JPH09135146A - Vibrator - Google Patents

Vibrator

Info

Publication number
JPH09135146A
JPH09135146A JP29237895A JP29237895A JPH09135146A JP H09135146 A JPH09135146 A JP H09135146A JP 29237895 A JP29237895 A JP 29237895A JP 29237895 A JP29237895 A JP 29237895A JP H09135146 A JPH09135146 A JP H09135146A
Authority
JP
Japan
Prior art keywords
copper
conductor
cover
diaphragm
vibrating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29237895A
Other languages
Japanese (ja)
Inventor
Aki Okamoto
亜紀 岡本
Hideki Higashiya
秀樹 東谷
Mitsuhiro Furukawa
光弘 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP29237895A priority Critical patent/JPH09135146A/en
Publication of JPH09135146A publication Critical patent/JPH09135146A/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To enhance the corrosion resistance of a conductor in a throughhole part by adopting a copper-nickel alloy with a chromium or titanium used for a bed material for a conductor on an inner face of the throughhole of a cover in 1st and 2nd connection sections. SOLUTION: An end of a lead electrode 11 is inserted into a throughhole 13 and extended to a side opposite to a root through a side of a vibration section 7 to form a connection section. Furthermore, the other end of the lead electrode forms a connection section at the root. Then the conductors 18 in throughholes 16, 17 formed to a cover 3 corresponding to the connection sections are connected to external electrodes 4, 5. The 1st and 2nd connection sections are in continuity with the 1st and 2nd external electrodes 4, 5 via the conductors 18 provided to the inner face of the throughholes 16, 17 of the 1st or 2nd covers 2, 3, and seal films are formed in the throughholes 16, 17 of the covers 2, 3 by using a copper nickel alloy while chromium or a titanium is used as a bed material by the vapor-deposition method or the sputtering method.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は各種電子機器に利用
される水晶等の振動子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a crystal oscillator or the like used in various electronic devices.

【0002】[0002]

【従来の技術】従来のこの種振動子は、振動板と、この
振動板の表、裏面を覆うとともにその外周部で前記振動
板の外周部を挟持した第1,第2のカバーとを備え、前
記振動板は前記第1,第2のカバーによる挟持内方に舌
片状の振動部を有し、この振動板の表、裏面には励振用
電極を形成していた。
2. Description of the Related Art A conventional vibrator of this type includes a diaphragm and first and second covers that cover the front and back surfaces of the diaphragm and sandwich the outer peripheral portion of the diaphragm with the outer peripheral portion. The diaphragm has a tongue-shaped vibrating portion inside the sandwiched by the first and second covers, and excitation electrodes are formed on the front and back surfaces of the diaphragm.

【0003】従来振動部の表、裏の励振用電極のリード
電極と第1または第2のカバー外の第1,第2の外部電
極との接続は、第1または第2のカバーの貫通孔内にク
ロムまたはチタンを下地にして銅で形成した導電体を介
して行っていた。
Conventionally, the lead electrodes of the front and back excitation electrodes of the vibrating portion and the first and second external electrodes outside the first or second cover are connected to each other through the through holes of the first or second cover. This is done via a conductor formed of copper with chromium or titanium as a base.

【0004】[0004]

【発明が解決しようとする課題】上記従来例では第1ま
たは第2のカバーに設けた貫通孔はサンドブラスト法に
より形成されていたので、貫通孔の内壁面に大きな凹凸
が形成されたり、貫通孔の貫通側の縁が部分的に欠けた
りしていた。また、第1または第2のカバーに設けた貫
通孔は蒸着法あるいはスパッタリング法でクロムまたは
チタンを下地にして銅で形成した導電体で封口してい
た。しかし、クロムまたはチタンを下地にして銅で形成
した導電体は耐食性に乏しく腐食によるリークが発生す
るという問題があった。
In the above-mentioned conventional example, since the through hole provided in the first or second cover is formed by the sandblast method, large irregularities are formed on the inner wall surface of the through hole, or the through hole is formed. The edge of the penetration side of was partially chipped. Further, the through hole provided in the first or second cover is sealed by a conductor formed of copper with chromium or titanium as a base by vapor deposition or sputtering. However, there is a problem that a conductor formed of copper with chromium or titanium as a base has poor corrosion resistance and causes leakage due to corrosion.

