JPH0846335A - Heat conduction sheet - Google Patents
Heat conduction sheetInfo
- Publication number
- JPH0846335A JPH0846335A JP19487794A JP19487794A JPH0846335A JP H0846335 A JPH0846335 A JP H0846335A JP 19487794 A JP19487794 A JP 19487794A JP 19487794 A JP19487794 A JP 19487794A JP H0846335 A JPH0846335 A JP H0846335A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- conductive particles
- electrode
- conductive sheet
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板上の電極にヒート
シールコネクタ等の接続部材を圧着接続するに際し、熱
及び圧力を基板側に均一に伝達するために接続部材とツ
ールとの間に介挿される熱伝導シートに関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact member and a tool for uniformly transmitting heat and pressure to a substrate when a connecting member such as a heat seal connector is pressure-bonded to an electrode on the substrate. The present invention relates to a heat conductive sheet to be inserted.
【０００２】[0002]
【従来の技術】ポリエステルフィルム等の片面に電極を
付着（帯状電極と、この帯状電極の表面に設けた微小径
の複数の導電粒子からなる）させて作られたシールコネ
クタを基板上の電極に圧着接続するに際しては、熱源を
内蔵した治具（ツール）をシールコネクタに当てて加熱
及び加圧を付与することにより行われる。この場合、熱
と圧力をシールコネクタに均一に付与するために、治具
とシールコネクタの間に熱伝導シートが介挿される。熱
伝導シートは、その全体にわたって温度差が生じ難く、
且つ変形などの生じ難い素材、例えばシリコンゴムを用
いて作られる。2. Description of the Related Art A seal connector made by attaching an electrode (consisting of a strip-shaped electrode and a plurality of conductive particles of minute diameter provided on the surface of the strip-shaped electrode) to one surface of a polyester film or the like is used as an electrode on a substrate. The crimping connection is performed by applying a jig (tool) containing a heat source to the seal connector to apply heat and pressure. In this case, a heat conduction sheet is inserted between the jig and the seal connector in order to uniformly apply heat and pressure to the seal connector. The thermal conductive sheet is less likely to have a temperature difference over the entire surface,
In addition, it is made of a material that is not easily deformed, such as silicon rubber.
【０００３】[0003]
【発明が解決しようとする課題】しかし、従来用いられ
ていた熱伝導シートは、図７（側面図）に示すように、
表面及び裏面は共に平滑に加工されている。このように
熱伝導シート２０の表面が平坦であるため、圧着時に導
電粒子の外径に従ってポリエステルフィルムが変形し、
また、上方から加圧されているため、導電粒子が移動し
易くなる。However, the conventionally used heat conductive sheet is as shown in FIG. 7 (side view).
Both the front surface and the back surface are processed to be smooth. Since the surface of the heat conductive sheet 20 is thus flat, the polyester film is deformed according to the outer diameter of the conductive particles during pressure bonding,
Further, since the pressure is applied from above, the conductive particles are easily moved.
【０００４】この結果、圧着後の熱伝導シートは、図８
（平面部分拡大図）に示すように、ヒートシールコネク
タ２１の導電粒子２２の内、帯状電極２３の境界近傍に
あった導電粒子２４が基板２５側の電極２６から離れ、
基板２５上のレジスト２７側へ流動する場合がある。As a result, the heat conductive sheet after pressure bonding is shown in FIG.
As shown in (enlarged plan view), among the conductive particles 22 of the heat seal connector 21, the conductive particles 24 near the boundary of the strip electrode 23 are separated from the electrode 26 on the substrate 25 side,
It may flow to the resist 27 side on the substrate 25.
【０００５】そこで本発明は、電極の端部近傍（電極周
辺部）に位置する導電粒子を確実に基板側の電極に接続
することが可能な熱伝導シートを提供することを目的と
している。Therefore, an object of the present invention is to provide a heat conductive sheet which can surely connect conductive particles located in the vicinity of the ends of the electrodes (periphery of the electrodes) to the electrodes on the substrate side.
