fed, the tablet in the sub tank 111 is moved to the hopper 1
It is supplied into the parts feeder 102 via 12. Resin tablet 101 stored in the sub tank 111
Although it depends on the type, it is usually desirable to store it at 20 ° C to 30 ° C. Since the resin tablet 101 is made of a thermosetting resin, unless it is stored at a predetermined temperature, the resin is deteriorated and causes defective molding. Further, as shown in FIG. 5, since the parts feeder 102 is disposed adjacent to the high temperature molding die 107 via the partition wall 113, the temperature of the feeder portion is likely to be high. The resin tablet 101 is taken out from the refrigerator stored at low temperature and returned to normal temperature before use. That is, since it is generally used at room temperature, a cooling fan 114 for taking in outside air is provided on the wall surface of the device in which the parts feeder 102 is arranged, and the parts feeder 102 and the sub tank 1 are provided.
The temperature of the resin tablet 101 was controlled by blowing the outside air onto 11.

[0005]

However, in the above conventional resin molding apparatus, the molding die 107 is used.
The vicinity is heated to about 180 ° C, and the lead frame is also preheated to about 100 ° C to 120 ° C.
The temperature around 1 may rise to nearly 40 ° C. In this case, a sufficient cooling effect cannot be obtained only by taking in the outside air depending on the temperature by the cooling fan 114. Especially,
In the case of a thermosetting resin, when the temperature becomes higher than 30 ° C to 35 ° C, a crosslinking reaction proceeds and the resin hardens and becomes hard to flow, which may cause a void during resin molding.
There was a risk of wire flow. Further, the resin tablet 101 housed in the sub-tank 111 supplied to the parts feeder 102 is a common one, and if the product type of the molding die 107 is repeated several times, the resin tablet 101 becomes 1
There is also the fact that they will be kept housed for about a day. Therefore, it is necessary to more strictly control the temperature of the storage location of the resin tablet 101.

The present invention has been made in view of the above demands, and provides a resin molding apparatus provided with a resin tablet temperature control mechanism capable of strictly controlling the temperature of the storage location of the resin tablet. The purpose is to

[0007]

The present invention has the following constitution in order to achieve the above object. That is, in a resin molding apparatus equipped with a temperature management mechanism of a resin tablet that supplies a temperature-controlled resin tablet to a molding die to perform resin molding, a plurality of resin tablets are arranged in a room surrounded by a partition wall. A tablet supply means capable of accommodating and storing and supplying on a table, a tablet transfer means for accommodating and holding the resin tablet supplied on the table by the tablet supply means and transferring the resin tablet to a mold, and the tablet supply It is characterized in that it is equipped with a cooling means for maintaining the temperature in the room accommodating the means at a predetermined temperature or lower, and a control means for controlling the cooling operation of the cooling means.

[0008]

Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is a plan view of a resin molding apparatus according to the present invention, FIG. 2 is a block diagram of a control system of a temperature management mechanism, FIG. 3 is an explanatory view showing a configuration of a room containing a parts feeder, and FIG. 4 is a chuck mechanism and discharge. It is explanatory drawing which shows the structure of a mechanism.

First, the overall structure of the resin molding apparatus will be described with reference to FIG. Reference numeral 1 denotes a tablet supply unit as a tablet supply means, which is equipped with a parts feeder 3 for accommodating and storing a cylindrical resin tablet 2.
The parts feeder 3 supplies the resin tablets 2 to the tablet table 4 continuously by aligning the resin tablets 2 in a line in the longitudinal direction with the feeder. The parts feeder 3 is supplied in units of the number corresponding to the number of storage holes of the holder described later. The parts feeder 3 is housed in a room 5 surrounded by a partition wall,
A temperature sensor 6a is provided in the room 5. A thermocouple or the like is preferably used as the temperature sensor 6a. The humidity sensor 6b may be provided if necessary.

