JPH09135045A - Piezoelectric vibrator and formation of electrode thereof - Google Patents
Piezoelectric vibrator and formation of electrode thereofInfo
- Publication number
- JPH09135045A JPH09135045A JP31472295A JP31472295A JPH09135045A JP H09135045 A JPH09135045 A JP H09135045A JP 31472295 A JP31472295 A JP 31472295A JP 31472295 A JP31472295 A JP 31472295A JP H09135045 A JPH09135045 A JP H09135045A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- plating
- piezoelectric
- piezoelectric vibrator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 22
- 238000007772 electroless plating Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 abstract description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 5
- 229910000906 Bronze Inorganic materials 0.000 abstract description 3
- 239000010974 bronze Substances 0.000 abstract description 3
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 3
- 239000011574 phosphorus Substances 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 description 7
- 230000007257 malfunction Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、圧電振動子およびその
電極の形成方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator and a method for forming electrodes thereof.
【０００２】[0002]
【従来の技術】従来、圧電振動子の電極としては、Ａ
ｇ，Ｎｉなどの半田付け性の良好な材料を、スクリーン
印刷法やメッキ法などにより形成する方法が採られてい
る。しかしながら、電極材料としてＡｇを使用する場合
には、材料コストが高いという問題点がある。また、電
極材料としてＮｉを使用する場合、Ｎｉ自身が延性及び
展性に乏しいため、特に圧電セラミックスの変位運動を
利用するような圧電振動子では、その動作中に電極面へ
微小なクラックが入ってしまい、容量が低下して動作不
良を引き起こすという問題点がある。2. Description of the Related Art Conventionally, as an electrode of a piezoelectric vibrator, A
A method of forming a material having good solderability such as g and Ni by a screen printing method, a plating method, or the like is adopted. However, when Ag is used as the electrode material, there is a problem that the material cost is high. Further, when Ni is used as the electrode material, Ni itself is poor in ductility and malleability. Therefore, particularly in a piezoelectric vibrator that utilizes displacement motion of piezoelectric ceramics, minute cracks are generated on the electrode surface during its operation. Therefore, there is a problem in that the capacity is lowered and the malfunction occurs.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、Ａｇ
などのような高価な貴金属材料を用いず、なおかつ、圧
電セラミックスが有する特性や、圧電セラミックス板と
電極との密着性を損なうことなく、動作不良発生率が改
善された圧電振動子を提供することにある。The object of the present invention is to provide Ag
To provide a piezoelectric vibrator in which the occurrence rate of malfunction is improved without using an expensive precious metal material such as that described above and without impairing the characteristics of the piezoelectric ceramic and the adhesion between the piezoelectric ceramic plate and the electrode. It is in.
【０００４】[0004]
【課題を解決するための手段】本発明者らは、圧電セラ
ミックス板の両側に、Ｎｉ無電解メッキによるＮｉ電極
を形成し、次いで、その上にＳｎメッキによるＳｎ電極
を形成することにより、本発明の目的を達成した。この
際、Ｎｉ電極の平均厚み、および、Ｎｉ無電解メッキを
行った後の熱処理温度を制御するのが好ましい。Means for Solving the Problems The inventors of the present invention formed Ni electrodes by Ni electroless plating on both sides of a piezoelectric ceramics plate, and then formed Sn electrodes by Sn plating thereon to form The object of the invention has been achieved. At this time, it is preferable to control the average thickness of the Ni electrode and the heat treatment temperature after the Ni electroless plating.
【０００５】本発明において、圧電セラミックス上にＮ
ｉ電極を形成する場合に使用されるＮｉ無電解メッキ浴
としては、通常知られているリン系またはホウ素系の浴
のいずれも採用可能である。Ｎｉ無電解メッキを行う際
には、メッキ浴組成、温度およびメッキ時間を制御する
ことにより、電極厚みが調整できる。この際形成される
電極の平均厚みは、０．２μｍ以上２．０μｍ以下に調
整されることが好ましい。電極厚みが０．２μｍより薄
く、しかも均一なメッキ皮膜を得ることは、通常、非常
に困難である。また、２．０μｍより厚い電極を形成す
る場合には、次に行う熱処理工程において、電極面のク
ラック発生が顕著となり、好ましくない。In the present invention, N is placed on the piezoelectric ceramics.
As the Ni electroless plating bath used when forming the i electrode, any of the commonly known phosphorus-based or boron-based baths can be adopted. When performing Ni electroless plating, the electrode thickness can be adjusted by controlling the plating bath composition, temperature and plating time. The average thickness of the electrodes formed at this time is preferably adjusted to 0.2 μm or more and 2.0 μm or less. It is usually very difficult to obtain a uniform plating film having an electrode thickness of less than 0.2 μm. In addition, when an electrode having a thickness of more than 2.0 μm is formed, cracking on the electrode surface becomes remarkable in the subsequent heat treatment step, which is not preferable.
【０００６】無電解メッキによるＮｉ電極形成後、圧電
セラミックスと電極との間に十分な密着性を得るため
に、熱処理を行う。熱処理温度としては、３００℃以上
６００℃以下が好適である。この熱処理温度が３００℃
より低くても、６００℃より高くても、十分な密着性は
得られない。また、上記熱処理の際には、形成されたＮ
ｉ電極が酸化されないよう、処理温度に応じ、窒素ガス
などを用いて、雰囲気を調整する必要がある。After forming the Ni electrode by electroless plating, heat treatment is performed to obtain sufficient adhesion between the piezoelectric ceramic and the electrode. The heat treatment temperature is preferably 300 ° C or higher and 600 ° C or lower. This heat treatment temperature is 300 ℃
If it is lower or higher than 600 ° C, sufficient adhesion cannot be obtained. In addition, during the heat treatment, N formed
In order to prevent the i electrode from being oxidized, it is necessary to adjust the atmosphere by using nitrogen gas or the like depending on the processing temperature.
【０００７】熱処理後のＮｉ電極上にＳｎメッキを施す
ことにより、Ｓｎ電極が形成される。Ｓｎは、延性およ
び展性に富んだ材料であるため、Ｎｉ電極上に形成され
たＳｎ電極により、Ｎｉ電極や圧電セラミックスにかか
る応力が緩和されると考えられる。このため、本発明の
圧電振動子は、その動作中において、Ｎｉ電極にクラッ
クが入る確率を低減することができ、従来品における動
作不良発生率の問題が解決される。また、Ｓｎは、半田
付け性がＮｉやＡｇに比べて、非常に良好であり、この
点でも優れている。The Sn electrode is formed by performing Sn plating on the Ni electrode after the heat treatment. Since Sn is a material that is rich in ductility and malleability, it is considered that the Sn electrode formed on the Ni electrode relaxes the stress applied to the Ni electrode and the piezoelectric ceramics. Therefore, the piezoelectric vibrator of the present invention can reduce the probability of cracks in the Ni electrode during its operation, and solves the problem of the defective operation rate in conventional products. Further, Sn has very good solderability as compared with Ni and Ag, and is also excellent in this respect.
【０００８】本発明におけるＳｎメッキについては、一
般的な電気メッキの他、無電解メッキ、乾式メッキな
ど、圧電セラミックスの特性を損なわないものであれ
ば、いずれのメッキ方式を採用してもかまわないが、メ
ッキ浴の管理が比較的容易なこと、経済性、膜形成が比
較的短時間で得られるなどの理由から、電気メッキ法が
好ましい。電気メッキ法によって、Ｓｎメッキを行う場
合には、Ｎｉ無電解メッキの場合同様、その浴組成、温
度ならびにメッキ時間により、電極厚みを調整できる。
この電極厚みは、均一なメッキ皮膜が得られれば、Ｎｉ
無電解メッキの場合のように特に限定されるものではな
く、数μｍ程度、好ましくは３〜１０μｍとすれば実用
上十分である。Regarding the Sn plating in the present invention, any plating method may be adopted, such as general electroplating, electroless plating, dry plating, etc., as long as the characteristics of the piezoelectric ceramics are not impaired. However, the electroplating method is preferable because it is relatively easy to manage the plating bath, is economical, and can form a film in a relatively short time. When Sn plating is performed by electroplating, the electrode thickness can be adjusted by the bath composition, temperature, and plating time, as in the case of Ni electroless plating.
If a uniform plating film is obtained, this electrode thickness is Ni
It is not particularly limited as in the case of electroless plating, and it is practically sufficient if it is about several μm, preferably 3 to 10 μm.