【0005】そこで本発明は貫通孔部分の導電体の耐食
性を高めることを目的とするものである。
Therefore, the present invention aims to enhance the corrosion resistance of the conductor in the through-hole portion.

【0006】[0006]

【課題を解決するための手段】そしてこの目的を達成す
るために本発明は、振動板と、この振動板の表、裏面を
覆うとともにその外周部で前記振動板の外周部を挟持し
た第1,第2のカバーと、これらの第1または第2のカ
バーの少なくとも一方に振動板とは反対側面に設けた第
1,第2の外部電極を備え、前記振動板は前記第1,第
2のカバーによる挟持部内方に舌片状の振動部を有し、
この振動部の表、裏面には励振用電極を形成し、これら
の表、裏の励振用電極からはそれぞれ振動部の根元部分
を介してリード電極を引き出し、これら表、裏のリード
電極の一方は第1の接続部を形成し、他方のリード電極
は前記一方のリード電極側に貫通後第2の接続部を形成
し、これらの第1,第2の接続部は第1または第2のカ
バーの貫通孔の内面に導電体をクロムまたはチタンを下
地にして銅−ニッケル合金により形成させるものであ
る。
In order to achieve this object, the present invention provides a vibrating plate and a first vibrating plate which covers the front and back surfaces of the vibrating plate and clamps the outer peripheral part of the vibrating plate at its outer peripheral part. , A second cover, and at least one of the first or second cover having first and second external electrodes provided on the side opposite to the diaphragm, the diaphragm being the first and second outer electrodes. Has a tongue-like vibrating part inside the sandwiching part by the cover of
Excitation electrodes are formed on the front and back surfaces of the vibrating section, and lead electrodes are drawn from the front and back excitation electrodes via the roots of the vibrating section. Form a first connection part, the other lead electrode forms a second connection part after penetrating to the one lead electrode side, and these first and second connection parts form the first or second The conductor is formed on the inner surface of the through hole of the cover by a copper-nickel alloy with chromium or titanium as a base.

【0007】本発明によれば、貫通孔部分の導電体の耐
食性を高めることができ、より信頼性の高い振動子が得
られる。
According to the present invention, the corrosion resistance of the conductor in the through-hole portion can be increased, and a more reliable vibrator can be obtained.

【0008】[0008]

【発明の実施の形態】本発明の請求項1に記載の発明
は、振動板と、この振動板の表、裏面を覆うとともにそ
の外周部で前記振動板の外周部を挟持した第1,第2の
カバーと、これらの第1または第2のカバーの少なくと
も一方に振動板とは反対側面に設けた第1,第2の外部
電極を備え、前記振動板は前記第1,第2のカバーによ
る挟持部内方に舌片状の振動部を有し、この振動部の
表、裏面には励振用電極を形成し、これらの表、裏の励
振用電極からはそれぞれ振動部の根元部分を介してリー
ド電極を引き出し、これら表、裏のリード電極の一方は
第1の接続部を形成し、他方のリード電極は前記一方の
リード電極側に貫通後第2の接続部を形成し、これらの
第1,第2の接続部を第1または第2のカバーの貫通孔
の内面に設けたクロムまたはチタンを下地として銅−ニ
ッケル合金で形成した導電体を介してそれぞれ前記第
1,第2の外部電極と導通させたものであり、貫通孔部
分の導電体の耐食性を高めるという作用を有する。
BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is directed to a diaphragm and first and first diaphragms which cover the front and back surfaces of the diaphragm and sandwich the outer peripheral portion of the diaphragm with the outer peripheral portion thereof. A second cover, and at least one of the first and second covers provided with first and second external electrodes provided on the side opposite to the diaphragm, and the diaphragm includes the first and second covers. The holding part has a tongue-like vibrating part inside, and the excitation electrodes are formed on the front and back sides of this vibrating part. The lead electrode is pulled out, one of the front and back lead electrodes forms a first connection portion, and the other lead electrode forms a second connection portion after penetrating to the one lead electrode side. Chrome provided with the first and second connection portions on the inner surface of the through hole of the first or second cover In addition, it is electrically connected to the first and second external electrodes through a conductor formed of copper-nickel alloy with titanium as a base, and has an effect of enhancing the corrosion resistance of the conductor in the through hole portion. .