Reference numeral 7 is a tablet storage portion which constitutes a tablet transfer means. In this tablet storage section 7, the resin tablet 2 supplied onto the tablet table 4 by the parts feeder 3 is chucked and held in holders 9a, 9b.
It is equipped with a chuck mechanism 8 to be transferred to. The chuck mechanism 8 has two pairs of openable and closeable chuck arms capable of chucking two resin tablets 2 at a time on the chuck side and the storage side. The chuck arm is rotatably supported on the arm rotation table 10. When one arm pair chucks the resin tablet 2, the other arm pair distributes and stores the resin tablet 2 in the holders 9a and 9b. repeat. Specifically, the holders 9a and 9b are housed in a housing hole formed in the longitudinal direction in accordance with the pot arrangement, and while the holders 9a and 9b are fed at a constant size, the arm rotary table 10 is rotated by, for example, 180 °.
Each time it is rotated, the pair of chuck arms is alternately opened and closed to pick up and store the resin tablet 2. Therefore, the two supplied on the tablet table 4
The two resin tablets 2 are abutted against a stopper and positioned and set at the chuck position.

Reference numeral 11 denotes a tablet transfer unit which constitutes a tablet transfer means, and the resin tablet 2 housed and conveyed in the holders 9a and 9b is heated at high frequency in the preheat unit and delivered to the in-loader 12. Specifically, the resin tablet 2 is pushed up by a push-up cylinder or the like to be delivered to the loader hand. Further, on the set plate provided on the heating plate 11a, the lead frame to which the semiconductor element is bonded from the supply magazine 13 is sequentially loaded by the frame cutout pusher 14 according to the molding position of the molding die. The set plate also serves as the preheat part of the lead frame, and the lead frame is 100 °
Heat to about C to 120 ° C. When the high frequency heating is used, the central portion of the tablet can be heated, so that uniform melting can be performed in the molding die. The in-loader 12
1 moves along the guide rail in the direction of the arrow in FIG. 1 while holding the lead frame on which the semiconductor element is mounted and the resin tablet 2, and transfers the lead frame and the resin tablet 2 onto the lower mold. After doing, return to the original position.

Reference numeral 15 denotes a molding die, in which the lead frame and the resin tablet 2 conveyed by the in-loader 12 are set on the lower die, and the lower die is lifted to perform the die clamping, and then the resin molding is performed. Be seen. The molding die 15 is provided with a type detection unit 16 so that the type of the molded product 17 to be resin-molded can be determined when the die is replaced. Specifically, all the data relating to the type of the resin tablet 2 to be used, that is, the storage temperature, the type of other molded products, the type of lead frame, and the like can be determined.

Reference numeral 18 denotes a molded product take-out portion, and the molded product take-out portion 18 is equipped with an unloader 19 capable of reciprocating on the molding die 15 along a guide rail. The unloader 19 moves to the lower mold after resin molding, transfers the molded product 17 released from the mold, and returns to the original position while holding the molded product 17. The molded product 17 held by the unloader 19 can be moved in a direction orthogonal to the direction in which the molded product is taken out.
It is transferred to the upper degate pallet and twisted to perform gate break and remove unnecessary resin.

Reference numeral 20 is a storage magazine for storing the molded product 17 after removing the unnecessary resin. Molded product 17 after removing unnecessary resin
Are transferred onto the storage magazine 20 by the moving table 18a and stored in the magazine.

Next, the structure of the temperature control mechanism provided in the resin molding apparatus will be described with reference to the flock diagram shown in FIG. In FIG. 2, reference numeral 21 denotes a control unit as a control means, which controls a cooling operation of a cooling unit 22 for controlling the temperature of a room 5 described later, and a resin tablet 2 heated to a predetermined temperature or higher on the tablet table 4. The operation of the discharging mechanism 23 for further discharging is controlled. The control unit 21
Stores an MPU (microprocessor) that controls the entire temperature management mechanism, a RAM used as a temporary storage of input data and a work area of the MPU, a control program, and management temperature data of the resin tablet 2 according to the molding type. The data storage unit 21a includes a ROM and the like, and the comparison unit 21b includes a comparator that compares the stored value of the data storage unit 21a with the detected value.

