JPH09102725A - Vibrator - Google Patents

Vibrator

Info

Publication number
JPH09102725A
JPH09102725A JP25844995A JP25844995A JPH09102725A JP H09102725 A JPH09102725 A JP H09102725A JP 25844995 A JP25844995 A JP 25844995A JP 25844995 A JP25844995 A JP 25844995A JP H09102725 A JPH09102725 A JP H09102725A
Authority
JP
Japan
Prior art keywords
hole
cover
vibrating
lead
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25844995A
Other languages
Japanese (ja)
Inventor
Seiichiro Sakaguchi
誠一郎 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP25844995A priority Critical patent/JPH09102725A/en
Publication of JPH09102725A publication Critical patent/JPH09102725A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve airtightness at a through-hole part by putting a metallic piece into the through-hole of a cover to form a metallic film by laser fusion. SOLUTION: A cover 3 has a conical through-hole 17 having a small diameter at the side of a diaphragm 1, and a conductor 18 is formed on the inner surface of the through-hole 17. Then a metallic piece is put into the through-hole 17 and irradiated by a laser within a vacuum tank. Thus the metallic piece is fused and a metallic film 22 is formed. In such a way, the metallic piece has fluidity when it is fused by the laser. As a result, the metallic piece can enter the through-hole 17 more smoothly and also can cover satisfactorily the upper small diameter part of the through-hole 17. Thus a sealing member is obtained by the conductor 18 and the film 22 to secure high airtightness. It is desirable to use chromium or titanium for the base of the conductor 18 and also to use indium, tin or zinc or an alloy of them to the film 22.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は通信機器などに用い
られる水晶などの振動子に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator such as a crystal used for communication equipment.

【0002】[0002]

【従来の技術】従来のこの種の振動子は、振動板と、こ
の振動板の表、裏面を覆うとともにその外周部で前記振
動板の外周部を挟持した第1、第2のカバーとを備え、
前記振動板は前記第1、第2のカバーによる挟持部の内
方に舌片状の振動部を有し、この振動板の表、裏面には
励振用電極を形成して構成していた。
2. Description of the Related Art A conventional vibrator of this type includes a vibrating plate and first and second covers which cover the front and rear surfaces of the vibrating plate and sandwich the outer peripheral portion of the vibrating plate at its outer peripheral portion. Prepared,
The vibrating plate has a tongue-shaped vibrating portion inside the sandwiched portion by the first and second covers, and excitation electrodes are formed on the front and back surfaces of the vibrating plate.

【0003】従来振動部の表、裏の励振用電極のリード
電極と第1または第2のカバー外の第1、第2の外部電
極との接続は、第1あるいは第2のカバーの貫通孔内に
設けた導電体を介して行っていた。
Conventionally, the lead electrodes of the excitation electrodes on the front and back of the vibrating portion and the first and second external electrodes outside the first or second cover are connected to each other through the through holes of the first or second cover. It went through the conductor provided inside.

【0004】[0004]

【発明が解決しようとする課題】上記従来例では第1あ
るいは第2のカバーに設けた貫通孔は、サンドブラスト
法により形成していたので貫通孔の内壁面に大きな凸凹
が形成されたり、貫通孔の貫通側の縁が部分的に欠けた
りしていた。また、第1あるいは第2のカバーに設けた
貫通孔は蒸着法あるいはスパッタリング法で形成された
導電体だけで封口していた。蒸着法あるいはスパッタリ
ング法での付着粒子は直進性が強いため、貫通孔内面の
大きな凹凸の影や、径小部分の縁の欠けを十分に覆うこ
とができなかったため、貫通孔の封口が確実に行われ
ず、貫通孔部分の気密性が低いという問題があった。
In the above-mentioned conventional example, since the through hole provided in the first or second cover is formed by the sandblast method, large irregularities are formed on the inner wall surface of the through hole, or the through hole is formed. The edge of the penetration side of was partially chipped. Further, the through hole provided in the first or second cover is sealed only by the conductor formed by the vapor deposition method or the sputtering method. Since the particles deposited by the vapor deposition method or the sputtering method have a strong straight-line property, it was not possible to sufficiently cover the shadow of the large unevenness on the inner surface of the through hole and the chipping of the edge of the small diameter part, so the through hole can be reliably sealed. However, there was a problem that the airtightness of the through hole portion was low.

【0005】そこで本発明は貫通孔部分における気密性
を高めることを目的とするものである。
Therefore, an object of the present invention is to improve the airtightness in the through hole portion.

