JPH09121040A - Semiconductor optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount a lens fixing member on a solid state image sensor while positioning easily without causing any damage thereon. SOLUTION: A lens fixing member 3 is provided with an inclining face 6 for positioning the lens fixing member 3 itself such that a specified positional relationship is kept between a solid state imaging sensor 2 and a lens 4 touching the upper edge on the side face thereof when the lens fixing member 3 is secured to a substrate 1 through the legs 5. Under a state where the inclining face 6 touches the upper edge on the side face of solid state imaging sensor 2, the lens fixing member 3 is positioned with respect to the solid state imaging sensor 2 and bonded onto the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor optical device,
In particular, it comprises a semiconductor optical element mounted on a substrate, for example, a solid-state image sensor, and a lens mounting member having legs for integrally or integrally mounting a lens corresponding to the semiconductor optical element and adhering to the substrate. The present invention relates to a semiconductor optical device.

[0002]

2. Description of the Related Art A small camera (still or video camera) using a solid-state image pickup device as an image pickup means is required to be further reduced in size and price. One such small camera is shown in FIG. In the figure, a is a substrate, b is a through hole, and c is a solid-state image pickup device mounted on the substrate a, in which a solid-state image pickup element d is housed in a package e and sealed with a transparent plate f. Reference numeral g denotes a lead, which is passed through the through hole b and connected to the substrate a by solder h.

Reference numeral i denotes a lens, which forms an image of a subject on the surface of the solid-state image pickup device d. Reference numeral j denotes a ring-shaped holding portion which holds the lens i at the inner peripheral portion thereof, and a thread groove is formed on the outer peripheral surface thereof. Reference numeral k denotes a ring-shaped lens mount, a thread groove is formed on the inner peripheral surface, and the thread groove of the holding portion j is screwed into the thread groove. By rotating the holding part j with respect to the lens mount k, the lens i can be moved closer to or away from the solid-state imaging device d, that is, focusing can be performed.

FIG. 5 shows another small-sized camera having a more simplified structure. In the figure, a is a substrate, d is a solid-state imaging device mounted on the substrate a, n is a lens mounting member, and has a leg m connected to the substrate a, and the lens i is integrally formed by, for example, two-color molding. Has been formed. j is a downward step surface formed on the inner surface of the leg m so that the lens i contacts the outer surface of the upper surface of the solid-state image sensor d so that the distance between the lens i and the solid-state image sensor d reaches a predetermined value, that is, the focus is achieved. Has been However, this camera does not require the mechanism shown in FIG. 4 for adjusting the position of the lens i which the camera has. Moreover, the package which seals the solid-state image sensor d and the transparent plate f are not provided. Therefore, the present camera has a considerably simpler structure than the camera shown in FIG. 4, uses a small number of parts, and is easy to reduce in size and cost.

[0005]

By the way, in the camera as shown in FIG. 4, the semiconductor chip forming the solid-state image pickup device needs to be sealed in order to avoid exposure to the general environment. Since the size of the mechanical component is large and it is difficult to seal it, the semiconductor chip and the optical component are
Despite the need to determine the positional relationship with high accuracy, there was a fate that it had to be assembled in a separate process that had a weak correlation.

Therefore, there are the following problems. First,
In addition, since there are processes with low dimensional accuracy such as sealing and soldering between each assembly process, position detection and
There has been a problem that a device such as a mount stage having a fine adjustment mechanism, which is expensive and maintenance cost is high, and a troublesome process such as position detection and alignment is required. Secondly, in order to prevent the adjustment at the manufacturing stage due to the difficulty of the adjustment at the time of manufacturing, an adjusting mechanism is required so that the user can make fine adjustment. This naturally becomes a factor that prevents the price and size of the camera from becoming smaller.

On the other hand, in the structure shown in FIG. 5, the stepped surface j for alignment is brought into contact with the surface of the solid-state image pickup device d so that the distance between the lens i and the solid-state image pickup device d becomes a predetermined value. Can be done with very high accuracy. However, according to this, the position of the lens i with respect to the solid-state image sensor d cannot be aligned in the X-direction, the Y-direction, and the θ (rotation) direction, and the lens mounting member n makes surface contact with the surface of the delicate solid-state image sensor d. However, there is a problem that the solid-state imaging device d may be damaged. Therefore, the camera shown in FIG. 5 also has a problem.

The present invention has been made to solve the above problems, and a semiconductor optical element mounted on a substrate and a lens corresponding to the semiconductor optical element are integrally or integrally attached, In a semiconductor optical device including a lens mounting member having legs bonded to a substrate, the lens mounting member can be easily positioned and assembled with respect to the semiconductor optical element without fear of damaging the semiconductor optical element. The purpose is to be able to.

[0009]

According to another aspect of the present invention, there is provided a semiconductor optical device according to claim 1, wherein the lens mounting member is in contact with an upper edge of a side surface of the semiconductor optical element when the lens mounting member is fixed to the substrate by legs, and the lens is attached to the semiconductor optical element. A positioning inclined surface for positioning the lens mounting member itself so as to have a predetermined positional relationship with the lens mounting member is provided, and the lens mounting member is provided with the positioning inclined surface in contact with the upper edge of the side surface of the semiconductor optical element. And the lens mounting member is adhered onto the substrate.

Therefore, according to the semiconductor optical device of the first aspect, the positioning inclined surface is simply used as the upper edge of the side surface of the semiconductor optical element without using a device such as a mount stage having a position detection and fine adjustment mechanism. The leg of the lens mounting member is brought into contact with the semiconductor optical element in a state of being in contact with the semiconductor optical element, so that the lens mounting member is positioned on the substrate so that the lens has a predetermined positional relationship with the semiconductor optical element. Positioning in the (axis) direction, the X direction, the Y direction, the θ direction, and the tilt 2 direction. Therefore, if the lens mounting member is adhered to the substrate in that state, a semiconductor optical device that is positioned in the X direction, the Y direction, the Z direction, the rotation (θ) direction, and the tilt 2 direction can be easily formed. Since the semiconductor optical element only comes into line contact with the lens mounting member at the edge of the upper surface, the semiconductor optical element is not damaged by the positioning.

According to another aspect of the semiconductor optical device of the present invention,
A positioning film having a pattern that does not cover the mounting portion of the semiconductor optical element and the leg bonding portion of the lens mounting member is formed, and the semiconductor optical element and the leg bonding portion of the lens mounting member are bonded to the substrate so as to deviate from the positioning film. It is characterized by being done. Therefore, according to the semiconductor optical device of the second aspect, it is possible to simply avoid the positioning film (not to protrude from the recess) without using a device such as a mount stage having a position detection and fine adjustment mechanism. If the legs of the optical element and the lens attachment member are attached, the lens is naturally positioned with respect to the semiconductor optical element in the X, Y and Z directions. Therefore, if the lens mounting member is adhered to the substrate in this state, a semiconductor optical device that is positioned in the X direction, the Y direction, and the Z axis direction can be easily formed.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. 1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a sectional view,
(B) is an enlarged cross-sectional view showing an enlarged portion B of (A). In the figure, 1 is a wiring board, 2 is the wiring board 1
The solid-state imaging device 3 mounted on the surface is a lens mounting member, to which the lens 4 is integrally mounted, and has, for example, four legs 5, 5, 5, and 5. Board 1
Adhered to the surface. 2 (A) and 2 (B) show legs 5, 5,
It is a top view which shows each example of another arrangement of 5 and 5.

Numerals 6, 6, 6, 6 are diagonally downward positioning slopes formed inside the legs 5, 5, 5, 5 (in the drawing, the positioning of the pair of legs 5, 5 is shown). Only the inclined surfaces 6 and 6 appear) to contact the edge of the upper surface of the solid-state imaging device 2 on the substrate 1 so that the lens mounting member 3
Plays a role of naturally defining the positional relationship with respect to the solid-state image sensor 2 by self-alignment. α is an angle formed by the positioning inclined surface 6 and the horizontal plane, specifically, the surface of the solid-state image sensor 2. In addition to the X direction, the Y direction, the Z direction, and the θ direction, a total of five tilt axes can be controlled by the alignment. This point will be described in detail below.

