WO1997044869A1

WO1997044869A1 - Method and device for manufacturing optical element mounting module

Info

Publication number: WO1997044869A1
Application number: PCT/JP1997/001708
Authority: WO
Inventors: Yoshitada Oshida; Masahito Ijuin; Hideo Sotokawa
Original assignee: Hitachi, Ltd.
Priority date: 1996-05-21
Filing date: 1997-05-21
Publication date: 1997-11-27
Also published as: JP3817777B2; JPH09312440A

Abstract

A method and device used for accurately mounting and fixing an optical element on and to the substrate of an optical element mounting module used for optical communication, etc., at a high yield. The optical element is mounted on the substrate in a fixed positional relation with respect to an optical element already mounted on the substrate or on a fixed position on the substrate and fixed to the substrate by irradiating a bonding material, such as solder, etc., existing between the element and substrate with bonding energy by limiting the irradiating position to the bonding position. In addition, an alignment detecting optical system and another optical system for supplying the bonding energy of infrared rays, etc., are provided so that the element can be bonded to the substrate immediately after alignment. Therefore, a high-quality module which hardly fluctuates in optical characteristic can be manufactured at a low cost with a high yield.

Description

Specification

TECHNICAL FIELD The present invention relates to a method and an apparatus for manufacturing an optical element mounted module.

The present invention relates to a method and an apparatus for manufacturing an optical element mounting module having an optical element mounted on a substrate, such as a semiconductor laser, a light receiving element, and an optical waveguide. In particular, the mounted module is mounted on a substrate with high precision and efficiency. The present invention relates to a method and an apparatus for manufacturing an optical element-mounted module capable of performing the above-described steps.

Background art

In recent years, the application of optical communication to homes and offices has been rapidly advanced. Such broad application and development of optical communication will be the key to the realization of an information society. In the development of such optical communication, the core of optical communication technology is

It is indispensable for the widespread spread of optical communication how to produce a high-precision, high-efficiency, high-efficiency module with one optical element mounted module. Conventionally, for example, in order to produce an optical device mounted module in which a semiconductor laser device is positioned with respect to an optical waveguide formed on a substrate on which the semiconductor laser device is mounted so that light emitted from the semiconductor laser can be introduced into the optical waveguide, the first method is as follows. The method shown in the flowchart of FIG. 0 was adopted.

The alignment mark 23 (A 2), which has a fixed positional relationship with the light-emitting part, is formed at the stage of semiconductor laser production, and the alignment mark 23 (A 2) is also fixed when forming the optical waveguide on the substrate. The alignment marks 13 (A 1) having the positional relationship of are formed. These two marks are formed on the semiconductor laser and the substrate, respectively, and are formed in, for example, the shape of a “mouth” having different dimensions as shown in FIG. 6, and the distance between the two marks is equal. Keep it in check. If the substrate is a material that transmits infrared light, such as Si, a semiconductor laser can be mounted on the Si substrate, and two I pairs of marks can be detected from behind using an infrared microscope. For example, the semiconductor laser is aligned by rotation and translation so that the marks on the left coincide with each other, and mounted at the stage where they coincide. Once mounted, if the semiconductor laser is a mounted optical element, the solder vapor deposited on the substrate surface and the bottom surface of the semiconductor laser is placed in a heating furnace to obtain electrical conductivity and thermal conductivity. Bonding and bonding by melting.

In the above-described conventional method of manufacturing an optical element mounting module, relative alignment between the semiconductor laser and the optical waveguide is performed using a pair of two alignment marks. Accurate alignment detection and alignment control are performed in two directions on the substrate surface where the mark is formed. The accuracy of the alignment detection and alignment adjustment in the above two directions within the plane is almost the target of ± 1 .2 to 2 .mu.m. In this case, misalignment occurs during heating because of melting.The positioning accuracy is sometimes more than ± 0.5 μπι at the final fixing stage after heating. Was.

Accordingly, an object of the present invention is to provide a method and an apparatus for accurately mounting and fixing an optical element with high yield on a substrate of an optical element mounting module used for optical communication and the like. Disclosure of the invention

The present invention employs the following means in order to solve the above problems. That is, a fixed relation to the reference position on the substrate, or at least one first optical element mounted on the substrate and a second optical element on this substrate, or this substrate and a fixed position The second not on the substrate in relation When fixing the first optical element by setting the position with the optical element to a desired constant relationship, the first optical element is limited to a desired portion including at least a part of the back surface of the first optical element, and the substrate or the first The first optical element is fixed to the substrate by supplying the energy necessary for the fixing through the second optical element. At this time, the desired portion is limited to a region within the back surface of the first optical element. Further, the desired portion is a portion that does not include the second optical element or the third optical element on the substrate.