【0006】[0006]

【課題を解決するための手段】そしてこの目的を達成す
るために本発明は、振動板と、この振動板の表、裏面を
覆うとともにその外周部で前記振動板の外周部を挟持し
た第1、第2のカバーと、これらの第1または第2のカ
バーの少なくとも一方の振動板とは反対側面に設けた第
1、第2の外部電極を備え、前記振動板は前記第1、第
2のカバーによる挟持部の内方に舌片状の振動部を有
し、この振動部の表、裏面には励振用電極を形成し、こ
れらの表、裏の励振用電極からはそれぞれ振動部の根元
部を介してリード電極を引き出し、これら表、裏のリー
ド電極の一方は第1の接続部を形成し、他方のリード電
極は前記一方のリード電極側に貫通後、第2の接続部を
形成し、これらの第1、第2の接続部は第1あるいは第
2のカバーの貫通孔内面に設けた導電体を介してそれぞ
れ前記第1、第2の外部電極と導通させ、前記カバーの
貫通孔内に金属片を投入してレーザー照射することによ
り金属片を溶融させた金属膜を形成させた構成とし、気
密性に優れたものを提供することができる。
In order to achieve this object, the present invention provides a vibrating plate and a first vibrating plate which covers the front and back surfaces of the vibrating plate and clamps the outer peripheral part of the vibrating plate at its outer peripheral part. A second cover and first and second external electrodes provided on the side opposite to at least one of the first and second covers, and the diaphragm includes the first and second outer electrodes. The cover has a tongue-like vibrating section inside the nipping section.Excitation electrodes are formed on the front and back surfaces of this vibrating section. Lead electrodes are drawn out through the root portion, one of the front and back lead electrodes forms a first connection portion, and the other lead electrode penetrates the one lead electrode side and then the second connection portion. And these first and second connecting parts are through holes of the first or second cover. A metal film in which the metal piece is melted by conducting the metal piece into the through hole of the cover and irradiating the metal film with the metal film is made conductive through the conductors provided on the surface, respectively. It is possible to provide the formed structure with excellent airtightness.

【0007】[0007]

【発明の実施の形態】本発明の請求項1に記載の発明
は、振動板と、この振動板の表、裏面を覆うとともにそ
の外周部で前記振動板の外周部を挟持した第1、第2の
カバーと、これらの第1または第2のカバーの少なくと
も一方の振動板とは反対側面に設けた第1、第2の外部
電極を備え、前記振動板は前記第1、第2のカバーによ
る挟持部の内方に舌片状の振動部を有し、この振動部の
表、裏面には励振用電極を形成し、これらの表、裏の励
振用電極からはそれぞれ振動部の根元部を介してリード
電極を引き出し、これら表、裏のリード電極の一方は第
1の接続部を形成し、他方のリード電極は前記一方のリ
ード電極側に貫通後第2の接続部を形成し、これらの第
1、第2の接続部は第1あるいは第2のカバーの貫通孔
内面に設けた導電体を介してそれぞれ前記第1、第2の
外部電極と導通させ、前記カバーの貫通孔内に投入した
金属片を真空中でレーザー照射することにより溶融させ
た金属膜を形成したものであり、気密性を高めることが
できる。
BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention includes a diaphragm and first and second diaphragms which cover the front and back surfaces of the diaphragm and sandwich the outer peripheral portion of the diaphragm with the outer peripheral portion thereof. No. 2 cover and first and second external electrodes provided on the side opposite to the diaphragm of at least one of the first and second covers, the diaphragm being the first and second covers. There is a tongue-shaped vibrating part inside the sandwiching part by the.The excitation electrodes are formed on the front and back sides of this vibrating part. Lead electrodes are led out through, one of the front and back lead electrodes forms a first connection portion, and the other lead electrode forms a second connection portion after penetrating to the one lead electrode side, The first and second connecting portions are conductors provided on the inner surface of the through hole of the first or second cover. A metal film is formed by being electrically connected to each of the first and second external electrodes via a laser beam and irradiating a metal piece put into the through-hole of the cover in a vacuum to form a metal film. Can be increased.

【0008】請求項2に記載の発明は、貫通孔内面に設
ける導電体をクロムまたはチタンを下地に銅を形成した
もので水晶との接着力を向上させるものである。
According to the second aspect of the present invention, the conductor provided on the inner surface of the through hole is formed by forming copper on the base of chromium or titanium to improve the adhesive force to the crystal.

