JP3948551B2 - Mounting method and mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately mount by accurately aligning an upper surface side recognition mark of a first material to be connected at a recognition mark of a lower second material to be connected. SOLUTION: The method for mounting comprises the steps of aligning the first material to be connected with a recognition mark for aligning, at the upper surface side to the second material to be connected with a recognition mark for aligning with the first material to be connected and arranged downward; and then mounting the first material on the second material. The method further comprises the steps of reading and storing the relative positional relationship between the recognition mark of the upper surface side of the first material, and the recognition mark adhered to the lower surface side or the profile silhouette of the first material before mounting; reading the lower surface side recognition mark of the first material or the profile silhouette of the first material and the mark of the second material by recognition means of 2 fields inserted between the first material, and the second material at the time of aligning for mounting; and aligning the recognition mark of the second material with the upper surface side recognition mark of the first material as a reference based on the stored relative positional relationship. The apparatus for mounting is provided.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting method and a mounting apparatus for bonding objects to be bonded, and in particular, a first object to be bonded with a recognition mark for alignment on the upper surface side is disposed below and the first object to be bonded. It is related with the mounting method and mounting apparatus which mount after aligning with respect to the 2nd to-be-joined object to which the recognition mark for position alignment was attached | subjected.
[0002]
[Prior art]
When bonding objects to be bonded, for example, when mounting a chip on a substrate, it is necessary to bond the chip and the substrate after aligning them in a predetermined relationship. For this alignment, the recognition mark for alignment usually attached to the chip and the recognition mark for alignment attached to the substrate side are read by a recognition means such as a camera, and the relative positional relationship between the two marks. Is performed within a predetermined accuracy.
[0003]
Before the bonding, for example, when the recognition mark application surface of the chip disposed above and the recognition mark application surface of the substrate disposed below are opposed to each other, a recognition means, for example, a two-field recognition means is provided therebetween. It is possible to adjust the relative position of the chip and the substrate by inserting the mark and reading the upper and lower recognition marks.
[0004]
However, when an alignment recognition mark is attached to the upper surface of the chip, or when an alignment reference exists inside the chip (for example, an optical element having an active layer that emits light, which exists inside the chip as an alignment reference) In this case, the recognition marks on the chip and the substrate cannot be read by the above-mentioned two-field recognition means positioned between them.
[0005]
[Problems to be solved by the invention]
An object of the present invention is to focus on such problems, and there is a recognition mark or alignment reference for alignment on the upper surface or inside (hereinafter, sometimes simply referred to as “upper surface side recognition mark”). The upper surface side recognition mark of one object to be bonded can be accurately aligned with the recognition mark of the second object to be bonded below, and even with the first object to be bonded in such a form, with high accuracy. An object is to provide a mounting method and a mounting apparatus that can be mounted.
[0006]
[Means for Solving the Problems]
In order to solve the above-described problems, the mounting method according to the present invention includes a first object to be bonded, which has an alignment recognition mark on the upper surface side, arranged below the first object to be bonded. A method of mounting after positioning with respect to a second workpiece to which a recognition mark for alignment with the workpiece is attached, wherein the first workpiece is transferred onto a transparent stage before mounting. mounting to, above and below the first object to be bonded upper surface of the recognition marks and the lower surface side marked the recognition mark or a first relative positional relationship of the first object to be bonded with the outer silhouette of the objects to be bonded of The first recognition target is read and stored by the recognition means arranged , and the first recognition target is recognized by the two-field recognition means inserted between the first and second attachment objects at the time of alignment for mounting. The recognition mark on the lower surface side of the object or the external silhouette of the first object to be joined and the recognition of the second object to be joined A mark is read and, based on the stored relative positional relationship, alignment with the recognition mark of the second object is performed based on the upper surface side recognition mark of the first object. It consists of a method.
[0007]
In the above description, the “upper surface side” of the first workpiece to which the alignment recognition mark is attached refers to the first object to be bonded in addition to the case where the alignment recognition mark is attached to the upper surface itself. This includes the case where an alignment reference corresponding to the alignment recognition mark is provided inside the joint. For example, as an alignment reference, an active layer that emits light and exists inside an optical element or the like is included.
[0008]
The first object to be bonded is made of, for example, a chip, and the second object to be bonded is made of, for example, a substrate. However, in the present invention, the term “chip” refers to all forms on the side to be bonded to the substrate, such as an IC chip, a semiconductor chip, an optical element, a surface mount component, and a wafer, regardless of the type and size. In the present invention, the term “substrate” refers to all forms on the side bonded to the chip, such as a resin substrate, a glass substrate, a film substrate, a chip, and a wafer, regardless of the type and size.
[0009]
In this mounting method, the relative positional relationship is read in advance before mounting by recognition means arranged above and below the first object to be bonded . At this time, it is preferable to calibrate the relative positional relationship between the upper and lower recognizing means in advance using a calibration object having a reference mark that can be read by the recognizing means arranged above and below.
[0010]
The relative positional relationship can also be read by transmitting infrared light to the first workpiece .
[0011]
Further, when reading the relative positional relationship between the upper surface side recognition mark of the first object to be bonded and the outline silhouette, for example, the upper surface side recognition mark of the first object to be bonded is read using coaxial light, and oblique light is emitted. It can be used to read the outline silhouette of the first object to be joined .
[0012]
A mounting apparatus according to the present invention for carrying out such a mounting method includes a first object to be joined having an alignment recognition mark on the upper surface side and is disposed below the first object to be joined . A device for mounting after positioning with respect to a second workpiece to which a recognition mark for alignment with one workpiece is attached, and mounting the first workpiece on a transparent stage before mounting to transfer, the first object to be bonded upper surface of the recognition marks and recognition mark attached on the lower surface side or first relative positional relationship of the first object to be bonded with the outer silhouette of the objects to be bonded of Means for reading and storing by means of recognition means arranged above and below, and means for recognizing two fields of view inserted between the first object and the second object at the time of positioning for mounting, A recognition mark on the lower surface side of the first object to be joined or an outline silhouette of the first object to be joined; The recognition mark of the object to be bonded is read, and based on the stored relative positional relationship, alignment with the recognition mark of the second object to be bonded is performed with reference to the upper surface side recognition mark of the first object to be bonded. And means for performing.
[0013]
In the mounting method and the mounting apparatus according to the present invention as described above, the recognition mark on the upper surface side of the first object to be bonded and the recognition mark attached to the lower surface side or the outer shape silhouette of the first object to be bonded. The positional relationship is read and stored in advance, that is, before actual mounting, and at the time of alignment for mounting, the lower surface side recognition mark of the first workpiece or the outline silhouette of the first workpiece The recognition mark of the second object to be bonded is read and the alignment is performed based on the upper surface side recognition mark reference of the first object to be bonded based on the stored relative positional relationship. The upper surface side recognition mark is aligned with the recognition mark of the second workpiece. Therefore, alignment based on the upper surface side recognition mark reference of the first object to be bonded, which was not possible with the conventional method, is possible, and mounting can be performed with high accuracy.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a mounting apparatus according to an embodiment of the present invention. In this embodiment, the mounting apparatus 1 is a first object to be joined having a recognition mark 4 for alignment on the upper surface. The chip 2 is configured as an apparatus for mounting on a substrate 3 as a second object to be joined, which is arranged below and provided with a recognition mark 5 for alignment with the chip 2. The chip 2 is held by suction on the tool 6 from the upper surface side. Adsorption is performed, for example, by air suction through a suction hole 7 provided in the tool 6 and opened in the lower surface of the tool 6. However, this chip holding means is not only an adsorption holding means, but also an electrostatic holding means by static electricity, a magnetic holding means by a magnet or a magnetic field, a mechanical means for sandwiching the chip by a plurality of movable claws, and a single movable claw. Any means such as a pressing means may be used.
[0015]
The substrate 3 is held on the stage 8 from the lower surface side. The holding means for the substrate 3 by the stage 8 may be any means such as a suction holding means, an electrostatic holding means, a magnetic holding means, a plurality of movable claws, or a mechanical means using a single movable claw. In this embodiment, the stage 8 can be controlled in position and posture in the horizontal direction (X, Y direction) and the rotation direction (θ direction), and the relative position of the substrate 3 with respect to the chip 2 is adjusted accordingly. Is done. In this embodiment, the tool 6 holding the chip 2 can be controlled to move in the vertical direction (Z direction), and accordingly, the chip 2 is pressed against the substrate 3. It has become. In addition to heating, heating can be performed by a heater (not shown) built in the tool 6.
[0016]
FIG. 1 shows a state at the time of alignment between the chip 2 and the substrate 3 for mounting. In this embodiment, a recognition means 9 having two fields of view is inserted between the two. The two-field recognition means 9 reads the recognition mark 10 on the lower surface of the chip 2 located above or the outline silhouette of the chip 2 and also reads the recognition mark 5 on the substrate 3 located below. Then, based on the relative positional relationship between the upper surface side recognition mark 4 and the lower surface side recognition mark 10 or the outer shape silhouette of the chip 2 that has been read and stored in advance (that is, before this alignment), the upper surface side recognition mark 4 is used as a reference. Then, the chip 2 and the substrate 3 are aligned, and the aligned chip 2 is mounted on the substrate 3.
[0017]
The relative positional relationship stored in advance is read by the following various methods.
[0018]
In the method shown in FIG. 2, in advance, the chip 2 to be mounted from above the chip tray 11, a transparent stage 12 (e.g., a transparent glass stage) is transferred onto the upper mark recognizing means 13 and the lower mark recognition By means 14, the upper surface side recognition mark 4 and the lower surface side recognition mark 10 of the chip 2 are read, and the relative positional relationship between the two marks is read and stored. At this time, the chip 2 may be held by a transparent tool (not shown) from the upper surface side.
[0019]
In reading the relative positional relationship between the marks, it is necessary that the relative position accuracy of the mark recognizing means 13 and 14 is accurately grasped. Therefore, it is preferable that the relative positional relationship between the upper and lower mark recognition means 13 and 14 is calibrated in advance. For example, as shown in FIG. 2, the calibration between both the mark recognizing means 13 and 14 is performed by reading the calibration mark 15 attached on the transparent stage 12 with both the recognizing means 13 and 14 and positioning between them. This can be done by inputting the amount of deviation and correcting it later, or by adjusting the position so as to eliminate the position deviation according to the detected amount of position deviation.
[0020]
In the above example, the relative positional relationship between the recognition mark 4 on the upper surface side of the chip 2 and the recognition mark 10 on the lower surface side is read. However, as shown in FIG. 2. The relative positional relationship with the outer shape silhouette 16 (that is, the outer shape silhouette behind the chip 2), or the relative positional relationship with the corner portion and the edge portion of the outer shape of the chip 2 although not shown. Can also be read. In particular, when reading the relative positional relationship with the outer shape silhouette 16 of the chip 2, as shown in FIG. 4, when the outer shape silhouette 16 is read by projection, even when the edge surface 2a of the chip 2 is inclined. The projected outer shape (outer silhouette) from above and below is the same. Therefore, even if the reading direction of the outline silhouette at the time of understanding the relative positional relationship in advance and the reading direction of the outline silhouette at the time of alignment for subsequent mounting are reversed, it can be read as the same outline silhouette. .
[0021]
Reading of the outer silhouette 16 of the chip 2 can be performed by any of the methods shown in FIGS. In the method shown in FIG. 5, the outline silhouette 16 projected by the light from the light source 17 can be read by the recognition means 14. In the method shown in FIG. 6, for example, the external silhouette 16 of the chip 2 held on the transparent tool 18 can be read using the reflection surface 18 a of the tool 18 instead of the projection.
[0022]
Further, as shown in FIG. 7, for example, “Gel Pack” (“Gel Pack” is a trade name, “Gel Pack” chip manufactured by Gel Pack (GEL-PAK LLC (USA)) and a wafer carrier (dust-free transfer). Case) The upper surface side recognition mark 4 of the chip 2 is read by the coaxial light 21 from the recognition means 20 for the chip 2 on the chip tray 19 consisting of ("Gel-Pak" Chip / wafer Carrier & Shipping System). At the same time, it is possible to read the outline silhouette (or edge position) using the oblique light 22 from the recognition means 20. In this case, the same recognizing means 20 can switch the coaxial light 21 and the oblique light 22 to read the upper surface side recognition mark 4 and the outline silhouette.
[0023]
Furthermore, as shown in FIG. 8, the relative positional relationship can be read by transmitting infrared light to the chip. For example, an infrared light source 24 is disposed above the chip 2 held on the stage 23, and the upper surface side recognition mark 4 and the lower surface side recognition mark 10 of the chip 2 are changed by the infrared light 25 emitted from the infrared light source 24. Both can be read by the recognition means 26. Further, in this case, when there is an alignment reference inside the chip 2, for example, in the case of the above-described optical element, the relative positional relationship between the internal alignment reference and the lower surface side recognition mark 10 is determined by transmitted infrared light. Can be read. In particular, when this infrared transmitted light is used, a single recognition means 26 is sufficient. In addition to infrared light, for example, X-rays, electromagnetic waves, sound waves, etc. may be used as long as they pass through the chip and can recognize the recognition mark attached to the chip.
[0024]
In this case, the recognition mark 4 or the internal alignment reference is read with infrared light, and the lower recognition mark or the outline silhouette is read with a projection of normal light (visible light) or a light source from below. it can. Furthermore, if the infrared light cut filter 27 is provided so as to be able to enter and exit, the irradiation light from the same light source 24 can be switched between infrared light and normal light. Can be read.
[0025]
As described above, in the present invention, the relative positional relationship between the upper surface side recognition mark 4 or the internal alignment reference of the chip 2 and the lower surface side recognition mark 10 or the outer shape silhouette 16 is read and stored in advance. For alignment. Therefore, a series of operations of this method can be shown in FIG. 9 for the relative positional relationship reading method shown in FIG. That is, the chip 2 transferred from the chip tray 11 to the transparent stage 12 is measured as shown in FIG. 2 and then moved from the transparent stage 12 to the tool 6 and held by the tool 6. As shown in FIG. 1, the chip 2 held by the tool 6 is read by the two-field recognition means 9 while the lower surface side recognition mark 10 of the chip 2 positioned above or the outer silhouette of the chip 2 is read. The recognition mark 5 of the substrate 3 positioned at is read. Then, on the basis of the upper surface side mark 4 or the internal alignment reference and the substrate 3 based on the relative positional relationship between the stored upper surface side mark 4 or the internal alignment reference of the chip 2 and the lower surface side mark 10 or the external silhouette. Alignment with the recognition mark 5 is performed. Therefore, extremely high-precision alignment is possible without directly reading the upper surface side recognition mark 4 or the internal alignment reference during this alignment, and high-precision mounting after alignment is possible.
[0026]
In the example shown in FIG. 9, the starting point of the transparent stage 12 is set between the axes of the mark recognizing means 13 and 14. However, the present invention is not limited to this, and the starting point may be on the chip tray 11 side. For example, as shown in FIG. 10, when the transparent stage 12 on which the chip 2 from the chip tray 11 is placed moves from the starting point on the chip tray 11 side under the head 6, when passing between the mark recognition means 13 and 14. The lower surface side recognition mark 10 of the chip 2 or the outer silhouette of the chip 2 can also be recognized instantaneously.
[0027]
Further, as shown in FIG. 11, even at the time of alignment for mounting, the outer shape silhouette 16 of the upper chip 2 can be read by using, for example, oblique light 29 by the recognition means 28 having two visual fields.
[0028]
【The invention's effect】
As described above, according to the mounting method and apparatus of the present invention, the relative positional relationship between the upper surface side recognition mark and the lower surface side recognition mark or the outer shape silhouette of the first object to be bonded is read and stored in advance. Based on the stored relative positional relationship, the alignment with the recognition mark of the second object to be joined is performed based on the upper surface recognition mark. Even without reading, both objects can be joined with high accuracy.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram showing an example of means for obtaining a relative positional relationship in advance.
FIG. 3 is a schematic configuration diagram showing a method for reading an outline silhouette of a first object to be joined.
4 is a schematic configuration diagram showing a state where an edge surface of a first object to be joined is tilted by the method of FIG. 3;
FIG. 5 is a schematic configuration diagram showing an example of a method for reading an outline silhouette by projection.
FIG. 6 is a schematic configuration diagram illustrating an example of a method of reading an outline silhouette by reflection.
FIG. 7 is a schematic configuration diagram showing an example of a method using coaxial light and oblique light.
FIG. 8 is a schematic configuration diagram showing an example of a method using infrared light.
FIG. 9 is a schematic perspective view showing an entire example of a method according to the present invention.
FIG. 10 is a schematic side view showing the whole of another example of the method according to the present invention.
FIG. 11 is a schematic configuration diagram illustrating a state in which an outline silhouette of a first object to be bonded is read during alignment for mounting.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Chip | tip 2a as 1st to-be-joined object Edge surface 3 Board | substrate 4 as 2nd to-be-joined object 4 Upper surface side recognition mark 5 Substrate recognition mark 6 Tool 7 which hold | maintains chip | tip Suction hole 8 Substrate for substrates 9 Two-field recognition means 10 Lower surface side recognition mark 11 Chip tray 12 Transparent stage 13 Upper mark recognition means 14 Lower mark recognition means 15 Calibration mark 16 Outline silhouette 17 Light source 18 Transparent tool 18a Reflecting surface 19 Chip tray 20 Recognition means 21 Coaxial light 22 Oblique light 23 Stage 24 Infrared light source 25 Infrared light 26 Recognizing means 27 Infrared light cut filter 28 Two-field recognizing means 29 Oblique light

Claims (5)

  The first object to be joined with the alignment recognition mark on the upper surface side is arranged below the first object to be joined, and the second object to which the recognition mark for alignment with the first object to be joined is attached. A method of mounting after positioning with respect to an object to be bonded, wherein the first object to be bonded is transferred onto a transparent stage before mounting, and a recognition mark on the upper surface side of the first object to be bonded is mounted. Is read and stored by the recognition means arranged above and below the first object to be bonded, and is aligned for mounting. Sometimes, the recognition means of the two fields of view inserted between the first workpiece and the second workpiece, the lower surface side recognition mark of the first workpiece or the outline silhouette of the first workpiece. And the recognition mark of the second object to be joined is read and the stored relative positional relationship Based on mounting method, wherein a top side recognition mark of the first object to be bonded to align the recognition mark of the second object to be bonded to the reference.   The mounting method according to claim 1, wherein the relative positional relationship between the upper and lower recognition means is preliminarily calibrated using a calibration object to which a reference mark that can be read by the upper and lower recognition means is attached.   The mounting method according to claim 1, wherein the relative positional relationship is read by transmitting infrared light to the first workpiece. The mounting method according to claim 1, wherein when the relative positional relationship is read, the upper surface side recognition mark of the first object to be bonded is read using coaxial light, and the outer shape silhouette of the first object to be bonded is read using oblique light. The first object to be joined with the alignment recognition mark on the upper surface side is arranged below the first object to be joined, and the second object to which the recognition mark for alignment with the first object to be joined is attached. An apparatus for mounting after positioning with respect to the object to be bonded, wherein the first object to be bonded is transferred onto a transparent stage before mounting, and a recognition mark on the upper surface side of the first object to be bonded is mounted. And a means for reading and storing the relative positional relationship between the recognition mark attached to the lower surface side or the outer shape silhouette of the first object to be joined, and the first object and the second object at the time of positioning for mounting By means of a two-field recognition means inserted between the object to be bonded, the lower surface side recognition mark of the first object to be bonded or the outer shape silhouette of the first object to be bonded and the recognition mark of the second object to be bonded Read and based on the stored relative positional relationship, the upper surface side of the first object to be joined Mounting apparatus characterized by comprising a means for aligning the recognition mark of the second object to be bonded based on the identification mark, the.

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