JPH0837353A - Printed board and printed board designing device - Google Patents

Abstract

PURPOSE:To provide a printed board for realizing high density mounting and to provide a printed board designing device realizing a design of the printed board. CONSTITUTION:A part of a wiring via is constituted of a substance allowing electric contact of a probe of an in-circuit tester because of a large non-covering region of a solder resist. Then, in addition to the wiring via, a combined wiring test - via allowing electric contact of the probe of the in-circuit because of a large non-covering region of the solder resist is resistered in a library 10. Further, it is so constituted that the constitution to design the printed board by using the wiring via is adopted, besides a means 13 to specify a probe point to be allotted on a circuit net owned by the printed board designed by priority of parts pins regarding the wiring via to become the probe point and a means 14 for changing the wiring via to be included by the specified probe point into a wiring test - via are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which circuit parts are mounted and a printed circuit board designing apparatus for designing the printed circuit board. In particular, high density mounting and efficient printed circuit board design are realized. The present invention relates to a printed circuit board that enables the printed circuit board and a printed circuit board design device that realizes the design of the printed circuit board.

When a printed circuit board is manufactured, it is checked by an in-circuit tester whether a manufacturing failure due to excessive solder rise or solder balls has occurred. In order to enable such a check, it is necessary to provide a probe point, which is a contact point of the probe of the in-circuit tester, on each circuit net of the printed board, but this probe point interferes with high-density mounting,
This will cause manufacturing failures. From now on, it is necessary to devise this probe point to realize higher density mounting and reduce manufacturing troubles.

[0003]

2. Description of the Related Art Basically, one probe point for an in-circuit tester is required for each circuit net, and in order to realize reliable contact between the probe and the printed board, the accuracy of the jig and the probe It is necessary to set in consideration of mutual interference and shapes of mounted parts. And this probe point is a manufacturing obstacle in the component mounting process,
It is required not to be a factor that deteriorates the reliability of the printed board, such as pattern insulation due to corrosion.

In the conventional printed board, when the component pins cannot be used as the probe points of the in-circuit tester, the test pads are prepared as the probe points.

That is, in a CAD system for designing a printed circuit board, when the basic design of the printed circuit board is completed, the CAD system interacts with the operator to find a circuit net having no probe points, and a virtual test pad is attached to the circuit net. The connection point is that the probe points of the in-circuit tester are arranged on the printed board.

In this way, in the conventional printed board, the test pad having the sectional structure shown in FIG. 8A is allocated to the circuit net having no probe point as shown in FIG. 8B. Is configured as follows. here,
Double circles in the drawing are wiring vias of plated through holes that electrically connect the front surface and the back surface of the printed board.

[0007]

However, when the test pad is provided, there is a problem that high-density mounting of the printed board cannot be realized.

Since the test pad requires wiring between the component pins and a relatively large area, a large amount of time is required for its placement and wiring, as well as its placement and wiring. There is a problem that the layout of components frequently changes due to wiring, which increases the number of repetitive tasks of logic design and mounting design.

Defining a test pad for a virtual component that has no logical function and is not actually mounted is as follows.
There is also a problem that the representation of the drawing and the processing of the CAD system become complicated.

The present invention has been made in view of the above circumstances, and provides a new printed board that realizes high-density mounting and enables efficient printed board design, and the design of the printed board. It is an object of the present invention to provide a new printed circuit board designing device that realizes the above.

[0011]

FIG. 1 shows the principle configuration of a printed board designing apparatus according to the present invention. In the figure, reference numeral 1 is a printed circuit board designing apparatus equipped with the present invention for designing a printed circuit board while interacting with an operator, and 2 is a terminal provided in the printed circuit board designing apparatus 1 for interacting with an operator. It will be.

The printed circuit board designing apparatus 1 includes a library 10 for managing parts to be mounted on the printed circuit board, and a basic design means 11 for executing a basic design of the printed circuit board while interacting with an operator to create printed circuit board design information. , And design information changing means 12 for changing the printed board design information created by the basic design means 11.

The library 10 is dedicated to wiring in which the probe of the in-circuit tester cannot electrically contact.
In addition to the wiring vias as shown in (a), the uncovered area of the solder resist is large, so that the probe of the in-circuit tester can be electrically contacted with the wiring test and combined vias as shown in FIG. To register.

The design information changing means 12 specifies the probe point of the in-circuit tester assigned to each circuit net included in the printed board design information.
And a changing means 14 for changing a specific wiring via possessed by the printed board design information to a via which also serves as a wiring test, and an adding means 15 for adding a wiring via to the printed board design information.