The control unit 21 receives temperature data from a temperature sensor 6a provided in the room 4 and temperature detection data of the tablet itself from a temperature sensor provided on a transfer path of the resin tablet 2 described later, and The type data in the type detection unit 16 of the molding die 15, the type of the die input from the keyboard 24, and the information such as the management temperature according to the type of the resin tablet to be used are input,
The control unit 21 changes the management temperature data. Further, the control unit 21 controls the cooling operation of the cooling unit 22 to control the temperature in the room 5 to a predetermined control temperature (for example, 30 ° C. or lower).
The temperature of the resin tablet 2 is maintained, the temperature of the tablet is discharged by the discharge mechanism 23, the alarm indicating that there is a defective resin tablet having a temperature increase is displayed, and the control temperature of the resin tablet 2 is displayed on the monitor 25.

Next, the structure of the room in which the parts feeder 3 is built will be described with reference to FIG. Parts feeder 3
It is equipped with a feeder portion 3a for continuously feeding the resin tablet 2 in the longitudinal direction, and a sub tank 3c for feeding the resin tablet 2 to the feeder portion 3a via a popper 3b. As the feeder section 3a, there are a bowl feeder, a linear feeder and the like, but in the present embodiment, a ball feeder is adopted. A cylindrical resin tablet 2 is stored and stored in the sub-tank 3c for about 100 shots. This resin tablet 2 is stored in a refrigerator at a low temperature, and is returned to room temperature before being used and then loaded into the parts feeder 3. The periphery of the parts feeder 3 is surrounded by a partition wall 3d.
A cooling unit 22 is provided outside the upper surface of d. By sucking the air in the room 5 and blowing the air cooled by the refrigerant toward the parts feeder 3,
Temperature control is performed so that the temperature in the room 5 is maintained at room temperature, that is, 30 ° C or lower, preferably 20 ° C to 25 ° C.
When the temperature inside the room 5 rises above 30 ° C. by repeating the resin molding process, the temperature is detected by the temperature sensor 6a, so the control unit 21 increases the cooling capacity of the cooling unit 22 to increase the room temperature. Adjust the temperature in 5 so that it is always below 30 ° C.

As a result, even if the resin tablet 2 in the parts feeder 3 is stored for a long time, for example, when only the molding die 15 is replaced without replacing the resin tablet 2, the room temperature is kept at room temperature. Therefore, a stable resin molding process can be performed without deteriorating the performance of the resin tablet.

Further, the temperature control of the resin tablet 2 can be performed not only in the room 5 but also in the transfer path of the resin tablet 2. For example, FIG.
An example in which the temperature sensor is arranged in the tablet storage unit 7 will be described. The resin tablet 2 supplied from the parts feeder 3 onto the tablet table 4 is abutted and positioned by the stopper 26 in order to set the chuck position by the chuck mechanism 8. A temperature sensor 6c (infrared sensor) may be arranged near the stopper 26. The tablet table 4 is configured to be movable in the arrow direction (left and right direction in the drawing) by a driving unit (not shown), and an openable / closable shutter 27 is provided at the bottom of the table 4. Below the shutter 27, a tablet discard box 28 for collecting defective tablets is provided. When the temperature sensor 6c detects that the temperature of the resin tablet 2 set on the tablet table 4 is 30 ° C. or higher, the supply operation of the resin tablet is stopped, the tablet table 4 is moved, and the shutter 27 is opened. The opened and heated resin tablet 2 is collected in the tablet disposal box 28.

Further, the tablet storage portion 7 is equipped with a defect detection mechanism for detecting whether or not the size (length) of the resin tablet 2 stored in the storage holes of the holders 9a and 9b is within the allowable range. Has been done. This is because if the length of the tablet is too short, the amount of resin will be insufficient to cause defective molding, and if it is too long, it will be difficult to take out the molded product. This defective discharge mechanism may be equipped with a temperature sensor.

