JPH08316762A - Manufacture of vibrator - Google Patents

Abstract

PURPOSE: To improve the reliability by making a throughhole from an outer side face with sand blast and eliminating a processing alteration layer with chemical etching and conducting mirror surface polishment so as to make electric connection stable. CONSTITUTION: First and second covers 2, 3 made of a crystal plate whose thickness is 400μm are joined to a front side and a rear side of a diaphragm 1 made of a crystal plate whose thickness is 100μm. After making throughholes 16, 17 from the outside of the cover 3 by sand blast, an alteration layer 22 and a chipping 23 are eliminated by chemical etching. Furthermore, drooping by the alteration layer 22 and the chemical etching is eliminated by mirror surface polishment. Thus, a stable conductor 18 is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a vibrator such as a crystal.

[0002]

2. Description of the Related Art A conventional vibrator of this type includes a diaphragm and first and second covers that cover the front and back surfaces of the diaphragm and sandwich the outer peripheral portion of the diaphragm with the outer peripheral portion. Prepare,
The vibrating plate has a tongue-shaped vibrating portion inside the sandwiching portion by the first and second covers, and excitation electrodes are formed on the front and back surfaces of the vibrating portion.

Conventionally, the excitation electrodes on the front and back of the vibrating portion and the external electrodes on the outer surfaces of the first and second covers are connected to each other through a through hole provided in the first or second cover. It was

[0004]

In the above configuration,
A conductor for electrically connecting the lead electrode and the external electrode is provided in the through hole. The conductor is attached and formed by vapor deposition, and the film thickness is made so thick. I can't do that. Therefore, conventionally, when the conductor is interrupted in the middle of the process, there is a problem that the lead electrode and the external electrode cannot be electrically connected.

Therefore, an object of the present invention is to stabilize the electrical connection by stabilizing the film thickness of the conductor in the through hole.

[0006]

In order to achieve this object, according to the present invention, after the through hole is opened from the outer surface side by sandblasting, the work-affected layer is removed by chemical etching, and further mirror polishing is performed. It is a thing.

[0007]

According to the above means, the through hole is formed with a uniform gradual slope from the outer surface to the inner surface of the first or second cover provided with the through hole, and the work-affected layer formed by sandblasting and Since there is no chipping near the opening, the film thickness of the conductor formed in this through hole becomes stable, and as a result, the electrical connection between the lead electrode and the external electrode through this conductor is prevented. It will be stable and reliable.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 is a vibrating plate having a plate thickness of 100 μm.
It is composed of a crystal plate. On the front and back of the diaphragm 1,
The first and second covers 2 and 3 made of a crystal plate having a plate thickness of 400 μm are bonded by directly bonding the crystals.
Incidentally, reference numerals 4 and 5 in this FIG.
Is located on the diagonal line on the back side of the. The diaphragm 1
As shown in FIGS. 2 and 3, a U-shaped cut groove 6 is formed inward of the groove, and a tongue-shaped vibrating portion 7 is formed thereby. Excitation electrodes 8 and 9 are formed on the front and back surfaces of the vibrating portion 7, and lead electrodes 11 and 12 thereof are drawn out via a root portion 10 of the vibrating portion 7, respectively. As shown in FIGS. 2 to 5, the end of the inner lead electrode 11 penetrates the diaphragm 1 by the through hole 13, and then passes through the side of the vibrating section 7 as shown in FIG. The connection portion 14 is formed by extending to the side. Further, the lead electrode 12 forms a connecting portion 15 on the side of the root portion 10. Then, the conductor 1 in the through holes 16 and 17 formed in the cover 3 corresponding to these connecting portions 14 and 15 is formed.
8 are connected to external electrodes 4 and 5, respectively. The outer peripheral portions of the covers 2 and 3 sandwich the front and rear outer peripheral portions of the diaphragm 1 and are directly joined together. However, the covers 2 and 3 are joined together at the outer peripheral portion of the kerf 6 of the diaphragm 1. The portion where the lead electrode 11 passes through the side of the vibrating portion 7 is joined to the cover 3 on the outside thereof. Then, in order to form the lead electrode 11 on the rear surface side of the diaphragm 1 on the side of the vibrating portion 7 as described above, as is apparent from FIGS.
The plate thickness is increased only in the sandwiched portion with the covers 2 and 3, and the plate thickness is reduced in the portions where the vibrating portion 7 and the lead electrodes 11 and 12 are formed by etching. FIG. 4 clearly shows the diaphragm 1 after this etching step, in which the back surface portion corresponding to the frame line 19 is thinned by etching. Further, the outer peripheral portion of the frame line 19 is a portion which is sandwiched and joined by the covers 2 and 3,
As is clear from FIG. 4, the holding width 20 on the longitudinal side of the diaphragm 1 is wider than the holding width 21 on the short side.

Further, since the lead electrode 11 is provided on the side of the vibrating portion 7 as shown in FIG.
Are displaced from the center of the diaphragm 1 to one side.

The cut groove 6 in the root portion 10 has a semicircular shape as shown in FIG. 4, so that cracks are less likely to occur even when an excessive impact is applied.

The conductor 18 in the through holes 16 and 17 is
It is formed by vapor deposition from the outer surface side of the cover 3, and the lead electrode 1 is formed through the conductor 18.
1, 12 and the external electrodes 4, 5 are electrically connected.
7 to 9 are for explaining the formation of the through hole 16 (17) in the cover 3. That is, in FIG. 7, the through holes 16 (17) are formed by sandblasting. FIG. 8 shows that after the through hole 16 (17) is formed,
It has been chemically etched. In FIG. 9, mirror polishing is performed after chemical etching is performed. In the structure shown in FIG. 7, the work-affected layer 22 and the chipping 23 are generated on the lower end side of the through hole 16 (17), and the conductor 18 having a stable film thickness cannot be formed in this portion by vapor deposition. . On the other hand, as shown in FIG. 8, when chemical etching is performed, the work-affected layer 22 of FIG. 7 due to sandblasting is removed. However, the through hole 16
At the lower end side of (17), dripping 24 occurs due to chemical etching, and the conductor 18 having a stable film thickness cannot be formed by vapor deposition. Therefore, as shown in FIG.
When chemical polishing is performed and then mirror polishing is performed, the work-altered layer 22 due to sandblasting and the slump 24 due to chemical etching are also eliminated. As a result, the conductor 18 having a stable film thickness can be formed here. .

[0012]

As described above, according to the present invention, after the through hole is opened from the outer surface side by sandblasting, the work-affected layer is removed by chemical etching, and further mirror polishing is performed. With the above configuration, the through hole is formed with a uniform gentle slope from the outer surface to the inner surface of the first or second cover in which the through hole is formed, and the work-affected layer and the opening due to sandblasting are formed. Since there is no chipping near the hole, the film thickness of the conductor formed in this through hole becomes stable, and as a result, the electrical connection between the lead electrode and the external electrode is stable through this conductor. It will be reliable.

[Brief description of drawings]

FIG. 1 is a perspective view of one embodiment of the present invention.

FIG. 2 is an exploded perspective view of FIG.

FIG. 3 is an exploded perspective view of FIG.

FIG. 4 is a top view of the diaphragm of FIG.

5 is a cross-sectional view taken along the line AA of a vibrator in which covers 2 and 3 are connected to the diaphragm of FIG.

6 is a cross-sectional view taken along the line BB of the vibrator in which covers 2 and 3 are connected to the diaphragm of FIG.

FIG. 7 is a cross-sectional view of the cover 3 having a through hole 16 formed therein.

FIG. 8 is a sectional view of the cover 3 having a through hole 16 formed therein.

FIG. 9 is a sectional view of the cover 3 having a through hole 16 formed therein.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Vibration plate 2 Cover 3 Cover 4 External electrode 5 External electrode 7 Vibration part 9 Excitation electrode 10 Root part 11 Lead electrode 12 Lead electrode 14 Connection part 15 Connection part 16 Through hole 17 Through hole 18 Conductor

Claims (2)

[Claims] 1. A diaphragm, comprising: a diaphragm; first and second covers that cover the front and back surfaces of the diaphragm and sandwich the outer periphery of the diaphragm with the outer periphery thereof. The first and second covers have a tongue-like vibrating portion inside the nipping portion, and excitation electrodes are formed on the front and back surfaces of the vibrating portion.
Lead electrodes are drawn out from the excitation electrodes on the front and back sides, respectively, through the roots of the vibrating parts, and the lead electrodes on the front and back sides are penetrated through at least one of the first and second covers. In the vibrator electrically connected to the external electrode provided on the outer surface side through the hole, the through hole is formed from the outer surface side by sandblasting, and then the work-affected layer is removed by chemical etching, and the mirror surface is further formed. A method for manufacturing a vibrator, which is formed by polishing. 2. The method for manufacturing a vibrator according to claim 1, wherein after forming the through hole, a conductor for electrically connecting the lead electrode and the external electrode is provided in the through hole.