On the back surface of the first optical element in the desired portion or on the substrate surface facing the desired portion, a member that absorbs the energy required for fixing is arranged, and the energy required for fixing passing through the optical element or the substrate is provided. Partially heated by absorption and fixed. For this fixing, a solder material or a polymer adhesive is used, and the energy is an electromagnetic wave such as infrared light or far infrared light. This energy is sound waves.

A method for making the position of the first optical element and the second optical element on the substrate, or the second optical element not on the substrate in a fixed positional relationship with the substrate, a desired constant relation. As the first alignment mark A1 formed on the substrate or the alignment mark A1 on the second optical element on the substrate or the third optical element not on the substrate which has a fixed relationship with the substrate. Each alignment mark A2 formed on the back surface of the first optical element is detected by the alignment detecting optical system through the substrate or the i-th optical element, and aligned. When fixing the first optical element, the first optical element is limited to a desired portion including at least a part of the back surface, and energy required for fixing is supplied through the substrate or the first optical element. In the method, the energy is light, and the light energy is supplied through the alignment detecting optical system. At this time, the light is infrared light or far infrared light.

First optical element that is detected and aligned by the alignment detection optical system When fixing the substrate, the substrate is limited to a desired portion including at least a part of the back surface of the first optical element, and energy required for the fixing is supplied through the substrate or the first optical element. Then, the first optical element is fixed, and after the fixing, the alignment state between the substrate and the first optical element is inspected using this alignment detection optical system. If there is a misalignment as a result of this inspection, the desired energy is supplied again to release the fixation, realignment is performed, the alignment is performed again, and the fixation is performed again. Further, the detection by the alignment detecting optical system, the alignment and the supply of the light energy for the fixing are performed almost simultaneously.

The first optical element is two or more different optical elements 0 1, 0 2,..., And after mounting the two or more optical elements on the substrate, the amount required for fixing each mounted optical element is determined. By individually supplying energy, the optical elements 0 1, 0 2,... Are fixed to the substrate. In addition, this individual energy supply can take place simultaneously or in parallel.

The displacement caused by aligning the substrate and at least one optical element mounted on it and then putting it in a heating furnace and heating the whole is limited to the part that is fixed by taking the above measures. It does not occur by heating.

That is, after setting the optical element on the substrate at a desired position, by supplying the energy required for fixing only to the fixed part through the substrate or the optical element, only the fixed part is heated, and the whole is heated. displacement without causing, by utilizing the fixed can _c electromagnetic or sonic as this energy, the substrate or in the optical element to propagate energy of these waves, there in pressed or the position between the substrate and the optical element By intensively heating the fixing agent in the fixing portion, the fixing can be performed without causing the entire displacement.

This fixation holds the optical element and the substrate or the second optical element on the substrate in a fixed position. In the present invention, the above-described light energy is supplied through an alignment detection optical system that realizes this setting. Immediately after realization, fixation becomes possible, and the problem of displacement due to conventional fixed heating is almost eliminated. In addition, if energy can be supplied for fixation through the alignment detection system, the fixation position can be checked immediately after fixation. The desired energy is supplied again, the fixation is released, and the realignment and refixation become possible. Furthermore, even if there are a plurality of fixing points, for example, the fixing object is different and the material for fixing is different, the optimum energy is selected for each fixing point and the energy is irradiated, so that each point is sequentially Or, it can be securely fixed at the same time. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is an embodiment of an apparatus for manufacturing an optical mounting module on which a semiconductor laser is mounted, FIG. 2 is an embodiment of a mask used in the embodiment of FIG. 1, and FIG. FIG. 4 is a diagram showing an embodiment of an apparatus for manufacturing an optical mounting module in which an alignment system and an infrared irradiation system are separated. FIG. 4 is an embodiment of an apparatus for manufacturing an optical mounting module for fixing a semiconductor laser and a photodiode. FIG. 5 is a diagram of an embodiment of a manufacturing apparatus of an optical mounting module for performing fixation via fine particles, FIG. 6 is a diagram of an embodiment of an alignment pattern, and FIG. Fig. 8 is an example of fixing using ultrasonic waves. Fig. 8 is an example of fixing using ultraviolet rays. Fig. 9 is fixing with an ultraviolet curing adhesive with beads interposed. FIG. 10 shows a conventional optical device. Is a flowchart illustrating a fixing method. BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 shows an embodiment of the present invention, wherein 1 is a substrate, 2 is a first optical element mounted on the substrate, what is indicated by a two-dot chain line is energy supply means 3, and what is indicated by a broken line is This is the alignment optical system 4. The substrate 1 is fixed to a substrate holding means 101 such as a vacuum suction chuck, and the optical element 2 is also fixed to an optical element holding means 201 such as a vacuum suction chuck. Relative positioning is performed by 4 and the position adjusting means 102,202.