【0009】請求項2に記載の発明は、貫通孔の内面に
設けた導電体の銅−ニッケル合金で、ニッケルの含有量
を5〜20%としたものであり、ニッケル含有量が5%
以下であると耐食効果が小さく、20%以上であると膜
の応力が大となるため、ニッケル含有量を5〜20%と
することで耐食効果を保ちながら膜の応力による剥がれ
を防ぐという作用を有するものである。
The invention according to claim 2 is a copper-nickel alloy of a conductor provided on the inner surface of a through hole, wherein the nickel content is 5 to 20%, and the nickel content is 5%.
If it is below, the corrosion resistance effect is small, and if it is 20% or more, the stress of the film becomes large. Therefore, by setting the nickel content to 5 to 20%, the action of preventing peeling due to the stress of the film while maintaining the corrosion resistance effect. Is to have.

【0010】請求項3に記載の発明は、貫通孔の内面に
設けた導電体が銅−ニッケル合金とクロムまたは銅−ニ
ッケル合金とチタンで構成され、これにより封止膜との
接着力の向上を図り、より気密性を高めることができ
る。
According to the third aspect of the present invention, the conductor provided on the inner surface of the through hole is made of copper-nickel alloy and chromium or copper-nickel alloy and titanium, whereby the adhesion with the sealing film is improved. It is possible to improve the airtightness.

【0011】以下、本発明の実施形態について図面を用
いて説明する。図1において1は振動板で、板厚100
μmの水晶板で構成されている。振動板1の表、裏面に
は、板厚400μmの水晶板よりなる第1,第2のカバ
ー2,3が直接接合されている。尚、この図1における
4,5は、外部電極で第2のカバー3の裏面の対角線部
分に配置されている。前記振動板1は、図2および図3
に示すように、その内方にU字状の切溝6が形成され、
これにより舌片状の振動部7が形成されている。この振
動部7の表、裏面には、励振用電極8,9が形成され、
各々振動部7の根元部分10を介してそのリード電極1
1,12が引き出されている。この内リード電極11の
端部は、図2から図5に示すごとく、振動板1をスルー
ホール13により貫通し、その後図3に示すごとく振動
部7の側方を通って根元部10の反対側に延長されて接
続部14を形成している。またリード電極12は根元部
10側において接続部15を形成している。
Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 is a vibration plate having a plate thickness of 100.
It is composed of a crystal plate of μm. First and second covers 2 and 3 made of a quartz plate having a plate thickness of 400 μm are directly bonded to the front and back surfaces of the diaphragm 1. It should be noted that reference numerals 4 and 5 in FIG. 1 are external electrodes and are arranged on the diagonal line of the back surface of the second cover 3. The diaphragm 1 is shown in FIGS.
As shown in, a U-shaped kerf 6 is formed inside thereof,
As a result, the tongue-shaped vibrating portion 7 is formed. Excitation electrodes 8 and 9 are formed on the front and back surfaces of the vibrating portion 7,
The lead electrode 1 via the root portion 10 of each vibrating portion 7
1, 12 are pulled out. As shown in FIGS. 2 to 5, the end of the inner lead electrode 11 penetrates the diaphragm 1 by the through hole 13, and then passes through the side of the vibrating section 7 as shown in FIG. The connection portion 14 is formed by extending to the side. The lead electrode 12 forms a connection part 15 on the base part 10 side.

