JPH088317A - Semiconductor device transfer system - Google Patents

Abstract

PURPOSE:To obtain a system for transferring semiconductor devices continuously by eliminating the waiting time for a tray. CONSTITUTION:The semiconductor device transfer system comprises a section 3 for clamping a tray 1, a cylinder 5 for driving the clamping section 3 vertically, a motor 4 for feeding the tray 1 pitch by pitch, a belt 7 for transmitting the motion of the motor 4, a tray stopper 2, and a cylinder 6 for feeding a transferred tray to a housing section, wherein a semiconductor device is transferred at a position shown by an arrow (a).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device transfer apparatus, and more particularly to a semiconductor device transfer apparatus which does not have a semiconductor storage tray exchange waiting time.

[0002]

2. Description of the Related Art FIG. 8 is a block diagram of a conventional semiconductor device transfer apparatus, and FIG. 9 is a side view of an elevator.

The tray supply unit vertically stacks the trays 1, and the elevator 16 moves up and down by a motor 17.
The tray 1 moves up and down by (16a, 16b).
The tray 1 is picked up from the upper surface of the tray 1 (not shown) when it is raised to the supply position by the elevator 16a.
Then, the tray 1 is adsorbed, conveyed to the tray storage portion, and placed on the storage elevator 16b.

The semiconductor device is sucked by the suction unit 8 at the tip of the arm 9 by an intermediate table (not shown), and the arm 9 is moved in the XY directions by a movement control unit (not shown) to place the semiconductor device on the storage elevator 16b. Transfer to a certain tray 1. When the tray 1 on the storage elevator 16b is full, the storage elevator 16b is lowered by the thickness of the tray 1 and an empty tray is supplied from the tray supply elevator 16a by the above method. Therefore, the semiconductor device transfer operation could not be performed until an empty tray was supplied.

In addition, another conventional tray exchange technique is Japanese Patent Publication No.
It is disclosed in Japanese Patent Publication No.-54467.

FIG. 10 is a block diagram showing the method of the publication. The tray 1 is stored in the tray magazine 18,
The tray 16 is moved up and down by the elevator 17 that is moved up and down by the motor 17 to match the height of the tray pedestal 21, and then the tray 1 is moved by the pushing cylinder 19.
Is pushed out onto the tray pedestal 21. After pushing out, the pickup collet 22 at the tip of the arm 9 is moved by a driving device (not shown) to move the XYZ table 23 to perform position control and take out chips (semiconductor devices) one by one from the tray 1. Chips are supplied to an intermediate table (not shown). After all the chips of the tray 1 are removed, the empty tray 1 is pushed back into the tray magazine 18 by the storage cylinder 20, and then the elevator 16 is lowered to perform the same work on the new tray of the next stage.

[0007]

In these conventional semiconductor device transfer apparatuses, when a tray is full, an empty tray is supplied until the tray is full, or a semiconductor device such as a chip in the tray is conveyed to empty the tray. In this case, the semiconductor device cannot be transferred until the tray on which the next chip is mounted is supplied, and there is a problem of an empty tray supply waiting time. Also, when the semiconductor device is transferred, the mechanism is required to move the arm in the XYZ directions because the tray is fixed.

[0008]

The features of the present invention are: a sandwiching portion for holding a supplied tray, a means for pitch feeding the tray in the X direction, for example, a motor, and a semiconductor device mounted on the tray. An arm, a means for driving the arm in the Y direction, for example, a motor, a control section for controlling the movement of the arm, and a means for moving the sandwiching section up and down in order to move it from the already transferred tray to the next tray. , For example, a cylinder and a means for pushing out the transferred tray to the tray storage portion, for example, a cylinder, which eliminates the waiting time of the tray and enables the semiconductor device to be transferred without interruption. On board equipment. It is preferable that the tray has a structure in which the semiconductor devices are arranged in the X direction and the Y direction and accommodated in a matrix. The transfer here is an operation of housing the semiconductor device in the tray or an operation of carrying out, that is, taking out the semiconductor device from the tray.

Another feature of the present invention is that a sandwiching portion for holding the supplied lead frame, a means for pitch-feeding the lead frame in the X direction, for example, a motor, and a lead frame that has been processed to the next lead frame. In order to replace the lead frame with a new one, it has means for moving the sandwiching part up and down, for example, a cylinder, and means for pushing the worked lead frame into the lead frame housing part, for example, a cylinder, eliminating the waiting time of the lead frame and performing the work. This is a semiconductor device transfer apparatus that can be performed without interruption. Here, it is preferable that the sandwiching portion is composed of a pin, and the pin is positioned and moved by inserting the pin into a positioning hole of the lead frame by moving the pin up and down by a cylinder.

[0010]

The present invention will be described below with reference to the drawings.

FIG. 1 is a side view showing an embodiment of the present invention, and is a perspective view showing the semiconductor device transferred to a tray in the embodiment of FIG.