That is, the substrate 1 is fixed to a desired visual field position of the optical system by the position adjusting means 102 using the alignment optical system 4. At this position, the alignment mark 13 formed in advance on the substrate is set at a desired position in the field of view of the alignment detection system. Next, in a state where the first optical element is adsorbed by the optical element holding means 201 such as a vacuum chuck, the center positions of the alignment marks 23 and 23 'previously drawn on the fixed surface of this optical element. The optical element holding means 201 is moved by the position adjusting means 202 in the X and y directions so that the position of the optical element holding means 201 coincides with the center position of the alignment marks 13 and 13 'on the substrate detected by the alignment optical system. And, if necessary, rotation control with the Z axis as the center, adjust the position, and in the z direction, the thin films of Cr and Ni that are the soldering surfaces and Au and S The patterns 12 and 22 on which the n solder material is placed are brought close to each other until they come into contact with each other.

If the center positions match, the semiconductor laser 31 serving as the light source of the energy supply means 3 is turned on. The energy supply means 3 converts the laser light emitted from the light source 31 into a parallel light or a convergent light by the lens 32, and is similar to a desired portion including at least a part of the back surface of the optical element used for fixing the optical element. Figure Irradiation is performed on a mask 33 having a Sekiguchi 331 and a light shielding portion 332 shown in FIG. The mask 33 has an imaging relationship with the alignment mark on the upper surface of the substrate or the soldering surface 12 by the lenses 34 and 46, the beam splitter 35 and the polarizing beam splitter 44. . Therefore, the laser beam passing through the opening 33 1 of the mask 33 forms an image of the opening 33 1 on the soldering surface 12. As a result, the thin film of Cr and Ni absorbs infrared light well, so that only the soldering surface 12 to be heated is heated, and the Au and Sn solder on it is heated. Melt and fix.

Next, the alignment detection system will be described. Reference numeral 41 denotes an illumination light source for detecting an alignment, which is a halogen lamp. The light emitted from the halogen lamp 4 1 is guided by the fiber 4 2, and the light emitted from the fiber is positioned by the lens 4 3 so that the exit end of the fiber 4 2 forms an image on the pupil of the lens 4 6. . The light passing through the lens 43 passes through the polarizing beam splitter 44 and the quarter-wave plate 45 to illuminate the alignment marks 13 and 23 of the substrate 1 and the optical element 2. On the substrate and the optical element, two are drawn at intervals enough to enter the visual field. The illuminated alignment mark reflects the illuminating light, and the reflected light passes through a lens 46, a 1/4 wavelength plate 45, a polarizing beam splitter 44, a beam splitter 35, and a lens 47. The light enters the CCD image sensor 48. Reference numeral 49 denotes a monitor of the imaging pattern. When the alignment is completed, the monitor is provided with two alignment marks 13 'and 23' of the substrate and the optical element at the above-mentioned intervals at the stage shown in FIG. Each center is displayed in a state where they match. At this time, the soldering surface 12 of the board and the soldering surface 22 of the optical element are 1 2 ′ and 2 2 ′ on the monitor 49 (however, 2 2 ′ is hidden by 1 2 ′ and cannot be seen). ing. After visually or automatically detecting that the alignment is accurate, a laser beam is emitted, and only the surface to be soldered is irradiated with the laser beam. Perform

In the embodiment shown in FIG. 1, since the alignment mark is always detected, it is possible to visually or automatically detect whether or not the soldering has been correctly performed after the soldering by using a monitor. If there is any deviation, irradiate the desired amount of laser light again, release the fixation by the solder, perform the alignment again, and fix again with the desired amount of laser irradiation.