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、この発明は、熱源を持つツールを用いて基板上の
電極に導電粒子を接続媒体とする電極を有する部材を圧
着接続するに際し、前記ツールと前記部材の間に介挿さ
れる熱伝導シートにおいて、その少なくとも片面に前記
部材に設けられている導電粒子の圧着時の移動を規制す
る凸部を設けるようにしている。In order to achieve the above object, the present invention provides a method for pressure-bonding a member having an electrode having conductive particles as a connecting medium to an electrode on a substrate using a tool having a heat source. In the heat conductive sheet inserted between the tool and the member, at least one surface thereof is provided with a convex portion that restricts movement of the conductive particles provided on the member during pressure bonding.
【０００７】前記部材は、ヒートシールコネクタとする
ことができる。The member may be a heat seal connector.
【０００８】また、前記凸部は、格子形に形成された線
状の突起にすることができる。そして、前記線状の突起
の相互間隔及び深さは、前記導電粒子の直径よりも大き
くすることができる。Further, the protrusions may be linear protrusions formed in a lattice shape. And, the mutual interval and the depth of the linear protrusions can be made larger than the diameter of the conductive particles.
【０００９】[0009]
【作用】上記した手段によれば、熱伝導シートの片面に
形成された凸部は、ヒートシールコネクタの様な部材に
熱伝導シートを重ねてツールにより加圧及び加熱した
際、凸部間の溝（凹部）内に導電粒子を捕捉し、導電粒
子の移動を防止する。この結果、電極の領域の境界近傍
にある導電粒子であっても、電極領域からはみ出ること
がなく、接続の信頼性を高めることができる。According to the above-mentioned means, the convex portions formed on one surface of the heat conducting sheet are provided between the convex portions when the heat conducting sheet is placed on a member such as a heat seal connector and pressed and heated by a tool. The conductive particles are captured in the groove (recess) to prevent the conductive particles from moving. As a result, even conductive particles in the vicinity of the boundary of the electrode region do not protrude from the electrode region, and the reliability of connection can be improved.
【００１０】基板側の電極に接続する部材がヒートシー
ルコネクタである場合、その構造上フィルムに設けられ
た帯状電極上に導電粒子を付着させており、圧着時に電
極端部に位置する部位に設けられた導電粒子は移動し易
いが、凸部を設けることにより導電粒子の移動を効果的
に規制することができる。When the member to be connected to the electrode on the substrate side is a heat seal connector, conductive particles are adhered to the band-shaped electrode provided on the film due to its structure, and the member is provided at a portion located at the electrode end portion at the time of pressure bonding. The conductive particles thus obtained are easy to move, but the movement of the conductive particles can be effectively regulated by providing the convex portion.
【００１１】線状の突起を格子形に形成した凸部は、こ
の格子の１つ１つに導電粒子を嵌入状態にさせることが
でき、導電粒子の領域外への移動を防止し、接続の信頼
性を高めることができる。The convex portion in which the linear projections are formed in a lattice shape can make the conductive particles fit into each of the lattices, prevent the conductive particles from moving out of the region, and connect the conductive particles. The reliability can be increased.
【００１２】また、線状の突起の相互間隔及び深さを前
記導電粒子の直径よりも大きくすれば、余裕をもって導
電粒子を捕捉することができ、接続の信頼性を高めるこ
とができる。Further, if the mutual intervals and depths of the linear protrusions are made larger than the diameter of the conductive particles, the conductive particles can be captured with a margin, and the reliability of connection can be improved.
【００１３】[0013]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【００１４】図１は本発明による熱伝導シート及びその
圧着時の周辺構成を示す正面図である。また、図２及び
図３は本発明による熱伝導シートの正面図及び側面図を
示している。FIG. 1 is a front view showing a heat conductive sheet according to the present invention and a peripheral structure at the time of pressure bonding. 2 and 3 show a front view and a side view of the heat conductive sheet according to the present invention.