【0009】請求項3に記載の発明は、金属膜を構成す
る金属片としてインジウムまたは錫または鉛あるいはそ
れらの合金を用いて確実な気密性を得るものである。
According to the third aspect of the invention, indium, tin, lead, or an alloy thereof is used as the metal piece forming the metal film to obtain a reliable airtightness.

【0010】請求項4に記載の発明は、金属膜を形成し
た貫通孔内に外部電極を流入させてより一層の気密性の
向上を図ったものである。
According to a fourth aspect of the present invention, the external electrode is caused to flow into the through hole formed with the metal film to further improve the airtightness.

【0011】(実施の形態1)図1において1は振動板
で、板厚100μmの水晶板で構成されている。振動板
1の表、裏面には、板厚400μmの水晶板よりなるカ
バー2,3が直接接合されている。尚、この図1におけ
る4,5は外部電極で、カバー3の裏面の対角線部分に
配置されている。前記振動板1は、図2及び図3に示す
ようにその内方にU字状の切溝6が形成され、これによ
り舌片状の振動部7が形成されている。
(Embodiment 1) In FIG. 1, reference numeral 1 is a vibrating plate, which is composed of a quartz plate having a plate thickness of 100 μm. The covers 2 and 3 made of a crystal plate having a plate thickness of 400 μm are directly bonded to the front and back surfaces of the diaphragm 1. The external electrodes 4 and 5 in FIG. 1 are arranged on the diagonal line of the back surface of the cover 3. As shown in FIGS. 2 and 3, the vibrating plate 1 has a U-shaped cut groove 6 formed inward thereof, thereby forming a tongue-shaped vibrating portion 7.

【0012】この振動部7の表、裏面には、励振用電極
8,9が形成され、各々振動部7の根元部10を介して
そのリード電極11,12が引き出されている。この内
リード電極11の端部は、図2から図5に示すごとく振
動板1をスルーホール13により貫通し、その後図3に
示すごとく振動部7の側方を通って根元部10の反対側
に延長されて接続部14を形成している。またリード電
極12は、根元部10側において接続部15を形成して
いる。そしてこれらの接続部14,15に対応するカバ
ー3に形成された貫通孔16,17内の導電体18を介
して各々外部電極4,5に接続されている。
Excitation electrodes 8 and 9 are formed on the front and back surfaces of the vibrating portion 7, and lead electrodes 11 and 12 thereof are drawn out via a root portion 10 of the vibrating portion 7, respectively. The end of the lead electrode 11 penetrates the diaphragm 1 through the through-hole 13 as shown in FIGS. 2 to 5, and then passes through the side of the vibrating part 7 as shown in FIG. To form a connection portion 14. Further, the lead electrode 12 forms a connection portion 15 on the base portion 10 side. Then, they are connected to the external electrodes 4 and 5 via conductors 18 in through holes 16 and 17 formed in the cover 3 corresponding to the connection portions 14 and 15, respectively.

【0013】尚カバー2,3は、その外周部で振動板1
の表、裏面の外周部を挟持し、また直接接合されている
ものであるが、それは振動板1の切溝6の外周部におい
て接合されているのであって、リード電極11が振動部
7の側方を通過している部分については、その外方にお
いてカバー3と接合されている。
The covers 2 and 3 are provided with a diaphragm 1 at their outer peripheral portions.
Although the outer peripheral portions of the front and back surfaces are sandwiched and directly bonded, they are bonded at the outer peripheral portion of the kerf 6 of the diaphragm 1, and the lead electrode 11 is The portion passing the side is joined to the cover 3 on the outside.

【0014】そして、このように振動板1の裏面側にお
いて、振動部7の側方にリード電極11を形成するため
に、図5、図6から明らかなように振動板1はカバー
2,3との挟持部分だけを板厚を厚くし、振動部7およ
びリード電極11,12を形成する部分などは、エッチ
ングにより板厚を薄くしている。図4は、このエッチン
グ工程後の振動板1を明確に表しており、枠線19に対
応する裏面部分がエッチングによりその板厚が薄くなっ
ているのである。また、この枠線19の外周部分がカバ
ー2,3によって挟持接合される部分であり、この図4
から明らかなように振動板1の長手方向側の挟持幅20
は短方向の挟持幅21よりも広くしている。
In order to form the lead electrode 11 on the side of the vibrating portion 7 on the rear surface side of the diaphragm 1 as described above, the diaphragm 1 is covered with the covers 2, 3 as apparent from FIGS. 5 and 6. The plate thickness is made thick only at the sandwiching portion between the and, and the plate thickness is made thin by etching at the portions where the vibrating portion 7 and the lead electrodes 11 and 12 are formed. FIG. 4 clearly shows the diaphragm 1 after the etching step, and the thickness of the rear surface portion corresponding to the frame line 19 is reduced by etching. Further, the outer peripheral portion of the frame line 19 is a portion which is sandwiched and joined by the covers 2 and 3.
As is apparent from the figure, the holding width 20 on the longitudinal side of the diaphragm 1
Is wider than the sandwiching width 21 in the short direction.