【０００９】以上のようにＮｉとＳｎとの電極が形成さ
れた圧電セラミックス板を、所望の形状に加工するなど
の手続きを経て、圧電振動子を得る。A piezoelectric vibrator is obtained through procedures such as processing the piezoelectric ceramic plate on which the Ni and Sn electrodes are formed into a desired shape as described above.
【００１０】[0010]
【実施例】以下、圧電振動子としてバイモルフ型圧電振
動子を用いた場合を例に挙げて、本発明を具体的に説明
する。ただし、本発明は、以下の実施例に限定されるも
のではない。EXAMPLES The present invention will be specifically described below by taking a case where a bimorph type piezoelectric vibrator is used as the piezoelectric vibrator as an example. However, the present invention is not limited to the following examples.
【００１１】実施例１ 長さ５０ｍｍ、幅２５ｍｍ、厚み０．５ｍｍのＰＺＴ系
圧電セラミックス板に、化学的前処理を行った後、市販
のリン系Ｎｉメッキ液（上村工業社製ニムデンＬＰＸ）
を使用し、浴温９０℃で８分間、Ｎｉ無電解メッキを行
い、Ｎｉ電極を形成した。次いで、熱風循環式恒温槽に
入れ、４００℃で２時間熱処理を行った。電極形成後の
圧電セラミックスの破断面を、走査型電子顕微鏡（ＳＥ
Ｍ）にて観察すると、Ｎｉ電極の平均厚みは、１．０μ
ｍであった。さらに、市販のＳｎメッキ液を用いて、Ｓ
ｎ電気メッキを行った。Ｓｎ電気メッキ条件は、表１の
通りである。Example 1 A PZT-based piezoelectric ceramic plate having a length of 50 mm, a width of 25 mm and a thickness of 0.5 mm was chemically pretreated, and then a commercially available phosphorus-based Ni plating solution (Nimden LPX manufactured by Uemura Kogyo Co., Ltd.) was used.
Ni was used for electroless plating at a bath temperature of 90 ° C. for 8 minutes to form a Ni electrode. Then, it was placed in a hot air circulation type constant temperature bath and heat-treated at 400 ° C. for 2 hours. The fracture surface of the piezoelectric ceramics after the electrodes were formed was examined with a scanning electron microscope (SE
When observed with M), the average thickness of the Ni electrode is 1.0 μm.
m. Furthermore, using a commercially available Sn plating solution, S
n electroplating was performed. Table 1 shows Sn electroplating conditions.
【００１２】[0012]
【表１】 Ｓｎメッキ浴組成 ＳｎＳＯ4 ４０ｇ／リットル Ｈ2 ＳＯ4 ４０ｇ／リットル クレゾールスルホン酸 ２５ｇ／リットル ゼラチン ２ｇ／リットル ｐ−ナフトール １ｇ／リットル Ｓｎメッキ浴温度 ２０℃ 陰極電流密度 ２Ａ／ｄｍ2 メッキ時間 ５分[Table 1] Sn plating bath composition SnSO 4 40 g / liter H 2 SO 4 40 g / liter Cresol sulfonic acid 25 g / liter Gelatin 2 g / liter p-naphthol 1 g / liter Sn plating bath temperature 20 ° C Cathode current density 2 A / dm 2 plating 5 minutes
【００１３】得られた圧電セラミックス板は、模式的に
は図１に示すような断面構造をなしていた。また、得ら
れた圧電セラミックスの破断面を、ＳＥＭにて観察した
ところ、Ｓｎ電極に相当する部分の平均厚みは、４．８
μｍであった。上述の方法により電極を形成した２枚の
圧電セラミックス板を、燐青銅板の両面に接着した後、
幅２ｍｍに切断加工し、図２に示すような構造のバイモ
ルフ型圧電振動子を得た。このようにして得られた本発
明の圧電振動子２００本に対し、ＤＣ１３０Ｖのパルス
を１０００万回印加し、変位動作を確認したが、変位量
の低下は見られなかった。The obtained piezoelectric ceramic plate had a cross-sectional structure as schematically shown in FIG. When the fracture surface of the obtained piezoelectric ceramic was observed by SEM, the average thickness of the portion corresponding to the Sn electrode was 4.8.