【００１５】ヒートシールコネクタ１は、ポリエステル
フィルム２、電極３、導電粒子４及び接着剤５をもって
構成される。ポリエステルフィルム２は平板状に加工さ
れ、その片面の所定位置に複数の略台形の電極３が貼着
されている。更に、電極３の表面の平坦部には微小径
（ヒートシールコネクタの電極３と基板側の電極を接続
する媒体として機能するもので、例えば直径約３０μｍ
の半田ボール）の複数の導電粒子４が設けられている。
また、導電粒子４及び電極３の露出面ならびにポリエス
テルフィルム２の電極取付面の露出部分には接着剤５が
塗布され、電極３及び導電粒子４の固定が行われてい
る。一方、基板６は、基板７の片面に複数の電極８（電
極３の各々に対向する位置に配設）が設けられると共に
レジスト９を施して構成されている。The heat seal connector 1 comprises a polyester film 2, electrodes 3, conductive particles 4 and an adhesive 5. The polyester film 2 is processed into a flat plate shape, and a plurality of substantially trapezoidal electrodes 3 are attached to predetermined positions on one surface of the polyester film 2. Further, the flat portion of the surface of the electrode 3 has a small diameter (which functions as a medium for connecting the electrode 3 of the heat seal connector and the electrode on the substrate side, for example, a diameter of about 30 μm).
A plurality of conductive particles 4 of the solder balls) are provided.
An adhesive 5 is applied to the exposed surface of the conductive particles 4 and the electrodes 3 and the exposed portion of the electrode mounting surface of the polyester film 2 to fix the electrodes 3 and the conductive particles 4. On the other hand, the substrate 6 is formed by providing a plurality of electrodes 8 (arranged at positions facing each of the electrodes 3) on one surface of the substrate 7 and applying a resist 9.
【００１６】ヒートシールコネクタ１を電極８に熱圧着
するに際しては、図１に示す様に、電極８を上側にして
基板６を最下部に置き、この上部に電極３を下側にして
ヒートシールコネクタ１が配設される。ついで、ポリエ
ステルフィルム２の上部に本発明による熱伝導シート１
０が配設される（なお、熱伝導シート１０の配設に際し
ては、凸部１１をポリエステルフィルム２側（下側）に
向けて配設する）。更に、熱伝導シート１０の上部に
は、熱圧着の熱源及び押圧駆動源となるツール１２（熱
源としてのヒータを内蔵している）が配設される。When the heat seal connector 1 is thermocompression-bonded to the electrode 8, as shown in FIG. 1, the electrode 8 is placed on the upper side, the substrate 6 is placed on the lowermost side, and the electrode 3 is placed on the upper side of the heat sealed seal. A connector 1 is provided. Then, the heat conductive sheet 1 according to the present invention is provided on the polyester film 2.
0 is provided (when the heat conductive sheet 10 is provided, the convex portion 11 is provided so as to face the polyester film 2 side (lower side)). Further, a tool 12 (having a built-in heater as a heat source) serving as a heat source for thermocompression bonding and a pressing drive source is disposed on the upper portion of the heat conductive sheet 10.
【００１７】熱伝導シート１０は、図２及び図３に示す
ように、その片面（基板側）には電極８の幅相当の間隔
に設定した格子状の凸部１１が設けられている。そして
熱伝導シート１０の素材には、例えば熱伝導率及び弾性
係数に優れるシリコンゴムを用いることができる。その
厚みｔは０．４〜０．５ｍｍ程度にされ、その表面に設
けられる凸部１１は碁盤の目状（格子状）に線状突起を
設けることにより形成でき、その高さｈ及び相互間隔は
導電粒子４の移動を規制するサイズ、例えば導電粒子４
の直径が３０μｍであれば５０μｍ程度にすればよい
が、具体的には、次のようにして決定することができ
る。As shown in FIGS. 2 and 3, the heat conductive sheet 10 is provided on one surface (substrate side) thereof with grid-like convex portions 11 set at intervals corresponding to the width of the electrodes 8. As the material of the heat conductive sheet 10, for example, silicon rubber having excellent thermal conductivity and elastic coefficient can be used. The thickness t is set to about 0.4 to 0.5 mm, and the convex portions 11 provided on the surface thereof can be formed by providing linear projections in a grid (lattice) pattern, and the height h and the mutual spacing therebetween. Is a size that regulates the movement of the conductive particles 4, for example, the conductive particles 4
If the diameter is 30 μm, it may be about 50 μm, but specifically, it can be determined as follows.
【００１８】すなわち、図４に示すように、凸部１１の
高さ及び溝の幅をＬ、導電粒子４の直径をＤ、ピッチを
Ｐと定義すれば、Ｌ＝１．７Ｄ、Ｐ＝１．５Ｌとして各
寸法を決定することができる。That is, as shown in FIG. 4, if the height of the convex portion 11 and the width of the groove are defined as L, the diameter of the conductive particles 4 as D, and the pitch as P, L = 1.7D, P = 1. Each dimension can be determined as 0.5L.
