JPH0896865A - Electric contact - Google Patents

Abstract

PURPOSE: To provide proper electric continuity across electric contacts under a low contact force by using a hard ceramic covered with the required plating for the contacts on a conductor pattern. CONSTITUTION: A flame sprayed coat 4A of a ceramic is formed on a conductive pattern on a substrate 1 at the positions of electric contacts, and the surface of the coat 4A is plated with tin or an alloy thereof. As a result, even when the electric contacts 90 of an IC 9 continuous to each other are kept in contact with the substrate 1 under a low contact force, good electric continuity can be provided through an oxide or a contaminant adhering to the contacts 90. Thus, electric continuity can be provided without crushing the oxide or contaminant and, therefore, good electric continuity can be provided even in a multi-core IC under small contact pressure. In this case, coat 4A is 5 to 50μm thick, and the ceramic is preferably made of ZrO2 and TiO2 having conductivity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical contact, and more particularly to an electrical contact for connecting an electronic component or the like to a board or the like. More specifically, it relates to an FPC board, a printed board, a QFP.
The present invention relates to electrical contacts for connecting a type IC and a test socket, a BGA type IC and a test socket, and the like.

[0002]

2. Description of the Related Art Conventionally, a good electrical connection between an electronic component or the like and a substrate or the like has been achieved by crushing oxides or contaminants on the surface of an electrical contact, which is an obstacle, by applying a contact pressure of about 100 g per core. Was getting by.

[0003]

However, as the performance of ICs has increased, the number of terminals has increased in proportion thereto, and the number of terminals having 100 or more cores is not small. Under these circumstances, in order to obtain a good connection by crushing oxides and contaminants on the electrical contact surface,
When crushing with a contact pressure of 100 g per core, a contact pressure of 10 kg or more is required as a whole. Therefore, the mechanism of the terminal portion and its related members, strength,
The dimensions must be designed so as to withstand this excessive contact pressure, which has been a factor in increasing costs.
This becomes a big problem as the number of cores is increased, and it has become a big barrier in the future.

The present invention has been proposed in view of the above problems of the prior art. Even if the number of cores is large and a large contact pressure is not applied between the contacts that are conductively connected to each other,
It is proposed for the purpose of obtaining an electrical contact capable of obtaining reliable conduction between contacts (terminals).

[0005]

In order to achieve the above object, a first invention is to form a ceramic sprayed coating at a position of an electric contact portion on a conductor pattern, and then perform tin plating or its alloy plating. It is possible to obtain an electrical contact characterized by the above.

Further, according to the first invention, it is possible to obtain an electrical contact characterized in that the thickness of the conductor pattern is several μm to several tens μm.

Further, according to the first aspect of the present invention, it is possible to obtain an electrical contact characterized in that the ceramic sprayed coating has a thickness of 5 to 50 μm.

Further, according to the first invention, it is possible to obtain an electric contact characterized in that the ceramic is ZrO2 or TiO2 having conductivity.

A second invention is to obtain an electric contact characterized in that a metal coating is formed on a conductor pattern and a sprayed coating of conductive ceramics is formed at a position of the electric contact portion on the metal coating. You can

The second aspect of the present invention can provide an electrical contact characterized in that the conductor pattern has a thickness of several μm to several tens of μm.

A second aspect of the present invention is that the metal film has
It is possible to obtain an electrical contact characterized by being formed with a film thickness of 10 μm.

The second aspect of the present invention can provide an electrical contact characterized in that the conductive ceramic sprayed coating has a thickness of 5 to 50 μm.

In a second aspect of the invention, the conductive ceramics are WC, TiB2, ZrB2, TiN, ZrN, C.
It is possible to obtain an electrical contact characterized by being formed by cermet thermal spraying using either Ni--Cr alloy or Co alloy, which is either r3 C2 or TiC.

The second aspect of the present invention can provide an electric contact characterized in that a plating layer is formed on the electric contact formed as described above.

In a third aspect of the present invention, a metal coating is formed on a conductor pattern, a thermal spray coating of ceramics is formed at a desired electric contact portion position on the metal coating, and a nickel plating layer or An electrical contact characterized by forming a gold plating layer can be obtained.

The third aspect of the present invention can provide an electrical contact characterized in that the ceramic sprayed coating has a thickness of 5 to 50 μm.

In a third aspect of the invention, the metal film has
It is possible to obtain an electrical contact characterized by being formed with a film thickness of 10 μm.