【0012】そしてこれらの接続部14,15に対応す
るカバー3に形成された貫通孔16,17内の導電体1
8を介して各々外部電極4,5に接続されている。尚第
1,第2のカバー2,3はその外周部で振動板1の表、
裏面の外周部を挟持し、また直接接合されているもので
あるが、それは振動板1の切溝6の外周部において、接
合されているのであって、リード電極11が振動部7の
側方を通過している部分については、その外方において
第2のカバー3と接合されている。
Then, the conductor 1 in the through holes 16 and 17 formed in the cover 3 corresponding to these connecting portions 14 and 15 is formed.
8 are connected to external electrodes 4 and 5, respectively. In addition, the first and second covers 2 and 3 have the outer peripheral portion of the front surface of the diaphragm 1,
Although the outer peripheral portion of the back surface is sandwiched and directly joined, it is joined at the outer peripheral portion of the kerf 6 of the diaphragm 1, and the lead electrode 11 is located laterally of the vibrating portion 7. The portion passing through is joined to the second cover 3 on the outside thereof.

【0013】そして、このように振動板1の裏面側にお
いて、振動部7の側方にリード電極11を形成するため
に、図5,図6から明らかなように、振動板1は第1,
第2のカバー2,3との挟持部分だけを板厚を厚くし、
振動部7およびリード電極11,12を形成する部分な
どは、エッチングにより板厚を薄くしている。図4は、
このエッチング工程後の振動板1を明確に表しており、
枠線19に対応する裏面部分がエッチングによりその板
厚が薄くなっているのである。また、この枠線19の外
周部分がカバー2,3によって、挟持接合される部分で
あり、この図4から明らかなように、振動板1の長手方
向側の挟持幅20は、短方向の挟持幅21よりも広くし
ている。
In order to form the lead electrode 11 on the side of the vibrating portion 7 on the back surface side of the diaphragm 1 as described above, as is apparent from FIGS.
Increase the plate thickness only at the sandwiching part with the second covers 2 and 3,
The vibrating portion 7 and the portions where the lead electrodes 11 and 12 are formed are thinned by etching. FIG.
It clearly shows the diaphragm 1 after this etching step,
The back surface portion corresponding to the frame line 19 is thinned by etching. Further, the outer peripheral portion of the frame line 19 is a portion to be sandwiched and joined by the covers 2 and 3, and as is apparent from FIG. 4, the sandwiching width 20 on the longitudinal side of the diaphragm 1 is sandwiched in the short direction. It is wider than the width 21.

【0014】また図3のごとくリード電極11を振動部
7の側方に設けたので、当然のこととして、振動部7は
振動板1の中心部より一方側にずれている。
Since the lead electrode 11 is provided on the lateral side of the vibrating portion 7 as shown in FIG. 3, the vibrating portion 7 is naturally displaced to one side from the central portion of the vibrating plate 1.

【0015】尚、根元部分10における切溝6の切り込
みは図4のごとく、半円形状になっており、これにより
過大な衝撃が加わった際にも、クラックが生じにくくな
るのである。
The cut groove 6 in the root portion 10 has a semi-circular shape as shown in FIG. 4, whereby cracks are less likely to occur even when an excessive impact is applied.

【0016】それでは本実施の形態における特徴部分に
ついて説明する。本実施の形態においては図5,図6,
図7に示すごとく第2のカバー3に設けた貫通孔16,
17は振動板1側(サンドブラストの貫通側)が径小と
なった円錐形状をしている。
Now, the characteristic part of this embodiment will be described. In the present embodiment, FIGS.
As shown in FIG. 7, the through holes 16 provided in the second cover 3,
Reference numeral 17 has a conical shape with a smaller diameter on the diaphragm 1 side (the side through which the sandblast is penetrated).

