JPH0851254A - Assembly and assembly device of semiconductor device - Google Patents

Abstract

PURPOSE:To allow easy positioning of the x, y, z and theta directions for a laser and a photodetector by forming positioning marks for positioning a photodetector and a laser on a transparent glass mask. CONSTITUTION:Marks for positioning a photodetector 12 and a laser 13 are formed on a transparent glass mask 6; the photodetector 12 matches this positioning mark and temporalily fixed to the glass mask 6; matching is performed to the positioning mark relating to the z, y, theta directions while observing a laser 13 fixed on a stem 14 through this glass mask 6 followed by observing the laser 13 and the positioning mark of the laser 13 using a microscope 15 of an optical system smaller than the microscope 15 of an optical system having observed the laser 13 besides having focal depth less than the desired assembly accuracy through the glass mask 6 to transfer the positional relation in the z-direction until the both parties can be simaltaneously observed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of assembling a semiconductor device and an assembling apparatus thereof, and more particularly to a post-process of the semiconductor device, and more particularly, a semiconductor laser and a light receiving element while maintaining a positional relationship with high accuracy. A semiconductor device that can be applied to a semiconductor manufacturing technique that is fixed on the top and can easily perform alignment of the laser and the light receiving element in the x, y, z, and θ directions without increasing the device cost and the like. The present invention relates to an assembling method and an assembling apparatus.

In recent years, a semiconductor device in which a laser and a multi-divided photodetector are arranged on the same stem, and a hologram optical element is arranged on the stem is an optical disk, a magnetic disk, a CD.
-It has been used for optical heads such as ROMs and has been drawing attention.

[0003]

2. Description of the Related Art FIG. 4 is a perspective view showing the structure of a semiconductor device in which a laser and a multi-divided light receiving element are arranged on the same stem.
FIG. 5 is a side view showing a structure in which a hologram optical element is arranged on the semiconductor device shown in FIG. 4. 4 and 5, 1
001 is a stem, and 1002 and 1003 are stems 1.
Numeral 1004 is a stand arranged on 001, 1004 is a multi-divided light receiving element which is arranged on the stand 1002 and whose light receiving section is multi-divided, 1005 is a laser arranged on the side plate of the stand 1003, and 1006 is a light receiving section. Element 10
04 and the laser 1005, which is a hologram optical element.

As shown in FIG. 5, a laser 1005 irradiates an optical disk with light through a hologram optical element 1006, and a multi-division light receiving element 1004 receives light diffracted by the hologram optical element 1006 out of the light returned from the optical disk. Receive. As a result, servo signals for tracking, focusing, etc. of the optical disk are extracted. These servo signals are detected from the sum, difference, product, etc. of the signals received by the plurality of light receiving surfaces of the light receiving element 1004. Therefore, if the relative position between the light receiving surface of the light receiving element 1004 and the light emitting point A of the laser 1005 is deviated from the originally intended position, there arises a problem that the servo signal cannot be accurately detected. .

Therefore, in order to accurately detect the servo signal, the light emitting point A of the laser 1005 and the light receiving surface of the light receiving element 1004 are accurately positioned in the x, y, z, and θ directions as shown in FIG. Placement is important. Where x,
y represents a direction orthogonal to the same plane, θ represents a direction of rotation in the same plane as x and y, and z represents a direction orthogonal to the x and y directions.

At this time, the required alignment accuracy varies depending on what kind of method is used to detect the servo signal, but it is used for the most severe optical magnetic disk optical heads and the like. In this case, a positioning accuracy of about 5 μm is required. This positioning accuracy of 5 μm
Simply the stem 1001, the laser 1005 and the light receiving element 10
In order to realize it only by stacking the tolerances of the outer dimensions 04, a tolerance of about 1 μm is required for each.

However, it is difficult to realize these precisions with the known stem, laser, and light receiving element manufacturing techniques that can be mass-produced at low cost at present, and a technique for fixing the laser and the light receiving element while aligning them is essential. Become. Hereinafter, a specific description will be given with reference to the drawings. FIG. 7 is a diagram showing a conventional method for assembling a semiconductor device. Here, a method of aligning and fixing the light receiving element to the laser is schematically shown. As shown in FIG. 7, the laser 1005
Is fixed to the side plate of the stand 1003 of the stem 1001. The light receiving element 1004 is a rod-shaped collet 101.
It is temporarily fixed to the tip of No. 1 by vacuum suction from inside the collet 1011 or the like.

First, the light receiving element 1004 is attached to the stem 100.
1 in the vicinity of the stand 1002 portion and the stem 100
The laser 1 fixed to the side plate of the stand 1003 of the stem 1001 while being slightly floated from the stand 1002 of No. 1 while observing from above the collet 1011 with a microscope or the like.
005 and light receiving element 10 temporarily fixed to collet 1011
The positional relationship of 04 in the x, y, and θ directions is shown in the stand 1
002 and the light receiving element 1004, etc. are aligned with each other based on the alignment marks.

After that, the collet 1011 is lowered with the x, y, and θ directions aligned, and the light receiving element 1004 is attached on the stand 1002 of the stem 1001 and the light receiving element 104 is fixed by a method such as soldering. Finally, the light receiving element 1004 is released from the collet 1011,
The fixation between the light receiving element 1004 and the stand 1002 is completed.

[0010]

In the conventional method of assembling the semiconductor device described above, since the observation is performed from above, the laser 1 fixed to the side plate of the stand 1003 is fixed.
005 and light receiving element 10 temporarily fixed to collet 1011
Regarding the x, y, and θ directions in the same horizontal plane of 04, since the inside of the horizontal plane can be seen from above, x, y in the horizontal plane
It has an advantage that positioning in the y and θ directions can be performed.

However, in this method, since the positioning is performed while observing from above, x, y from above.
There is a problem that it is difficult to perform positioning in the z direction because the in-plane in the vertical direction z orthogonal to the horizontal direction cannot be seen. Further, since the positioning is performed while observing from above, the collet 10
On the other hand, when the size of the light receiving element 1004 becomes smaller due to the recent severe demand for element miniaturization, the light receiving element 1004 is hidden by the collet 1011 and becomes difficult to see.
5 and the light receiving element 1004 are difficult to align with each other.

Therefore, the laser 1005 and the light receiving element 100
In order to measure the z direction of No. 4, the height of the light emitting point of the laser 1005 and the height of the light receiving surface of the light receiving element 1004 may be measured by a measuring device such as a laser length measuring machine. There is a problem that the device becomes large in size and the device cost increases. Further, it is considered that the positional relationship in the z direction between the laser 1005 and the light receiving element 1004 can be measured by observing with a microscope from the lateral direction instead of the upward direction. However, as described above, unless the measurement is performed with a detection accuracy of the order of several μm. Therefore, a high-magnification lens is newly required, and the device becomes large in size as above, and the cost increases accordingly, and when the lens is fitted in the lateral direction, the lens is not attached to the stem 1001 or the stand 1002. There was a problem that it was easy to hit and it became difficult to focus.

Therefore, the present invention provides a semiconductor device assembling method and an assembling device which can easily align the laser and the light receiving element in the x, y, z, and θ directions without increasing the device cost or the like. The purpose is to provide.

[0014]

According to the first aspect of the present invention,
A first component alignment mark and a second component alignment mark are formed on the flat surface of the transparent member on which the component is temporarily fixed, and the first component is the first component of the transparent member. Aligning with the component alignment mark of 1), and temporarily fixing the transparent member on the plane; and then, through the transparent member to which the first component is temporarily fixed,
Of the first component and the second component in the plane by using the second component alignment mark to observe the second component and the rotation direction of the first component and the second component. θ
The step of adjusting the positional relationship between the first component and the second component in the plane and maintaining the positional relationship between the first component and the second component in the two orthogonal axes and the rotation direction θ. In this state, a second optical system having a shallower depth of focus than the first optical system that observed the second component is used, and the second component and the second component alignment mark are passed through the transparent member. Until both of them can be observed by the second optical system, by moving the positional relationship in the vertical direction z between the transparent member and the orthogonal biaxial direction in the second component, A step of aligning and then a step of permanently fixing the first component to the second component while maintaining the positional relationship in the orthogonal two-axis direction, the rotation direction θ and the vertical direction z. It is characterized by including.