The third aspect of the present invention can provide an electrical contact characterized in that the ceramic is ZrO2 or TiO2 having conductivity.

Also, an electrical contact is obtained in which the thermal spray coating of the ceramic is formed by thermal spraying a powder obtained by coating a ceramic powder for thermal spraying with a metal, for example, nickel / gold / amorphous alloy in advance. be able to.

Furthermore, the particle size of the powder used for thermal spraying is 5 to 5.
It is possible to obtain an electrical contact characterized by having a thickness of 50 μm.

[0021]

According to the present invention having the above-mentioned structure, even if the electric contact portions which are electrically connected to each other are brought into contact with each other with a low contact force,
In the present invention, the hard ceramics plated with tin or an alloy thereof are used to break through oxides and contaminants by the conductive ceramics in the second invention, and the hard ceramics plated with nickel or gold in the third invention. Good conduction can be obtained.

[0022]

Embodiments of the present invention will now be described with reference to the accompanying drawings.

FIG. 1 shows an embodiment of the first invention. In this embodiment, a case where the leads of the QFP type IC and the test socket are electrically connected to each other will be described as an example.

As shown in FIG. 1, a conductor pattern 2 made of, for example, copper is formed on a substrate 1 of a test socket. The conductor pattern 2 is formed by an additive method or a subtractive method to have a thickness of, for example, several tens of μm.

Next, a sprayed coating 4A of ceramics (or oxide ceramics) is formed on the conductor pattern 2 formed as described above. The thermal spray coating 4A is formed to have a film thickness of 5 to 50 μm. At this time, the ceramic sprayed coating 4A has a surface roughness of 5-5.
The thickness is about 0 μm, and the electric contact has a protrusion sufficient to break through oxides and contaminants attached to the electric contact portion 90 of the IC 9.

Then, after that, tin plating is applied to the surface of the ceramic sprayed coating layer 4A to form electrical contacts on the substrate 1 side. As a result, even if the electrical contact portion 90 of the IC 9 and the electrical contact on the substrate 1 side are brought into contact with each other with a low contact force, sufficient conduction can be obtained.

Next, an embodiment of the second invention will be described. Similarly to the first embodiment, the second embodiment of the invention will be described by taking as an example the case where the leads of the QFP IC and the test socket are electrically connected to each other.

As shown in FIG. 2, a conductor pattern 2 made of a material such as copper is formed on the substrate 1 of the test socket.
Is formed. The conductor pattern 2 is also formed by an additive method or a subtractive method so as to have a thickness of, for example, several tens of μm.

On the surface of the conductor pattern 2, the thickness 1
A metal film having a thickness of 10 μm, for example, a plating layer 3 of nickel or its alloy is formed. This is for the purpose of preventing corrosion of copper, which is the material of the conductor pattern 2, and for improving the adhesion of the conductive ceramics, which will be described later, to cermet thermal spraying using a Co, Ni—Cr alloy.

Next, a sprayed coating 4B of conductive ceramics is formed on the plating layer 3 formed as described above. The thermal spray coating 4B is formed to have a film thickness of 5 to 50 μm. At this time, the conductive ceramics sprayed coating 4B has a surface roughness of about 5 to 50 μm.
9 is an electric contact having protrusions sufficient to break through oxides and contaminants attached to the electric contact portion 90.

Then, if necessary, the surface of the conductive ceramics sprayed coating layer 4B is plated with tin, for example. As a result, sufficient electrical continuity can be obtained even if the electrical contact portion 90 of the IC 9 and the electrical contact on the substrate 1 side are brought into contact with each other with low contact force.

Next, the third invention will be described. Third
Similarly to the first embodiment of the invention, the embodiment of the invention of
An example will be described in which the leads of the mold IC and the test socket are electrically connected to each other.

As shown in FIG. 3, a conductor pattern 2 made of a material such as copper is formed on the substrate 1 of the test socket.
Is formed. The conductor pattern 2 is also formed by an additive method or a subtractive method so as to have a thickness of, for example, several tens of μm.

On the surface of the conductor pattern 2, the thickness 1
A metal film having a thickness of 10 μm, for example, a plating layer 3 of nickel or its alloy is formed. The plating layer 3 is provided for the purpose of preventing corrosion of copper, which is the material of the conductor pattern 2, and for functioning as an undercoat during thermal spraying of ceramics, which will be described later, to enhance adhesion.

Next, a sprayed coating 4C of ceramics (or oxide ceramics) is formed on the plating layer 3 formed as described above. The thermal spray coating 4C is formed to have a film thickness of 5 to 50 μm. At this time, the ceramic sprayed coating 4C has a surface roughness of 5 to 50.
The thickness is about μm, and the electric contact has a protrusion sufficient to break through oxides and contaminants attached to the electric contact portion 90 of the IC 9.

If necessary, the surface of the electrically conductive ceramics sprayed coating layer 4C is plated with, for example, tin or gold. As a result, sufficient electrical continuity can be obtained even if the electrical contact portion 90 of the IC 9 and the electrical contact of the substrate are brought into contact with each other with a low contact force.

Further, an electrical contact is obtained in which the ceramic sprayed coating is formed by spraying a powder obtained by coating a ceramic powder for thermal spraying with a metal, for example, nickel / gold / amorphous alloy in advance. be able to.

Furthermore, the particle size of the powder used for thermal spraying is 5 to 5.
It is possible to obtain an electrical contact characterized by having a thickness of 50 μm.

[0039]

As described above, according to the present invention, at least one of the electrical contacts electrically connected to each other is pierced by the oxides and contaminants adhering to the electrical contacts of the other party to form a conductor of the other party. Good conduction can be obtained. As a result, conduction can be obtained without crushing oxides and contaminants attached to the mating electrical contacts, so that good conduction can be obtained even with a multi-core IC with a small contact pressure. As a result, the structure of the IC socket can be made simple and small. Also, IC
Since it is not necessary to use a package having a relatively high strength, it is possible to use an inexpensive material, and the manufacturing cost can be reduced also from this point.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the first invention.

FIG. 2 is an explanatory diagram showing an embodiment of the second invention.

FIG. 3 is an explanatory diagram showing an embodiment of the third invention.

[Explanation of symbols]

 1 Substrate 2 Conductor Pattern 3 Plating Layer 4A Ceramics Thermal Spray Coating 4B Conductive Ceramics Thermal Spray Coating 4C Ceramics Thermal Spray Coating

Front page continued (72) Inventor Tadashi Fukumoto 1-21-6 Dogenzaka, Shibuya-ku, Tokyo Within Japan Aviation Electronics Industry Co., Ltd. 3 Shinshu Ceramics Co., Ltd.

Claims (13)

[Claims] 1. At a position of an electrical contact portion on a conductor pattern,
An electrical contact characterized in that a thermal spray coating of ceramics is formed and tin plating or its alloy plating is applied on the thermal spray coating. 2. The ceramic sprayed coating has a thickness of 5 to 5.
The electrical contact according to claim 1, wherein the electrical contact has a thickness of 50 μm. 3. The Zr, wherein the ceramic has conductivity.
2. O2 or TiO2.
Or the electrical contact described in 2. 4. An electric contact, wherein a metal film is formed on a conductor pattern, and a sprayed film of conductive ceramics is formed at a position of the electric contact portion on the metal film. 5. The electrical contact according to claim 4, wherein the metal film is formed to have a film thickness of 1 to 10 μm. 6. The electrically conductive ceramics sprayed coating is 5 to 5.
The electrical contact according to claim 4, wherein the electrical contact is formed to have a film thickness of 50 μm. 7. The conductive ceramics are WC and TiB.
7. ZrB2, TiN, ZrN, Cr3 C2, or TiC, which is formed by cermet thermal spraying using a Ni--Cr alloy or a Co alloy. The electrical contacts listed. 8. The electrical contact according to claim 4, 5 or 6 or 7, wherein a plating layer is formed on the sprayed coating of the conductive ceramics. 9. A metal coating is formed on a conductor pattern, a ceramic thermal spray coating is formed at a desired electric contact portion position on the metal coating, and a nickel plating layer or a gold plating layer is formed thereon. An electrical contact characterized by being used. 10. The electrical contact according to claim 9, wherein the metal coating is formed to have a film thickness of 1 to 10 μm. 11. The Z, wherein the ceramic has conductivity.
The electrical contact according to claim 9 or 10, which is rO2 or TiO2. 12. The ceramic sprayed coating is formed on a ceramic powder for thermal spraying in advance with a metal such as nickel / gold / gold.
The electrical contact according to claim 1, 4 or 9, which is formed by spraying powder coated with an amorphous alloy. 13. The particle size of powder used for thermal spraying is 5 to 50.
The electric contact according to claim 12, wherein the electric contact is μm.