The positions of the openings 33 of the mask 33 with respect to the alignment marks 13 and 23 may need to be changed depending on the model. In such a case, the position of the opening 33 I of the mask may be changed by the mask driving mechanism 33, or the mask 33 may be changed. In addition, if a large mask opening is used and the position and shape of the soldering surfaces 12 and 22 are changed so that the image of the mask opening includes the soldering surfaces 12 and 22, such a mask can be obtained. Soldering is possible without changing the disk or the position. However, irradiating an excessively large area causes thermal deformation, so the area is limited to the area inside the back surface of the optical element. In particular, when an optical element other than the first optical element is already mounted on the substrate, irradiating light to this optical element may cause the fixed element to come off. A portion other than the first optical element and containing no optical element is irradiated.

If a spatial modulator such as a liquid crystal display is used for the mask 33, an arbitrary pattern can be manufactured by software. In addition, the control circuit 5 controls the intensity and irradiation time of the laser beam according to the solder material, the bonding area, and the thermal conductivity and heat capacity of the adherend.

FIG. 3 shows another embodiment of the present invention, in which the same reference numerals as those in FIG. 1 denote the same components or components having the same functions. The bonding of the optical element 2 to the substrate 1 is performed by an infrared semiconductor laser below the substrate. An infrared image of a mask 33 having an opening pattern almost similar to the solder pattern 12 By irradiating only the turn 12 portion, the solder is heated, melted, and bonded as described above with little heating of the peripheral portion. In FIG. 3, the alignment optical system is located above the irradiation optical system, and the red light passes through an optical element suction holder 201 ′ made of transparent glass and an optical element 2 such as a semiconductor laser that transmits infrared light. Alignment is detected by external light. Reference numeral 41 denotes a halogen lamp, and light passing through the fiber 42 passes through the lens 43, passes through the infrared light transmission filter, passes through the beam splitter 44, and passes through the objective lens 46 with an optical element. And irradiate the alignment patterns 23 and 13 on the substrate. The reflected light passes through the objective lens 46 and forms an image on the CCD image sensor 48. Based on this signal, the control circuit 5 determines the positional deviation between the two patterns, and the optical element and the substrate are positioned at the correct positions by the mechanisms 202 and 102 for relatively positioning the substrate.

FIG. 4 shows another embodiment of the present invention in which two optical elements are bonded in parallel almost simultaneously. A rectangle indicated by a dotted line is a dotted line portion in FIG. 1 or an alignment optical system having a configuration and a function of the alignment optical system in FIG. 2, and an alternate long and short dash line represents its optical axis.

Reference numeral 2 denotes a semiconductor laser and reference numeral 2 'denotes a photodiode. These optical elements are mounted on a substrate 1 and bonded. The semiconductor laser 2 needs to be positioned with respect to the optical waveguide 6 with an accuracy of about 0.1 μm, but the accuracy of the photodiode is one digit or less. Therefore, the photodiode can be mounted at the reference position on the board by the holding and control mechanisms 201 'and 202'. On the other hand, the semiconductor laser is aligned using the alignment detection system 4.

Thin films 12 and 22 of Cr and Ni are previously deposited on the substrate at the bonding portion of the semiconductor laser 2 and the lower surface of the element, and a fixed diameter made of glass or a resin having a high melting point is interposed therebetween. Au containing beads with There is Sn solder 30. On the other hand, on the substrate at the bonding portion of the photodiode 2 ′ and on the lower surface of the element, there are solder members made of the same material and composition as a semiconductor laser. However, in the case of the photodiode 2 ', no bead is included because the height accuracy is not strict. In the case of a photo diode, a thermosetting adhesive may be used instead of solder. Infrared lasers 31 and 3I 'are located at the positions corresponding to these two bonded parts, and the emitted infrared rays (heat rays) pass through the infrared transmitting lenses 32, 34' and 36 and should be bonded. Irradiated through the substrate at some places. At this time, an infrared-transmitting mask 33 'is used so that only the desired bonding portion between the two optical elements is irradiated with infrared light. This mask has a light-shielding portion 332 and infrared-transmitting portions 331 and 331 ′, and the transmitting portion forms an image on the bonding portions 12 and 12 ′ on the substrate by the lens 36. It is now. For this reason, the portion to be heated is limited to 12 and 12 '.

Next, two bonding methods will be described. First, using the control circuit 5 ′, the alignment of the semiconductor laser 2 to the substrate 1 is performed by the alignment system 4, and the accurate positioning of the photodiode 2 ′ to the substrate 1 is performed by the chuck 210 ′. And the transport fine adjustment mechanism 202 '. The alignment of the two elements is performed almost in parallel, and when the alignment is completed, the semiconductor lasers 31 and 31 'emit light almost simultaneously under the control of the control circuit 5'. Considering the adhesive material and area of the two optical elements to be bonded and the heat resistance of each optical element, the emission wavelength of the semiconductor lasers 31 and 31 'for heating is changed, or the emission time or emission intensity is changed. It is controlled by the control circuit 5 '.

