JPH085588Y2 - 半導体チップモジュールの冷却構造 - Google Patents

半導体チップモジュールの冷却構造

Info

Publication number
JPH085588Y2
JPH085588Y2 JP1990023986U JP2398690U JPH085588Y2 JP H085588 Y2 JPH085588 Y2 JP H085588Y2 JP 1990023986 U JP1990023986 U JP 1990023986U JP 2398690 U JP2398690 U JP 2398690U JP H085588 Y2 JPH085588 Y2 JP H085588Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
module
wiring board
chip module
cooling structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990023986U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03113893U (enrdf_load_stackoverflow
Inventor
良一 落合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1990023986U priority Critical patent/JPH085588Y2/ja
Publication of JPH03113893U publication Critical patent/JPH03113893U/ja
Application granted granted Critical
Publication of JPH085588Y2 publication Critical patent/JPH085588Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990023986U 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造 Expired - Lifetime JPH085588Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990023986U JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990023986U JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Publications (2)

Publication Number Publication Date
JPH03113893U JPH03113893U (enrdf_load_stackoverflow) 1991-11-21
JPH085588Y2 true JPH085588Y2 (ja) 1996-02-14

Family

ID=31526967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990023986U Expired - Lifetime JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Country Status (1)

Country Link
JP (1) JPH085588Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222808A (ja) * 2010-04-12 2011-11-04 Japan Steel Works Ltd:The 電子機器の冷却装置
KR20170097421A (ko) * 2016-02-18 2017-08-28 엘에스산전 주식회사 2차원 배열 전력변환장치용 냉각 시스템

Also Published As

Publication number Publication date
JPH03113893U (enrdf_load_stackoverflow) 1991-11-21

Similar Documents

Publication Publication Date Title
US6778390B2 (en) High-performance heat sink for printed circuit boards
CN103561555B (zh) 机柜结构及其集装箱数据中心
US7361081B2 (en) Small form factor air jet cooling system
US8430644B2 (en) Synthetic jet ejector for the thermal management of PCI cards
US6288895B1 (en) Apparatus for cooling electronic components within a computer system enclosure
US5063476A (en) Apparatus for controlled air-impingement module cooling
CN101547588B (zh) 用于容纳于箱体中的印刷电路板的冷却装置
US7203063B2 (en) Small form factor liquid loop cooling system
US20080259566A1 (en) Efficiently cool data centers and electronic enclosures using loop heat pipes
US4291364A (en) Air-cooled hybrid electronic package
JP2004538657A (ja) 電子装置冷却構造
JPS61198799A (ja) 可連結筐体構造
CN113056161A (zh) 电子设备外壳和边缘计算系统
US5873407A (en) Windblown-type heat-dissipating device for computer mother board
JPH085588Y2 (ja) 半導体チップモジュールの冷却構造
JP2019201165A (ja) 冷却装置、及び電子機器
CN107436651A (zh) 一种融合供电与散热的服务器交换模组
TWI477948B (zh) 伺服器機櫃
JP3564453B2 (ja) 電子機器筐体の空冷構造
CN1133109C (zh) 电脑风扇定位装置
CN219893693U (zh) 手持式装置及其散热模块
KR200289467Y1 (ko) 병렬 컴퓨터 냉각장치
CN101009991A (zh) 热交换器
JPH0642387Y2 (ja) 電子機器筐体の放熱構造
KR200377070Y1 (ko) 전자 장치용 내장형 냉각 장치

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term