【0017】先ず1例としてこの貫通孔16,17の内
面にクロムまたはチタンを下地にして銅−ニッケルまた
は銅−ニッケルとチタンを蒸着法あるいはスパッタリン
グ法により付着させ、導電体18を形成する。クロムま
たはチタンは水晶と銅との接着力を強めるために数百か
ら数千Å付着させ、銅−ニッケルは導通をとるため数千
Åから数μm付着させる。また、このあと形成する封止
膜との接着力を強めるためクロムまたはチタンを数百か
ら数千Å付着させる。
First, as an example, a conductor 18 is formed by depositing copper-nickel or copper-nickel and titanium on the inner surfaces of the through holes 16 and 17 with chromium or titanium as a base by vapor deposition or sputtering. Chromium or titanium is deposited in the range of several hundred to several thousand Å in order to strengthen the adhesive force between crystal and copper, and copper-nickel is deposited in the range of several thousand Å to several μm in order to establish conduction. Also, in order to strengthen the adhesive force with the sealing film to be formed later, several hundred to several thousand Å of chromium or titanium is attached.

【0018】この導電体18の上方は貫通孔16,17
の上方径小部分を封口するとともに、上記接続部14,
15に電気的に接続され、またこの導電体18の下方
は、第2のカバー3の振動板1とは反対側面において、
貫通孔16,17の開口縁が広がっている。
Above the conductor 18, the through holes 16 and 17 are provided.
The upper part of the small diameter is sealed, and the connection parts 14,
15 is electrically connected to the lower part of the second cover 3 on the side opposite to the diaphragm 1.
The opening edges of the through holes 16 and 17 are widened.

【0019】この状態で前記貫通孔16,17の上方径
小部を覆った導電体18部分を覆うごとく貫通孔16,
17内に半田を流入させ封止膜22を形成する。貫通孔
16,17内は導電体18と封止膜22による封口体に
より良好な気密性が確保される。
In this state, the through holes 16 and 17 are formed so as to cover the conductor 18 portion which covers the upper small diameter portions of the through holes 16 and 17.
The sealing film 22 is formed by injecting solder into the inside 17. A good airtightness is ensured in the through holes 16 and 17 due to the sealing body formed by the conductor 18 and the sealing film 22.

【0020】さらに、封止膜22を形成した状態で外部
電極4,5をスクリーン印刷等で形成すれば、その貫通
孔16,17部分は図1,図5,図6,図7のごとく、
この貫通孔16,17内に若干落ち込むようになる。こ
の外部電極4,5も封口体の一部となることによってさ
らに気密性が高まる。
Further, when the external electrodes 4 and 5 are formed by screen printing or the like with the sealing film 22 formed, the through holes 16 and 17 are as shown in FIGS. 1, 5, 6 and 7.
It slightly falls into the through holes 16 and 17. Since the external electrodes 4 and 5 also become a part of the sealing body, airtightness is further enhanced.

【0021】なお、上記実施の形態においては、導電体
18として銅−ニッケルとクロムまたは銅−ニッケルと
チタンを蒸着あるいはスパッタリングにより形成したも
のについて説明したが、導電体18として封止膜22と
の接着力は多少弱くなるが、銅−ニッケル合金のみでも
実用上の気密性を確保できることになる。
In the above embodiment, the conductor 18 is formed by depositing copper-nickel and chromium or copper-nickel and titanium by vapor deposition or sputtering, but as the conductor 18, the sealing film 22 is used. Although the adhesive strength is slightly weakened, practical airtightness can be ensured by using only the copper-nickel alloy.

【0022】[0022]

【発明の効果】以上のように本発明は、振動板と、この
振動板の表、裏面を覆うとともにその外周部で前記振動
板の外周部を挟持した第1,第2のカバーと、これらの
第1または第2のカバーの少なくとも一方の振動板とは
反対側面に設けた第1,第2の外部電極を備え、前記振
動板は前記第1,第2のカバーによる挟持部内方に舌片
状の振動部を有し、この振動部の表、裏面には励振用電
極を形成し、これらの表、裏の励振用電極からはそれぞ
れ振動部の根元部分を介してリード電極を引き出し、こ
れら表、裏のリード電極の一方は第1の接続部を形成
し、他方のリード電極は前記一方のリード電極側に貫通
後第2の接続部を形成し、これらの第1,第2の接続部
は第1または第2のカバーの貫通孔の内面に設けた導電
体を介してそれぞれ前記第1,第2の外部電極と導通さ
せ、前記カバーの貫通孔内に封止膜を蒸着法あるいはス
パッタリング法によりクロムまたはチタンを下地にして
銅−ニッケル合金により形成したものであり、貫通孔の
内面の導電体が銅−ニッケル合金の場合、銅のみで形成
した場合よりもニッケル酸化膜により耐食性の向上が図
れる。また、銅のみで形成した場合より銅−ニッケル合
金で形成した方がより緻密な膜形成が可能となり、封口
性のより信頼性の高いものとなる。
As described above, the present invention provides a diaphragm, first and second covers for covering the front and back surfaces of the diaphragm and sandwiching the outer periphery of the diaphragm with the outer periphery thereof. Of the first or second cover, the first and second external electrodes are provided on the opposite side of the diaphragm from the diaphragm, and the diaphragm is tongue inwardly of the holding portion by the first and second covers. It has a piece-shaped vibrating portion, and excitation electrodes are formed on the front and back surfaces of this vibrating portion, and lead electrodes are drawn from these front and back excitation electrodes through the root portion of the vibrating portion, respectively. One of the front and back lead electrodes forms a first connecting portion, the other lead electrode forms a second connecting portion after penetrating to the one lead electrode side, and these first and second lead electrodes are formed. The connecting portions are respectively provided through conductors provided on the inner surface of the through hole of the first or second cover. Note that the first and second external electrodes are electrically connected to each other, and a sealing film is formed in the through-hole of the cover by a vapor deposition method or a sputtering method with chromium or titanium as an underlayer by a copper-nickel alloy. When the conductor on the inner surface is a copper-nickel alloy, the corrosion resistance can be improved by the nickel oxide film as compared with the case where the conductor is formed of only copper. In addition, a more dense film can be formed by using a copper-nickel alloy than by using only copper, and the sealing performance becomes more reliable.

【0023】また、銅−ニッケル合金で形成した膜は銅
のみで形成した場合よりも、その上に形成する半田封止
膜との界面で形成される合金層が薄くなるため膜厚を薄
くすることが可能となる。
Further, the film formed of the copper-nickel alloy is thinner than that formed only of copper, because the alloy layer formed at the interface with the solder sealing film formed thereon is thinner, so that the film thickness is made thinner. It becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態の振動子を示す斜視図FIG. 1 is a perspective view showing a vibrator according to an embodiment of the present invention.

【図2】図1の振動板の表面状態を説明するための分解
斜視図
FIG. 2 is an exploded perspective view for explaining a surface state of the diaphragm shown in FIG. 1;

【図3】図1の振動板の裏面状態を説明するための分解
斜視図
FIG. 3 is an exploded perspective view for explaining a back surface state of the diaphragm shown in FIG. 1;

【図4】振動板の上面図FIG. 4 is a top view of the diaphragm.

【図5】図4の振動板にカバーを接合した振動子のA−
A断面図
FIG. 5 is a diagram A- of a vibrator in which a cover is joined to the diaphragm of FIG. 4;
A sectional view

【図6】図4の振動板にカバーを接合した振動子のB−
B断面図
FIG. 6 is a cross-sectional view of a vibrator in which a cover is joined to the vibrating plate of FIG.
B sectional view

【図7】同要部の拡大断面図FIG. 7 is an enlarged cross-sectional view of the relevant part.

【符号の説明】[Explanation of symbols]

1 振動板 2 カバー 3 カバー 4 外部電極 5 外部電極 6 U字状の切溝 7 振動部 8 励振用電極 9 励振用電極 10 根元部 11 リード電極 12 リード電極 13 スルーホール 14 接続部 15 接続部 16 貫通孔 17 貫通孔 18 導電体 22 封止膜 DESCRIPTION OF SYMBOLS 1 Vibration plate 2 Cover 3 Cover 4 External electrode 5 External electrode 6 U-shaped groove 7 Vibrating part 8 Excitation electrode 9 Excitation electrode 10 Root part 11 Lead electrode 12 Lead electrode 13 Through hole 14 Connection part 15 Connection part 16 Through hole 17 Through hole 18 Conductor 22 Sealing film

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 振動板と、この振動板の表、裏面を覆う
とともにその外周部で前記振動板の外周部を挟持した第
1,第2のカバーと、これらの第1または第2のカバー
の少なくとも一方に振動板とは反対側面に設けた第1,
第2の外部電極を備え、前記振動板は前記第1,第2の
カバーによる挟持部内方に舌片状の振動部を有し、この
振動部の表、裏面には励振用電極を形成し、これらの
表、裏の励振用電極からはそれぞれ振動部の根元部分を
介してリード電極を引き出し、これら表、裏のリード電
極の一方は第1の接続部を形成し、他方のリード電極は
前記一方のリード電極側に貫通後第2の接続部を形成
し、これらの第1,第2の接続部を第1、または第2の
カバーの貫通孔の内面に設けたクロムまたはチタンを下
地として銅−ニッケル合金で形成した導電体を介してそ
れぞれ前記第1,第2の外部電極と導通させた振動子。
1. A vibrating plate, first and second covers for covering the front and back surfaces of the vibrating plate and sandwiching the outer peripheral part of the vibrating plate with the outer peripheral part thereof, and the first or second cover. At least one of the first and second sides provided on the side opposite to the diaphragm.
A second external electrode is provided, and the vibrating plate has a tongue-shaped vibrating portion inside the holding portion by the first and second covers, and excitation electrodes are formed on the front and back surfaces of the vibrating portion. , Lead electrodes are drawn out from the front and back excitation electrodes via the roots of the vibrating portions, respectively, one of the front and back lead electrodes forms a first connection portion, and the other lead electrode is A second connecting portion is formed after penetrating on the side of the one lead electrode, and these first and second connecting portions are provided on the inner surface of the through hole of the first or second cover. A vibrator which is electrically connected to each of the first and second external electrodes via a conductor formed of a copper-nickel alloy.
【請求項2】 貫通孔の内面に設けた導電体の銅−ニッ
ケル合金で、ニッケルの含有量を5〜20%とした請求
項1に記載の振動子。
2. The vibrator according to claim 1, wherein the conductor is a copper-nickel alloy provided on the inner surface of the through hole, and the content of nickel is 5 to 20%.
【請求項3】 貫通孔の内面に設けた導電体が銅−ニッ
ケル合金とクロムまたは銅−ニッケルとチタンで構成し
た請求項1記載の振動子。
3. The vibrator according to claim 1, wherein the conductor provided on the inner surface of the through hole is made of copper-nickel alloy and chromium or copper-nickel and titanium.
JP29237895A 1995-11-10 1995-11-10 Vibrator Pending JPH09135146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29237895A JPH09135146A (en) 1995-11-10 1995-11-10 Vibrator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29237895A JPH09135146A (en) 1995-11-10 1995-11-10 Vibrator

Publications (1)

Publication Number Publication Date
JPH09135146A true JPH09135146A (en) 1997-05-20

Family

ID=17781026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29237895A Pending JPH09135146A (en) 1995-11-10 1995-11-10 Vibrator

Country Status (1)

Country Link
JP (1) JPH09135146A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147643A (en) * 2007-12-13 2009-07-02 Epson Toyocom Corp Piezoelectric device and its sealing method
JP2009177736A (en) * 2008-01-28 2009-08-06 Murata Mfg Co Ltd Method of manufacturing electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009147643A (en) * 2007-12-13 2009-07-02 Epson Toyocom Corp Piezoelectric device and its sealing method
JP2009177736A (en) * 2008-01-28 2009-08-06 Murata Mfg Co Ltd Method of manufacturing electronic component

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