In the above embodiment, the alignment and the heating are performed at the same time, but the time is slower, but it may be more advantageous to perform the alignment in a time series. When the amount of light (heat) supplied to the two places is significantly different, one of the light transmitting portions 331 and 331 'of the mask 33' is made to reflect or transmit a part of the incident light. It is a good idea to balance the amount of light. The opening of the mask 3 3 ′ 3 3 1, 3 3 Is fixed at a fixed position, but when there are many types of manufactured products, a variety of masks can be automatically replaced at high speed, or a two-dimensional optical modulator using liquid crystal instead of a mask is used. It can also be used to respond to variations in the irradiation pattern and the number of irradiation points. In this case, it is needless to say that a plurality of semiconductor lasers for heating are prepared so that the semiconductor laser can be moved to some extent.

FIG. 5 is another embodiment of the present invention, and is an enlarged explanatory view of a case where the alignment optical system and the heating optical system for bonding described in FIG. 1 are performed by the same optical system. FIG. 5 is a diagram illustrating the method of soldering with beads described in FIG. 4 in further detail.

On the bottom surface of the semiconductor laser 2 to be mounted on the substrate 1, alignment patterns 23 and 23 ′ shown in detail in FIG. 6 are made of irregularities or an infrared ray absorbing material. Also, an Ni-Cr pattern 22 for bonding is formed in a fixed positional relationship with the pattern 23. Au-Sn solder material and beads are adhered on the Ni-Cr pattern. On the other hand, alignment patterns 13 and 13 ′ and Ni—Cr pattern 12 for bonding are similarly formed on substrate 1. The N i — C r pattern absorbs relatively infrared light, but in order to further improve the infrared absorption efficiency, a material 120 with good adhesion to the substrate and good absorption of infrared light should be placed between the substrate 1 and the pattern 12. May be configured.

The mounting element and the substrate configured as described above are irradiated with infrared alignment light 400 transmitted through the substrate, the alignment is detected as described above, and the mounting light is adjusted while the in-plane direction is aligned by the position control system. Lower the device so that it contacts the substrate. After the alignment, irradiate the bonding infrared ray 300 as described above, and the pattern 12 is heated, and the Au-Sn301 that is in contact is melted and pressed slightly from above. With this heating, Bonded while maintaining the gap determined by the diameter of the dose 302. Since the thickness of the bonding patterns 22, 12, and (120) are known in advance with an accuracy of about 0.01 μππ, the direction perpendicular to the substrate surface is the same as the direction in the substrate surface. In addition, they can be accurately aligned and bonded.

FIG. 7 shows another embodiment of the present invention, in which the optical element 2D is bonded to the substrate 1 by ultrasonic heating after being aligned with the optical waveguide 6 on the substrate 1. Using the ultrasonic wave source 103, the ultrasonic lens 38, and the ultrasonic wave propagation medium 381, such as water, the ultrasonic waves are intensively applied only to the bonding portion of the mounted optical element. Since a material that absorbs the ultrasonic wave, heats, and cures and adheres is previously attached between the mounted optical element 2D and the substrate 1, the material is bonded and fixed by the ultrasonic heating.

FIG. 8 shows an optical element manufacturing method of the present invention. 1A is an optical element mounting substrate, which is made of a material such as glass that transmits ultraviolet light. The semiconductor laser 2 and the optical waveguide 6 are mounted on this substrate. The light emitted from the semiconductor laser passes through the gradient index lens 2 L and is introduced into the optical waveguide 6. For this reason, the lens 2L needs to be positioned in the plane of the substrate and in a direction perpendicular to the substrate and bonded to the substrate. As shown in Fig. 9, an adhesive 301A and a bead 302 having a constant diameter are adhered to the bottom surface of the lens 2L, and an alignment (not shown) is performed in the in-plane direction of the substrate. Then, ultraviolet light is irradiated from below the substrate while applying pressure from above in the direction perpendicular to the surface, and the adhesive is cured by ultraviolet light. In this UV curing, the ultraviolet rays emitted from the mercury lamp 3 1 ′ are collected by the lens 34 ”and applied to the mask 33”, and the transmitted light is mounted on the mask pattern. By doing so, a desired mounted optical element can be fixed to the substrate without irradiating ultraviolet rays to portions other than the adhesive portion and without damaging other components. In the above-described embodiment, the power described with the semiconductor laser, the photodiode, and the gradient index lens as examples of the optical element mounted on the optical module substrate, the present invention is not limited to such an optical element. Needless to say, the present invention can be applied to any optical device such as an optical fiber, an optical switch, an optical demultiplexing device, an optical multiplexing device, a wave plate, a polarizer, a band-pass filter, or a wavelength separating mirror. Industrial applicability