【0015】また図3のごとくリード電極11を振動部
7の側方に設けたので、当然のこととして振動部7は振
動板1の中心部より一方側にずれている。
Since the lead electrode 11 is provided on the side of the vibrating portion 7 as shown in FIG. 3, the vibrating portion 7 is naturally deviated to one side from the central portion of the vibrating plate 1.

【0016】尚、根元部10における切溝6の切り込み
は図4のごとく半円形状になっており、これにより過大
な衝撃が加わった際にもクラックが生じにくくなるので
ある。
The cut groove 6 in the root portion 10 has a semicircular shape as shown in FIG. 4, so that cracks are less likely to occur even when an excessive impact is applied.

【0017】それでは本実施例における特徴部分につい
て説明する。すなわち、本実施例においては図5、図6
に示すごとく、カバー3に設けた貫通孔16,17は振
動板1側(サンドブラストの貫通側)が径小となった円
錐形状をしており、この内面にクロムまたはチタンを下
地にして銅とクロムまたは銅とチタンを蒸着法あるいは
スパッタリング法により付着させ、導電体18を形成し
ている。クロムまたはチタンは水晶と銅との接着力を強
めるために数百から数千オングストローム付着させ、銅
は導通をとるため数千オングストロームから数マイクロ
メートル付着させる。
Now, the characteristic portion of this embodiment will be described. That is, in the present embodiment, FIGS.
As shown in FIG. 3, the through holes 16 and 17 provided in the cover 3 have a conical shape with a small diameter on the diaphragm 1 side (the penetrating side of the sandblast). Chromium or copper and titanium are attached by a vapor deposition method or a sputtering method to form the conductor 18. Chromium or titanium is deposited in hundreds to thousands of angstroms in order to strengthen the adhesion between crystal and copper, and copper is deposited in thousands of angstroms to several micrometers to establish conduction.

【0018】この導電体18の上方は貫通孔16,17
の上方径小部分を封口するとともに上記接続部14,1
5に電気的に接続され、またこの導電体18の下方は、
カバー3の振動板1とは反対側面において貫通孔16,
17の開口縁に沿って広がっている。
Above the conductor 18, the through holes 16 and 17 are provided.
And sealing the upper small diameter portion of the
5 is electrically connected, and below the conductor 18,
On the side of the cover 3 opposite to the diaphragm 1, the through holes 16,
It extends along the opening edge of 17.

【0019】この状態で前記貫通孔16,17内に金属
片(金属片はインジウムまたは錫または鉛またはそれら
の合金を用いる。)を投入する(この時カバー3は図
5、図6とは反転されて上方に位置している。)。この
状態で振動子を真空槽内に入れ、真空状態(圧力100
Torr以下)でレーザーを貫通孔16,17内の金属
片に照射し、金属片を溶解させて貫通孔16,17内に
流入させ、しかる後レーザー出力を徐々に下げ、金属を
徐冷して金属膜22を形成する。
In this state, a metal piece (the metal piece uses indium, tin, lead, or an alloy thereof) is put into the through holes 16 and 17 (at this time, the cover 3 is reversed from those in FIGS. 5 and 6). It is located above.) In this state, the vibrator is placed in a vacuum chamber, and a vacuum state (pressure 100
(Torr or less), the metal piece in the through holes 16 and 17 is irradiated with a laser, the metal piece is melted and allowed to flow into the through hole 16 and 17, and then the laser output is gradually reduced to gradually cool the metal. The metal film 22 is formed.

【0020】金属片をレーザーで溶融させ流動性を持た
せることにより貫通孔16,17内への回り込みが良く
なり、貫通孔16,17の上方径小部を充分に覆い、導
電体18と金属膜22とで封口体をなし、良好な気密性
が確保される。
By melting the metal piece with a laser so as to have fluidity, the metal piece can easily flow into the through holes 16 and 17, and sufficiently cover the small diameter upper part of the through holes 16 and 17, so that the conductor 18 and the metal A good airtightness is ensured by forming a sealing body with the film 22.

【0021】さらに、金属膜22を形成した状態で外部
電極4,5をスクリーン印刷等で形成すれば、その外部
電極4,5の一部は図1、図5、図6のごとくこの貫通
孔16,17内に若干落ち込むようになる。この外部電
極4,5を封口体の一部とすることによってさらに気密
性が高まることになる。
Further, when the external electrodes 4, 5 are formed by screen printing or the like with the metal film 22 formed, a part of the external electrodes 4, 5 are formed in the through holes as shown in FIGS. 1, 5 and 6. It will fall slightly within 16,17. By forming the external electrodes 4 and 5 as a part of the sealing body, the airtightness is further enhanced.

【0022】[0022]

【発明の効果】以上のように本発明は、振動板と、この
振動板の表、裏面を覆うとともにその外周部で前記振動
板の外周部を挟持した第1、第2のカバーと、これらの
第1または第2のカバーの少なくとも一方の振動板とは
反対側面に設けた第1、第2の外部電極を備え、前記振
動板は前記第1、第2のカバーによる挟持部の内方に舌
片状の振動部を有し、この振動部の表、裏面には励振用
電極を形成し、これらの表、裏の励振用電極からはそれ
ぞれ振動部の根元部を介してリード電極を引き出し、こ
れら表、裏のリード電極の一方は第1の接続部を形成
し、他方のリード電極は前記一方のリード電極側に貫通
後第2の接続部を形成し、これらの第1、第2の接続部
は第1あるいは第2のカバーの貫通孔内面に設けた導電
体を介してそれぞれ前記第1、第2の外部電極と導通さ
せ、前記カバーの貫通孔内に金属片を投入し、レーザー
を照射することにより溶融させた金属膜を形成したもの
であるため、第1または第2のカバーの貫通孔は、導電
体だけでなく、その外面部が金属膜で覆われることとな
るので気密性が高くなる。
As described above, the present invention provides a diaphragm, first and second covers for covering the front and back surfaces of the diaphragm and sandwiching the outer peripheral portion of the diaphragm with the outer peripheral portion thereof. A first or second external electrode provided on the side opposite to at least one of the first and second covers of the diaphragm, wherein the diaphragm is inside the sandwiching portion by the first and second covers. It has a tongue-shaped vibrating part on the front side, and excitation electrodes are formed on the front and back sides of this vibrating part, and lead electrodes are respectively connected from the front and back excitation electrodes via the root of the vibrating part. One of the front and back lead electrodes forms a first connection portion, and the other lead electrode forms a second connection portion after penetrating to the one lead electrode side. The two connecting portions are respectively connected through the conductors provided on the inner surface of the through hole of the first or second cover. Note that the first and second external electrodes are electrically connected to each other, a metal piece is put into the through hole of the cover, and a molten metal film is formed by laser irradiation. Since the through hole of the cover is covered with the metal film not only on the conductor but also on the outer surface, the airtightness is enhanced.

【0023】その導電体表面はクロムまたはチタンのた
め、インジウムまたは錫または鉛の金属膜あるいはそれ
らの合金膜との接着力も十分に強い。
Since the surface of the conductor is chromium or titanium, the adhesive force to the metal film of indium, tin or lead or the alloy film thereof is sufficiently strong.

【0024】また、貫通孔のこの封止膜の外面側に外部
電極の一部を流入させることにより、この外部電極も封
口体の一部となり、さらに気密性が高まるものとなり、
信頼性の高い振動子が提供できることになる。
Further, by making a part of the external electrode flow into the outer surface side of the sealing film of the through hole, the external electrode also becomes a part of the sealing body, and the airtightness is further enhanced.
A highly reliable oscillator can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態の振動子の斜視図FIG. 1 is a perspective view of a vibrator according to an embodiment of the present invention.

【図2】図1の振動板の表面状態を説明するための分解
斜視図
FIG. 2 is an exploded perspective view for explaining a surface state of the diaphragm shown in FIG. 1;

【図3】図1の振動板の裏面状態を説明するための分解
斜視図
FIG. 3 is an exploded perspective view for explaining a back surface state of the diaphragm shown in FIG. 1;

【図4】振動板の上面図FIG. 4 is a top view of the diaphragm.

【図5】図4の振動板にカバーを接合した振動子のA−
A断面図
FIG. 5 is a diagram A- of a vibrator in which a cover is joined to the diaphragm of FIG. 4;
A sectional view

【図6】図4の振動板にカバーを接合した振動子のB−
B断面図
FIG. 6 is a cross-sectional view of a vibrator in which a cover is joined to the vibrating plate of FIG.
B sectional view

【符号の説明】 1 振動板 2 カバー 3 カバー 4 外部電極 5 外部電極 6 U字状の切溝 7 振動部 8 励振用電極 9 励振用電極 10 根元部 11 リード電極 12 リード電極 13 スルーホール 14 接続部 15 接続部 16 貫通孔 17 貫通孔 18 導電体 22 金属膜[Explanation of reference numerals] 1 diaphragm 2 cover 3 cover 4 external electrode 5 external electrode 6 U-shaped groove 7 vibrating part 8 excitation electrode 9 excitation electrode 10 root 11 lead electrode 12 lead electrode 13 through hole 14 connection Part 15 Connection part 16 Through hole 17 Through hole 18 Conductor 22 Metal film

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 振動板と、この振動板の表、裏面を覆う
とともにその外周部で前記振動板の外周部を挟持した第
1、第2のカバーと、これらの第1または第2のカバー
の少なくとも一方の振動板とは反対側面に設けた第1、
第2の外部電極を備え、前記振動板は前記第1、第2の
カバーによる挟持部の内方に舌片状の振動部を有し、こ
の振動部の表、裏面には励振用電極を形成し、これらの
表、裏の励振用電極からはそれぞれ振動部の根元部を介
してリード電極を引き出し、これら表、裏のリード電極
の一方は第1の接続部を形成し、他方のリード電極は前
記一方のリード電極側に貫通後第2の接続部を形成し、
これらの第1、第2の接続部は第1あるいは第2のカバ
ーの貫通孔内面に設けた導電体を介してそれぞれ前記第
1、第2の外部電極と導通させ、前記カバーの貫通孔内
に投入した金属片を真空中でレーザー照射することによ
り溶融させた金属膜を形成した振動子。
1. A vibrating plate, first and second covers for covering the front and back surfaces of the vibrating plate and sandwiching the outer peripheral part of the vibrating plate with the outer peripheral part thereof, and the first or second cover. The first side provided on the side opposite to at least one of the diaphragms,
A second external electrode is provided, and the vibrating plate has a tongue-shaped vibrating portion inside the sandwiched portion by the first and second covers, and excitation electrodes are provided on the front and back surfaces of the vibrating portion. From these front and back excitation electrodes, lead electrodes are respectively drawn out through the roots of the vibrating parts, and one of these front and back lead electrodes forms the first connection part and the other lead is formed. The electrode forms a second connection portion after penetrating to the one lead electrode side,
These first and second connecting parts are electrically connected to the first and second external electrodes through conductors provided on the inner surface of the through hole of the first or second cover, respectively, and are connected to the inside of the through hole of the cover. An oscillator in which a metal film is formed by melting a metal piece put into a substrate and irradiating it with a laser in a vacuum.
【請求項2】 貫通孔内面に設けた導電体をクロムまた
はチタンを下地に銅を形成した請求項1に記載の振動
子。
2. The vibrator according to claim 1, wherein copper is formed on the conductor provided on the inner surface of the through hole by using chromium or titanium as a base.
【請求項3】 金属片としてインジウムまたは錫または
鉛あるいはそれらの合金を用いた請求項1記載の振動
子。
3. The vibrator according to claim 1, wherein indium, tin, lead, or an alloy thereof is used as the metal piece.
【請求項4】 金属膜を形成した貫通孔内に、外部電極
を流入させた請求項1記載の振動子。
4. The vibrator according to claim 1, wherein the external electrode is caused to flow into the through hole having the metal film formed therein.
JP25844995A 1995-10-05 1995-10-05 Vibrator Pending JPH09102725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25844995A JPH09102725A (en) 1995-10-05 1995-10-05 Vibrator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25844995A JPH09102725A (en) 1995-10-05 1995-10-05 Vibrator

Publications (1)

Publication Number Publication Date
JPH09102725A true JPH09102725A (en) 1997-04-15

Family

ID=17320372

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25844995A Pending JPH09102725A (en) 1995-10-05 1995-10-05 Vibrator

Country Status (1)

Country Link
JP (1) JPH09102725A (en)

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