In the lens mounting member 3, the lens 4 and the other parts of the legs 5, 5, 5, 5 and the like are integrated by, for example, two-color molding (the lens 4 is transparent, and the other parts are colored and non-transparent). Legs 5, 5, formed in two-color molding to form
The positional relationship between the lens 4 and the positioning inclined surfaces 6, 6, 6, 6 on the inner surfaces 5, 5 is set as desired, and the processing accuracy thereof is sufficiently high. However, the lens 4 and the other leg 5,
The parts 5, 5, 5 and the like may be formed separately and assembled to be integrated. This is called "integrally attached". Then, after the solid-state imaging device 2 is bonded to the substrate 1, the lens mounting member 3 is positioned such that the positioning inclined surfaces 6, 6, 6, 6 are in contact with the edges of the upper surface of the solid-state imaging device 2 and the legs 5, 5, 5, 5 are attached. The thickness, shape, and size of the solid-state imaging device 1 and the shape and size of the lens mounting member 3 are set so that the above-described five-axis control is automatically performed by self-alignment when the surface is in contact with the surface of the substrate 1. So
Self-alignment can be performed simply by bringing the solid-state imaging device 2 and the lens mounting member 3 into line contact.

Specifically, the bottom surfaces of the legs 5, 5, 5, 5 are temporarily adhered to the surface of the substrate 1 with a semi-curable resin (for example, an ultraviolet curable resin NUV-20 [manufactured by Nippon Lec Co., Ltd.]) 7. Then, the solid-state imaging device 2 and the lens mounting member 3 are brought into line contact with each other to adjust the position. After the position adjustment, the resin 7 is cured by irradiation with ultraviolet rays so that the resin 7 is completely adhered.

The error caused by this self-alignment will be described. The maximum error in the X direction and the Y direction is determined by the size of the play between the legs 5 and 5 and the gap between the legs 5 (play amount). . In the case of a solid-state image sensor, the allowable error is ± 200 μm, and it is extremely easy to set the allowable error within the allowable range with the current technology. Next, the rotational deviation (deviation in the θ direction) is self-aligned by abutting the positioning inclined surfaces 6, 6, 6, 6 of the lens mounting member 3 on the four sides of the solid-state image pickup element 2, so that there is no possibility of occurrence. It can be said that there is no.

Next, regarding the error in positioning in the Z direction, that is, focusing, this requires a high positioning accuracy such as resolution, and in the case of a CCD type solid-state image pickup device, the allowable error is, for example, ± 10 to 20 μm. It can be said that the range is considerably narrow. However, according to the current resin molding technique, the lens mounting member 3 can be formed within ± several μm, and it is extremely easy to set the error within the allowable range. However, regarding the positional relationship in the Z direction, the errors in the X direction and the Y direction may be modulated into the errors in the Z direction, and it is said that the accuracy in the Z direction is determined only by the processing accuracy of the lens mounting member 3. It does not break, but there is no problem if the inclination angles α of the positioning inclined surfaces 6.6 and 6.6 of the legs 5, 5 and 5, 5 facing each other are made equal.

In such a case, if the position of the lens mounting member 3 with respect to the solid-state image pickup device 1 is deviated by Δx, one leg 5 is moved toward the plus side in the Z direction by Δx.
Although it is displaced by x · sin α, the other leg 5 is displaced by the same amount in the negative direction in the Z direction, so that no displacement occurs in the Z direction. It goes without saying that the same is true even when the displacement is in the Y direction. Therefore, the focus deviation is determined by the molding accuracy of the lens mounting member 3 and other factors do not intervene, so that it is still easy to bring it within the allowable range.