As described above, according to the present invention, an optical element such as a semiconductor laser, a semiconductor light receiving element, an optical fiber, or an optical switch is mounted on a substrate, and when an optical module is manufactured, between the mounted elements or between these mounted elements. It is now possible to accurately and stably align and fix the optical axis between the device thus fabricated and an optical device such as an optical waveguide manufactured on a substrate.

In particular, since there is no time between the alignment performed when the optical element is fixed to a substrate or the like and the subsequent fixing, the aligned positional relationship, which has been a problem in the past, is generally heated for bonding. Since it did not break down, the mounted optical element could be fixed accurately and stably.

As a result, it is possible to manufacture an optical module at a high yield and at a low cost, contributing to the development of optical communication technology and the like.

Claims

The scope of the claims

In a method of manufacturing an optical element module having at least one optical element mounted on a substrate,

Installing the optical element for a predetermined reference position,

When fixing the optical element, fixing the optical element to the substrate by supplying necessary energy through the substrate or the optical element to a desired portion including at least a part of the back surface of the optical element. A method for manufacturing an optical element mounting module.

2. The method for manufacturing an optical element mounted module according to claim 1, wherein a portion of the back surface of the substrate or the optical element that supplies necessary energy through the optical element is substantially equal to a portion where the substrate and the optical element are fixed. A method for manufacturing an optical element mounting module, which is limited.

2. The method for manufacturing an optical element mounted module according to claim 1, wherein the substrate or the back surface of the optical element for supplying necessary energy through the optical element or a substrate surface facing the rear surface of the optical element has energy. A method for manufacturing an optical element mounting module, comprising using a member that absorbs light.

2. The method for manufacturing an optical element mounted module according to claim 1, wherein the substrate and the optical element are fixed using a solder material or a polymer adhesive, and the energy is an electromagnetic wave.

5. The method of claim 4, wherein the electromagnetic waves are infrared light or far-infrared light.

2. The method for manufacturing an optical element mounting module according to claim 1, wherein the substrate and the optical element are fixed using a solder material or a polymer adhesive, and the energy is a sound wave.

The method for manufacturing an optical element mounted module according to claim 1, wherein As a method of installing the optical element with respect to the predetermined reference position, an alignment mark A1 representing the reference position and an alignment mark A2 formed on the back surface of the optical element are attached to a substrate or an optical element. A method for manufacturing an optical element mounted module, characterized by using a method of detecting and positioning by means of an alignment detection system through the process.

8. The method for manufacturing an optical element mounted module according to claim 7, wherein the energy is converted into an electromagnetic wave and supplied through the alignment detection system.

9. The method for manufacturing an optical element mounted module according to claim 7 or 8, wherein the required energy is supplied to fix the optical element to the substrate, and the alignment state between the optical element and the substrate is set to the alignment. A method for manufacturing an optical element mounted module, wherein the inspection is performed using a detection system.

10. The method of manufacturing an optical element mounted module according to claim 9, wherein, as a result of inspecting the alignment state using the alignment detection system, if the optical element and the substrate are misaligned, the alignment is repeated. A method for manufacturing an optical element mounted module, comprising supplying predetermined energy and performing realignment.

11. The method for manufacturing an optical element mounted module according to claim 7, wherein the alignment detection system, the alignment between the substrate and the optical element, and the supply of energy are performed almost simultaneously. The method of manufacturing the mounting module.

12. The method for manufacturing an optical element mounted module according to claim 1, wherein a plurality of optical elements are mounted on a substrate and required energy is supplied to each of the plurality of optical elements. .

13. Optical element holding means for holding an optical element;

Substrate holding means for holding a substrate, Position adjusting means for changing a relative positional relationship between the optical element and the substrate held by the holding means to make a predetermined relationship;

Energy supply means for supplying necessary energy to at least a part of the back surface of the optical element through the optical element or the substrate;

An apparatus for manufacturing an optical element mounted module, comprising: