JPH0869855A - Manufacture of test socket of semiconductor device package - Google Patents

Abstract

PURPOSE: To enhance productivity without causing a twist and deformation even if receiving terminals to engage with external terminals are put at a fine pitch by layering engaging parts with the external terminals of a package and the receiving terminals having a deriving pin through a calking part, and molding the layered body by resin. CONSTITUTION: External terminals 2a of a semiconductor device package 2 are inserted in receiving terminals 1, or contact engaging parts 3 are provided, and the intermediate part becomes a socket holder slit corresponding part 5, and a calking part 6 is formed on the tip. When the receiving terminals 1 are punched, calked and layered, a dummy 10 is interposed so that an interval between the adjacent terminals l corresponds to a pitch of the external terminals 2a of the package 2. After the terminals 1 are layered, the slit corresponding part 5 of an intermediate part of deriving pins 4 is formed as a resin block as a resin mold 11. Therefore, the receiving terminals 1 are fixed at intervals in a file shape with insulating performance. Afterwards, when the resin block of the terminals 1 is installed on a holder 12, a test socket 13 where the engaging parts 3 into which the external terminals 2a of the package 2 enter are juxtapoed at prescribed intervals on the obverse side and the pins 4 are juxtapoed at prescribed intervals on the reverse side, is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a test socket for testing the electrical characteristics of a semiconductor device package.

[0002]

2. Description of the Related Art In a semiconductor device package, for example, a semiconductor chip (hereinafter referred to as a chip) is mounted on a pad of a lead frame, a chip terminal and an inner lead are connected by a bonding wire, and a portion inside the inner lead is sealed with a resin or the like. The outer lead of the external terminal is formed into a predetermined shape by protruding from the package.

The semiconductor device has a large number of input / output signal pins and a narrow interval (pitch) due to high functionality, multi-function, miniaturization and the like.

These semiconductor device packages are subjected to an electrical characteristic test for quality assurance and control during or after manufacturing. The test is performed by inserting the external terminals of the semiconductor device package into the test socket.

As described above, the semiconductor device has a large number of pins and a small pitch. For example, the pitch of external terminals is extremely fine, about 0.25 mm. In the electrical characteristic test of such a semiconductor device package, the receiving terminals of the test socket must also have a fine pitch.

[0006]

A receiving terminal with which an external terminal of a semiconductor device package engages is implanted in the test socket. The receiving terminals are formed by pressing or etching, and each of the terminals is manually inserted into the gap of the terminal insertion slit of the socket holder to manufacture the test socket.

In the manufacture of the test socket, since the receiving terminal is manually inserted into the terminal insertion slit of the socket holder, the receiving terminal may be twisted or deformed, which requires skill and time to assemble. are doing.
In particular, with the recent increase in the number of pins of semiconductor devices, the receiving terminals must be planted at a fine pitch, which makes it difficult to manufacture them, resulting in a high cost.

According to the present invention, a semiconductor device can be manufactured without twisting or deforming even if a receiving terminal which engages with an external terminal of a semiconductor device package to be inspected is installed with a fine pitch and without requiring skill and with high productivity. The purpose is to get a test socket for the package.

[0009]

DISCLOSURE OF THE INVENTION The gist of the present invention is to punch out a receiving terminal having an engaging portion for engaging an external terminal of a semiconductor package to be inspected and a lead-out pin and having a crimped portion, and to place the receiving terminal at a predetermined interval. After caulking and laminating, the portion corresponding to the socket holder-slit in the middle of the lead-out pin of the caulking-laminating receiving terminal is resin-molded into a resin block, and the caulking portion on the tip side of the resin-mold is removed, A method for manufacturing a test socket for a semiconductor device package, characterized in that the test socket is mounted on a socket holder.

[0010]

According to the present invention, a receiving terminal having an engaging portion with an external terminal of a semiconductor device package to be inspected, a lead-out pin and a caulking portion is laminated with the caulking portion at predetermined intervals,
Since the socket holder-corresponding to the slit in the middle portion of the lead-out pin is fixed as a resin mold, the receiving terminal is easily resin-blocked without being twisted or deformed.
After that, by removing the caulking portion on the tip side of the resin mold and mounting the resin block on the socket holder, a test socket for a semiconductor package can be manufactured accurately and in a short time without requiring skill. .

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the drawings, reference numeral 1 is a receiving terminal, on which an engaging portion 3 into which an external terminal 2a of a semiconductor device package 2 is inserted or abuts is formed. Reference numeral 4 denotes a lead-out pin, which is formed so as to project to the opposite side of the engaging portion 3, an intermediate portion thereof serves as a socket holder slit-corresponding portion 5, and a caulking portion 6 is formed at the tip portion. It is preferable to test the multi-pin semiconductor device package 2 by periodically changing the formation position of the lead-out pin 4 as shown in FIGS. 2A, 2B and 2C.

In the caulking portion 6, for example, as shown in FIG. 3, a through hole 7 is formed in the receiving terminal 1 of the first laminated sheet, and a cut-and-raised protrusion 8 is formed in the subsequent receiving terminal 1. The projection 8 is inserted into the front through hole 7 or the cut-raised projection rear hole 9 to be laminated. The shape of the caulking portion 6 is not limited to this embodiment, but may be any V shape or the like.

The engaging portion 3, the lead-out pin 4 and the caulking portion 6
The punching and forming is performed by pressing. Further, switching between formation of the through hole 7 of the caulking portion 6 and the cut-and-raised protrusion 8 can be easily performed by changing the depth of advance / retreat of the punch toward the die side.

When the receiving terminals 1 are punched and caulked to be stacked, the dummy 10 is interposed as shown in FIG. 3 so that the interval between the adjacent receiving terminals 1 corresponds to the pitch of the external terminals 2a of the semiconductor device package 2 to be inspected. Let When manufacturing a test socket whose pitch is narrowed due to the increase in the number of pins of a semiconductor device, it is possible to accurately and easily deal with it by making the dummy 10 thin.

After stacking the receiving terminals 1 according to the length of one side of the test socket, the socket holder-slit corresponding portion 5 in the middle of the lead-out pin 4 is made into a resin block 11 to form a resin block. As a result, the receiving terminals 1 are fixed in a row at a predetermined interval and with an insulating property.

Since the resin-blocked laminated body of the receiving terminals 1 is connected to each other at the caulking portion 6 at the tip of the lead-out pin 4, the caulking portion 6 on the tip side of the resin mold 11 is removed. , The receiving terminals 1 are not electrically connected to each other, and the tips of the receiving terminals 1 are pin tips.

After that, when the resin block of the receiving terminal 1 is mounted on the socket holder 12, the engaging portion 3 into which the external terminal 2a of the semiconductor device package 2 to be inspected enters the front side.
Is arranged at a predetermined interval, and the lead-out pins 4 are arranged at a predetermined interval on the back side to obtain a test socket 13.

[0018]

As described above, according to the present invention, the engaging portion with the external terminal of the semiconductor device package and the receiving terminal having the lead-out pin are laminated through the caulking portion, and the laminated body is resin-molded. Therefore, even if the receiving terminals are arranged at a predetermined pitch at a fine pitch, a test socket fixed in a row without twisting or deforming can be easily obtained without requiring any skill.

[Brief description of drawings]

FIG. 1 is a diagram showing a test socket according to an embodiment of the present invention.

FIG. 2 is a diagram showing a receiving terminal of a test socket in one embodiment of the present invention.

FIG. 3 is a diagram showing an array of receiving terminals that are caulked and laminated in one embodiment of the present invention.

FIG. 4 is a diagram showing the manufacture of a test socket according to an embodiment of the present invention.

[Explanation of symbols]

 1 Receiving Terminal 2 Semiconductor Device Package 3 Engagement Part 4 Outlet Pin 5 Socket Holder-Slit Corresponding Part 6 Caulking Part 7 Through Hole 8 Cut-and-raised Protrusion 9 Cut-and-raised Protrusion Rear Hole 10 Dam 11 Resin Mold 12 Socket Holder -13 Test socket

Claims (1)

[Claims] Claim: What is claimed is: 1. A receiving terminal, which forms an engaging portion with an external terminal of a semiconductor device package to be inspected and a lead-out pin and is provided with a caulking portion, is punched out, the receiving terminal is caulked and laminated at a predetermined interval, and the caulking is performed. The socket holder in the middle of the lead-out pin of the laminated receiving terminals-a portion corresponding to the slit is resin-molded to form a resin block, and the caulking portion on the tip side of the resin mold is removed and then mounted on the socket holder. A method for manufacturing a test socket for a semiconductor device package having a feature.