The invention according to claim 2 is characterized in that, in the invention according to claim 1, the temporary fixing is performed by a vacuum chuck. According to a third aspect of the invention, in the inventions of the first and second aspects, the main fixing is performed by irradiating ultraviolet rays through the transparent member using an adhesive having an ultraviolet curing characteristic. To do.

According to a fourth aspect of the present invention, in the above-mentioned third aspect of the invention, the transparent member is made of quartz. According to a fifth aspect of the present invention, the surface on which the component is temporarily fixed is a flat surface, and the first component alignment mark and the second component alignment mark are formed on the flat surface. Observing the second component through a temporary fixing means for aligning the first component with the first component alignment mark and temporarily fixing it, and the transparent member to which the first component is temporarily fixed. Observing the second component with a first optical means and the first optical means,
The second component is aligned with the second component alignment mark, and the positional relationship between the first component and the second component in the plane in the two orthogonal axial directions and the rotation direction θ. A first drive means for adjusting the
In a state where the positional relationship between the first component and the second component in the two planes in the plane orthogonal to each other and the rotation direction θ is maintained, the depth of focus is smaller than that of the first optical unit.
Optical means through the transparent member until the second component and the second component alignment mark are both observable by the second optical means. Second drive means for adjusting the vertical direction z within a predetermined accuracy by moving a positional relationship in the vertical direction z with respect to the biaxial direction, and the orthogonal 2
The present invention is characterized by having a main fixing means for main-fixing the first component to the second component while maintaining the positional relationship in the axial direction, the rotation direction θ and the vertical direction z.

[0017]

In the present invention, as shown in FIGS. 1 to 3 of the embodiment described later, the transparent glass mask 6 is formed with the alignment marks 6b and 6c for aligning the light receiving element 12 and the laser 13. , The light receiving element 12 is aligned with the alignment mark 6b, the light receiving element 12 is temporarily fixed to the glass mask 6, and while observing the laser 13 fixed to the stem 14 through the glass mask 6, x, y, After the alignment mark 6c is aligned in the θ direction, the laser 13 and the laser 13 are passed through the glass mask 6 using the optical system microscope 15 having a smaller depth of focus than the optical system microscope 15 which observed the laser 13. The alignment mark 6c is observed, and the positional relationship of both in the z direction is moved until both can be observed at the same time.

Therefore, it is possible to determine a desired positional relationship between the laser 13 and the light receiving element 12 in the x, y, z and θ directions. In this way, for the alignment of the two components of the light receiving element 12 and the laser 13 in the x, y, and θ directions, one of the light receiving elements 12 is previously set by using the pattern of the alignment marks 6b and 6c on the surface of the glass mask 6. While aligning and temporarily adhering on the glass mask 6, alignment is performed with the alignment mark 6c pattern of the other glass mask 6 so that the microscope 15 having a sufficiently high magnification optical system can be used. Then, for the alignment in the z direction, the light receiving element 12 is temporarily fixed to the surface of the glass mask 6, and the positional relationship between the alignment mark 6c pattern of the other glass mask 6 and the laser 13 is determined by the position in the x and y directions. By using an optical system microscope 15 having a focal depth smaller than that of the optical system microscope 15 used for matching so that both can be seen at the same time, as a result, the two components of the light receiving element 12 and the laser 13 are simultaneously produced. Positioning in the z direction can be performed with sufficient accuracy (for example, 5 μm) without entering the visual field. Moreover, the end surface of the laser 13 and the light receiving element 12 can be aligned on the same surface.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing the arrangement of a semiconductor device assembling apparatus according to an embodiment of the present invention. 2 and 3 are views showing a method of assembling a semiconductor device according to an embodiment of the present invention.

In FIGS. 1 to 3, 1 is a movable stage with a ratchet that moves left and right as indicated by arrow A, and 2 is stainless steel for adsorbing a glass mask, which is arranged on support bases 3 and 4 made of stainless steel or the like. The support base 2 is made of steel or the like, and the support base 2 is formed with an opening 2a having two shapes, a large size and a small size, and a light receiving element through a suction port 2b for sucking a glass mask and a small size opening 2a. A suction port 2c for suction is formed.

