JPH09130021A - Manufacture of flexible wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain uniform thickness of the plated film of a conductive pattern of flexible wiring board. SOLUTION: In order to uniformly flow a current supplied from an electrode 15 to the conductive patterns 13a, 13b, 13c of flexible wiring boards 12a, 12b, 12c of different shapes, a dividing bar pattern 16 is arranged to give uniformity to artificially form divided blocks 17a, 17b,..., 17d. Thereby, the flexible wiring boards 12a, 12b, 12c having uniform film thickness of the plated film 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flexible wiring board plated with a conductor portion, which is used for electrical connection of electric circuit units in various electronic devices in the OA / AV field. is there.

[0002]

2. Description of the Related Art Generally, in a method of manufacturing a flexible wiring board, a flexible wiring of the same shape is formed so that a waste material can be effectively used by minimizing the size of a waste material in a limited size of an insulating film sheet. In many cases, many boards are arranged and processed, or several kinds of flexible wiring boards having different shapes are combined and co-taken. For example, insulation formed by combining flexible wiring boards as shown in FIG. 3 and printed. I was using a film sheet.

In the figure, 1 is an insulating film sheet,
2e are separate flexible wiring boards, 3a, 3b, ... 3e are conductor patterns forming a flexible wiring board to be plated, 4 is an electrode pattern, and 5 is an electrode portion.

Electroplating is carried out by the above-mentioned insulating film sheet 1
Is immersed in an electrolyte solution containing metal ions, and an electric current is passed through the conductor to form the target metal into the conductor patterns 3a, 3
b, ..., 3e, which is deposited on 3e, and this technique is well known, so detailed description will be omitted.

[0005]

Generally, it is recognized that the plating film can be controlled in units of several microns. However, in the conventional electroplating using an insulating film sheet, there are the following problems. is there.

Usually, in the plating process, an electrode pattern for supplying a current to the object to be plated is connected and wired to the object to be plated. In this case, flexible wiring boards with different sizes, flexible wiring boards with a large difference in the number of conductor patterns, and asymmetric flexible wiring boards are arranged in a non-uniform manner. If so, the current supplied from the electrode part 5 to the electrode pattern 4 becomes non-uniform at the time of being supplied to the flexible wiring board of each shape, which causes a difference in the amount of metal ion deposition from the plating bath. Flexible wiring boards 2a, 2b, ..., 2e conductor patterns 3a, 3b,
The thickness of the plating film deposited on 3e becomes uneven.

The unevenness of the plating film is caused by the conductor patterns 3a, 3 of the flexible wiring boards 2a, 2b ,.
b, ...... 3e Inducing dispersion of conductor resistance value and deterioration of flexibility, which is one of the causes of fatal defects such as disconnection.
The flexible wiring boards 2a, 2b, ..., 2e may be a factor that significantly impairs the reliability of the product as a product.

As described above, the conventional insulating film sheet 1
It is very difficult to make the plating film thickness of the conductor patterns 3a, 3b, ... 3e of the flexible wiring boards 2a, 2b ,. Met.

It is an object of the present invention to solve these problems and to provide a method for manufacturing a flexible wiring board capable of forming a plating film having a uniform film thickness even when the plating film is not uniformly arranged. It is what

[0010]

In order to solve the above-mentioned problems, the present invention provides an object to be plated having a plurality of sets arranged on an insulating film sheet in a state where both ends of a conductor pattern are connected to an electrode pattern. A flexible wiring board is divided into blocks by using a split beam pattern, and each flexible wiring board with different shapes is mixed and arranged into one flexible wiring board. Of the flexible wiring board, which has a pseudo-highly uniform arrangement of the flexible wiring board, is electroplated using an insulating film sheet, and the manufacturing method is to cut and process the portion of the flexible wiring board. is there.

According to the present invention, by forming a plurality of different-shaped flexible wiring boards arranged in the insulating film sheet into blocks, the current from the electrode portions can be supplied to each block at a constant ratio. The thickness of the plating film deposited on the conductor pattern of each flexible wiring board can be made uniform.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention blocks a large number of sets of conductor patterns of a flexible wiring board having a deformed pattern, which is an object to be plated, arranged on an insulating film sheet in an arbitrary number of sets. And connect one end to each conductor pattern so as to sandwich the conductor pattern of each block and connect the other end to the electrode part, and arrange a pair of electrode patterns for supplying a current from the electrode part. After performing electroplating using an insulating film sheet formed by sandwiching a conductor pattern in parallel and arranging divided beam patterns whose both ends are connected to the pair of electrode patterns, the flexible wiring board is cut and processed. This is a method in which a large number of sets of flexible wiring boards with different shapes are placed in an insulating film sheet, and the current from the electrode section is blocked by blocking them. Can be supplied at a constant ratio to the click, and has the effect that the plating film thickness to be deposited on the conductive pattern of each of the flexible wiring board can be made uniform.

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. 1 is a plan layout view of the present embodiment, and FIG. 2 is a sectional view taken along the line AA of FIG.

In the figure, reference numeral 11 is an insulating film sheet, and 12a, 12b, 12c printed on the surface thereof.
Is a separate flexible wiring board, 13a, 13b, 1
3c is a conductor pattern forming each of the flexible wiring boards 12a, 12b, 12c, 14 is an electrode pattern for supplying a current from the electrode portion to the conductor pattern, 15 is an electrode portion, 16 is a current from the electrode pattern 14 to each block Dividing bar pattern 17a, 1 for evenly distributing and supplying
.. 17d are divided blocks divided by the dividing beam pattern 16, and 18 is a plating film.

The conductor patterns 13a, 13b, 13c are
In addition to having a role as an electric circuit, it has a role to securely hold the deposited plating film 18 on the insulating film sheet 11.

In the case of this embodiment, the flexible wiring boards 12a, 12b and 12c of the respective conductor patterns 13a, 13b and 13c, which are different in the number and shape thereof, are co-taken with the insulating film sheet 11.

In FIG. 1, a flexible wiring board 1 having a different shape is shown.
2a, 12b, 12c are combined into one block,
By arranging the electrode pattern 14 and the dividing beam pattern 16 so as to surround the conductor patterns 13a, 13b, 13c, the dividing blocks 17a, 17b, ..
d has been created.

The divided cross-piece pattern 16 has a uniform structure in which the divided blocks 17a, 17b, ... 17d in which the different-shaped flexible wiring boards 12a, 12b, 12c are mixedly arranged are pseudo flexible flexible wiring boards. Has the effect of imparting sex. Therefore, the divided blocks 17 in which the flexible wiring boards 12a, 12b, 12c having different shapes are mixed
.. 17d are replaced by flexible wiring boards 12a, 12b, 12c having uniformity, so that the insulating film sheet 11 has flexible wiring boards 12a, 12b, 12c having pseudo uniformity. Can be realized. As a result, the current supplied from the electrode portion 15 can be evenly distributed and supplied to each divided block through the electrode pattern 14, so that the amount of metal ions deposited in each block becomes uniform and the difference between the blocks is attenuated. As a result, each flexible wiring board 12
It is possible to make the plating film thickness between a, 12b and 12c uniform.

Further, it is possible to easily control the plating film thickness between a small number of flexible wiring boards 12a, 12b, 12c in each block by a known technique.

[0020]

As described above, according to the present invention, when a large number of flexible wiring boards having different shapes are arranged, by providing uniformity, the plating film thickness of each of the flexible wiring boards can be increased. Can be made uniform.

The fact that the plating film thickness can be made uniform can provide a high-quality flexible wiring board having extremely stable characteristics and functions such as resistance value and bending reliability of the conductor pattern of the flexible wiring board.

Also, in the plating process, the frequency of product type switching is reduced, so that switching loss is small and stable quality production is possible.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a method for manufacturing a flexible wiring board according to the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG. 1;

FIG. 3 is a plan view showing an example of a conventional method for manufacturing a flexible wiring board.

[Explanation of symbols]

 11 Insulating film sheet 12a, 12b, 12c Flexible wiring board 13a, 13b, 13c Conductor pattern 14 Electrode pattern 15 Electrode part 16 Dividing crossbar pattern 17a, 17b, ... 17d Dividing block 18 Plating film

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenji Otomo 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A conductor pattern of a flexible wiring board having a deformed pattern, which is an object to be plated and arranged in a large number on an insulating film sheet, is divided into blocks by an arbitrary number of sets, and one end of each block is sandwiched between the conductor patterns of the blocks. A pair of electrode patterns connected to the conductor pattern and the other end thereof connected to the electrode section to supply a current from the electrode section are arranged. Further, the conductor patterns of the respective blocks are sandwiched in parallel, and the pair of electrode patterns are formed. After performing electroplating using the insulating film sheet formed by arranging the divided crosspiece pattern connecting both ends,
A method for manufacturing a flexible wiring board, which comprises cutting and processing the portion of the flexible wiring board.