WO2001022503A1 - Method for applying flat outer electrodes to a piezoceramic multi-layer actuator - Google Patents
Method for applying flat outer electrodes to a piezoceramic multi-layer actuator Download PDFInfo
- Publication number
- WO2001022503A1 WO2001022503A1 PCT/DE2000/003135 DE0003135W WO0122503A1 WO 2001022503 A1 WO2001022503 A1 WO 2001022503A1 DE 0003135 W DE0003135 W DE 0003135W WO 0122503 A1 WO0122503 A1 WO 0122503A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- outer electrodes
- temperature
- carried out
- tin
- takes place
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 238000001465 metallisation Methods 0.000 claims description 22
- 230000004913 activation Effects 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 10
- 239000012266 salt solution Substances 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- -1 halide ions Chemical class 0.000 claims description 6
- 238000005554 pickling Methods 0.000 claims description 6
- 150000001879 copper Chemical class 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 241000080590 Niso Species 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 4
- 230000007935 neutral effect Effects 0.000 claims description 4
- 150000002815 nickel Chemical class 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 3
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical compound [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000002604 ultrasonography Methods 0.000 claims description 2
- 239000012808 vapor phase Substances 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims 4
- 238000010899 nucleation Methods 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 2
- 238000005496 tempering Methods 0.000 claims 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- 230000003213 activating effect Effects 0.000 claims 1
- MMCOUVMKNAHQOY-UHFFFAOYSA-N carbonoperoxoic acid Chemical compound OOC(O)=O MMCOUVMKNAHQOY-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
- 239000012459 cleaning agent Substances 0.000 claims 1
- 239000003599 detergent Substances 0.000 claims 1
- 150000004820 halides Chemical class 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 239000006259 organic additive Substances 0.000 claims 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 239000010953 base metal Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000001994 activation Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 239000011888 foil Substances 0.000 description 5
- 230000035784 germination Effects 0.000 description 5
- 239000011133 lead Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 101150095744 tin-9.1 gene Proteins 0.000 description 1
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
Definitions
- the invention relates to a method for attaching flat outer electrodes to a piezoceramic multilayer actuator, by means of which the inner electrodes, which are mutually led out to opposite outer sides, are each connected in parallel.
- Such a piezoceramic multilayer actuator is known for example from DE 196 48 545 AI. It consists of a sintered stack of thin foils made of piezoceramic, inner electrodes arranged between the foils being alternately guided out of the stack on two opposite sides and electrically connected in parallel via outer electrodes. These external electrodes have to be flexible and, for example, have a three-dimensional structure. They are connected to a base metallization via partial contact points. When an electrical voltage is applied, the stacked multilayer actuator expands or, when an AC voltage is applied, performs expansion and shrinking movements in time with the AC frequency.
- Such a multilayer actuator is used, for example, to generate mechanical vibrations or as an actuating element for valves or valve members, for example for fuel injectors.
- the base metallization Due to the mechanical movement of the multi-layer actuator, the base metallization in particular is exposed to a high load, with the fact that Piezoceramic material is inherently brittle and has only a low tensile strength. As a result, the maximum permissible tensile stress is often exceeded during polarization, so that cracking, in particular cracking on the edge, inevitably occurs and supports its detachment in the case of poorly adhering base metallization.
- the method according to the invention with the features of the main claim advantageously leads to a very firmly adhering base metallization and a readily solderable structural metallization, the method also being particularly suitable for large-scale production.
- the process baths and process conditions are advantageously chosen so that only loads occur in predominantly weakly acidic or alkaline solutions.
- the special pickling process ensures that the base metallization adheres securely to the multi-layer actuator.
- the build-up metallization made of tin or a tin alloy with additives made of lead, copper, silver or other alloy components enables good adhesion and safe soldering of the outer electrodes. Adhesion to the soldering surface is improved by soldering under protective gas. The use of no-clean fluxes means that subsequent washing processes can be dispensed with.
- Activation takes place in a particularly advantageous manner and / or germination on the desired surfaces by means of stamp application, preferably for a period of 0.5 to 2 minutes each, which can be done at room temperature.
- the metallization is created only on the desired surfaces, so that post-processing of the other surfaces is not necessary.
- a multilayer actuator with external electrodes soldered on via a metallization is shown in longitudinal section in the single figure and is described in more detail below in connection with the method according to the invention for attaching the external metallization and external electrodes.
- a piezoceramic multilayer actuator is shown schematically. It consists of a sintered stack 10 of thin foils 11 made of piezoceramic, e.g. made of lead zirconate titanate. Metallic internal electrodes 12 are attached between the individual foils 11, e.g. consist of AgPd and are applied by screen printing technology. These inner electrodes 12 alternately extend out of the stack 10 up to its two opposite outer sides. There they are connected to each other or connected in parallel via two outer metallizations 13, 14.
- the distance between the inner electrodes 12 is, for example, 150 ⁇ m with an electrode thickness of approx.
- Such a multilayer actuator consists of several hundred individual electrodes or foils 11, and this number can also be higher.