Specifically, the resin tablets 2 positioned at the chuck position are chucked by the chuck mechanism 8 two by two and then raised, and rotated by 180 degrees by the arm rotating table 10 to chuck the tablet arm 8a. , 8b are moved to the storage side positions (the rear side in the drawing), and then the chuck arms 8a, 8b are moved to 90
Rotate by ° to open on both sides to the horizontal position (inspection position) as shown by the chain double-dashed line. At this time, the other chuck arms 8c and 8d (not shown) are arranged at the chuck side position (front side in the drawing).

In this state, the inspection pins 29a and 29b are lowered to the air cylinder (not shown) to move the chuck arms 8a and
The upper end surface of the resin tablet 2 chucked by 8b is contacted. At this time, a detection sensor (not shown) inspects whether the inspection piece is within the allowable range, and after the inspection, the chuck mechanism 8 is lowered to chuck the chuck arms 8a and 8b arranged at the storage side position (the rear side in the drawing). And the resin tablet 2 is stored in the storage holes of the holders 9a and 9b.
At this time, the chucks 8c and 8d simultaneously chuck the resin tablet 2 on the tablet table 4. Then, the chuck mechanism 8 is raised again, and is rotated by 90 ° so as to close the stored chuck arms 8a and 8 to the vertical position, and then the arm rotating table 10 moves the
When rotated by 80 °, the chuck arms 8c and 8d that chuck the resin tablet 2 move to the storage side positions (the rear side in the drawing), and the chuck arms 8a and 8b move to the chuck side positions (the front side in the drawing). And the chuck arm 8
By rotating c and 8d by 90 ° respectively, they are opened on both sides to the horizontal position (inspection position) shown by the chain double-dashed line in the figure,
Simultaneously store and chuck the tablet. In FIG. 4, 31 is the chuck arms 8a, 8b,
Reference numeral 32 denotes an arm opening / closing cylinder for opening / closing 8c, 8d, and 32 denotes the chuck arms 8a, 8b and 8c, 8
It is a rotating cylinder for rotating d by 180 °. By repeating the above operation alternately, the resin tablet 2 is stored in the storage holes of the holders 9a and 9b while inspecting the resin tablet 2.

When the inspection piece is within the allowable range, the operation moves to the next resin tablet 2 transfer operation by the chuck arms 8a and 8b, and when it is out of the allowable range, the defective resin tablet discharge operation is performed. . When the defective resin tablet is discharged, first, the holders 9a and 9b are moved so that the storage hole position in which the defective resin tablet is stored is located above the discharge cylinders 30a and 30b. Then
The holder 9 is operated by operating the discharge cylinders 30a and 30b.
The defective resin tablet is pushed up from a and 9b, and the defective tablet is chucked by one of the chuck arms arranged on the storage side and opened to the horizontal position. Next, after raising the chuck mechanism 8, the arm is closed vertically,
The arm rotating table 10 rotates 180 ° to move it to the chuck side position. Further, the tablet table 4 is moved to open the shutter 27, and the chuck of the defective resin tablet is opened to drop it into the tablet discard box 28. The defective resin tablet may be discharged by pushing it up into a discharge shooter (not shown) with a discharge cylinder and sliding it down to the tablet disposal box 28 through the shooter.

In the above structure, temperature sensors (infrared sensor etc.) 6d may be provided at both side positions corresponding to the inspection position where the resin tablet 2 is held by the chuck mechanism 8. In this case, when the temperature sensor 6d raises the temperature of the resin tablet 2 to 30 ° C. or higher, the tablet discard box 28 is operated by the same operation as the mechanism for discharging the defective resin tablet in the holders 9a and 9b by the chuck mechanism 8 described above. Be recovered to.

As described above, the temperature sensors 6c, 6d and the like are provided in the resin tablet transfer path for fine temperature control, and the resin tablet 2 having a temperature higher than a predetermined temperature is collected by the discharge mechanism 23. Since factors such as molding defects can be eliminated in advance, high-quality molded products can be stably supplied.

When the molding die 15 is replaced to change the molding type, the management temperature data corresponding to the type of the resin tablet 2 to be used is specified by the type detecting unit 16 and stored in the data storage unit 21a of the control unit 21. The stored management temperature is automatically rewritten to control the cooling operation of the cooling unit 22.

The present invention is not limited to the above-mentioned embodiment, and for example, the temperature detection of a resin tablet is
It may be performed in the preheat portion or the like in the tablet transfer portion 11, and it goes without saying that other modifications can be made without departing from the spirit of the invention.

[0028]

As described above, according to the present invention, even if the storage time of the resin tablet stored in the tablet supply means becomes long, the room for accommodating the tablet supply means is kept at room temperature by the cooling means. Since the temperature is controlled to 1, the stable resin molding process can be performed without deteriorating the performance of the resin tablet. In particular, a temperature sensor, etc. is provided in the resin tablet transfer path to perform fine temperature control, and the resin tablet that has risen above a predetermined temperature is collected by the discharge mechanism, thereby eliminating factors such as molding defects in the resin mold. Therefore, a remarkable effect such as stable supply of high-quality molded products can be obtained.

[Brief description of the drawings]

FIG. 1 is a plan view of a resin molding device according to the present invention.

FIG. 2 is a block diagram of a control system of a temperature management mechanism equipped in a resin molding device.

FIG. 3 is an explanatory diagram showing a configuration of a room in which a parts feeder is built.

FIG. 4 is an explanatory diagram showing a configuration of a chuck mechanism and a discharge mechanism.

FIG. 5 is a plan view of a conventional resin molding device.

FIG. 6 is an explanatory diagram showing a configuration of a conventional temperature control mechanism of a parts feeder.

[Explanation of symbols]

 1 Tablet Supply Section 2 Resin Tablet 3 Parts Feeder 3a Feeder Section 3b Hopper 3c Sub Tank 3d Partition Wall 4 Tablet Table 5 Room 6a, 6b, 6c, 6d Temperature Sensor 6b Humidity Sensor 7 Tablet Storage Section 8 Chuck Mechanism 9a, 9b Holder 10 Arm Rotary table 11 Tablet transfer unit 11a Hot plate 12 In loader 13 Supply magazine 14 Frame cutting pusher 15 Mold die 16 Product type detection unit 17 Molded product 18 Molded product removal unit 19 Unloader 20 Storage magazine 21 Control unit 21a Data storage unit 21b Comparison Part 22 Cooling unit 23 Ejection mechanism 24 Keyboard 25 Monitor 26 Stopper 27 Shutter 28 Tablet discard box 29a, 29b Inspection pin 30a, 30b Out cylinder 31 the arm opening and closing cylinder 32 rotates the cylinder

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01L 21/56 H01L 21/56 T // B29C 31/02 9267-4F B29C 31/02 B29L 31: 34

Claims (4)

[Claims] 1. A resin molding apparatus having a temperature management mechanism for a resin tablet, which supplies a temperature-controlled resin tablet to a molding die to perform resin molding, wherein a plurality of units are arranged in a room surrounded by a partition wall. A tablet supply means capable of accommodating and storing the resin tablet of the above and supplying it on the table, and a tablet transfer means for accommodating and holding the resin tablet supplied on the table by the tablet supply means and transferring it to the molding die, A temperature management mechanism comprising: a cooling means for maintaining a temperature in a room accommodating the tablet supply means at a predetermined temperature or lower; and a control means for controlling a cooling operation of the cooling means. Resin molding equipment. 2. The control means controls the operation of the cooling means so as to maintain the temperature in the room below a predetermined value in accordance with the temperature detected by a temperature sensor provided in the room. Item 1. A resin molding device provided with a temperature control mechanism for a resin tablet according to Item 1. 3. The control means monitors the temperature of the resin tablet by a temperature sensor provided in the transfer path of the resin tablet, and when the temperature of the resin tablet exceeds a predetermined value, discards it by the discharging means. A resin molding apparatus comprising a temperature management mechanism for a resin tablet according to claim 1. 4. The control means stores the control temperature in the room according to the type of the mold die, and changes the control temperature in the room by detecting the type of the mold die. The resin molding apparatus having a temperature management mechanism for a resin tablet according to claim 1, wherein the cooling operation by the cooling means is controlled.