【００１９】図１のように各部材の位置決めを行った
後、その相互の位置関係を保ったまま、熱源が機能して
いるツール１２を降下させて行くと導電粒子４が電極８
に圧接し、また、ポリエステルフィルム２の上面に熱伝
導シート１０を押し当てる。これにより、熱伝導シート
１０とヒートシールコネクタ１が、ツール１２と基板６
で挟み込まれる形になる。したがって、ツール１２の熱
が熱伝導シート１０、ポリエステルフィルム２を通して
電極３に到達し、更に、導電粒子４を通して電極８に伝
熱される。この熱によって接着剤５が軟化すると共に、
ツール１２から付与される押圧力によって、導電粒子４
と電極８が電気的かつ機械的に接続（熱圧着）される。
この過程で熱硬化性の接着剤５は数秒後に硬化し、ま
た、ツール１２は初期位置に戻され、圧着作業が完了す
る。After positioning the respective members as shown in FIG. 1, the conductive particles 4 are transferred to the electrodes 8 by lowering the tool 12 in which the heat source is functioning while maintaining the mutual positional relationship.
Then, the heat conductive sheet 10 is pressed against the upper surface of the polyester film 2. As a result, the heat conductive sheet 10 and the heat seal connector 1 are connected to the tool 12 and the substrate 6
It will be sandwiched between. Therefore, the heat of the tool 12 reaches the electrode 3 through the heat conductive sheet 10 and the polyester film 2, and is further transferred to the electrode 8 through the conductive particles 4. This heat softens the adhesive 5 and
By the pressing force applied from the tool 12, the conductive particles 4
And the electrode 8 are electrically and mechanically connected (thermocompression bonding).
In this process, the thermosetting adhesive 5 is cured after a few seconds, the tool 12 is returned to the initial position, and the crimping work is completed.
【００２０】このとき、熱伝導シート１０に凸部１１が
設けられているため、図５、図６に示すように、導電粒
子４は熱伝導シート１０によって電極幅方向への移動が
規制され、電極３の端（境界近傍）に存在していた導電
粒子４は電極８からはみ出ることがなく、圧着時に確実
に基板６の電極８上に接続することができ、接続の信頼
性を高めることが可能になる。At this time, since the convex portion 11 is provided on the heat conductive sheet 10, the movement of the conductive particles 4 in the electrode width direction is restricted by the heat conductive sheet 10 as shown in FIGS. 5 and 6. The conductive particles 4 existing at the end (near the boundary) of the electrode 3 do not protrude from the electrode 8 and can be reliably connected to the electrode 8 of the substrate 6 at the time of pressure bonding, and the reliability of the connection can be improved. It will be possible.
【００２１】なお、上記実施例においては、凸部１１を
格子状に設けるものとしたが、これに限定されるもので
はなく、ハニカム形、一の字つなぎ形等であってもよ
い。In the above embodiment, the convex portions 11 are provided in a lattice shape, but the present invention is not limited to this, and may be a honeycomb shape, a one-piece connecting shape or the like.
【００２２】また、前記実施例では、ヒートシールコネ
クタを例に説明したが、これに限定されるものではな
く、導電粒子を電極間の接続媒体とし、熱伝導シートを
用いて圧着接続する全ての電子部品に本発明を適用する
ことができる。In the above embodiment, the heat seal connector has been described as an example, but the present invention is not limited to this, and conductive particles are used as a connecting medium between the electrodes, and all of them are pressure-bonded by using a heat conductive sheet. The present invention can be applied to electronic components.
【００２３】[0023]
【発明の効果】以上説明した通り、本発明は、熱源を持
つツールを用いて基板上の電極に導電粒子を接続媒体と
する電極を有する部材を圧着接続するに際し、前記ツー
ルと前記部材の間に介挿される熱伝導シートにおいて、
その少なくとも片面に前記部材に設けられている導電粒
子の圧着時の移動を規制する凸部を設けるようにしたの
で、接続の信頼性を高めることができる。As described above, according to the present invention, when a member having an electrode having conductive particles as a connecting medium is pressure-bonded to an electrode on a substrate using a tool having a heat source, the tool and the member are connected to each other. In the heat conductive sheet inserted in
Since the convex portion that restricts the movement of the conductive particles provided on the member at the time of pressure bonding is provided on at least one surface of the member, the reliability of connection can be improved.
【図１】本発明による熱伝導シート及びその圧着時の周
辺構成を示す正面図である。FIG. 1 is a front view showing a heat conductive sheet according to the present invention and a peripheral configuration at the time of pressure bonding.
【図２】本発明による熱伝導シートを示す正面図であ
る。FIG. 2 is a front view showing a heat conductive sheet according to the present invention.
【図３】本発明による熱伝導シートを示す側面図であ
る。FIG. 3 is a side view showing a heat conductive sheet according to the present invention.
【図４】本発明にかかる凸部の各部の寸法定義を示す説
明図である。FIG. 4 is an explanatory view showing the dimension definition of each part of the convex part according to the present invention.
【図５】本発明による導電粒子の移動規制効果を示す説
明図である。FIG. 5 is an explanatory diagram showing the effect of restricting the movement of conductive particles according to the present invention.
【図６】本発明の熱伝導シートを用いた圧着工程を示す
正面図である。FIG. 6 is a front view showing a crimping step using the heat conductive sheet of the present invention.
【図７】従来の熱伝導シートの構成を示す側面図であ
る。FIG. 7 is a side view showing a configuration of a conventional heat conductive sheet.
【図８】従来の熱伝導シートによる圧着不良を示す説明
図である。FIG. 8 is an explanatory diagram showing a crimping defect due to a conventional heat conductive sheet.
１ ヒートシールコネクタ ２ ポリエステルフィルム ３ 電極 ４ 導電粒子 ５ 接着剤 ６ 基板 ７ 基板 ８ 電極 ９ レジスト １０ 熱伝導シート １１ 凸部 １２ ツール ２０ 熱伝導シート ２１ ヒートシールコネクタ ２２ 導電粒子 ２３ 帯状電極 ２４ 導電粒子 ２５ 基板 ２６ 電極 ２７ レジスト 1 Heat Seal Connector 2 Polyester Film 3 Electrode 4 Conductive Particle 5 Adhesive 6 Substrate 7 Substrate 8 Electrode 9 Resist 10 Thermal Conductive Sheet 11 Convex 12 Tool 20 Thermal Conductive Sheet 21 Heat Seal Connector 22 Conductive Particle 23 Strip Electrode 24 Conductive Particle 25 Substrate 26 Electrode 27 Resist
Claims (4)
に導電粒子を接続媒体とする電極を有する部材を圧着接
続するに際し、前記ツールと前記部材の間に介挿される
熱伝導シートにおいて、 その少なくとも片面に前記部材に設けられている導電粒
子の圧着時の移動を規制する凸部を設けたことを特徴と
する熱伝導シート。1. A heat conductive sheet interposed between a tool and the member, when a member having an electrode having conductive particles as a connection medium is pressure-bonded to an electrode on a substrate using a tool having a heat source, A heat-conducting sheet, characterized in that at least one surface thereof is provided with a convex portion for restricting movement of the conductive particles provided on the member during pressure bonding.
ることを特徴とする請求項１記載の熱伝導シート。2. The heat conductive sheet according to claim 1, wherein the member is a heat seal connector.
突起であることを特徴とする請求項１記載の熱伝導シー
ト。3. The heat conductive sheet according to claim 1, wherein the convex portion is a linear protrusion formed in a lattice shape.
前記導電粒子の直径よりも大きくすることを特徴とする
請求項３記載の熱伝導シート。4. The mutual spacing and depth of the linear protrusions are
The heat conductive sheet according to claim 3, wherein the diameter is larger than the diameter of the conductive particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19487794A JPH0846335A (en) | 1994-07-26 | 1994-07-26 | Heat conduction sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19487794A JPH0846335A (en) | 1994-07-26 | 1994-07-26 | Heat conduction sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0846335A true JPH0846335A (en) | 1996-02-16 |
Family
ID=16331806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19487794A Pending JPH0846335A (en) | 1994-07-26 | 1994-07-26 | Heat conduction sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0846335A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7118386B2 (en) | 2002-12-17 | 2006-10-10 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| JP2007128829A (en) * | 2005-11-07 | 2007-05-24 | Fuji Polymer Industries Co Ltd | Sheet for thermocompression bonding |
| US7230830B2 (en) | 2004-04-16 | 2007-06-12 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
| JP2007194830A (en) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co Ltd | Tuner module |
| US7335030B2 (en) | 2005-03-10 | 2008-02-26 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
| US7568918B2 (en) | 2007-09-28 | 2009-08-04 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7618277B2 (en) | 2004-08-31 | 2009-11-17 | Yamaichi Electronics Co., Ltd. | Method of mounting and demounting a semiconductor device, device for mounting and demounting a semiconductor device using the same, and socket for a semiconductor device |
| US7815456B2 (en) | 2008-12-22 | 2010-10-19 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
| US7887355B2 (en) | 2008-11-13 | 2011-02-15 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
-
1994
- 1994-07-26 JP JP19487794A patent/JPH0846335A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7278868B2 (en) | 2002-12-17 | 2007-10-09 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7165978B2 (en) | 2002-12-17 | 2007-01-23 | Yamichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7204708B2 (en) | 2002-12-17 | 2007-04-17 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7118386B2 (en) | 2002-12-17 | 2006-10-10 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7230830B2 (en) | 2004-04-16 | 2007-06-12 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
| US7618277B2 (en) | 2004-08-31 | 2009-11-17 | Yamaichi Electronics Co., Ltd. | Method of mounting and demounting a semiconductor device, device for mounting and demounting a semiconductor device using the same, and socket for a semiconductor device |
| US7563144B2 (en) | 2005-03-10 | 2009-07-21 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
| US7335030B2 (en) | 2005-03-10 | 2008-02-26 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
| US7556507B2 (en) | 2005-03-10 | 2009-07-07 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
| JP2007128829A (en) * | 2005-11-07 | 2007-05-24 | Fuji Polymer Industries Co Ltd | Sheet for thermocompression bonding |
| JP2007194830A (en) * | 2006-01-18 | 2007-08-02 | Mitsumi Electric Co Ltd | Tuner module |
| US7568918B2 (en) | 2007-09-28 | 2009-08-04 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7887355B2 (en) | 2008-11-13 | 2011-02-15 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
| US7815456B2 (en) | 2008-12-22 | 2010-10-19 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10303252A (en) | Semiconductor device | |
| US4626478A (en) | Electronic circuit device components having integral spacers providing uniform thickness bonding film | |
| JP3491415B2 (en) | Manufacturing method of liquid crystal display device | |
| JPH0846335A (en) | Heat conduction sheet | |
| JP4428472B2 (en) | Clip connector mounting structure, clip connector mounting method, and clip connector | |
| JP3492195B2 (en) | Electrode bonding method for plasma display panel | |
| JP3763607B2 (en) | Method for manufacturing liquid crystal display device and liquid crystal display device | |
| KR100187580B1 (en) | Method for sticking an insulating film to a lead frame | |
| JP2876292B2 (en) | Connector and connector manufacturing method | |
| JP2001308146A (en) | Apparatus for installing semiconductor chip on chip carrier | |
| JPH08146451A (en) | Apparatus for producing circuit device | |
| US6132226A (en) | Structure and method for mounting an electronic part | |
| JP2003124256A (en) | Mounting method of flexible substrate | |
| JP4356137B2 (en) | Manufacturing method of semiconductor device | |
| JP2897406B2 (en) | Semiconductor element peeling method | |
| JPH06235928A (en) | Liquid crystal display device | |
| JPH10112584A (en) | Connecting method for circuit board, connecting structure for circuit board, and liquid crystal device using the structure | |
| JP3213096B2 (en) | Heat seal connector | |
| JPH0236556A (en) | Pin grid array and mounting of semiconductor element | |
| JPH10107072A (en) | Structure and method for connecting semiconductor element | |
| JP3267071B2 (en) | TAB-cell crimping apparatus and crimping method | |
| JP2004004947A (en) | Plasma display panel | |
| JP2004039756A (en) | Semiconductor device and method and apparatus of manufacturing the same | |
| JP3027171B2 (en) | Electric circuit members | |
| JP4213499B2 (en) | Semiconductor device and manufacturing method thereof |