However, such deviation is modulated in a tilted manner. For example, if there is a displacement in the X direction by Δx, Δx · sin α / Lx (Lx: X of the solid-state image sensor 2).
(Length in the direction) will be modulated. However, even if Δx is considered to be a large value of 100 μm, in the case of Lx = 1 cm and angle α = 5 °, the tilt is very small at about 0.05 ° and can be ignored, and there is no problem at all. By the way, the size of Δx · sin α itself is considerably small, about 10 μm. As shown in FIG. 2B, legs 5, 5, 5 and 5 are arranged at the four corners of the solid-state image sensor 2, and the solid-state image sensor 2 is attached to each leg 5, 5, 5, and 5.
By providing two positioning inclined surfaces that come into line contact with the right-angled edges of the upper surface, such tilting does not occur at all when self-aligning.

In such a case, if it is assumed that the leg 5 is tilted in the X direction,
Since it is modulated by the deviation of the leg 5 facing in the Y direction from the surface of the solid-state image sensor 2, the four legs 5, 5,
This is because there is no room for error due to the inclination angle α as long as 5 and 5 are always placed at the four corners of the solid-state image sensor 2. In this case, it can be said that only the molding error of the lens mounting member 3 is an error factor, and the error is not increased by other factors.

According to such a semiconductor optical device, the positioning inclined surfaces 6, 6, 6, 6 are simply provided on the upper surface of the solid-state image pickup device 2 without using a device such as a mount stage having a position detection and fine adjustment mechanism. The lens mounting member 3 is positioned on the substrate 1 so that the lens 4 has a predetermined positional relationship with the solid-state image sensor 2 by contacting the solid-state image sensor 2 while being in contact with the edge. Since this positioning is performed in the Z (optical axis) direction, the X direction, the Y direction, the rotation (θ) direction, and the tilt 2 direction, if the lens mounting member 3 is bonded to the substrate 1 in that state, X A camera positioned in the direction, the Y direction, the Z direction, the rotation direction, and the two tilt directions can be easily formed. Further, since the solid-state imaging device 2 only comes into line contact with the positioning inclined surface 6 of the lens mounting member 3 at the edge of the upper surface, the semiconductor optical device is not damaged by the positioning.

[0022]

FIG. 3 is a sectional view showing a second embodiment of the present invention. In the figure, 1 is a substrate, 2 is a solid-state imaging device mounted on the substrate 1, and 3 is a lens 4 and legs 5, 5, 5 and 5 (only two legs 5 and 5 appear in the figure).
The lens mounting member 3 integrally formed with the legs 5, 5, 5,
The positional relationship between the bottom surface of the lens 5 and the lens 4 is formed in a predetermined manner. 8 is a positioning film (film thickness, for example, 200 μm),
A resist, an overcoat, or a prepreg is formed in a predetermined pattern on the surface of the substrate 1 by printing or photolithography.

Specifically, the positioning film 8 does not cover the portion of the substrate 1 on which the semiconductor optical element 1 is to be mounted and the portion of the lens mounting member 3 to which the legs 5, 5, 5, 5 are to be bonded. It is formed in a pattern with an accuracy of the μm unit so as to cover the portion other than the above portion, and is naturally formed before the mounting of the solid-state imaging device 2 and the bonding of the lens mounting member 3. After the positioning film 8 is formed, the solid-state image sensor 2 is positioned in the recessed solid-state image sensor mounting portion so that the solid-state image sensor 2 is not protruded from the recess and chip-bonded, and then the recess is formed. The legs 5, 5, 5 and 5 of the lens mounting member 3 are positioned and adhered on the substrate 1 at the portions where the legs 5, 5, 5 and 5 are to be adhered so as not to protrude from the recesses. still,
7, 7 ... are adhesives.

According to such a semiconductor optical device, the portion where the semiconductor optical element 1 is to be mounted and the portion where the legs 5, 5, 5 and 5 of the lens mounting member 3 are to be bonded are covered in one forming step. A positioning film 8 having a non-shaped shape and a pattern having a high positional relationship between them is formed on the substrate 1, and the solid-state image sensor 2 and the lens mounting member 3 are formed in the recesses on the substrate 1.
Since the legs 5, 5, 5, 5 are adhered so as not to stick out therefrom, there is almost no displacement in the X direction, the Y direction, the θ direction, and the tilt direction. Only a slight error (about several μm) occurs due to the limit of the pattern accuracy of the positioning film 8 and the molding accuracy of the lens mounting member 3.

Further, the error in the Z-axis direction, that is, the focusing error is the molding error of the lens mounting member 3, specifically, the position between the lens 4 and the plane where the bottom surfaces of the legs 5, 5, 5, 5 are present. The error is determined by the relationship error, which is about several μm, so that it falls within the allowable range in a solid-state imaging device having a resolution of about 10 to 20 μm. Therefore, it is possible to easily position and assemble without using a device such as a mount stage having a position detection and fine adjustment mechanism, and the structure can be extremely simple.

[0026]

According to the semiconductor optical device of the present invention, the positioning inclined surface is simply the upper edge of the side surface of the semiconductor optical element without using a device such as a mount stage having a position detection and fine adjustment mechanism. The legs of the lens mounting member are brought into contact with the semiconductor optical element in a state of being in contact with the lens mounting member so that the lens mounting member is positioned on the substrate so that the lens has a predetermined positional relationship with the semiconductor optical element.
Positioning in the (optical axis) direction, the X direction, and the Y direction. Therefore, if the lens mounting member is adhered to the substrate in that state, a semiconductor optical device that is positioned in the X direction, Y direction, Z direction, rotation direction and two tilt directions can be easily completed. Since the semiconductor optical element only comes into line contact with the lens mounting member at the edge of the upper surface, the semiconductor optical element is not damaged by the positioning.

According to the semiconductor optical device of the second aspect, the legs of the semiconductor optical element and the lens mounting member are simply arranged so as to avoid the positioning film without using a device such as a mount stage having a position detection and fine adjustment mechanism. When attached, the lens is naturally positioned in the X, Y and Z directions with respect to the semiconductor optical element. Therefore, if the lens mounting member is adhered to the substrate in this state, a semiconductor optical device that is positioned in the X direction, the Y direction, and the Z axis direction can be easily formed.

[Brief description of the drawings]

1A and 1B show a first embodiment of the present invention, wherein FIG. 1A is a sectional view, and FIG. 1B is an enlarged sectional view showing a portion B of FIG. It is a figure.

FIGS. 2A and 2B are plan views showing different examples of arrangement of legs of the lens mounting member in the first embodiment.

FIG. 3 is a sectional view showing a second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing one conventional example.

FIG. 5 is a sectional view showing another conventional example.

[Explanation of symbols]

 1 substrate 2 semiconductor optical element (solid-state image sensor) 3 lens mounting member 4 lens 5 leg 6 positioning inclined surface 8 positioning film

Claims (2)

[Claims] 1. A semiconductor optical element mounted on a substrate,
What is claimed is: 1. A semiconductor optical device, comprising: a lens mounting member having a leg that is integrally or integrally mounted with the semiconductor optical element and bonded to a substrate, wherein the lens mounting member is attached to the substrate by the leg. A positioning sloped surface that contacts the upper edges of at least one pair of side surfaces of the semiconductor optical element when fixed and positions the lens mounting member itself so that the lens has a predetermined positional relationship with the semiconductor optical element; A semiconductor device characterized in that the lens mounting member is positioned with respect to the semiconductor optical element and the lens mounting member is adhered onto the substrate with the positioning inclined surface in contact with the upper edge of the side surface of the semiconductor optical element. Optical device 2. A semiconductor optical element mounted on a substrate,
A semiconductor optical device comprising: a lens mounting member having a leg that is integrally or integrally mounted with a lens corresponding to the semiconductor optical element and is adhered to a substrate, wherein the semiconductor optical element mounting portion is provided on the substrate. A positioning film having a pattern that does not cover the leg adhesion portion of the lens mounting member is formed, and the semiconductor optical element and the lens mounting member of the lens mounting member are prevented from protruding from the concave portion formed by the semiconductor optical element mounting portion and the leg adhesion portion of the positioning film. A semiconductor optical device characterized in that a leg bonding portion is bonded to the substrate.