μm. After bonding the two piezoelectric ceramic plates with electrodes formed by the above method to both sides of the phosphor bronze plate,
By cutting to a width of 2 mm, a bimorph type piezoelectric vibrator having a structure as shown in FIG. 2 was obtained. A pulse of DC130V was applied 10 million times to 200 piezoelectric vibrators of the present invention thus obtained, and the displacement operation was confirmed, but no reduction in displacement was observed.
【００１４】比較例１ Ｎｉ無電解メッキの後にＳｎメッキを行なわず、そのま
ま圧電振動子へと加工する以外は、実施例１と同様にし
て、バイモルフ型圧電振動子を作製した。この圧電振動
子２００本に対し、ＤＣ１３０Ｖのパルスを１０００万
回印加し、変位動作を確認したところ、２００本のうち
５本が電極面の欠損により、変位量が初期値の８０％以
下に低下していた。Comparative Example 1 A bimorph type piezoelectric vibrator was produced in the same manner as in Example 1 except that Sn electroplating was not performed after Ni electroless plating and the piezoelectric vibrator was processed as it was. A pulse of DC130V was applied 10 million times to the 200 piezoelectric vibrators, and the displacement operation was confirmed. As a result, the displacement amount decreased to 80% or less of the initial value due to a defect in the electrode surface of 5 of the 200 Was.
【００１５】実施例２ Ｎｉ無電解メッキを行う時間を変化させることにより、
電極厚みを表２に示すように変化させた以外は、実施例
１と同様に処理して、バイモルフ型圧電振動子をそれぞ
れ得た。これらの圧電振動子２００本に対し、まず、初
期容量値を測定した。次いで、ＤＣ１３０Ｖのパルスを
印加し、初期の変位量と１０００万回印加後の変位量と
を測定し、１０００万回印加後の変位量が初期値の８０
％以下に低下しているものを、動作不良発生数としてカ
ウントした。表２に結果を示す。なお、表２において、
＊印を付したものは、本発明の範囲外である。Example 2 By changing the time for performing Ni electroless plating,
Bimorph-type piezoelectric vibrators were obtained in the same manner as in Example 1, except that the electrode thickness was changed as shown in Table 2. First, initial capacitance values were measured for 200 of these piezoelectric vibrators. Then, a pulse of DC 130V is applied, and the initial displacement amount and the displacement amount after 10 million times of application are measured.
Those that fell below% were counted as the number of malfunction occurrences. Table 2 shows the results. In Table 2,
Those marked with * are outside the scope of the present invention.
【００１６】[0016]
【表２】 [Table 2]
【００１７】圧電セラミックスと電極との密着性が低か
ったり、電極面に微小なクラックが生じている場合に
は、平均初期容量値は低い数値を示し、結果的に動作不
良が発生する。表２の結果から明らかなように、Ｎｉ無
電解メッキによる電極厚みが本発明の範囲内にあるもの
は、高い平均初期容量値を得ることができるとともに、
動作不良が見られないことがわかる。When the adhesion between the piezoelectric ceramics and the electrode is low, or when minute cracks are formed on the electrode surface, the average initial capacitance value shows a low value, resulting in malfunction. As is clear from the results of Table 2, when the electrode thickness by Ni electroless plating is within the range of the present invention, a high average initial capacity value can be obtained, and
It can be seen that no malfunction is seen.
【００１８】実施例３ Ｎｉ無電解メッキ後の熱処理温度を、表３に示すように
変化させた以外は、実施例１と同様に処理して、バイモ
ルフ型圧電振動子をそれぞれ得た。これらの圧電振動子
２００本に対し、実施例２と同様の測定を行った。表３
に結果を示す。なお、表３において、＊印を付したもの
は、本発明の範囲外である。Example 3 Bimorph type piezoelectric vibrators were obtained in the same manner as in Example 1, except that the heat treatment temperature after electroless plating of Ni was changed as shown in Table 3. The same measurement as in Example 2 was performed on 200 of these piezoelectric vibrators. Table 3
Shows the results. In Table 3, those marked with * are outside the scope of the present invention.
【００１９】[0019]
【表３】 [Table 3]
【００２０】表３の結果から明らかなように、Ｎｉ無電
解メッキ後の熱処理温度が本発明方法の範囲内にあるも
のは、高い平均初期容量値を得ることができるととも
に、動作不良が見られないことがわかる。As is clear from the results shown in Table 3, when the heat treatment temperature after Ni electroless plating is within the range of the method of the present invention, a high average initial capacity value can be obtained, and malfunction is observed. I know there isn't.