Reference numeral 5 is a glass plate arranged so as to cover the small opening 2a, and 6 is a glass mask sucked and adsorbed on the bottom surface of the support base 2 through the suction port 2b.
The glass mask 6 includes a glass mask 6 and a glass plate 5.
A suction port 6a for sucking the light receiving element is formed through the hollow portion and the suction port 2c, and a positioning mark 6b for positioning the light receiving element and a positioning mark 6c for laser positioning are formed on the lower surface of the glass mass 6. ing.

Reference numerals 7 to 10 denote an X stage moving in the x direction, a Y stage moving in the Y direction, and a Z moving in the Z direction.
A stage is a θ stage that moves in the θ direction, and 11 is disposed on the θ stage 10 and includes a light receiving element 12 such as a PIN photodiode or a stem 14 having a size of 5 mm × 10 mm with a laser 13 formed on the upper surface. Suction port 11
It is a stage that is adsorbed by a.

Reference numeral 15 is a microscope having an objective lens for observing the positional relationship among the alignment marks 6b and 6c, the light receiving element 12, the laser 13 and the like through the glass plate 5 and the glass mask 6, and 16 is an ultraviolet lamp. . Here, the stem 14 is formed with a glass-sealed lead pin for wiring, and one of the lead pins is connected to the laser 13, and a current can be passed through the laser 13 to emit light. It is configured to be able to.

In this embodiment, first, a UV adhesive for adhering the light receiving element 12 is applied onto the stem 14 in advance, and then the light receiving element 12 is passed through the glass mask 5 through the glass mask 6 to the light receiving element 12 by the microscope 15. 12, the light receiving element 12 is aligned with the alignment mark 6b formed on the lower surface (flat surface) of the transparent glass mask 6 that can be vacuum chucked, and the light receiving element 12 is temporarily fixed to the lower surface of the glass mask 6 with a vacuum chuck. .

At this time, specifically, the alignment mark 6b of the glass mask 6 and the hollow portion between the glass mask 6 and the glass plate 5 are sucked by a vacuum pump from the suction port 2c of the support base 2 and the suction port 6a. The light receiving element 12 is sucked and temporarily fixed, and the light receiving surface of the light receiving element 12 is temporarily fixed so as to contact the lower surface of the glass mask 6. Then, the vacuum chuck on the side of the stage 11 is turned off to move the stage 11 to the light receiving element 12
Keep away from.

Further, here, when temporarily adhering, the stage 11 side is raised and moved to the glass mask 6 side fixed to the support base 2, but the support base 2 side is lowered and moved to the stage 11 side. It may be configured to do so. Although various methods such as bonding with an adhesive or the like can be considered as a method of temporarily fixing the light receiving element 12 and the glass mask 6, a small-diameter suction port 6a is formed in the transparent vacuum chuckable quartz glass mask 6 as in this embodiment. By opening and temporarily fixing as a vacuum chuck using this, it is possible to keep the visual field obstruction due to the temporary fixing smaller than when using an adhesive or the like, and at the same time, the light receiving element 12 is attached to the lower surface of the quartz glass mask 6 to be sucked. There are advantages that the element surfaces can be made to substantially coincide with each other, and the temporary fixing can be easily set and released by turning the vacuum on and off.

Next, the vacuum chuck OF on the stage 11 side
After F, the stage 11 side is moved by the movable stage 1,
Thereafter, the stem 14 having the laser 13 is moved by the movable stage 1 on the side of the vacuum chucked stage 11 and brought to a predetermined position under the glass mask 6. Next, while observing the laser 13 formed on the stem 14 from above with the microscope 15 through the glass mask 6 to which the light receiving element 12 is temporarily fixed through the glass plate 5, the laser 13 is moved to the approximate fixed point. Then, with the end face of the laser 13 and the alignment mark 6c of the glass mask 6 as a reference, the laser 13 is aligned with the alignment mark 6c and x in the plane where the positional relationship between the laser 13 and the light receiving element 12 is projected. The positional relationship in the y, θ direction is adjusted to a predetermined positional relationship by the driving device for the X stage 7, the Y stage 8 and the θ stage 10. At this time, the end surface of the laser 13 and the lower surface of the glass mask 6 are separated by about 30 μm.

