JPH0864321A - Socket for semiconductor apparatus - Google Patents

Abstract

PURPOSE: To provide an IC socket for which fine trouble analysis can be done by utilizing a microscope and which can provide stable electric connection of terminals. CONSTITUTION: Terminals 2 corresponding to the terminals of an IC are provided in the upper face of socket main body 1 and a cover fixing part 3 to fix a cover main body 4 is installed in side face. The cover main body 4 has a frame-like structure and a metal fitting 6' having rod-like parts 6'a, 6'b and a rectangular part 6'c is insulated and fitted in the cover main body 4. The rectangular part 6'c forms an observation hole 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device socket (hereinafter referred to as an IC socket), and more particularly to an IC socket used for electrical evaluation and failure analysis of a flat package type semiconductor integrated circuit.

[0002]

2. Description of the Related Art A conventional IC socket will be described with reference to FIG. In FIG. 2, (A) shows an open state and (B) shows a closed state. In FIGS. 2A and 2B, 1
Is a socket main body made of a short-shaped insulator, and a terminal 1a corresponding to the terminal of the IC is provided on the upper surface thereof, and a hook-shaped lid fixing portion 2 is provided on the side surface.
Further, 4 is a frame-shaped lid main body, and an IC fixing portion 5 is provided in the frame.

The IC fixing portion 5 is formed by insulating a rod-shaped metal fitting 6 shown in FIG. 2 (C) with an insulator, and the terminal of the IC under test is fixed to the terminal 2 of the socket body 1 on its lower surface. The terminal fixing part 7 for the is provided.

When the IC to be tested is evaluated, the terminals (not shown) of the IC are connected to the terminals 2 of the socket body 1 of FIG.
Then, as shown in FIG. 2B, the lid body 4 is closed and fixed by the lid fixing portion 3. As a result, the terminal of the IC is fixed to the terminal 2 by the terminal fixing portion 7, and the IC fixing portion 5 presses the entire resin upper surface of the IC to electrically connect the terminal of the IC and the terminal 2. , Electrical evaluation is possible.

[0005]

In the IC failure analysis method, a hole is formed in the upper surface of the IC and the semiconductor chip is exposed to operate, and the state of the semiconductor surface changes due to leakage current. There is a method of observing and finding an abnormal place. However, in order to use this method for a flat package type IC such as QFP, a hole is made in the center of the IC fixing part 5 and the metal fitting 6 is cut to form an IC socket so that the surface of the semiconductor chip can be observed. It needs to be processed. In this case, there is a problem in that the strength of the IC fixing portion 5 is insufficient and distortion occurs, and the electrical connection between the terminals of the IC and the terminals 14 becomes unstable. Further, although the IC fixing portion 5 is made of resin, there is a problem that it is difficult to perform fine failure analysis using a microscope because the resin becomes thick to obtain strength.

There is also a structure in which an observation hole is provided in the IC fixing portion (see Japanese Utility Model Laid-Open No. 62-55887). That is, it has a structure in which the observation hole of the resin IC fixing portion is covered with a transparent material such as acrylic. However, in order to observe the heat generation on the surface of the semiconductor chip, it is necessary to apply liquid crystal to the surface of the chip, but since the observation hole of the IC fixing portion is provided with a transparent lid, the liquid crystal cannot be applied. Moreover, since the IC fixing portion is made of resin,
Due to the problem of strength, it cannot be formed thin, and it is difficult to perform fine failure analysis with a microscope.

Furthermore, there is an IC socket that enables fine failure analysis with a microscope (see: Actual Kaihei 2-54187).
Issue). That is, it is a structure in which a groove is formed in the socket body and a lead pressing plate is fitted into the groove to fix the IC.
However, in this structure, the usage is different from that of the IC socket of FIG. 2, and there is a possibility that the leads may be bent when fixing the IC terminals one by one with the lead retainer, so that it requires proficiency in use.

[0008] Therefore, an object of the present invention is to provide an IC socket which enables fine failure analysis using a microscope and has stable electrical connection of terminals.

[0009]

In order to solve the above-mentioned problems, an IC socket according to the present invention comprises a socket body having terminals corresponding to the terminals of an IC under test formed on its upper surface, a frame-shaped lid body, It is provided with at least two rod-shaped portions fixed to the frame-shaped lid main body and an IC fixing portion formed by insulating a metal fitting having a short-shaped portion between these rod-shaped portions and forming an observation hole.

[0010]

According to the above means, the insulator of the IC fixing portion can be thinned by the strength of the metal fitting.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing an embodiment of an IC socket according to the present invention, wherein (A), (B) and (C) of FIG.
Corresponds to (A), (B), and (C) of FIG. That is, the metal fitting 6'includes rod-shaped portions 6'a, 6'b and a short-shaped portion 6'c, as shown in FIG. The rod-shaped portions 6'a and 6'b are fixed to the IC fixing portion 5,
The short-shaped portion 6'c forms the observation hole 8 having substantially the same size as the IC under test. The IC fixing portion 5 is formed by insulating the metal fitting 6'with an insulator, for example, resin, but the resin is not distorted due to the strength of the metal fitting 6 '. Further, in this case, since the resin can sufficiently insulate the IC terminal and the metal fitting 6 ′, it can be formed thinner than the conventional IC fixing portion 11, and thus the resin can be formed through the observation hole 8. It is also possible to observe with a high-power microscope.

In the above-described embodiment, the lid fixing portion is provided on the socket body to connect the socket body and the lid body. However, the socket fixing portion is provided on the lid body to connect the socket body and the lid body. May be combined.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of an IC socket according to the present invention, (A) showing an open state, (B) showing a closed state, and (C) showing a metal fitting.

FIG. 2 is a perspective view showing a conventional IC socket,
(A) shows an open state, (B) shows a closed state, and (C) shows a metal fitting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Socket main body 2 ... Terminal 3 ... Lid fixing part 4 ... Lid main body 5 ... IC fixing part 6, 6 '... Metal fitting 7 ... Terminal fixing part 8 ... Observation hole

Claims (3)

[Claims] 1. A socket body (1) having terminals (2) corresponding to terminals of a semiconductor device under test formed on an upper surface thereof, a frame-shaped lid body (4), and at least fixed to the frame-shaped lid body. A semiconductor device fixing part (2 ') that insulates two rod-shaped portions (6'a, 6'b) and a metal fitting (6') having a short-shaped portion which forms an observation hole (6'c) between the rod-shaped portions ( 5) A semiconductor device socket comprising: 2. A one end of the socket main body is rotatably connected to one end of the frame-shaped lid main body, and a lid fixing portion (3) for fixing the frame-shaped lid main body to the other end of the socket main body. The semiconductor device socket according to claim 1, wherein the socket is provided. 3. An end of the frame-shaped lid main body is rotatably connected to one end of the socket main body, and a socket fixing portion for fixing the socket main body to the other end of the frame-shaped lid main body is provided. Item 2. A semiconductor device socket according to item 1.