【００２１】[0021]
【発明の効果】本発明に係る圧電振動子は、圧電セラミ
ックス板上に形成されたＮｉ電極の上に、さらにＳｎ電
極が形成されているので、圧電セラミックスやＮｉ電極
にかかる応力が緩和される。その結果、圧電セラミック
ス板が元来有する特性や、圧電セラミックスと電極との
密着性を損なうことなく、動作中の不良発生率が改善さ
れた圧電振動子を得ることができる。According to the piezoelectric vibrator of the present invention, since the Sn electrode is further formed on the Ni electrode formed on the piezoelectric ceramic plate, the stress applied to the piezoelectric ceramic and the Ni electrode is relieved. . As a result, it is possible to obtain a piezoelectric vibrator in which the rate of occurrence of defects during operation is improved without deteriorating the characteristics that the piezoelectric ceramic plate originally has and the adhesiveness between the piezoelectric ceramic and the electrode.
【図１】 本発明による電極構成を示す、圧電セラミッ
クス板とＮｉ電極、Ｓｎ電極の構造を示す断面図であ
る。FIG. 1 is a sectional view showing a structure of a piezoelectric ceramics plate, a Ni electrode, and a Sn electrode, showing an electrode structure according to the present invention.
【図２】 本発明の圧電振動子の一例である、バイモル
フ型圧電振動子の構造を示す断面図である。FIG. 2 is a cross-sectional view showing the structure of a bimorph type piezoelectric vibrator which is an example of the piezoelectric vibrator of the present invention.
１：圧電セラミックス板、２：Ｎｉ電極、３：Ｓｎ電
極、４：接着剤、５：燐青銅板1: Piezoelectric ceramic plate, 2: Ni electrode, 3: Sn electrode, 4: Adhesive, 5: Phosphor bronze plate
Claims (2)
解メッキによるＮｉ電極が、平均厚みで０．２μｍ以上
２．０μｍ以下で形成され、その外側にＳｎメッキによ
るＳｎ電極が形成されていることを特徴とする圧電振動
子。1. A Ni electrode formed by electroless Ni plating having an average thickness of 0.2 μm or more and 2.0 μm or less is formed on both sides of a piezoelectric ceramic plate, and Sn electrodes formed by Sn plating are formed outside the Ni electrodes. Piezoelectric vibrator.
ｉ無電解メッキを行った後の熱処理温度が、３００℃以
上６００℃以下であることを特徴とする圧電振動子の電
極形成方法。2. The piezoelectric vibrator according to claim 1, wherein N
i A method for forming an electrode of a piezoelectric vibrator, wherein a heat treatment temperature after performing electroless plating is 300 ° C. or higher and 600 ° C. or lower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31472295A JPH09135045A (en) | 1995-11-07 | 1995-11-07 | Piezoelectric vibrator and formation of electrode thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31472295A JPH09135045A (en) | 1995-11-07 | 1995-11-07 | Piezoelectric vibrator and formation of electrode thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09135045A true JPH09135045A (en) | 1997-05-20 |
Family
ID=18056787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31472295A Pending JPH09135045A (en) | 1995-11-07 | 1995-11-07 | Piezoelectric vibrator and formation of electrode thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09135045A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001022503A1 (en) * | 1999-09-21 | 2001-03-29 | Robert Bosch Gmbh | Method for applying flat outer electrodes to a piezoceramic multi-layer actuator |
| KR20020034834A (en) * | 2000-11-02 | 2002-05-09 | 아끼구사 나오유끼 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method |
| CN100411213C (en) * | 2006-06-15 | 2008-08-13 | 湖南嘉业达电子有限公司 | Electrode for piezoelectric ceramic component and its preparation process |
-
1995
- 1995-11-07 JP JP31472295A patent/JPH09135045A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001022503A1 (en) * | 1999-09-21 | 2001-03-29 | Robert Bosch Gmbh | Method for applying flat outer electrodes to a piezoceramic multi-layer actuator |
| KR20020034834A (en) * | 2000-11-02 | 2002-05-09 | 아끼구사 나오유끼 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method |
| CN100411213C (en) * | 2006-06-15 | 2008-08-13 | 湖南嘉业达电子有限公司 | Electrode for piezoelectric ceramic component and its preparation process |
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