[0015]

In the present invention, when the basic design means 11 receives the circuit information to be designed from the operator via the terminal 2, the circuit information is mounted using the wiring via registered in the library 10. The basic design of the printed board is executed to create the printed board design information.

When this printed board design information is created,
The identifying unit 13 of the design information changing unit 12 regards the wiring via as a probe that can be electrically contacted by the in-circuit tester, and assigns it to each circuit net included in the printed circuit board design information while giving priority to component pins. Identify in-circuit tester probe points. That is, for a circuit net in which a component pin serves as a probe point, the component pin is specified as a probe point, and for a circuit net in which the component pin does not serve as a probe point, a wiring via serving as a probe point is specified.

At this time, when there is a circuit net in which neither the component pin nor the wiring via serves as a probe point, the adding means 15 adds a wiring via serving as a probe point to the circuit net in accordance with the interactive processing. .

Then, in response to the probe point identification processing, the changing unit 14 routes the wiring via included in the identified probe point (including the probe point of the wiring via added by the adding unit 15). By changing to the test-use via, the printed board design information is changed and the printed board manufacturing information is created.

In this way, when the printed board designed by the printed board designing apparatus 1 of the present invention is manufactured,
Part of the wiring vias will be composed of vias that also serve as a wiring test and have a slightly different shape that serves as a probe point for the in-circuit tester.

As described above, since the printed board of the present invention does not use the test pads, it is possible to realize high-density mounting and reduce the repetitive work of logic design and mounting design. This makes it possible to realize an efficient printed circuit board design.

The printed board design apparatus of the present invention is
This enables the design of the printed board of the present invention.

[0022]

EXAMPLES The present invention will be described in detail below with reference to examples. FIG. 3 shows a processing flow executed by the printed board designing apparatus 1 of the present invention shown in FIG. Next, the present invention will be described in detail according to this processing flow.

When the printed board designing apparatus 1 of the present invention enters the design of the printed board, as shown in the processing flow of FIG.
First, in step 1, in accordance with an interactive process with an operator, an entry process of a circuit diagram to be designed is executed. Then, in step 2, in accordance with an interactive process with the operator, it is determined which package component each gate of the entered circuit is assigned to, and how the pins of each gate are connected. Execute the process.

Subsequently, in step 3, a component placement process for deciding at which position the package component is to be placed is executed in accordance with an interactive process with the operator. Subsequently, in step 4, according to the automation processing, the wiring processing of the pattern corresponding to the allocation result up to now is executed. At this time,
When it is necessary to electrically connect the front surface and the back surface of the printed board, use the wiring vias registered in the library 10 (vias in which the probe of the in-circuit tester cannot electrically contact) and use the wiring of the in-circuit tester. The pattern wiring is executed without considering the probe points at all.

In this way, when the basic design information of the printed board is completed according to the processing of steps 1 to 4, subsequently, in step 5, the probe of the in-circuit tester can be contacted according to the automation processing. While evaluating whether or not it is, identify the probe point of the in-circuit tester assigned to each circuit net of the created printed circuit board design information, and attribute information of that probe point (front and back surface information, etc.) Is output.

This process of specifying the probe point is executed by giving priority to the component pins and regarding wiring vias in which the probe of the in-circuit tester cannot electrically contact as being to be probe points. That is, for a circuit net whose component pin is the probe point, specify that component pin as the probe point, and for a circuit net where the component pin is not the probe point, specify the wiring via that is the probe point. become.

Subsequently, in step 6, it is judged by the process of step 5 whether or not the probe points can be specified for all the circuit nets, and if there is a circuit net which cannot be specified, an interactive process with the operator is carried out. According to
A process of adding a wiring via that becomes a probe point to those circuit nets is executed. Here, if the probe points can be specified for all the circuit nets by the process of step 5, the process of step 6 is omitted.

Then, in step 7, according to the automation processing, the probe points of all the specified circuit nets are
It is checked whether the probe points using the wiring vias (including the wiring vias added in step 6) are included. If they are included, the attribute information (coordinates, surface / Information on the back side).

Subsequently, at step 8, when it is checked by the process of step 7 that the probe points using the wiring vias are included, the wiring vias to be the probe points (the wirings added at step 6). (Including vias) are converted into vias that are also used in the wiring test and registered in the library 10. That is, the wiring via which the probe of the in-circuit tester determined as the probe point cannot electrically contact is connected to the wiring via which the probe of the in-circuit tester can electrically contact due to the large uncovered area of the solder resist. That is, the process of converting to the test-use via is executed. Where step 7
When it is checked by the processing of step 8 that the probe point using the wiring via is not included, the processing of step 8 is omitted.

In this way, when the final printed board design information is completed by changing the printed board design information created by the processing of steps 1 to 4 according to the processing of steps 5 to 8, finally, In step 9, printed board manufacturing information is created from the completed printed board design information, and the whole process is completed.

The printed board is composed of a signal layer / power supply layer / ground layer / solder resist layer as shown in FIG. 4, and is manufactured by a manufacturing process such as a subtractive method as shown in FIG. become. That is, a copper-clad laminate is punched, and subsequently, electrical copper plating is applied to electrically connect the front surface and the back surface of the printed board, and subsequently, a dry film is coated on a portion where solder plating is not applied,
Next, solder plating is applied to the parts other than the dry film, and then the dry film is removed by etching,
Finally, a solder resist is applied.

From this, the printed board manufacturing information created in step 9 gives these manufacturing information. The difference of the present invention from the prior art is that the solder resist layer in the wiring via portion has a certain size. That is, instead of having a non-covered area of, there may be a small non-covered area or a large non-covered area. That is, the solder resist layer of the wiring via portion prepared exclusively for wiring has a small uncovered area as shown in FIG. 2A, and is used for both the wiring test and the wiring test prepared for the probe point of the in-circuit tester. The solder resist layer of the via has a large uncovered area as shown in FIG. 2 (b).

That is, as shown in FIG. 6, in the printed circuit board manufactured by the printed circuit board manufacturing information, a part of the wiring via has a large uncovered area of the solder resist which becomes a probe point of the in-circuit tester. Since it is configured by a dual-purpose via, the test by the in-circuit tester is realized by using the dual-purpose via for wiring test and the component pin set as the probe point.

By using this wiring test dual-purpose via, it is possible to realize the function as a wiring via and the function as a probe point of the in-circuit tester.
As shown in FIG. 3, it is possible to use a wiring test via only without using any wiring via.
However, when such a method is used, the wiring test combined via has a large uncovered area of the solder resist, and as shown in FIG. 7B, manufacturing failures such as excessive solder rise and shorts due to solder balls or the like occur. However, there is a problem that is likely to occur. Therefore, in the present invention, the wiring vias are used as much as possible, and the wiring test vias are minimized.

[0035]

As described above, since the printed board of the present invention does not use the test pad, it is possible to realize high-density mounting and reduce the repetitive work of logic design and mounting design. By doing so, an efficient printed circuit board design can be realized.

The printed board design apparatus of the present invention is
This enables the design of the printed board of the present invention.

[Brief description of drawings]

FIG. 1 is a principle configuration diagram of the present invention.

FIG. 2 is an explanatory diagram of a wiring via / wiring test combined via.

FIG. 3 is a processing flow executed by the printed board design device of the present invention.

FIG. 4 is an explanatory diagram of a layer structure of a printed board.

FIG. 5 is an explanatory view of the manufacturing process of the printed board.

FIG. 6 is an explanatory diagram of a printed board of the present invention.

FIG. 7 is an explanatory diagram of a problem when all the vias are also used for a wiring test.

FIG. 8 is an explanatory diagram of a test pad.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 printed circuit board design apparatus 2 terminal 10 library 11 basic design means 12 design information changing means 13 specifying means 14 changing means 15 adding means

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H05K 3/28 B

Claims (3)

[Claims] 1. In a printed circuit board for mounting a circuit component using a plated through-hole wiring via, a part of the wiring via has a large uncovered area of the solder resist, so that the probe of the in-circuit tester is electrically connected. A printed board characterized by being configured so that it can be physically contacted. 2. A library (10) for managing parts to be mounted on a printed board in a printed board designing device for designing a printed board.
In addition to the wiring via, the wiring test dual-purpose via that allows the probe of the in-circuit tester to electrically contact due to the large uncovered area of the solder resist is registered, and is also registered in the library (10). The printed circuit board is designed to be designed using wiring vias, and the wiring vias are regarded as being capable of being electrically contacted by the probe of the in-circuit tester. The specifying means (13) for specifying the probe point of the in-circuit tester assigned to each circuit net and the wiring via included in the probe point specified by the specifying means (13) are changed to the above-mentioned wiring test dual-use via Thus, the printed board designing device is provided with a changing means (14) for changing the designed printed board. 3. The printed circuit board design apparatus according to claim 2, wherein the design means (13) adds a wiring via serving as a probe point to a circuit net for which the probe point cannot be identified according to an interactive process. The additional means (15) for changing the printed circuit board is provided, and the changing means (14) processes the wiring via added by the additional means (15) to also be a via for wiring test. Printed circuit board design device.