A semiconductor device transfer apparatus according to the present invention includes a tray sandwiching section 3 for picking up one tray 1 from an elevator (not shown), and a cylinder (CY) 5 for moving the tray sandwiching section 3 up and down. , A motor (M) 4 for feeding the tray 1 at a pitch, a belt 7 for transmitting the drive of the motor (M) 4, a tray retainer 2 for fixing the tray 1, and a suction portion 8 for sucking the semiconductor device. Arm 9 for transferring the semiconductor device to tray 1, and arm 9
1 has a motor 10 for driving the motor 10, a control unit 11 for controlling the motor 10 and the suction mechanism 8, and a cylinder (CY) 6 for sending the transferred tray to the tray storage unit. 2 is the transfer position of the semiconductor device, and the direction indicated by the arrow b in FIG. 2 indicates the direction (X direction) in which the tray 1 is pitch-fed by the belt 7 by the drive of the motor (M) 4, and the arrow c The direction indicated by means the direction (Y direction) in which the semiconductor device is held by the suction unit 8 and transferred by the arm 9. The X direction and the Y direction are directions orthogonal to each other in the same plane. Also, the motor (M)
The operations of the cylinders (CY) 5, 6 and the like are also controlled by a control unit (not shown), and this control unit is connected to a computer (not shown) together with the control unit 11 to perform an automatic transfer operation. Further, the tray 1 has storage portions (recesses) 1A arranged in the X direction (b direction) and the Y direction (c direction) so that a large number of semiconductor devices can be stored in a matrix. The tray retainer 2 has an opening 2A formed in the tray retainer 2 so as to cover and hold one row of the storage portions 1A, and the tray retainer 2 has an opening 2A formed therein. To be done.

3 to 5 are side views showing the operation of the embodiment of the present invention, and FIG. 6 is a view seen from the side of the storage section.

FIG. 3A shows the setting for transferring the semiconductor device to the first row of the tray 1, and the arrow a indicates the transfer position.
When the arm shown in FIG. 2 finishes the transfer of the first row, the tray retainer 2 rises, and the tray 1 is moved to the position of the second row as shown in FIG.
Pitch feed. When the pitch feed of the tray 1 is completed, the tray retainer 2 is lowered, the tray 1 is fixed, and the second row semiconductor devices are transferred.

When the operation of FIGS. 3A to 3B is repeated up to the final row and the final row of the tray 1 is reached, FIG.
As shown in (C), tray supply elevator (not shown)
The tray 1'is supplied.

Next, as shown in FIG. 4A, the tray holding portion 3 is lowered by the cylinder 5 in a state where the tray 1 is fixed by the tray retainer 2 (transfer state of the semiconductor device), and FIG.
As shown in (B), the tray holding portion 3 is moved to the tray supply portion side to hold the next tray 1'by driving the motor 4.

At this time, the tray 1 is supported by the guide rails 12 shown in FIG. 6, and the guide rails 12 correspond to three trays 1 in this embodiment (from the tray supply side to the storage side).
It has a length that can support the and is fixed by the tray retainer 2.

Next, as shown in FIG. 4 (C), the cylinder 5 rises to hold the tray 1'with the tray sandwiching portion 3.

The operation of changing the trays shown in FIGS. 3 (C) to 4 (C) is completed while the final row of trays is being transferred.

Next, when the transfer operation of the tray 1 is completed, the tray clamping unit 3 moves the tray 1'to the transfer position by driving the motor 4 as shown in FIG. 5 (A). Simultaneously with the movement of the tray 1 ′, the tray 1 that has completed the transfer operation is pushed out to the tray storage portion by the tip of the tray sandwiching portion 3. Then, when the tray retainer 2 fixes the tray 1 ', as shown in FIG.
As shown in (B), the tip of the tray sandwiching portion 3 is pushed by the cylinder 6 to push out the tray 1 for which the transfer operation has been completed, and the tray 1 is moved to a tray storage portion (not shown). After that, FIG.
It returns to the setting of (A) and repeats the same operation.

Therefore, by performing the operation described above,
By eliminating the tray supply waiting time, semiconductor devices can be transferred without interruption.

Further, conventionally, as shown in FIGS. 8 and 10, the arm 9 is controlled by biaxial control in the X and Y directions.
In the present invention, the pitch feed control is performed in the X direction by the motor 4 and the sandwiching portion 3 shown in FIG. 1, and the pitch feed control is performed in the Y direction by the motor 10 and the arm 9 shown in FIG. Control is possible with only one axis.

In the above embodiment, the supply timing of the next empty tray from the tray supply elevator is exemplified on the basis of the storage in the last row of the previous tray, but other predetermined rows of the previous tray are exemplified. It can also be performed on the basis of the time of storage work in. For example, it is also possible to feed the next empty tray from the elevator while storing the first tray in the first row. Then, the next tray can also be brought closer to the arm direction by pitch feed.

In the above embodiment, the case where the semiconductor device is stored in the tray has been described as an example, but it is obvious that the semiconductor device can be carried out from the tray by the same operation.

FIG. 7 is a side view showing an example in which the technique of the above embodiment is applied to the conveyance of a lead frame. Note that, in FIG. 7, the same or similar functions as those in FIGS. 1 to 6 are denoted by the same reference numerals and symbols, and a duplicate description will be omitted.

In a strip-shaped lead frame, semiconductor devices (chips) are generally mounted in one direction (horizontal direction in the figure), for example, on islands arranged. Therefore, for example, the carrying method of the present invention is suitable for the work of automatically die-bonding a semiconductor device to a lead frame. In FIG. 7, work stages such as a die bonding stage are not shown.

As a method of carrying, the pins 13a and 13b are inserted into the pin holes of the lead frame 14 to hold the lead frame 14. Then, the lead frame 14 is pitch-fed to the work stage by the motor 4. At the final working position of the lead frame 14, the pins 13a,
When the cylinder 5 and the motor 4 are driven, b moves to hold the lead frame supplied from the supply unit (not shown), and the pins 13a and 13b are moved up by the drive of the cylinder 5. In addition, the pin 13c is also driven by the cylinder 15
Lead frame 1 that has been lifted at the same time as a and b and has completed the work
The pin 13c is inserted into the pin hole 4 to hold the lead frame. The supplied lead frame 14 is moved to the work stage by driving the motor 4, and the lead frame 14, which has already been finished while the work is being performed, is transferred to the storage portion of the cylinder 6
And the pin 13c is lowered by the cylinder 15 to release the lead frame 14 and the pin 13 is pushed by the cylinder 6.
Return c to its original position.

Therefore, by performing the operation described above,
Lead frames can be supplied without interruption.

[0029]

As described above, according to the present invention, by feeding the trays and the lead frames by pitch, the supply of the trays and the lead frames can be eliminated and the semiconductor device transfer work can be performed without interruption. As a result, the tray supply waiting time can be reduced from about 8 seconds to 0 seconds.
In addition, since the tray is pitch-fed to the storage side,
Pitch feed direction (X direction) for arm part of semiconductor device transfer
Since it can be done only by moving in the vertical direction (Y direction) in the plane,
The semiconductor device can be transferred by controlling the drive system of the arm unit from the conventional two axes (X and Y directions) to only one axis (Y direction).

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an embodiment of the present invention.

FIG. 3 is a side view showing the operation of the embodiment of the present invention.

FIG. 4 is a side view showing the operation of the embodiment of the present invention.

FIG. 5 is a side view showing the operation of the embodiment of the present invention.

FIG. 6 is a view of the embodiment of the present invention viewed from the side of the storage section.

FIG. 7 is a side view showing a carrying technique of an embodiment to which the embodiment of FIGS. 1 to 6 is applied.

FIG. 8 is a perspective view showing a conventional technique.

FIG. 9 is a side view showing an elevator in a semiconductor device transfer apparatus.

FIG. 10 is a perspective view showing another conventional technique.

[Explanation of symbols]

 1 tray 1'next tray 2 tray retainer 3 tray clamp 4 pitch feed motor 5 tray clamp vertical cylinder 6 transferred tray push cylinder 7 belt 8 adsorption 9 arm 10 motor 11 controller 12 guide rail 13a, 13b pin 13c Worked leadframe feed pin 14 Leadframe 15 Pin 10c vertical cylinder 16 Elevator 16a Supply elevator 16b Storage elevator 17 Motor 18 Tray magazine 19 Push-out cylinder 20 Storage cylinder 21 Tray cradle 22 Pickup collet 23 XYZ table

Claims (5)

[Claims] 1. A sandwiching part for holding a supplied tray, a means for pitch-feeding the tray in the X direction, an arm for transferring a semiconductor device to the tray, and a means for driving the arm in the Y direction. A control unit for controlling the movement of the arm, a unit for moving the sandwiched unit up and down in order to move it from the transferred tray to the next tray, and a unit for pushing out the transferred tray to the tray storage unit. And a semiconductor device transfer device capable of transferring semiconductor devices without interruption, eliminating the tray waiting time. 2. The transfer device for a semiconductor device according to claim 1, wherein the tray has a structure in which the semiconductor devices are arranged in the X direction and the Y direction to be housed in a matrix. 3. The semiconductor device transfer apparatus according to claim 1, wherein the transfer is an operation of storing the semiconductor device in the tray or an operation of unloading the semiconductor device from the tray. . 4. A sandwiching part for holding the supplied lead frame, a means for pitch-feeding the lead frame in one direction, and a sandwiching part for switching the worked lead frame to the next lead frame. A semiconductor device having means for moving up and down and means for pushing out the worked lead frame to the lead frame housing portion, eliminating the lead frame waiting time and enabling the work to be performed without interruption. Transfer device. 5. The pinching portion is composed of a pin, and the lead frame is positioned and moved by inserting the pin into a positioning hole of the lead frame by moving the pin up and down by a cylinder. The semiconductor device transfer apparatus according to claim 4.