JPH0869971A - Belt driving device in belt driven atmospheric pressure cvd device - Google Patents

Abstract

PURPOSE: To provide a belt driven atmospheric pressure CVD device capable of preventing a belt from slipping from a track for stabilizing the film formation on a semiconductor wafer as well as suppressing dust raising furthermore lengthening the belt life. CONSTITUTION: Within the belt driven atmospheric pressure CVD device provided with a film forming device 3, a belt driving device 4 is formed of belt position regulating flanges R on both ends of rollers 42A, 42G positioned at least on the inlet.outlet sides of a film forming device 3 of rollers 42 guiding and driving a meshy belt 41.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a belt drive type atmospheric pressure CV used in a manufacturing process for manufacturing a semiconductor device or the like.
The present invention relates to a belt drive device in device D.

[0002]

2. Description of the Related Art First, a belt driving device in a conventional belt driving type atmospheric pressure CVD apparatus will be described with reference to FIGS. FIG. 2 is a front view of a belt drive apparatus in a conventional belt drive type atmospheric pressure CVD apparatus, and FIG. 3 is a conceptual top view in which a housing of the conventional belt drive type atmospheric pressure CVD apparatus is partially broken. 4 is a conceptual and schematic cross-sectional view taken along the line AA of FIG.

First, the structure of a conventional belt-driven atmospheric pressure CVD apparatus (hereinafter simply referred to as "atmospheric pressure CVD apparatus") will be described with reference to FIGS. Reference numeral 1 generally indicates an atmospheric pressure CVD apparatus. This atmospheric pressure CVD apparatus 1 is found in the WJ-999 series manufactured by Watkins Johnson, USA, and is, for example, an apparatus for producing a thin film on the surface of a semiconductor wafer S while conveying the semiconductor wafer S by a mesh belt. A film forming device 3 surrounded by a muffle 2, a belt driving device 4 having a belt 41 for conveying the semiconductor wafer S to the film forming device 3, a belt cleaning / drying device 5, and a semiconductor wafer S carried into the belt 41. Loading device 6
And a casing 8 enclosing the film forming device 3, the belt driving device 4 and the like, and a unloading device 7 for unloading the semiconductor wafer S from the belt 41. A side wall 9 exists between the carry-in device 6, the carry-out device 7, and the film forming device 3.

As shown in FIG. 4, the film forming apparatus 3 is
A plurality of, in the illustrated example, three heads 31 for injecting a reaction gas are provided, and the space between the heads 31 and the outside of the heads 31 at both ends are curtains of nitrogen gas N ₂ injected by an injection device (not shown). Shielded by. The semiconductor wafer S mounted on the mesh belt 41 containing nickel as a main component is passed under the heads 31, and the reaction gas ejected from each head 31 causes, for example, SiO 2.
₂ thin film, BPSG thin film, PSG thin film for each semiconductor wafer S
Generated on the surface of.

As shown in FIG. 4, the belt cleaning / drying device 5 comprises an etching device 51, a pure water cleaning device 52, and a drying device 53, and any one of the thin films attached to the belt 41 at the time of film formation. Is etched and washed with hydrofluoric acid, then washed with pure water, and dried by heating the lamp of the dryer 53.

The carrying-in device 6 includes a transfer robot 61 arranged in the central portion, two carrier mounting tables 62 arranged so as to surround the transfer robot 61, and the casing on the left side of the transfer robot 61 in the figure. A carrier C having a plurality of semiconductor wafers S accommodated therein is mounted on the carrier mounting table 62, and each carrier C is transferred to the semiconductor by the transfer robot 61. The wafers S are sequentially transferred one by one onto the transfer rail 63, and the semiconductor wafers S are transferred from the transfer rail 63 onto the belt 41.

Further, the carry-out device 7 is provided with a carrier robot 71 arranged at the center, two carrier mounting tables 72 arranged so as to surround the carrier robot 71, and the casing on the right side of the carrier robot 71 in the figure. Two carrier rails 73 and an auxiliary carrier table 7 extending from the body
4 and the belt 41 to the transport rail 7
No. 3 semiconductor wafer S formed in a desired state and transferred to No. 3
Is placed on each carrier placing table 72 by the transfer robot 71 and accommodated in each empty carrier C waiting. The semiconductor wafer S when trouble occurs on the belt 41 and the transfer rail 73 is stored in the auxiliary carrier Ca on the auxiliary carrier mounting table 74.

As shown in FIG. 4, the belt driving device 4 includes an annular belt 41 and a plurality of rollers 42A, 42A.
B, 42C, 42D, 42E, 42F and 42G, the belt 41 passes under each head 31 of the film forming apparatus 3, and is turned downward by a roller 42A at the left end of the muffle 2, After being horizontally rolled by the roller 42B located immediately below and passing through the etching device 51, a part of the belt 41 is partially separated from the pure water cleaning device 52 by the roller 42C located at the inlet side of the pure water cleaning device 52. The belt 41, which is guided in the pure water by the roller 42D existing in the water and exits the pure water, is redirected to the roller 42E existing on the outlet side of the pure water cleaning device 52, and is directed upward by the roller 42F. , And is turned by the roller 42G toward the film forming apparatus 3,
It is guided horizontally.

Each of the rollers, for example, the roller 42A,
As shown in FIG. 2, the roller body 42Aa is flat, and the shafts 42Ab extending from both ends thereof are supported by the bearings 43.

The role of the roller 42A having such a structure is as follows: Smooth the movement of the belt 41. The purpose is to prevent the belt 41 from being displaced.

Next, the operation of the belt drive type atmospheric pressure CVD apparatus 1 having such a structure will be described. The semiconductor wafers S are transferred one by one from the carrier C by the transfer robot 61 to the transfer rail 63.
And transferred to the belt 41. The semiconductor wafer S transferred on the belt 41 moves in the muffle 2 at a constant speed. Inside the muffle 2 is a heater (not shown) 4
The temperature is raised to around 00 ° C., a desired thin film is formed on the surface of the semiconductor wafer S by the film forming gas ejected from each head 31, and when the film forming is completed, the film is transferred to the transfer rail 73. It is accommodated in an empty carrier C by the transfer robot 71.
The belt 41 that has finished carrying the formed semiconductor wafer S
The product adhered to the surface of the belt 41 is etched by the etching device 51, washed with pure water in the pure water cleaning device 52, dried by lamp heating in the drying device 53, and again on the carrying-in device 6 side. Return to.

[0012]

The track (position) of the belt 41 is adjusted by adjusting the position of each roller so that there is no track deviation depending on the tension of the belt. However, this adjustment is very difficult, and it is difficult to maintain the same adjustment state for a long time. If this adjustment is insufficient, the belt 41 runs with deviation, so that it does not pass directly under each of the heads 31, the film formation on the surface of the semiconductor wafer S deviates and becomes unstable, and the belt 41 As the belt 41 contacts the side wall of the muffle 2 due to the running of the belt, the dust most disliked in the manufacturing of the semiconductor device is generated, or the belt 41 is stretched at an early stage. It will cause deterioration. The belt drive apparatus in the belt drive type atmospheric pressure CVD apparatus of the present invention aims to solve such a problem.

[0013]

Therefore, the belt drive apparatus of the present invention is a belt drive type atmospheric pressure CV equipped with a film forming apparatus.
In the apparatus D, the above problems are solved by forming a belt position regulating flange at least at both ends of the rollers existing on the entrance and exit sides of the film forming apparatus of the plurality of rollers for guiding and driving the mesh belt. .

[0014]

Therefore, according to the belt drive device of the present invention,
The belt was not displaced, so that the film formation on the semiconductor wafer was stabilized, dust was suppressed, and the life of the belt could be extended.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the belt driving device of the present invention will be described with reference to FIG. FIG. 1 is a front view of a belt driving device in an atmospheric pressure CVD apparatus according to the present invention. The same parts as those of the belt driving device 4 of the prior art are designated by the same reference numerals,
The description thereof will be omitted. Belt drive device 4 of the present invention
Among the plurality of rollers in the belt driving device 4 of the prior art shown in FIG. 4, at least the rollers 42A and 42G on the inlet / outlet side of the film forming apparatus 3 are flat as shown in FIG. The belt 4 is attached to both ends of the roller body 42Aa.
The roller 142 is formed by forming a brim R that regulates the meandering of 1
A, 142G. Only the roller 142A is shown in FIG. These collars R may be formed by inserting "counterbore" into a flat roller. In addition, roller 1 with a collar R
42A is not limited to the rollers existing on the entrance / exit side of the film forming apparatus 3, and may be formed on all the rollers forming the belt driving device 4.

[0016]

As described above, according to the belt driving device of the present invention, the use of the flanged roller eliminates the need for belt adjustment and eliminates the deviation of the orbit of the belt. Therefore, the film formation on the semiconductor wafer is stable. However, dust could be suppressed and the life of the belt could be extended.

[Brief description of drawings]

FIG. 1 is a front view of a belt driving device in an atmospheric pressure CVD apparatus of the present invention.

FIG. 2 is a front view of a belt driving device in a conventional atmospheric pressure CVD apparatus.

FIG. 3 is a conceptual top view in which a case of a conventional atmospheric pressure CVD apparatus is partially broken.

FIG. 4 is a conceptual and schematic cross-sectional view taken along the line AA of FIG.

[Explanation of symbols]

 1 Belt Drive Type Atmospheric Pressure CVD Device 2 Muffle 3 Film Forming Device 31 Head 4 Belt Drive Device 41 Mesh Belt 42Aa Roller Body 42Ab Shaft 43 Bearing 142A Collared Roller 5 Belt Cleaning / Drying Device 51 Etching Device 52 Pure Water Cleaning Device 53 Dryer R Tsuba

Claims (1)

[Claims] 1. A belt drive type atmospheric pressure CV equipped with a film forming apparatus.
In the apparatus D, a belt position control flange is formed on at least both ends of the rollers existing on the entrance side and the exit side of the film forming apparatus among a plurality of rollers for guiding and driving the mesh belt. Belt drive in pressure CVD equipment.