JPH09108602A - Attachable and detachable coating applying head-mounting body and printed circuit board working device having coating applying head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to rapidly and efficiently manufacture printed circuit boards by automatically executing soldering work and through-hole processing which are heretofore carried out by manual work. SOLUTION: A copper clad original plate 2 is placed and fixed onto a working table 3. A working mechanism 5 freely attachably and detachably and pendently provided with a cutting head is freely vertically movably installed in the position above the copper clad original plate 2. The printed circuit board working device is constituted to execute desired cutting on the copper clad original plate 2 by making the working mechanism 5 movable horizontally (X, Y) in the position relative to the copper clad original plate 2 and controlling the relative movement and descending action of the working mechanism 5. The coating applying head mounting body 11 which is freely attachably and detachably mounted at the working mechanism 5 of the device described above and has an insertion hole to be inserted and fixed with a dispenser 10 for applying paste is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more specifically, to a soldering work or a through-hole process after a pattern is formed on a copper-clad original plate by milling to form a pattern, and a hole is formed and an outer shape is formed. It is about.

[0002]

2. Description of the Related Art Conventionally, in a printed circuit board on which required electronic parts are arranged and connected, a circuit pattern is printed or baked on a copper foil of a copper clad original plate, and then unnecessary parts are eluted by etching to leave only necessary parts. It is created by A printed circuit board on which a printed wiring pattern is formed by etching can reduce the manufacturing cost per printed circuit board in mass production of completed electronic devices as the same product, and can provide printed wiring of uniform quality. Can be formed efficiently. However, in the case of electronic devices of high-mix low-volume production or printed circuit boards used for prototypes in the development stage of electronic devices, it costs a lot of money to install an etching treatment device and waste liquid treatment of the developing solution necessary for the treatment. However, in the production of printed circuit boards by etching, there is a problem that the production cost per sheet is rather increased.

Therefore, in recent years, a printed circuit board used for the above-mentioned electronic equipment of a variety of small-quantity production or a prototype in the development stage of the electronic equipment is mechanically processed without using the conventional etching processing apparatus. A cutting groove is cut on the upper surface of the copper clad original plate along the contour of the desired printed wiring pattern by simple milling, and a printed wiring pattern equivalent to the etching process is formed on the copper clad surface of the above copper clad original plate, and a hole is formed, There has been proposed a processing device for processing.

[0004]

By the way, in making a board as described above, generally, after punching and outer shape processing, electronic parts are manually inserted into necessary parts of the board and soldering is also carried out manually. ing. In addition, the double-sided board
The holes also had lead wires or eyelet-shaped terminals inserted and soldering was done manually on both sides, which made the work complicated.

The present invention was devised to solve the above-mentioned problems, and a printed circuit board is manufactured by automatically performing a soldering operation and a through-hole treatment which have been conventionally performed manually. The purpose is to be able to perform efficiently in a short time.

[0006]

In order to solve the above-mentioned object, the present invention mounts and fixes a copper clad original plate on a working table,
A machining mechanism, in which a cutting head is removably hung vertically above the copper-clad original plate, is provided so as to be vertically movable, and the horizontal relative position of the machining mechanism with respect to the copper-clad original plate can be moved, and the relative position of the machining mechanism. It is detachably attached to the processing mechanism of the printed circuit board processing device that performs the desired cutting process on the copper clad original plate by controlling the automatic movement and lowering operation, and the paste coating dispenser is fitted and fixed. An application head mounting body having an insertion hole for allowing the application head and a processing apparatus including the coating head by the application head mounting body are adopted. Preferably,
It is preferable that the application head mounting body has a fitting portion with respect to the processing mechanism, and that the relative position in the horizontal direction of the insertion hole with respect to the fitting portion can be adjusted.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described in detail with reference to an embodiment shown in the drawings. In FIG. 1, reference numeral 1 denotes a printed circuit board processing apparatus. The processing apparatus 1 has a processing table 3 on which a copper clad original plate 2 is placed and which moves in the front-rear direction Y.
And a processing device 5 mounted on the moving support 4 so as to be movable up and down, and a processing table 3 or a processing mechanism 5. Is moved to a desired machining position by receiving movement data in respective directions X and Y from a personal computer (not shown) and controlled by a stepping motor (not shown), and a machining mechanism in which the cutting head 6 is detachably mounted. 5 is lowered to perform various cutting processes on the copper-clad original plate 2 on the processing table 3. Reference numeral 7 is a dust collecting unit that discharges chips and the like generated during cutting processing to the outside of the processing apparatus.