Next, with the light receiving element 12 temporarily fixed to the glass mask 6, the x, y, and θ of the laser 13 and the light receiving element 12 are kept.
In the state where the positional relationship in the direction is maintained, the glass plate 5 is used by using an optical system microscope 15 (an optical system having a large magnification) having a smaller depth of focus than the optical system microscope 15 observing the laser 13.
Until the laser 13 and the alignment mark 6c can be well observed by the microscope 15 of the optical system having a small depth of focus through the glass mask 6 via the Z stage 9, the positional relationship between the laser 13 and the alignment mark 6c in the direction z perpendicular to the plane is determined by the Z stage 9 By moving with the driving device of (3), it is adjusted within a predetermined accuracy.
At this time, the light receiving element 12 appears to float on the ultraviolet curable adhesive. Here, the optical system microscope 15 having a small depth of focus has a predetermined assembly accuracy of, for example, 5 or less.
The one having a focal depth of μm is used.

Then, the stem 1 is placed through the glass mask 6.
The light receiving element 12 is fixed on the stem 14 by irradiating the ultraviolet curable adhesive on 4 with ultraviolet rays by the ultraviolet lamp 16. Then, the vacuum chuck of the glass mask 6 is cut to complete the assembly. According to this method, ± 5μ
The alignment in m can be done. As described above, in this embodiment, the transparent glass mask 6 has the alignment mark 6b for aligning the light receiving element 12 and the laser 13,
6c is formed, the light receiving element 12 is aligned with the alignment mark 6b, and the light receiving element 12 is attached to the glass mask 6b.
After observing the laser 13 fixed on the stem 14 through the glass mask 6 temporarily, the alignment mark 6c is aligned in the x, y, and θ directions, and then the laser 13 is observed. Using the optical system microscope 15 having a focal depth smaller than that of the system microscope 15 and having a focal depth not more than a desired assembling accuracy (for example, 5 μm), the laser 13 and the alignment mark 6c of the laser 13 are passed through the glass mask 6. Are observed, and the positional relationship of both in the z direction is moved until both can be observed simultaneously.

Therefore, a desired positional relationship between the laser 13 and the light receiving element 12 in the x, y, z, and θ directions can be determined. In this way, for the alignment of the two components of the light receiving element 12 and the laser 13 in the x, y, and θ directions, one of the light receiving elements 12 is previously set by using the pattern of the alignment marks 6b and 6c on the surface of the glass mask 6. While aligning and temporarily adhering on the glass mask 6, alignment is performed with the alignment mark 6c pattern of the other glass mask 6 so that the microscope 15 having a sufficiently high magnification optical system can be used. Then, for the alignment in the z direction, the light receiving element 12 is temporarily fixed to the surface of the glass mask 6, and the positional relationship between the alignment mark 6c pattern of the other glass mask 6 and the laser 13 is determined by the position in the x and y directions. By using an optical system microscope 15 having a focal depth smaller than that of the optical system microscope 15 used for the alignment so that both can be seen at the same time, as a result, the light receiving element 12 and the laser 1 are obtained.
It is possible to perform the alignment in the z direction with sufficiently high accuracy (for example, 5 μm) even if the two components of 3 do not enter the visual field at the same time. Moreover, the end surface of the laser 13 and the light receiving element 12 can be aligned on the same surface.

In the above embodiment, the main fixing of the stem 14 and the light receiving element 12 is performed by using an ultraviolet curing type UV adhesive.
The case of a preferable mode in which ultraviolet rays are uniformly irradiated through the glass mask 6 to reduce the positional deviation at the time of fixing has been described, but the present invention is not limited to this, and heat treatment is performed using, for example, cream solder. Then, it may be configured to be permanently fixed.

In the above embodiment, the stem 14 and the light receiving element 12 are
Although the case where the vacuum chuck of the glass mask 6 is cut and the light receiving element 12 is released from the glass mask 6 after the main fixation is performed, the present invention is not limited to this, and the position in the z direction is not limited thereto. After combining and stem 1
4 and the light receiving element 12 may be configured to be performed immediately before the main fixation.

In the above embodiment, the laser 13 and the light receiving element 12 are used.
However, the present invention is not limited to this and does not deviate from the concept of the present invention when assembling a semiconductor device that requires other precise alignment. It can be applied in a range.

[0034]

According to the present invention, there is an effect that the laser and the light receiving element can be easily aligned in the x, y, z and θ directions without increasing the device cost and the like.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a semiconductor device assembling apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a method for assembling a semiconductor device according to an embodiment of the present invention.

FIG. 3 is a diagram showing a method for assembling a semiconductor device according to an embodiment of the present invention.

FIG. 4 is a perspective view showing a structure of a semiconductor device.

5 is a side view showing a structure in which a hologram optical element is arranged on the semiconductor device shown in FIG.

FIG. 6 is a diagram showing x, y, z, and θ directions.

FIG. 7 is a diagram showing a conventional method of assembling a semiconductor device.

[Explanation of symbols]

 1 Movable Stage 2, 3, 4 Support 2a Openings 2b, 2c, 6a, 11a Suction Port 5 Glass Plate 6 Glass Mask 6b, 6c Alignment Mark 7 X Stage 8 Y Stage 9 Z Stage 10 θ Stage 11 Stage 12 Light Reception Element 13 Laser 14 Stem 15 Microscope 16 UV lamp

Claims (5)

[Claims] 1. A first component alignment mark (6b) and a second component alignment mark (6c) on the flat surface of a transparent member (6) on which the component (12) is temporarily fixed. )
And the first part (12) is formed into the transparent member (6).
Aligning with the first component alignment mark (6b) and temporarily fixing to the flat surface of the transparent member (6), and then the first component (12) is temporarily fixed. The second part (13) is observed through the transparent member (6), and the second part (13) is attached to the first part (1) using the second part alignment mark (6c).
2) and the second component (13) in the plane, adjusting the positional relationship between the two orthogonal axial directions (x, y) and the rotation direction θ, and performing the alignment; First
The second part (12) and the second part (13) are held in the plane in the plane of the second part (12) and the second part (13) while maintaining the positional relationship between the two directions (x, y) orthogonal to each other and the rotation direction θ. 13, 1
4) using the second optical system (15) having a shallower depth of focus than the first optical system (15) observed, and the transparent member (6)
Through the transparent member (6) and the second part (until both the second part (13) and the second part alignment mark (6b) can be observed by the second optical system. 13) a step of aligning in the vertical direction z by moving a positional relationship in the vertical direction z with respect to the orthogonal biaxial direction (x, y), and then in the orthogonal biaxial direction (x, y). y), the step of permanently fixing the first component (12) to the second component (14) while maintaining the positional relationship in the rotation direction θ and the vertical direction z. Assembling method of semiconductor device. 2. The method for assembling a semiconductor device according to claim 1, wherein the temporary fixing is performed by a vacuum chuck. 3. The semiconductor device according to claim 1, wherein the main fixing is performed by irradiating ultraviolet rays through the transparent member (6) using an adhesive having an ultraviolet curing characteristic. How to assemble. 4. The method of assembling a semiconductor device according to claim 3, wherein the transparent member (6) is made of quartz. 5. The surface on which the component (12) is temporarily fixed is a flat surface,
Further, the first component (12) is placed on the plane of the transparent member (6) on which the first component alignment mark (6b) and the second component alignment mark (6c) are formed. The second component (the second component () is passed through a temporary fixing unit that aligns with the first component alignment mark (6b) and temporarily secures it, and the transparent member (6) to which the first component (12) is temporarily secured. 13) observing a first optical means (15), and observing the second component (13) by the first optical means,
Aligning the second component (13) with the second component alignment mark (6b), the first component (1
2) and the second component (13) in the plane, the positional relationship between the two orthogonal biaxial directions (x, y) and the rotation direction θ is
First drive means (7, 8,
10), and the first component (12) and the second component (13) in the plane in the two orthogonal directions (x,
y) and the rotation direction θ are maintained, the second optical means having a smaller depth of focus than the first optical means (15) is used, and the second optical means is passed through the transparent member (6). The transparent member (6) and the second component (13) until both the component (13) and the second component alignment mark (6b) can be observed by the second optical means (15). Second drive means (9) for adjusting the vertical direction z within a predetermined accuracy by moving the positional relationship in the vertical direction z with respect to the orthogonal two axis directions (x, y).
And the first part (12) is permanently fixed to the second part (14) while maintaining the positional relationship in the orthogonal two-axis directions (x, y), the rotation direction θ and the vertical direction z. A device for assembling a semiconductor device, comprising: