JPH03113893U - - Google Patents

Info

Publication number
JPH03113893U
JPH03113893U JP2398690U JP2398690U JPH03113893U JP H03113893 U JPH03113893 U JP H03113893U JP 2398690 U JP2398690 U JP 2398690U JP 2398690 U JP2398690 U JP 2398690U JP H03113893 U JPH03113893 U JP H03113893U
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring board
chip module
mother wiring
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2398690U
Other languages
English (en)
Japanese (ja)
Other versions
JPH085588Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990023986U priority Critical patent/JPH085588Y2/ja
Publication of JPH03113893U publication Critical patent/JPH03113893U/ja
Application granted granted Critical
Publication of JPH085588Y2 publication Critical patent/JPH085588Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1990023986U 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造 Expired - Lifetime JPH085588Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990023986U JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990023986U JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Publications (2)

Publication Number Publication Date
JPH03113893U true JPH03113893U (enrdf_load_stackoverflow) 1991-11-21
JPH085588Y2 JPH085588Y2 (ja) 1996-02-14

Family

ID=31526967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990023986U Expired - Lifetime JPH085588Y2 (ja) 1990-03-09 1990-03-09 半導体チップモジュールの冷却構造

Country Status (1)

Country Link
JP (1) JPH085588Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222808A (ja) * 2010-04-12 2011-11-04 Japan Steel Works Ltd:The 電子機器の冷却装置
JP2017147436A (ja) * 2016-02-18 2017-08-24 エルエス産電株式会社Lsis Co., Ltd. ２次元配列電力変換装置用冷却システム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222808A (ja) * 2010-04-12 2011-11-04 Japan Steel Works Ltd:The 電子機器の冷却装置
JP2017147436A (ja) * 2016-02-18 2017-08-24 エルエス産電株式会社Lsis Co., Ltd. ２次元配列電力変換装置用冷却システム
US9949414B2 (en) 2016-02-18 2018-04-17 Lsis Co., Ltd. Cooling system for two-dimensional array power converters

Also Published As

Publication number Publication date
JPH085588Y2 (ja) 1996-02-14

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