JPH085588Y2 - 半導体チップモジュールの冷却構造 - Google Patents

半導体チップモジュールの冷却構造

Info

Publication number
JPH085588Y2
JPH085588Y2 JP1990023986U JP2398690U JPH085588Y2 JP H085588 Y2 JPH085588 Y2 JP H085588Y2 JP 1990023986 U JP1990023986 U JP 1990023986U JP 2398690 U JP2398690 U JP 2398690U JP H085588 Y2 JPH085588 Y2 JP H085588Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
module
wiring board
chip module
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990023986U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03113893U (enrdf_load_stackoverflow
Inventor
良一 落合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1990023986U priority Critical patent/JPH085588Y2/ja
Publication of JPH03113893U publication Critical patent/JPH03113893U/ja
Application granted granted Critical
Publication of JPH085588Y2 publication Critical patent/JPH085588Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990023986U 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造 Expired - Lifetime JPH085588Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990023986U JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990023986U JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Publications (2)

Publication Number Publication Date
JPH03113893U JPH03113893U (enrdf_load_stackoverflow) 1991-11-21
JPH085588Y2 true JPH085588Y2 (ja) 1996-02-14

Family

ID=31526967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990023986U Expired - Lifetime JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Country Status (1)

Country Link
JP (1) JPH085588Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222808A (ja) * 2010-04-12 2011-11-04 Japan Steel Works Ltd:The 電子機器の冷却装置
KR20170097421A (ko) * 2016-02-18 2017-08-28 엘에스산전 주식회사 2차원 배열 전력변환장치용 냉각 시스템

Also Published As

Publication number Publication date
JPH03113893U (enrdf_load_stackoverflow) 1991-11-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term