- Flat, flexible, electrically conductive outer electrodes 15, 16 are soldered to the outer metallizations 13, 14 and can be designed as sieves, nets, spirals, combs, polymers, bronze sieves or the like to achieve the required flexibility. This is described in more detail in the prior art specified at the outset.
- a connecting wire 17 is soldered to the outer electrodes in the transverse direction and a connecting wire 18 in the longitudinal direction or welded on, for example, by resistance welding or laser welding.
- plug contacts can also be attached. This attachment can take place before or after the soldering of the outer electrodes 15, 16.
- a process chain for attaching the outer metallizations 13, 14 and outer electrodes 15, 16 to the stack 10 is described below.
- the individual stacks 10 or larger bar arrangements which are later broken down into individual stacks by cutting, are already sintered and are held in galvanized frames with ground or lapped outer surfaces.
- the treatment of the side surfaces can be limited to those side surfaces to which the outer metallizations 13, 14 are to be attached.
- the stacks or bars are first subjected to a fine cleaning with a neutral cleaner at a pH value of 6 - 8 and a temperature of 40 - 60 C for a few minutes. This is followed by pickling or roughening the stacks 10 in dilute solutions of acids or acid mixtures. This process takes place with high energetic ultrasound support at a frequency of over 40 kHz and an o
- a base metallization made of nickel, copper or a nickel-copper alloy is deposited or applied.
- This treatment step takes place in an alkaline solution, the separation being carried out without current or without external current. This can be done using three process variants:
- Nickel is made from a nickel salt solution, for example NiSO, with phosphinates, for example NaH-PO-, as a reducing agent at a pH of 8-9 and an elevated temperature of, for example, 70-95 ° C. for a period of 10 - Separated for 20 minutes.
- Nickel and copper is made from a nickel salt solution. for example NiSO., and a copper salt solution, for example CuSO., with phosphinates, for example NaH-, PO-, as a reducing agent and a hydroxycarboxylic acid as a complexing agent. This takes place at a pH of 9-10 and an elevated temperature of, for example, 80 ° C. for a period of 10-30 minutes.
- Copper is made from a copper salt solution, for example CuSO., with formaldehyde (CH-, 0) as reducing agent and a polyaminopolycarboxylic acid as complexing agent at a pH of 9-10 and an elevated
- the electroless deposition i.e. the application of the basic metallization
- it is rinsed with demineralized water and an electroplating metallization with tin or a tin alloy is carried out immediately.
- an electroplating metallization with tin or a tin alloy is carried out immediately.
- the process chain can be briefly interrupted by applying an approx. 0.1 y thick gold layer.
- an electroless gold plating is used at a neutral to weakly acidic pH and elevated temperature.
- a solution is used for the electrodeposition of a tin alloy as a solder layer, as is also used, for example, specifically for lead-containing glasses and ceramics. Due to the high temperature load of the multi-layer actuators in later use, for example in motor vehicles, the resistance of the solder must be guaranteed up to 230 C, so that the solution for coating the stack 10 is adjusted, for example, so that e.g. a solder with the composition
- the outer electrodes 15, 16 are soldered to the outer metallizations 13, 14 formed in this way.
- the stacks 10 or bars are prepared by applying a so-called no-clean flux, in which subsequent washing is not necessary.
- a 2% adipic acid in ethanol, for example, is suitable for this.
- the pre-soldered outer electrodes 15, 16 are supplied via positioning aids, and they are then pressed flat, for example by means of disc springs, with a pressure of, for example, 1 N / mm 2 .
- the actual soldering takes place under protective gas (eg nitrogen) with a residual oxygen content ⁇ 10 pp in a reflow furnace.
- the temperature profile in the furnace is 250 - 400 C, and the parts are fed at a feed rate of 300 - 600 mm / min in order to achieve a gentle, even heating of the stacks 10 to 250 C in 5 - 15 minutes.
- the soldering can also be carried out in a vapor phase soldering system at, for example, 260 ° C.
- the individual stacks 10 or piezo actuators have sensitive areas, such as chamfers and side surfaces, which by means of the described chemical activation and germination in immersion baths as well as the desired contact sides with a chemically reductive metal layer (eg nickel).
- a chemically reductive metal layer eg nickel
- these bevels and side surfaces must therefore be cleaned again, for example by grinding.
- the multilayer actuator is often destroyed, in particular by short-circuiting.
- the method described below can therefore be used for activation, which enables local or selective activation and germination by means of stamp printing technology.
- the activation with tin (II) tetrafluroborate is carried out by means of a stamp application or stamp printing for approx. 1 minute at room temperature.
- the activation is therefore only carried out in the areas that were covered according to the stamp shape.
- the subsequent germination can then take place via stamp printing for about 1 minute at room temperature, so that the thin nickel layer is formed in the desired manner only in accordance with the stamp shape, while the remaining surfaces remain free. This also applies to the subsequent structural metallization.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Fuel-Injection Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00972588A EP1226613A1 (en) | 1999-09-21 | 2000-09-09 | Method for applying flat outer electrodes to a piezoceramic multi-layer actuator |
KR1020027003659A KR20020030121A (en) | 1999-09-21 | 2000-09-09 | Method for applying flat outer electrodes to a piezoceramic multi-layer actutator |
JP2001525775A JP2003510819A (en) | 1999-09-21 | 2000-09-09 | How to attach a planar external electrode to a piezoceramic multilayer actuator |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1999145267 DE19945267C1 (en) | 1999-09-21 | 1999-09-21 | Method for applying flat external electrodes on a piezoceramic multilayer actuator |
DE19945267.9 | 1999-09-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001022503A1 true WO2001022503A1 (en) | 2001-03-29 |
Family
ID=7922810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/003135 WO2001022503A1 (en) | 1999-09-21 | 2000-09-09 | Method for applying flat outer electrodes to a piezoceramic multi-layer actuator |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1226613A1 (en) |
JP (1) | JP2003510819A (en) |
KR (1) | KR20020030121A (en) |
CN (1) | CN1382307A (en) |
DE (1) | DE19945267C1 (en) |
WO (1) | WO2001022503A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004019423A2 (en) * | 2002-08-13 | 2004-03-04 | Robert Bosch Gmbh | Piezoelectric actuator |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100587583B1 (en) * | 2004-01-08 | 2006-06-08 | 학교법인 건국대학교 | Method of manufacturing piezoelectric actuator having a stacked ceramic thin actuation layer |
DE102008062021A1 (en) | 2008-08-18 | 2010-03-04 | Epcos Ag | Piezo actuator in multilayer construction |
CN102790168A (en) * | 2012-08-09 | 2012-11-21 | 昆山攀特电陶科技有限公司 | Piezoelectric ceramic actuator with flexible electrode |
DE102014219147A1 (en) | 2014-09-23 | 2016-03-24 | Robert Bosch Gmbh | Actuator module with a stack of piezoceramics |
CN110137338B (en) * | 2019-04-02 | 2023-05-02 | 苏州诺莱声科技有限公司 | Piezoelectric element lead welding method and piezoelectric element with pins |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3402494A1 (en) * | 1984-01-25 | 1985-07-25 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR METAL COATING PIEZOCERAMIC WORKPIECES |
JPH07162049A (en) * | 1993-12-07 | 1995-06-23 | Brother Ind Ltd | Multilayer piezoelectric element |
JPH09135045A (en) * | 1995-11-07 | 1997-05-20 | Teika Corp | Piezoelectric vibrator and formation of electrode thereof |
DE19648545A1 (en) * | 1996-11-25 | 1998-05-28 | Ceramtec Ag | External electrode for a monolithic multilayer actuator |
DE19715488C1 (en) * | 1997-04-14 | 1998-06-25 | Siemens Ag | Piezoelectric actuator |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3402949A1 (en) * | 1984-01-28 | 1985-08-08 | Schlick roto-jet Maschinenbau GmbH, 4439 Metelen | Abrasive-blasting turnstile installation, in particular for the partially automatic abrasive blasting of objects |
DE3907902A1 (en) * | 1989-03-08 | 1990-09-13 | Siemens Ag | METHOD FOR CHEMICALLY METALLIZING CERAMIC BODIES |
DE19753930A1 (en) * | 1997-12-05 | 1999-06-10 | Ceramtec Ag | Process for attaching external electrodes to solid state actuators |
-
1999
- 1999-09-21 DE DE1999145267 patent/DE19945267C1/en not_active Expired - Fee Related
-
2000
- 2000-09-09 EP EP00972588A patent/EP1226613A1/en not_active Withdrawn
- 2000-09-09 KR KR1020027003659A patent/KR20020030121A/en not_active Application Discontinuation
- 2000-09-09 JP JP2001525775A patent/JP2003510819A/en active Pending
- 2000-09-09 CN CN00814605A patent/CN1382307A/en active Pending
- 2000-09-09 WO PCT/DE2000/003135 patent/WO2001022503A1/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3402494A1 (en) * | 1984-01-25 | 1985-07-25 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR METAL COATING PIEZOCERAMIC WORKPIECES |
JPH07162049A (en) * | 1993-12-07 | 1995-06-23 | Brother Ind Ltd | Multilayer piezoelectric element |
JPH09135045A (en) * | 1995-11-07 | 1997-05-20 | Teika Corp | Piezoelectric vibrator and formation of electrode thereof |
DE19648545A1 (en) * | 1996-11-25 | 1998-05-28 | Ceramtec Ag | External electrode for a monolithic multilayer actuator |
DE19715488C1 (en) * | 1997-04-14 | 1998-06-25 | Siemens Ag | Piezoelectric actuator |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 09 31 October 1995 (1995-10-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 09 30 September 1997 (1997-09-30) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004019423A2 (en) * | 2002-08-13 | 2004-03-04 | Robert Bosch Gmbh | Piezoelectric actuator |
WO2004019423A3 (en) * | 2002-08-13 | 2004-07-01 | Bosch Gmbh Robert | Piezoelectric actuator |
Also Published As
Publication number | Publication date |
---|---|
JP2003510819A (en) | 2003-03-18 |
DE19945267C1 (en) | 2001-04-19 |
EP1226613A1 (en) | 2002-07-31 |
CN1382307A (en) | 2002-11-27 |
KR20020030121A (en) | 2002-04-22 |
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