The processing mechanism 5 may be constructed so as to be movable relative to the copper clad original plate 2 in the horizontal direction (horizontal direction X, front-back direction Y). Therefore, in this embodiment, the relative position of the machining mechanism 5 in the front-rear direction Y can be moved by sliding the machining table 3, but the invention is not limited to this, and for example, the machining mechanism is The processing mechanism 5 itself may be moved in the left-right direction and the front-back direction by mounting the 5 on a moving column that moves in the left-right direction and the front-back direction.

As shown in FIG. 2A, the cutting head 6 comprises a cutting element 6b and a spindle motor (not shown) for rotating the element, and the relative depth of the cutting element 6b, that is, the copper depth. The cutting depth for the stretched plate 2 is adjusted by rotating the adjusting ring 6a clockwise or counterclockwise. The cutting head 6 has an inverted trapezoidal cross-section fitting portion 8 formed therein, and an inverted trapezoidal cross-section fitting receiving portion 9 formed below the head mounting portion of the machining mechanism 5.
It can be fitted to. Since the cross-sectional shapes of the fitting receiving portion 9 and the fitting portion 8 are inverted trapezoidal, the cutting head 6 can be attached to the lower part of the working mechanism 5 simply by inserting it. Reference numeral 16 in the drawing denotes a screw for more reliably fixing the fitting portion, and after fitting the fitting portion 8 of the head to the fitting receiving portion 9 of the processing mechanism, the screw 16 is laterally attached. It is designed to be easily tightened with.

The coating head is a coating head mounting body 11 and a paste coating dispenser fitted and fixed to the mounting body 11.
10 and. Reference numeral 10a is a cartridge for accommodating a paste such as a solder cream or a conductive adhesive. Air is supplied from the pipe 14 to the cartridge 10a so that the paste is suitable for the paste. I try to apply air pressure. Reference numeral 12 is a screw pump incorporating a DC motor (not shown), and the screw pump 12 is connected to a controller (not shown) by a conductor 15.
By controlling the controller, the screw pump 12 extrudes the paste. The dispenser 10 is not limited to the one in the embodiment, and the point is that the dispenser 10 can be mounted on the coating head mounting body 11 and can control the coating operation. For example, the dispenser 10 is composed only of a cartridge portion and an application needle attached below the cartridge portion, and air is supplied by a control signal by a control signal without using a screw pump to apply a paste by air pressure. May be.

A fitting portion 13 having an inverted trapezoidal cross-section, which has the same shape as the cutting head 6, is formed in the coating head mounting portion 11, and the fitting portion 13 is fitted into the fitting receiving portion 9 of the working mechanism 5. Then, the screw 16 is used for fixing. Cutting head 6
Since the application head mounting portion 11 can be attached and detached by a simple means of fitting the fitting portions 8 and 13 to the fitting receiving portion 9 of the processing mechanism 5, it is necessary to replace the head, but it is complicated. There is no work, and workability is not reduced. The shapes of the fitting portion 13 and the fitting receiving portion 9 are not limited to those in the embodiment.

FIG. 3 (a) is an overall perspective view showing a printed circuit board processing apparatus equipped with a coating head. The processing table 3 and the processing mechanism 5 are arranged in respective directions X and Y from a personal computer (not shown). The movement data is received and controlled by a stepping motor (not shown) to move it to a desired processing position, and the processing mechanism 5 to which the coating head is detachably mounted is lowered, and the screw pump 12 is operated by a signal from the control section. The paste is applied from the dispenser 10 to a desired portion of the substrate for a predetermined time. Needless to say, the dust collecting means 7 is not used in the coating operation.

Next, the coating head mounting body 11 constructed so that the mounting position of the dispenser 10 in the horizontal direction (horizontal direction X, front-back direction Y) can be adjusted will be described. The application head mounting body 11 mainly includes the insertion hole 1 of the dispenser 10.
8a through the cover body 18 and the fitting portion 1 to the processing mechanism
3 and a main body 19 having 3. The cover body is a plate-shaped member having a rectangular shape in plan view, and encloses an insertion hole 18a penetrating the plate to mount the dispenser 10 on the mounting portion 18b.
Is erected. The mounting portion 18b is a dispenser-10.
Has a cylindrical hollow portion 18c for receiving the space, and the side wall of the cylinder is partially cut out in consideration of the shape of the dispenser 10 (18e). 18d is a screw for fixing the dispenser 10 after it is inserted into the cavity. Cover
A side wall 18f having a U-shaped cross section is formed near the side of the body 18 in the length direction of the back surface, and cylindrical slide rails 18g, 18g are provided facing each other in the groove of the side wall 18f. One of the sliding rails 18g is partially cut out near the through hole.

The main body 19 further includes a base 20 and a sliding body 2.
And 1. Dispenser-1 for base 20
Rectangular plate 20b having 0 through holes 20a
The fitting portion 13 is formed at one end in the lengthwise direction, and the rising portion 20c is formed with the other end facing the fitting portion 13, and the fitting portion 13 and the rising portion 2 are formed.
The sliding rails 20d and 20d extending over 0c are arranged side by side at a predetermined interval.

The sliding body 21 slidably mounted orthogonally to the base 20 has rising receiving portions 21c, 21c formed so as to face both ends in the length direction of a rectangular plate 21b.
And a notch 21a formed on one side of the long side for inserting the dispenser 10, and a rising part 21g formed on the other side of the long side so as to face the notch 21a. A plurality of bearings 21d are provided at both end portions of the sliding body 21 in the length direction,
21e is attached. Each of the bearings 21d and 21e has a sliding contact groove 21f on the circumferential surface, and two bearings 21d and 21e are provided side by side at both ends in the length direction of the plate 21b so as to be close to the rising receiving portion and a total of four are opposed to each other. Two of them are piled up in the rising direction of the receiving part and are rotatably provided, and a total of eight are mounted. The bearing 21e located on the lower side (plate side) is fixed to the plate 20b, and the sliding contact groove 21
The sliding rail 20d of the base 20 is slidably engaged with f. On the other hand, a sliding rail 18f of the cover body 18 is provided on the bearing 21d located on the upper side.
Are slidably engaged.

The rising portion 21g and the rising portion 20c formed on the base 20 are connected by adjustable tightening means. One end of the tightening means is the rising portion 21 of the sliding body 21.
It has a screw 22 fixed to g and having the other end penetrating the rising portion 21c of the base 20 and provided with a knob 22b. A coil ammunition machine 22a is fitted on the screw 22 between the compatible rising portions. is there. The other end of the screw 22 is screwed into the knob 22b, and the screw 22 is rotated by rotating the knob 22b.
Moves forward and backward, and the sliding member 21 moves to the base 2 accordingly.
It slides to the left and right in the length direction of 0.

Reference numeral 23 is a rectangular parallelepiped side forming the side wall of the head mounting body 21. The side wall 23 has a screw hole 23b formed at the center of the side wall and a screw at both end portions of the upper wall. A hole 23a is provided. From the screw holes 18h formed in the vicinity of the four corners of the cover body 18, screws are screwed into the screw holes 2
The cover body and the side edge 23 are fixed to each other by being screwed into 3a. The screw hole 2 is provided outside the rising portion 21c of the sliding body 21.
1h is formed, and the slide adjusting screw 24 is screwed through the screw hole 23b of the side edge 23. A sliding position stator 24a is screwed onto the screw 24, and the sliding position of the cover body 18 is adjusted and fixed by screwing the stator 24a forward and backward.

In the above construction, the processing apparatus 1 receives a control signal from a personal computer (not shown).
Indicates that the machining mechanism 5 and the machining table 3 are moved to a predetermined machining position based on the movement data in the left-right direction X and the front-rear direction Y, the machining mechanism 5 is vertically moved, and the rotating cutting element 7 is copper. A desired cutting process is performed on the stretched base plate 2. By continuously moving the processing mechanism 5 in the direction X and the direction Y while the cutting element 6b is in contact with the copper-clad original plate 2, a printed wiring pattern according to the circuit design is formed on the copper-clad original plate 2, and the direction X and By vertically moving the processing mechanism 5 equipped with the cutting element 7 which rotates at each movement based on the direction Y, a hole is made at a predetermined position on the copper-clad original plate 2 (counterbore).
Processing can be performed continuously.

In order to perform soldering work or through-hole treatment, first, the screw 16 is loosened, the cutting head 6 is removed from the processing mechanism 5, and the fitting portion 13 of the application head mounting body 11 is processed by the processing mechanism. 5 is fitted into the fitting receiving portion 9 of the screw 1
Fix with 6. Next, the dispenser 10 is inserted into the insertion hole 18
a, the notch 21a, and the insertion hole 20a are fitted and inserted into the mounting portion 18b with the screw 18d. Here, when it is desired to adjust the position of the dispenser 10 in the front-rear direction Y, the sliding body 21 is slid by sliding the sliding body 21 by screwing the screw 22 forward and backward with the knob 22b. Cover
The body 18 slides, and as a result, the dispenser 10 mounted on the cover body 18 can be positioned in the front-rear direction Y. In order to adjust the position of the dispenser 10 in the left-right direction X, the left and right stators 24a are screwed forward and backward to cover.
The body 18 is slid to bring the stator 24a into contact with the side edge 23 to fix the adjusted position. That is, the position of the tip of the dispenser 10 of the application head can be adjusted by adjusting the relative position of the insertion hole 18a in the horizontal direction (left-right direction X and front-back direction Y) with respect to the fitting portion 13. ing. After adjusting the position of the tip of the dispenser to match the desired start position, the coating operation is started. Upon receiving a control signal from a personal computer (not shown), the processing apparatus 1 moves the processing mechanism 5 to a predetermined paste application position with the movement data in the left-right direction X and the front-rear direction Y, and after the movement, the processing mechanism 5 descends. Then
The controller receiving the application signal operates the screw pump 12 for a predetermined time, and the dispenser 10 automatically applies the paste to a predetermined portion of the substrate 2. And
If you insert electronic parts into the board, put it in a constant temperature bath and heat it,
Soldering is completed. Further, when the conductive adhesive is applied, the through-hole treatment is completed only by the application.

[0020]

According to the present invention, the soldering work or the through-hole treatment which has been conventionally performed manually can be automatically performed by using the detachable coating head mounting body. According to the present invention, it is possible to efficiently manufacture a printed circuit board in a short time. By controlling the processing control and the coating control with integrated software, it is possible to perform the processing work and the coating work as a consistent system, which is efficient. Further, in the case where the horizontal mounting position of the coating head is adjustable, the coating position of the dispenser can be adjusted and the initial start position can be adjusted without moving the processing mechanism.

[Brief description of the drawings]

FIG. 1 is a perspective view of a printed circuit board processing apparatus equipped with a cutting head.

FIG. 2A is a side view of a cutting head. (B) A side view of the coating head. (C) Side view of a dispenser (d) Perspective view showing a fitting receiving portion provided in a head mounting portion of a processing device.

FIG. 3A is a perspective view of a printed circuit board processing apparatus equipped with a coating head. FIG. 3B is a perspective view showing a mounting state of the coating head.

FIG. 4A is a plan view of the cover body as viewed from the back side. (B) The side view of a cover body. (C) A front view of the cover body. (D) Rear view of the cover body. (E) A plan view of the cover body as seen from above.

FIG. 5 (a) is a plan view of the main body of the application head mounting body with the cover body removed from the coating head mounting body. (B) The figure which looked at the main body of the application head mounting body from the fitting part.

FIG. 6 is a plan view in which a part of the application head mounting body is disassembled and viewed from the back side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Processing device 2 Copper-clad original plate 3 Processing table 4 Moving support body 6 Cutting processing head 10 Dispenser 11 Application head mounting body 13 Fitting part 18 Cover body 19 Main body X Left-right direction Y Front-back direction

Claims (3)

[Claims] 1. A processing mechanism in which a copper-clad original plate is placed and fixed on a processing table, and a cutting head is detachably installed vertically above the copper-clad original plate so as to be movable up and down. The processing of the printed circuit board processing apparatus, which makes the relative position of the processing mechanism movable in the horizontal direction and controls the relative movement and lowering operation of the processing mechanism to perform a desired cutting process on the copper clad original plate. A coating head mounting body that is detachably mounted on a mechanism and has an insertion hole for inserting and fixing a paste coating dispenser. 2. The coating head mounting body has a fitting portion with the processing mechanism, and is configured such that the relative position of the insertion hole in the horizontal direction with respect to the fitting portion can be adjusted. Item 1. A removable coating head according to Item 1. 3. The coating head mounting body according to claim 1, wherein the copper clad original plate is placed and fixed on the processing table, and the dispenser is fitted and fixed in the insertion hole above the copper clad original plate. A processing mechanism that is detachably mounted is provided so as to be able to move up and down, and the horizontal relative position of the processing mechanism with respect to the copper clad original plate can be moved, and the relative movement of the processing mechanism, the lowering operation, and the paste coating operation are controlled By doing so, a printed circuit board processing apparatus adapted to apply the paste to a desired portion of the printed circuit board on which a predetermined cutting process has been formed.